JPH08317539A - Wire laying chip for double floor and wire laying construction for floor panel using the chip - Google Patents

Abstract

PURPOSE: To obtain wire laying chips for double floor capable of performing wire laying to a good form and a wire laying construction for floor panel using the chips while adopting a simple construction without using a rotatable construction relative to the floor panel. CONSTITUTION: A wire laying chip 1 for double floor comprises a cylindrical drum portion 2 having linking projections 2a at predetermined positions in axial direction, and a head portion 3 having a knock-out portion 3a for forming a wire laying hole at the center, which has an outer diameter larger than that of the drum portion and is connected to close its opening at the end portion of the drum portion. These are all made of an elastic material. At the drum portion 2 and the head portion 3, notches S2 and S3 formed by partially leaving are continuously provided on a line passing through the wire laying hole formed by punching the knock-out portion 3a. Also, the wire laying construction of the floor panel is constituted by an almost rectangular plate-shaped floor panel having this wire laying chip 1 and a wire laying opening portion.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double floor wiring chip and a floor panel wiring structure using the same.

[0002]

2. Description of the Related Art The applicant of the present application has proposed, in Japanese Patent Laid-Open No. 5-230981, a wiring chip for double floors and a floor panel wiring structure using the same as shown in FIG. The floor panel A of this product has a substantially rectangular plate shape, and has a U-shaped cutout opening Aa on one or two sides thereof. And, the through-wire chip B consists of the top plate Ba, the side plate Bb, the partition plate
The ceiling plate Ba is configured to have Bc and the like, and is supported by the passage opening Aa so as to be vertically rotatable with respect to the upper plane of the floor panel A. That is, the wiring chip B makes the upper plane of the top plate Ba flush with the upper plane of the floor panel A when the wiring is not performed and closes the passage opening Aa, and when the wiring is performed, the floor panel Rotate and lock so that it projects from the upper plane of A.

In recent years, there has been a double floor in which the space between the floor panel and the foundation floor is used as an air conditioning duct. In such a case, it is necessary to reduce air leakage from other than the air conditioning outlet. As a means for reducing this air leakage, as shown in FIG. 9, the stringer D installed between the panel receiving surface Ca of the pillar C supporting the floor panel A and the pillars C, C is installed.
In some cases, air leakage prevention packing E is attached to the upper surface of the floor and the floor panel A is placed on it.

[0004]

SUMMARY OF THE INVENTION The former one described above is designed to support the wire-passage chip B at the wire-passage opening Aa so as to be vertically rotatable with respect to the upper plane of the floor panel A. The structure becomes complicated.

When the former floor panel A is used for conducting wiring in the latter case described above, the wiring chip B of the wiring opening Aa is projected from the upper plane of the floor panel A. Not only when it is rotated and locked,
Since Aa is on one or two sides of the floor panel A, even if there is an air leak packing E, air easily leaks from that part.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a simple structure which does not employ a structure rotatable about a floor panel.
(EN) It is intended to provide a wiring chip for a double floor and a floor panel wiring structure using the same, which can perform wiring in a good condition.

[0007]

In order to solve the above-mentioned problems, the wire chip for double floor according to claim 1 has a cylindrical shape and has a locking projection at a predetermined axial position thereof. And a head having a knockout portion for forming a through hole in the center, which is connected to the end of the body with an outer diameter larger than the outer diameter of the body to close the opening. And is made of an elastic material.

The double floor wire-through tip according to claim 2 is a notch formed by leaving a part on the line passing through the wire-through hole formed by punching out the knockout portion according to claim 1. Is continuously provided on the head and the body.

Further, in the wire-through tip for a double floor according to a third aspect, the notch according to the second aspect is formed by leaving a part in the head portion corresponding to the body portion and the wall thickness thereof. Has a configuration in which a cutout portion that extends in a fan shape from a part thereof to the outer periphery is formed.

According to a fourth aspect of the present invention, there is provided a floor panel wiring structure using a double floor wiring chip, wherein the floor panel has a substantially rectangular plate shape having a wiring opening, and the wiring opening. The double floor wire-through tip according to any one of claims 1 to 3, wherein the body portion is inserted and locked in the portion.

