JPH0831253A - Electric contact material - Google Patents
Electric contact materialInfo
- Publication number
- JPH0831253A JPH0831253A JP6177640A JP17764094A JPH0831253A JP H0831253 A JPH0831253 A JP H0831253A JP 6177640 A JP6177640 A JP 6177640A JP 17764094 A JP17764094 A JP 17764094A JP H0831253 A JPH0831253 A JP H0831253A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- contact material
- rare earth
- resistance
- earth element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、比較的小さな電流域で
使用する通信機用小型リレー、小型スイッチ等の電気接
点に係り、特に電気接点に於ける粘着を抑制する電気接
点材料に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electric contacts such as small relays and small switches for communication equipment used in a relatively small current region, and more particularly to an electric contact material for suppressing adhesion at the electric contacts.
【0002】[0002]
【従来の技術】従来、比較的小さな電流域で使用する通
信機用小型リレー、小型スイッチ等の電気接点は、開閉
時のアーク発生が少ない為、接点表面に酸化物、硫化物
が生成すると分解できず、接触抵抗が不安定となる。こ
の為、耐環境性及び接触抵抗の安定性から、高価なAu
を主体としたAu−Ag合金及びAu−Pd合金が用い
られている。しかし、このAu−Ag合金やAu−Pd
合金の電気接点をプリント基板に搭載後、基板洗浄時に
超音波洗浄を行なうと、接触部に微摺動が加わり、接点
が粘着による開離不能となる現象が生じたり、リレーや
スイッチを組立後の輸送途中の振動により接点粘着が発
生するという問題があった。2. Description of the Related Art Conventionally, electrical contacts such as small relays and small switches for communication equipment used in a relatively small current range generate little arc when opening and closing, so decomposition occurs when oxides or sulfides are generated on the contact surface. The contact resistance becomes unstable. Therefore, due to the environmental resistance and the stability of contact resistance, expensive Au
Au-Ag alloys and Au-Pd alloys mainly containing are used. However, this Au-Ag alloy and Au-Pd
After mounting the electrical contacts of the alloy on the printed circuit board, if ultrasonic cleaning is performed at the time of cleaning the circuit board, slight contact may be applied to the contact parts, which may cause the contacts to become unable to open due to adhesion, or after the relay or switch is assembled. There was a problem that contact vibration occurred due to the vibration during the transportation.
【0003】[0003]
【発明が解決しようとする課題】そこで本発明は、耐粘
着性に優れ、接触抵抗が低く安定し、耐環境性にも優れ
た通信機用小型リレー、小型スイッチ等の電気接点材料
を提供しようとするものである。Therefore, the present invention provides an electrical contact material such as a small relay for communication equipment, a small switch, etc. which has excellent adhesion resistance, low contact resistance and stability, and excellent environmental resistance. It is what
【0004】[0004]
【課題を解決するための手段】上記課題を解決するため
の本発明の電気接点材料は、Au又はAu合金に、C
a、Mgの少なくとも1種又は希土類元素が微小添加さ
れてなるものである。この電気接点材料に於いて、Au
合金は、Au−Ag合金又はAu−Pd合金であること
が好ましい。また、Ca、Mgの少なくとも1種の添加
量は、 0.005〜 0.5%であることが好ましい。さらに、
希土類元素の添加量は、0.05〜1%であることが好まし
い。そして、希土類元素は、La、Ce、Sm、Nd、
Eu、Gdの少なくとも1種が添加されるのが良い。本
発明の電気接点材料に於いて、Ca、Mgの少なくとも
1種の添加量が0.005〜 0.5%であることが好ましい理
由は、Au又はAu合金の硬さが向上し、耐粘着性の向
上に効果があるからで、 0.005%未満ではその効果が薄
く、 0.5%を超えると溶解による合金が困難となり、ま
たその後の塑性加工に於いて割れ等が発生し、さらには
接触抵抗も不安定となるからである。また、希土類元素
の添加量が0.05〜1%であることが好ましい理由は、A
u又はAu合金の硬さが向上し、耐粘着性の向上に効果
があるからで、0.05%未満ではその効果が薄く、1%を
超えると塑性加工時に割れ等が発生し、また接点開閉動
作により摩耗粉が発生し、この摩耗粉中に含まれる希土
類元素が酸化し、これが接触部に介在すると、接触抵抗
が高く、不安定となるからである。The electrical contact material of the present invention for solving the above-mentioned problems is Au or Au alloy, and C
At least one of a and Mg or a rare earth element is minutely added. In this electrical contact material, Au
The alloy is preferably Au-Ag alloy or Au-Pd alloy. The addition amount of at least one of Ca and Mg is preferably 0.005 to 0.5%. further,
The amount of rare earth element added is preferably 0.05 to 1%. The rare earth elements are La, Ce, Sm, Nd,
