JPH08316384A - Mounting structure for heat sink - Google Patents

Abstract

PURPOSE: To obtain a mounting structure for heat sink in which the mounting/ demounting work is facilitated for a heating element and a heat sink. CONSTITUTION: The mounting structure for heat sink comprises an IC socket 2 for mounting a heating element 1 on a mounting board, a heat sink having a fan contained in a fan containing part formed in a heat sink body 3 made of a material having high thermal conductivity and mounted on the upper surface of the heating element 1, and a cover 6 secured through a coupling part 5 to the IC socket 2 while covering the upper surface of the heat sink body 3, wherein the heat sink is mounted while being held between the heating element 1 and the cover 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink device mounting structure.

[0002]

2. Description of the Related Art Recently, a heat sink equipped with a fan device has been widely used in accordance with an increase in the amount of heat generated by the heating element 1. For mounting a heat sink device with a fan on the heating element, the heat sink is mounted on the heat dissipation surface of the heating element. It is done by adhering to.

[0003]

However, in the above-mentioned conventional example, when the fan device fails or the heat generating element side is replaced, there is a drawback that individual replacement is not possible.

The present invention has been made to solve the above drawbacks, and an object of the present invention is to provide a mounting structure of a heat sink device in which the heat generating element and the heat sink device can be easily separated and the mounting work is simple. And

[0005]

According to the present invention, the above object is to provide an IC socket 2 for mounting a heating element 1 on a mounting board.
And a heat sink device in which a fan device 4 is housed in a fan housing part 30 formed in a heat sink body 3 formed of a material having good thermal conductivity, which is mounted on the upper surface of the heating element 1, and an IC socket by a connecting part 5. And a cover 6 that is fixed to the heat sink body 3 and covers the upper surface of the heat sink body 3. The heat sink device is achieved by providing a mounting structure of a heat sink device that is sandwiched and mounted by the heat generating element 1 and the cover 6. It

[0006]

In the present invention, the heat sink device is mounted on the heat generating element 1 by mounting the heat generating element 1 on the IC socket 2.
After the heat sink body 3 and the cover 6 are sequentially placed on the heat sink surface of, the connecting portion 5 formed on the cover 6 is I
The heat sink body 3 is pressed against the heat sink surface of the heat generating element 1 at a predetermined pressure by being fixed to the C socket 2.

By pressing the heat sink body 3 into pressure contact with the heat generating element 1 via the IC socket 2, the heat generating element 1 and the heat sink device can be separated from each other as necessary, and the heat sink device can be mounted on the heat generating element 1. Work becomes easy.

The present invention is not limited to mounting a thin heat sink device by housing the fan device 4 in the heat sink body 3, but is also applicable to mounting the fan device 4 on the upper surface of the heat sink body 3. It is possible, and in this case, as described in claim 2, the cover 6 for housing the fan device 4 may be fixed to the IC socket 2.

According to the third aspect of the invention, a buffer 7 having excellent elasticity and thermal conductivity is interposed at the boundary between the back surface of the heat sink body 3 and the heating element 1. The cushioning body 7 absorbs unevenness or a dimensional error in the contact portion between the heat sink body 3 and the heating element 1 to bring them into close contact with each other, and promotes a decrease in thermal resistance at the boundary portion.

The cover 6 can be connected to the IC socket 2 by various means such as screwing. However, as in the invention described in claim 4, the cover 6 is connected by the horizontal rotation of the cover 6. When the part 5 is configured to elastically engage with the connected parts 8 provided at the four corners of the IC socket 2, the workability of mounting and dismounting is further improved.

As a structure for elastically mounting the connecting portion 5 on the connected portion 8, as described in claim 5, the connecting portion 5
The fitting portion 9 of the cover 6 and the fitting portion 9 in which the locking claw 91 of the other is fitted to the fitting groove 90 opened in one of the coupled portions 8 by the rotation operation of the cover 6, and the fitting portion 9 of the cover 6 is engaged. In order to smoothly guide the rotation operation of the cover 6, it suffices to provide detent locking portions 50 and 80 for elastically locking each other in the mounting posture and for detenting the cover 6. As described in (1), it is effective to provide the connecting portion 5 and the connected portion 8 with arcuate sliding contact surfaces 51 and 81 arranged on substantially the same circumference with respect to the rotation operation center of the cover 6. .

