JPH08315412A - Photodetector fitting device for optical head - Google Patents

Abstract

PURPOSE: To surely prevent misalignment of a photodetector in the plane direction upon accomplishment of good workability by a simple structure. CONSTITUTION: Plural pins 9a and 9b provided to project from a mounting plate 4 having a mounted printed wiring board 2 or directly from an optical housing 1 are soldered to lands 11a and 11b formed on the printed wiring board 2 respectively, so that the photodetector 3 fitted to the printed wiring board 2 is fixed to the optical housing 1. Thus, no force causing the adjusting deviation of the photodetector 3 in the planewise direction is made to be generated at the time of fitting the photodetector 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photodetector mounting device for an optical head for mounting a photodetector on an optical housing, and a photodetector for an optical head for mounting the photodetector without shifting the position of the photodetector. Regarding mounting device.

[0002]

2. Description of the Related Art As is well known, an optical head that optically traces a signal recording medium such as a disk is provided with a photodetector for receiving a light beam modulated by the signal of the signal recording medium. The detector is soldered to a printed wiring board, and is attached together with the printed wiring board to an optical housing in which each optical element forming the optical head is incorporated. The photodetector is positionally adjusted so that light is received at the correct position and is mounted on the optical housing.

[0003]

By the way, in the photodetector mounting device for mounting the photodetector, the photodetector is mounted on the optical housing by screwing the mounting member on which the photodetector is mounted, such as a printed wiring board. There is a type that is designed to be fixed to a device, and this type is widely used because it does not require a special mounting member.

In the photodetector mounting device for fixing the photodetector by screwing in this manner, the plane direction (X, Y) of the photodetector orthogonal to the optical axis direction of the light beam received by the photodetector. (Axial direction) adjustment is performed with the screws loosened, and after the adjustment, tighten the screws to fix the photodetector. In this photodetector mounting device, when the screw is tightened, the mounting member is rotated in the screw tightening direction, and the photodetector is misaligned. There is a problem in that the photodetector is misaligned due to the stress.

Further, in the photodetector mounting device for fixing the photodetector by screwing, as shown in Japanese Utility Model Publication No. 7-3457, right and left screws are used as screws for screwing. Although there is a device that prevents misalignment of the photodetector when tightening the screw, this method causes deterioration of workability because two types of screws are used. Moreover, the residual stress at the time of screwing was not eliminated.

An object of the present invention is to provide a photodetector mounting device for an optical head which solves the above-mentioned problems with a simple structure.

[0007]

SUMMARY OF THE INVENTION According to the present invention, a plurality of pins provided directly on a mounting plate to which a printed wiring board is mounted, or directly protruding from an optical housing, and the printed wiring board are formed. A plurality of holes that are loosely inserted and lands that are formed in the printed wiring board and that are formed on the periphery of the holes are provided, and the pins are soldered to the corresponding lands.

[0008]

According to the present invention, a plurality of pins fixed to the optical housing in the surface direction of the photodetector or directly provided on the optical housing are soldered to the respective lands formed on the printed wiring board to print the printed circuit board. By fixing the photodetector attached to the wiring board to the optical housing, it is not necessary to use a force that causes an adjustment deviation in the plane direction of the photodetector when attaching the photodetector. The stress does not remain on the printed wiring board.

[0009]

1 and 2 are a plan view and a front view, respectively, showing an embodiment of the present invention. In FIG. 1, reference numeral 1 is an optical housing in which optical elements (not shown) constituting an optical head are incorporated, 2 is a printed wiring board to which a photodetector 3 is soldered, and 4 is the printed wiring board 2 mounted. This is a mounting plate.

A through hole 5 is formed in the printed wiring board 2 and a through hole 6 is formed in the mounting plate 4, so that an optical path to the light receiving surface of the photodetector 3 is secured. Also,
The mounting plate 4 has a thin-walled portion 4a cut in a V-shaped cross section, one end of which is fixed to the optical housing 1 by sandwiching the thin-walled portion 4a, and the other by sandwiching the thin-walled portion 4a. The printed wiring board 2 is arranged on the end side. And, on the other surface where the printed wiring board 2 on the other end side is mounted,
A cam member 8 pivotally supported by the optical housing 1 is in contact with the optical housing 1. By rotating the cam member 8, the other end of the mounting plate 4 is moved up and down, and a light beam received by the photodetector 3 is received. The position of the photodetector 3 is adjusted in the optical axis direction (Z-axis direction).

Reference numerals 9a and 9b denote two diagonals of the printed wiring board 2.
Pins 10a, which are provided at the positions so as to project from the mounting plate 4,
10b is formed in the printed wiring board 2, holes into which the pins 9a and 9b are respectively inserted, and 11a and 11b are formed in the printed wiring board 2, and the holes 10a and 1b are formed.
The lands are formed on the periphery of 0b.

Each of the pins 9a and 9b is formed by using a wrapper pin which is easy to solder and has general versatility, and the wrapper pin is embedded in the mounting plate 4. Next, the position adjustment of the photodetector 3 in the surface direction and the work of mounting the printed wiring board 2 will be described.