At least one of Eu and Gd is preferably added. In the electrical contact material of the present invention, the reason why the addition amount of at least one of Ca and Mg is preferably 0.005 to 0.5% is that the hardness of Au or Au alloy is improved and the adhesion resistance is improved. If it is less than 0.005%, the effect is weak, and if it exceeds 0.5%, alloying due to melting becomes difficult, cracks etc. occur during subsequent plastic working, and contact resistance becomes unstable. Because. The reason why the addition amount of the rare earth element is preferably 0.05 to 1% is because A
This is because the hardness of u or Au alloy is improved and it is effective in improving the adhesion resistance. If it is less than 0.05%, the effect is small, and if it exceeds 1%, cracks etc. occur during plastic working, and contact opening / closing operation. As a result, abrasion powder is generated, the rare earth element contained in the abrasion powder is oxidized, and if it intervenes in the contact portion, the contact resistance becomes high and it becomes unstable.
【0005】[0005]
【作用】上記成分組成の本発明の電気接点材料は、A
u、Au−Ag合金、Au−Pd合金等のAu系材料特
有の粘着性が、Ca、MgやLa、Ce、Sm、Nd、
Eu、Gd等の希土類元素の働きにより効果的に抑制さ
れると共に、Au系材料の接触安定性を阻害することな
く維持でき、しかも有機ガスと反応せず、耐環境性も維
持できるものである。The electrical contact material of the present invention having the above-mentioned composition is A
u, Au-Ag alloy, Au-Pd alloy, and other Au-based material-specific adhesiveness is Ca, Mg, La, Ce, Sm, Nd,
It is effectively suppressed by the action of a rare earth element such as Eu and Gd, and can be maintained without impairing the contact stability of the Au-based material, and further, it does not react with an organic gas and can also maintain environmental resistance. .
【0006】[0006]
【実施例】本発明の電気接点材料の実施例と従来例につ
いて説明する。下記の表1の左欄に示す配合組成比の実
施例1〜6及び従来例1〜3の電気接点材料を溶解鋳造
し、次に伸線加工して線材となし、次いで圧延加工して
テープとなし、然る後Ag−Pd60%のベース材料の上
に張り合せて、幅 1.0mm、高さ 0.6mm、張厚 0.4mmのク
ロスバー接点とした。然して、これら接点を、同種の接
点と対向して組合わせ、接触力15g、微摺動距離 0.2m
m、振動数50Hz、振動時間5分、試験台数各5台にて接
点試験を行った処、下記の表1の右欄に示すような結果
を得た。EXAMPLES Examples and conventional examples of the electrical contact material of the present invention will be described. The electrical contact materials of Examples 1 to 6 and Conventional Examples 1 to 3 having the blending composition ratios shown in the left column of Table 1 below are melt-cast, and then drawn to form a wire, and then rolled to form a tape. After that, it was laminated on a base material of Ag-Pd 60% to form a crossbar contact having a width of 1.0 mm, a height of 0.6 mm and a tension thickness of 0.4 mm. However, these contacts are combined with the same type of contacts facing each other, and the contact force is 15g, and the fine sliding distance is 0.2m.
When a contact test was conducted with m, a vibration frequency of 50 Hz, a vibration time of 5 minutes, and five test units each, the results shown in the right column of Table 1 below were obtained.
【0007】[0007]
【表1】 [Table 1]
【0008】上記の表1の右欄の結果で明らかなように
従来例1〜3の電気接点材料は、接触抵抗が低く安定し
ているものの粘着係数が高く、開離不能が懸念されるの
に対し、実施例1〜9の電気接点材料は、接触抵抗が同
様に低く安定していることは勿論のこと、粘着係数が格
段に低く、耐粘着性に優れていることが判る。As is clear from the results in the right column of Table 1, the electrical contact materials of Conventional Examples 1 to 3 have a low contact resistance and are stable, but have a high adhesion coefficient, and there is a concern that they cannot be separated. On the other hand, it can be seen that the electrical contact materials of Examples 1 to 9 have not only a low contact resistance and stability, but also a significantly low adhesion coefficient and excellent adhesion resistance.