The structure for mounting the cover 6 on the IC socket 2 while rotating the cover 6 is not limited to the one described above. For example, as described in claim 7,
The IC socket 2 is erected from the four corners and has a head 82 at the tip.
An arc-shaped introduction notch 52 for receiving the shaft portion 83 of the pin-like body along with the horizontal rotation of the cover 6, and a terminal end portion of the introduction notch 52 on the cover 6 side. It is also possible to provide the connecting portion 5 having the holding portion 53 that is elastically engaged with and holds the shaft portion 83.

[0013]

1 and 2 show an embodiment of the present invention. The heat sink device is composed of a heat sink body 3 formed of a material having good thermal conductivity such as an aluminum alloy, a fan device 4 mounted on the heat sink body 3, and a cover 6.

The heat sink body 3 has a large number of pin-shaped heat radiation fins 32, 32, ...
The fan housing portion 30 is formed by reducing the height of the heat radiation fins in a predetermined area or disposing the heat radiation fins 32 in the area. Note that FIG. 1 shows an example in which the fan housing portion 30 is formed by disposing the heat radiation fins 32.

The fan unit 4 is formed with rotary blades 40 fixed around the rotation axis, and is housed in the fan housing section 30. The fan device 4 can be mounted by rotatably holding the rotary shaft in a bearing house (not shown) embedded in the bottom wall of the heat sink body 3. It is also possible to hold it through an auxiliary fixing member, and the cooling air forcedly introduced into the heat sink body 3 from above by the fan device 4 is blown out to the bottom wall 31 side of the heat sink body 3 and then the radiating fins. The heat sink body 3 is cooled by passing through the spaces 32, 32, ... And discharged from the edge of the heat sink body 3 to the outside. It should be noted that the fan device 4 may be of a type that is the reverse of the specifications described above, that is, one that inhales air from the side edge side of the heat sink body 3 and exhausts it upward. Further, in order to simplify the drawing, the fan device 4 is not shown in FIG.

As shown in FIGS. 1 and 3, the cover 6 has a rectangular flat plate portion 61 having an intake / exhaust port 60 of the fan unit 4 at the center thereof, and a connecting member arranged at four corners of the flat plate portion 61. And the rear side of the flat plate portion 61 and the intake / exhaust port 60.
A venturi cylinder 62 that surrounds the rotation trajectory of the rotary blades 40 of the fan device 4 is provided on the peripheral edge of the.

The connecting portion 5 is formed on a block portion 64 having a substantially triangular cross section, which is provided so as to project from the back surface of the flat plate portion 61 toward the heat sink body 3 side. Sliding contact surface 51 as an arc surface
Is formed. The respective sliding contact surfaces 51 are arranged on the same circumference, and the center thereof is substantially coincident with the center of the heat sink body 3. Further, a protrusion is vertically provided at the center of each of the sliding contact surfaces 51, 51, ...
0 is formed, and the lower end of the block portion 64 is extended toward the center portion to form a locking claw 91 whose tip edge is arranged concentrically with the sliding contact surface 51.

On the other hand, as shown in FIG. 4, the IC socket 2 for mounting the heating element 1 on the mounting substrate has contact portions 20, 20 ...
The block portions 26 are formed at the four corners of the base 21 provided with, and the connected portions 8 are formed on the block portions 26.

That is, the block portion 26 has substantially the same curvature as the horizontal portion 27 supporting the bottom wall of the connecting portion 5 and the sliding contact surface 51 on the connecting portion 5 side so that the block portion 26 slides in contact with the sliding contact surface 51. And the horizontal portion 27 is extended inward so as to engrave the lower end portion of the sliding contact surface 81,
The engaging claw 91 on the connecting portion 5 side is a fitting groove 90 into which the engaging claw 91 can be fitted. Further, the sliding contact surface 81 is provided with a recessed groove in the vertical direction, and serves as a detent locking portion 80 capable of elastically locking the detent locking portion 50 on the connecting portion 5 side.

Therefore, in this embodiment, after mounting the heat generating element 1 in the IC socket 2, the heat sink body 3 is placed on the upper surface of the heat generating element 1, and then the block portion 64 is formed.
Does not interfere with the block portion 26 on the IC socket 2 side, for example, as shown in FIG.
The cover 6 is placed in a state of being rotated by °.