Further, the wiring structure of the floor panel using the wiring chip for double floor according to claim 5 is the surface finishing material between the floor panel according to claim 4 and the head of the wiring chip. Is configured to intervene.

Furthermore, the wiring structure of the floor panel using the wiring chip for double floor according to claim 6 is the same as that according to claim 4 or 5, wherein the through hole is formed by punching out the knockout portion. And a bushing that elastically holds the outer periphery of the electric wire to be inserted.

[0013]

According to the structure of the first aspect of the present invention, it can be mounted by simply inserting and locking it in the passage opening of the floor panel. If the passage does not occur, the knock-out portion for forming the passage hole must be punched out to leak air. Can be largely prevented.

According to the structure of claim 2, in addition to the function of claim 1, when conducting a wire or the like, the knockout portion is punched out to form a wire hole, and the notch is widened to extend the wire. Etc. are possible.

According to the structure of claim 3, in addition to the effect of claim 2, the notch of the body portion can be formed at one place, the mechanical strength thereof is not lowered, and the operation of expanding the notch becomes easy. .

According to the structure described in claim 4, there is provided a floor panel wiring structure having the operations described in claims 1 to 3.

According to the structure of claim 5, in addition to the operation of claim 4, a floor panel wiring structure in which a surface finishing material is interposed between the floor panel and the head of the wiring chip is obtained. To be

According to the sixth aspect of the invention, in addition to the effect of the fourth or fifth aspect, it is possible to reduce the gap between the wire that has been passed through and the through hole.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a double-floor wiring chip of the present invention will be described below with reference to FIGS. FIG. 1 is a plan view of the through-wire chip 1 seen from below, FIG. 2 is a sectional view taken along the line AA of FIG. 1, and FIG. 3 is a perspective view of the through-wire chip 1. The wire-through tip 1 is molded from a thermoplastic resin having elasticity such as vinyl chloride resin, and has a body 2 and a head 3 as main parts.

The body 2 has a cylindrical shape having an inner diameter large enough to allow an electric wire or the like to be passed therethrough, and four locking projections 2a, 2a, ... Are provided at predetermined axial positions thereof. They are provided at equal intervals. Further, the tip side from the locking projections 2a, 2a, ... Of the body 2 is tapered in a taper shape. Furthermore, the torso
2 is 1 over the entire axial direction, continuous with the head described later.
The notch S2 is provided.

The head 3 is connected to the end of the body 2 with an outer diameter larger than the outer diameter of the body 2 so as to close the opening, and is formed at the center for forming a through hole. Is provided with a knockout portion 3a. The knockout portion 3a can be formed with a through hole 3b by punching it out, but in order to facilitate this punching out, a thin portion 3c is formed around the knockout portion 3a. The knockout portion 3a is finely sunk slightly on the upper surface side and has an inner diameter slightly larger than the outer diameter of the knockout portion 3a. The outside of the outer diameter of the body 2 of the head 3 has a predetermined R shape so that the outside becomes thinner toward the outside.

A notch S3 is formed on the head 3 on a line passing through a through hole 3b formed by punching out the knockout portion 3a, leaving a part 3d corresponding to the wall thickness of the body 2. . The cut S3 is continuous with the cut S2 of the body 2 described above. In addition, a cutout portion 3e that expands in a fan shape is formed from the above-mentioned part 3d on the extension line of the cut S3 to the outer periphery. These notches S2 and S3 are made by punching out the knockout part 3a when passing wires.
While forming 3b, the cuts S2 and S3 can be expanded to allow passage of wires and the like.

In this embodiment, the following dimensions are specifically set. The body 2 has an inner diameter of approximately 40 mm, an outer diameter of approximately 43 mm, a tip wall thickness of approximately 0.5 mm, a locking projection 2a height of approximately 1 mm, and an axial length of approximately 32 mm. The lower end position of 2a is about 6.
5 mm, axial length of locking projection 2a is about 2.2 mm, cut S2
The width of the head 3 is about 0.5 mm, the head 3 has an outer diameter of about 70 mm, the knockout part 3a has an outer diameter of about 18.6 mm, and the slightly sinking amount on its upper surface side is about 0.4 mm and its inner diameter is about The thickness of the thin portion 3c is 19.1 mm, the thickness of the thin portion 3c is about 1.4 mm, the thickness other than the thin portion 3c is 4.4 mm, the R of the above-mentioned R shape is about 10 mm, and the central angle of the cut portion 3e is about 30 °.