When the position of the photodetector 3 in the plane direction is adjusted, that is, in the X-axis and Y-axis directions, the mounting board 4 corresponding to the holes 10a and 10b of the printed wiring board 2 is automatically machined. The printed wiring board 2 is brought into contact with the mounting board 4 with the pins 9a and 9b inserted, and in that state, the holes 10a and 10b of the printed wiring board 2 are formed at two diagonal positions where the holes are not arranged. Adjustment pins (not shown) of an automatic machine are inserted into the adjustment holes 12a and 12b, respectively, and the printed wiring board 2 is brought into contact with the mounting plate 4 by the adjustment pins while monitoring the detection output of the photodetector 3. Displace with. Then, the displacement of the adjusting pin is stopped in a state where the detection output of the photodetector 3 becomes optimum, and the adjustment of the photodetector 3 in the X-axis and Y-axis directions is completed. At the time of completion of this adjustment, the printed wiring board 2 is maintained at that position, and the pins 9a and 9b are soldered to the corresponding lands 11a and 11b, respectively.
The printed wiring board 2 is fixed. Each of the pins 9a,
The soldering of 9b is performed, for example, by adopting light beam solder, applying the solder, and irradiating the solder with a specific light beam to cure the solder.

Here, the mounting plate 4 of the printed wiring board 2
Since the force for causing the adjustment deviation in the X-axis and Y-axis directions of the photodetector 3 is not used at all for fixing to the optical detector 1, the photodetector 3 is fixed to the optical housing 1 without causing the adjustment deviation. You can do the work.

FIG. 3 is a plan view showing another embodiment of the present invention, in which each pin 13 soldered to the printed wiring board 2 is shown.
In the embodiment, a and 13b are provided so as to directly project from the mounting surface of the mounting plate 4 of the optical housing 1. FIG.
1, the same parts as those in FIG. 1 are designated by the same reference numerals.

In FIG. 3, each pin 1 is attached to the mounting plate 4.
Holes 14a and 14b into which 3a and 13b are respectively inserted are formed, and the pins 13a and 13b are connected to the holes 10a and 1 of the printed wiring board 2 through the holes 14a and 14b, respectively.
It is configured to be inserted into 0b.

Also in this case, the position adjustment of the photodetector 3 in the plane direction and the mounting work of the printed wiring board 2 are performed as in the embodiment shown in FIG. In the above-described embodiment, the optical head having the structure in which the mounting plate 4 is used to adjust the position of the photodetector 3 in the Z-axis direction has been described. However, the light receiving beam received by the photodetector using the power lens is described. Since the mounting plate 4 is not required in the optical head having the configuration for adjusting the focal length of the optical head, the configuration in which the pins to be soldered to the printed wiring board are directly provided on the optical housing may be adopted.

[0018]

As described above, according to the present invention, a plurality of pins provided so as to project directly from the mounting plate on which the printed wiring board is mounted or directly from the optical housing is soldered to each land formed on the printed wiring board. Since the photodetector attached to the printed wiring board is fixed to the optical housing by attaching the photodetector to the optical housing, a force that causes an adjustment deviation in the plane direction of the photodetector is required when the photodetector is attached. Moreover, it is possible to provide a photodetector mounting device for an optical head that achieves good workability with a simple configuration and reliably prevents misalignment in the surface direction of the photodetector. Further, since stress does not remain on the printed wiring board, there is an advantage that adjustment deviation in the plane direction of the photodetector is less likely to occur due to aging.

In particular, according to the present invention, each pin is soldered to the corresponding land with the adjusting tool inserted in the adjusting hole, so that the photodetector can be reliably maintained at the adjustment completion position. Can be fixed to.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of the present invention.

FIG. 2 is a front view showing an embodiment of the present invention.

FIG. 3 is a plan view showing another embodiment of the present invention.

[Explanation of symbols]

 1 Optical Housing 2 Printed Wiring Board 3 Photo Detector 4 Mounting Plate 9a, 9b, 13a, 13b Pins 10a, 10b Holes 11a, 11b Lands 12a, 12b Adjustment Holes

Claims (3)

[Claims] 1. A photodetector mounting device for an optical head, wherein a photodetector for receiving a light beam modulated by a signal of a signal recording medium is mounted on an optical housing in which optical elements constituting the optical head are incorporated. A printed wiring board to which the photodetector is fixed by soldering, a mounting board to which the printed wiring board is mounted and which is mounted to the optical housing, and a plurality of pins protruding from the mounting board, The printed wiring board is provided with a plurality of holes in which the pins are respectively loosely inserted, and lands formed in the printed wiring board at the periphery of the holes, the pins corresponding to the respective holes. An optical head photodetector mounting device designed to be soldered to a land. 2. A photodetector mounting device for an optical head, wherein a photodetector for receiving a light beam modulated by a signal of a signal recording medium is mounted on an optical housing in which optical elements constituting the optical head are incorporated. A printed wiring board to which the photodetector is fixed by soldering, a plurality of pins protruding from the optical housing, and a plurality of holes formed in the printed wiring board and into which the pins are loosely inserted, respectively. A photodetector mounting device for an optical head, comprising: a land formed on the periphery of each hole formed on the printed wiring board, and each pin being soldered to a corresponding land. 3. The printed wiring board is provided with an adjusting hole into which a tip of an adjusting tool for adjusting the position of the photodetector is inserted.
The position of the photodetector is adjusted by the adjusting tool, and the pins are soldered to the corresponding lands while the adjusting tool is inserted into the adjusting hole.
Alternatively, the photodetector mounting device for the optical head according to claim 2.