After that, when the cover 6 is rotated in a posture in which the cover 6 overlaps with the IC socket 2, first, the locking claws 9 on the cover 6 side are first formed.
After 1 is fitted into the fitting groove 90 of the connected portion 8 from the side, the sliding contact surfaces 51, 81 are in sliding contact with each other. When an operation force in the rotational direction is further applied to the cover 6, the cover 6 is rotated about its center as a rotation center due to the sliding contact between the sliding contact surfaces 51 and 81, and the detent locking portion 50 on the connecting portion 5 side is rotated. The anti-rotation locking portion 80 on the connected portion 8 side is elastically engaged, and the mounting of the heat sink device is completed.

In this state, the locking claw 91 and the fitting groove 9
Since the fitting portions 9 made of 0 and 0 are engaged with each other in the stacking direction, the cover 6 is prevented from being detached upward, and the rotation stopper portions 50 and 80 are elastically locked to each other to prevent the cover 6 from being removed. Movement in the rotation direction is also restricted. Furthermore, the cover 6
In the connected state, the back surface of the heat sink body 3 is pressed against the upper surface of the heat generating element 1, that is, the heat sink surface, so that they are in close contact with each other and an increase in thermal resistance at the boundary portion is prevented.

In order to bring the heat sink body 3 into close contact with the heat generating element 1 by absorbing the unevenness of the surface of the heat sink body 3 and the heat generating element 1, or by absorbing the dimensional error between the connecting portion 5 and the connected portion 8. As shown in FIGS. 1 and 2, the boundary portion between the heat sink body 3 and the heating element 1 has excellent elasticity,
In addition, it is desirable to interpose the buffer 7 having good heat conductivity, and as the buffer 7, a thin sheet body made of the material having the above-described properties can be used.

Further, when the cover 6 is rotated, the heating element 1
In order to prevent a rotational stress from being generated in the lead portion of the cover 6, a sheet having excellent lubricity or heat transfer grease or the like is interposed at the boundary between the back surface of the cover 6 and the heat radiation fins 32 to apply a rotational force to the cover 6 and the heat sink body. By absorbing heat at the boundary with the heat sink body 3, applying heat transfer grease or the like to the upper surface of the buffer body 7, or imparting self-lubricating property to the upper surface of the buffer body 7. It is desirable to absorb at the boundary with 7.

In this embodiment, the structure shown on the side of the connecting portion 5 may be the structure on the connected portion 8 side, and the structure on the connected portion 8 side may be adopted on the connecting portion 5 side. FIG.
7 shows another embodiment of the present invention. In the description of the present embodiment, the same configurations as those of the above-described embodiment will be designated by the same reference numerals in the drawings, and the description thereof will be omitted. In this example,
Block portions 26 are provided at the four corners of the surface of the IC socket 2, and pin-shaped bodies are provided at the tips of the block portions 26 so as to form the connected portions 8. The pin-shaped body is formed by bulging the head portion 82 at the tip of the shaft portion 83, and the length of the shaft portion 83 is substantially equal to the thickness dimension of the cover 6 described later.

On the other hand, the cover 6 is a plate-like member provided with the intake / exhaust ports 60 of the fan unit 4, and the connecting portions 5 are formed at the four corners thereof. The connecting portion 5 is I when the cover 6 is rotated.
For example, an arcuate introduction notch 52, which is opened clockwise toward the side edge so that the connected part 8 on the C socket 2 can be fitted and whose end is arranged on a diagonal line of the cover 6, and an introduction notch 52.
And a holding portion 53 in which the shaft portion 83 elastically engages with the end portion by slightly narrowing the opening size in the vicinity of the end portion.

Therefore, in this embodiment, when the cover 6 is rotated in the direction of the arrow in FIG. 6, first, the shaft portion 83 enters the opening end of the introduction notch 52, and then the holding portion 53.
After the shaft portion 83 or the cover 6 is once bent in the foreground, the shaft portion 83 is housed in the holding portion 53, and in this state, the head portion 82 of the connected portion 8 detaches the cover 6 upward. To be prevented.