The above-mentioned dimensions are examples and can be changed as appropriate. Regarding the cuts S2 and S3, a part 3d which is not cut may be provided on the outermost periphery of the head 3. In this case, the body 2 has two notches S2, and the excision 3e
Does not exist, and the amount of deformation when expanding the cuts S2 and S3 can be small. Furthermore, these notches S2 and S3 may be omitted. In this case, general wiring work will be performed. Furthermore, the locking projection 2a may be provided continuously on the outer circumference.

Next, one embodiment of the floor panel wiring structure using the double floor wiring chip of the present invention will be described with reference to FIGS. 4 to 7.
It will be described based on. This consists of the through wire tip 1, floor panel 5, surface finish 9 and bushing 10 described earlier.
Is a main component.

As shown in FIGS. 4 and 5, the floor panel 5 has an approximately square plate shape by an upper plate 6 and a lower plate 7 made of an iron plate. The upper plate 6 is a flat surface on the surface side as a floor. On the other hand, the lower plate 7 is the rear surface side as a floor, and has a square outer shell flange portion 7a, a frame portion 7b inside thereof, a step portion 7c inside thereof, and a large number inside thereof. The dimples 7d, 7d, ... And the reinforcing ribs 7e, 7e ,. Then, the space formed by both plates 6 and 7 is filled with concrete 7f. Specifically, in this embodiment, the thickness is about 600 mm and the thickness is about 34 mm,
Further, the dimples 7d, 7d, ... Have a root diameter of about 55 mm, and the lower plate 7, which is the deepest part, is in contact with the upper plate 6.

A large number of floor panels 5 are laid on the floor, and a passage opening 8 is provided at a position that does not cover the outer shell and is suitable for conducting a passage. The opening 8 for wire passage is formed by using, for example, a hole saw (rotary circular saw), and forming a through hole of about 43 mm coaxially with the center of the desired dimple 7d. As a result, as shown in FIGS. 5 and 6, the inclined curved surface 7g remains on the root side of the dimple 7d.

The surface finishing material 9 is made of carpet or the like,
It is laid on the upper surface of many floor panels 5,5, .... Then, at the position corresponding to the passage opening 8 of the floor panel 5, the passage chip 1
An insertion opening (9a) is provided for inserting the. This insertion opening 9a
May have a slightly larger inner diameter as long as it is covered by the outer diameter of the head of the wire passing tip 1.

The bushing 10 is made of a highly elastic material such as rubber and, as shown in FIG. 7, has a through hole 3b.
Has a larger outer diameter and has a thin portion of the wire insert 1 in the middle
A locking groove 10a into which 3c is inserted and a through hole 10c whose one end is closed by a thin portion 10b are provided in the center. The thin portion 10b is punched so that the through hole 10c penetrates when conducting the wire. In this embodiment, the outer diameter is about 28 mm, the inner diameter of the through hole 10c is about 15 mm, the axial length (total thickness) is about 8.5 mm, and the locking groove 10a is
Has a width of about 1.5 mm, an outer diameter of about 19 mm, and the thin portion 10b has a thickness of about 1 mm.

In such a wire passage structure, the knockout portion 3a of the wire insert chip 1 is punched out to form a wire passage hole 3b.
Insert bushing 10 into 3b and lock it, then insert wire
1 is inserted into the insertion opening 9a of the surface finish material 9 and the passage opening 8 of the floor panel 5, and the locking projection 2a is locked to the inner edge of the inclined curved surface 7g. If not passing, thin section 10b of bushing 10
Do not punch. The bushing 10 may be inserted into the through hole 3b by expanding the notches S2 and S3 and inserting the bushing 10 from there.

When passing a wire, the thin portion of the bushing 10
The through hole 10c is punched out to form a through hole 10c.
Pass an electric wire through and cut the bushing 10 in this state S
2, S3 is expanded and inserted and locked into the through hole 3b from there. Then, the wire-through tip 1 in this state is inserted into the wire-through opening 9a of the surface finish material 9 and the wire-through opening 8 of the floor panel 5, and the locking projection is formed.
The 2a is locked to the inner edge of the inclined curved surface 7g. This bushing 10
Is made of a highly elastic material such as rubber,
Since the wire is deformed along the outer diameter of the wire to be threaded, the gap between the wire and the wire hole 10c can be reduced.