In the present embodiment as well, it is desirable to use the shock absorber 7 in the above-mentioned embodiment, and further, the modification for absorbing the rotational force explained in the above-mentioned embodiment can be adopted.

Further, the connecting portion 5 and the connected portion 8 are arranged so that the holding force of the cover 6 increases as the cover 6 rotates.
It is also possible to set the engaging surface between the connecting portion 5 and the connected portion 8, for example, the sliding contact surface between the locking claw 91 and the fitting groove 90 as an inclined surface.

Further, in the above embodiment, the cover 6
Is shown fixed to the IC socket 2, but I
Instead of the C socket 2, a cover fixing auxiliary member may be fixed to the mounting board. In this case, the heating element 1 is directly bonded on the mounting board, and the cover fixing auxiliary member is the heating element. It suffices if it is fixed on the mounting board so as to surround No. 1.

[0031]

As is apparent from the above description, according to the present invention, the heating element and the heat sink device can be easily separated and the mounting work can be simplified.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention.

FIG. 2 is a view showing an assembled state of FIG. 1, (a) is a plan view,
2B is a sectional view taken along line BB of FIG.

FIG. 3 is a back view showing the cover, (a) is a back view,
3B is a sectional view taken along line BB of FIG.

FIG. 4 is a view showing an IC socket, (a) is a plan view,
4B is a front view, and FIG. 4C is a sectional view taken along the line CC of FIG.

FIG. 5 is a view showing a mounted state of a cover.

FIG. 6 is a diagram showing another embodiment.

FIG. 7 is a view showing an IC socket, (a) is a plan view,
(B) It is a front view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat generating element 2 IC socket 3 Heat sink main body 30 Fan accommodating portion 4 Fan device 5 Connecting portion 50 Rotation stop engaging portion 51 Sliding contact surface 52 Introducing notch 53 Holding portion 6 Cover 7 Buffer 8 Connected portion 80 Rotation stopping engaging portion 81 Sliding Contact Surface 82 Head 83 Shaft 9 Fitting 90 Fitting Groove 91 Locking Claw

Claims (8)

[Claims] 1. A fan device is housed in an IC socket for mounting a heating element on a mounting board, and a fan housing portion formed on a heat sink body mounted on the upper surface of the heating element and made of a material having good thermal conductivity. And a cover fixed to the IC socket by the connecting portion and covering the upper surface of the heat sink body, wherein the heat sink device is mounted by being sandwiched between the heat generating element and the cover. 2. An IC socket for mounting a heating element on a mounting board, and a heat sink device in which a fan device housed in a cover is arranged on an upper surface of a heat sink body made of a material having good thermal conductivity. However, the cover has a connection portion formed on the cover.
A mounting structure of a heat sink device fixed to a C socket and sandwiching and fixing the heat sink body between the cover and the heating element. 3. The mounting structure for a heat sink device according to claim 1, wherein a buffer body having excellent elasticity and thermal conductivity is interposed at a boundary between the heat sink body and the heat generating element. 4. The mounting of a heat sink device according to claim 1, wherein the IC socket has four corners formed with connected portions that are elastically received by the connecting portions when the cover is horizontally rotated. Construction. 5. The connecting part and the connected part are a fitting part in which a locking groove of the other is fitted into a fitting groove formed in either one by a rotation operation of the cover and engaged in the stacking direction. 5. The mounting structure for a heat sink device according to claim 4, further comprising: a detent locking portion that elastically locks each other in the mounting posture of the cover and locks the cover. 6. The connecting portion and the connected portion have arcuate sliding contact surfaces arranged on substantially the same circumference with respect to the center of rotation operation of the cover, and the rotation stopper engaging portion has the sliding contact surface. The mounting structure of the heat sink device according to claim 5, which is formed on the surface. 7. The connected portion is a pin-shaped body that is erected from the four corners of the IC socket and has a head at the tip, and the pin-shaped body is provided on the cover as the cover horizontally rotates. 5. A connecting portion is provided, which is provided with an arcuate introduction notch for receiving a shaft portion of a body and a holding portion formed at a terminal end portion of the introduction notch and elastically engaging and holding the shaft portion. Mounting structure of the heat sink device. 8. A cover fixing auxiliary member fixed on a mounting board is used instead of the IC socket.
8. A mounting structure for a heat sink device according to any one of 1 to 7.