When the surface finishing material 9 is omitted, the length of the body portion 2 of the wire passing tip 1 is shortened. Also floor panels
Needless to say, 5 may not have dimples.

[0033]

The wire chip for double floor according to claim 1 can be mounted only by inserting and locking it in the wire opening of the floor panel. Air leakage can be largely prevented unless the knockout part is punched out. Therefore, although the structure is simple without using a structure that can rotate with respect to the floor panel, it is possible to carry out good wiring.

The wire chip for a double floor according to claim 2 is
In addition to the effect of claim 1, when conducting a wire, etc., the knockout portion is punched out to form a wire hole, and
It is possible to extend the notch and pass lines from there.

The wire chip for double floor according to claim 3,
In addition to the effect of the second aspect, the notch of the body portion can be formed at one place so that the mechanical strength thereof is not lowered and the operation of expanding the notch becomes easy.

According to the wiring structure of the floor panel using the wiring chip for double floor of the fourth aspect, the wiring structure of the floor panel having the effects of the first to third aspects can be obtained.

According to a fifth aspect of the present invention, in addition to the operational effect of the fourth aspect, the floor panel wiring structure using the double floor wiring chip has a space between the floor panel and the head of the wiring chip. It is possible to obtain a floor panel wiring structure with a surface finish interposed.

According to a sixth aspect of the present invention, there is provided a floor panel wiring structure using a double floor wiring chip, wherein in addition to the operational effect of the fourth or fifth aspect, a gap between the wire and the through hole is provided. Can be reduced.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a conductor chip of the present invention.

FIG. 2 is a sectional view taken along the line AA.

FIG. 3 is a perspective view thereof.

FIG. 4 is a plan view of a floor panel having a wiring structure of a floor panel using the wiring chip of the present invention.

FIG. 5 is a sectional view thereof.

FIG. 6 is a cross-sectional view of a main part of the floor panel wiring structure.

FIG. 7 is a sectional view of the bushing.

FIG. 8 is a perspective view of a floor panel wiring structure previously proposed by the applicant of the present application.

FIG. 9 is a perspective view of a main part of a conventional example.

[Explanation of symbols]

 1 Through-wire tip 2 Through-wire tip body 2a Trunk locking projection S2 Body notch 3 Through-wire tip head 3a Head knockout 3b Head through-hole 3c Head thin-walled part 3d Remaining part on the line of the notch of the head 3e Cutout part on the line of the notch of the head S3 Notch of the head 5 Floor panel 6 Upper plate of the floor panel 7 Lower plate of the floor panel 8 Passage opening of the floor panel Part 9 Surface finish 10 Bushing 10a Bushing locking groove 10b Bushing thin part 10c Bushing through hole

Claims (6)

[Claims] 1. A body having a cylindrical shape and having a locking projection at a predetermined position in the axial direction, and a body connected to an end of the body with an outer diameter larger than the outer diameter of the body. A double floor wire-through chip, which is provided and has a knockout portion for forming a wire-hole in the center, and is made of an elastic material. 2. The head and the body are continuously provided with a notch formed by leaving a part on a line passing through a through hole formed by punching out the knockout part. Passing chip for heavy floors. 3. The notch is formed by leaving a part of the head corresponding to the body and the thickness thereof, and the head is formed with a cutout portion that extends in a fan shape from the part to the outer periphery. The wire chip for a double floor according to claim 2. 4. The double floor floor panel according to claim 1, wherein the floor panel is a substantially rectangular plate having a passage opening, and the trunk is inserted and locked in the passage opening. A floor panel wiring structure using a wiring chip and a wiring chip for a double floor. 5. A floor panel wiring structure using a double floor wiring chip according to claim 4, wherein a surface finishing material is interposed between the floor panel and the head of the wiring chip. . 6. A bushing which is mounted in a wire hole formed by punching out a knockout portion and elastically holds the outer circumference of an electric wire to be inserted.
A floor panel wiring structure using the above-mentioned double floor wiring chip.