【0009】[0009]
【発明の効果】以上の通り本発明の電気接点材料は、耐
粘着性に優れ、接触抵抗が低く安定し、さらに有機ガス
と反応せず耐環境性に優れるので、従来の通信機用小型
リレー、小型スイッチ用等の電気接点材料にとって代わ
ることができる。As described above, the electric contact material of the present invention has excellent adhesion resistance, low contact resistance and stability, and does not react with organic gas and has excellent environmental resistance. , Can replace electrical contact materials such as for small switches.
Claims (5)
くとも1種又は希土類元素が微小添加されてなる電気接
点材料。1. An electrical contact material comprising at least one of Ca and Mg or a rare earth element minutely added to Au or an Au alloy.
Pd合金であることを特徴とする請求項1記載の電気接
点材料。2. The Au alloy is an Au—Ag alloy or Au—
The electrical contact material according to claim 1, which is a Pd alloy.
0.005〜 0.5%であることを特徴とする請求項1又は2
記載の電気接点材料。3. The addition amount of at least one of Ca and Mg is
It is 0.005-0.5%, Claim 1 or 2 characterized by the above-mentioned.
The described electrical contact material.
ことを特徴とする請求項1又は2記載の電気接点材料。4. The electrical contact material according to claim 1, wherein the amount of the rare earth element added is 0.05 to 1%.
d、Eu、Gdの少なくとも1種であることを特徴とす
る請求項1又は2若しくは4記載の電気接点材料。5. The rare earth element is La, Ce, Sm, N.
The electrical contact material according to claim 1, 2 or 4, wherein the electrical contact material is at least one of d, Eu, and Gd.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6177640A JPH0831253A (en) | 1994-05-11 | 1994-07-06 | Electric contact material |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12194294 | 1994-05-11 | ||
JP6-121942 | 1994-05-11 | ||
JP6177640A JPH0831253A (en) | 1994-05-11 | 1994-07-06 | Electric contact material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0831253A true JPH0831253A (en) | 1996-02-02 |
Family
ID=26459181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6177640A Pending JPH0831253A (en) | 1994-05-11 | 1994-07-06 | Electric contact material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0831253A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6247565B1 (en) * | 1996-07-23 | 2001-06-19 | Commissariat A L'energie Atomique | Composition and process for the reactive brazing of ceramic materials containing alumina |
EP1312687A4 (en) * | 2000-07-03 | 2003-05-21 | Kazuo Ogasa | Hard noble-metal alloy member and process for producing the same |
CN100354038C (en) * | 2005-11-09 | 2007-12-12 | 华东理工大学 | Continuous fluidized bed for gas phase preparing silicon dioxide and its industrial application |
CN100439528C (en) * | 2005-10-28 | 2008-12-03 | 贵研铂业股份有限公司 | New type alloy material |
CN108878179A (en) * | 2018-08-15 | 2018-11-23 | 宁波科扬贵金属合金科技有限公司 | The contact material formula of siller tin oxide exacerbation rare earth |
-
1994
- 1994-07-06 JP JP6177640A patent/JPH0831253A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6247565B1 (en) * | 1996-07-23 | 2001-06-19 | Commissariat A L'energie Atomique | Composition and process for the reactive brazing of ceramic materials containing alumina |
EP1312687A4 (en) * | 2000-07-03 | 2003-05-21 | Kazuo Ogasa | Hard noble-metal alloy member and process for producing the same |
EP1312687A1 (en) * | 2000-07-03 | 2003-05-21 | Kazuo Ogasa | Hard noble-metal alloy member and process for producing the same |
US6913657B2 (en) | 2000-07-03 | 2005-07-05 | Kazuo Ogasa | Hard precious metal alloy member and method of manufacturing same |
US7396424B2 (en) | 2000-07-03 | 2008-07-08 | Kazuo Ogasa | Method of manufacturing a hard precious metal alloy member |
CN100439528C (en) * | 2005-10-28 | 2008-12-03 | 贵研铂业股份有限公司 | New type alloy material |
CN100354038C (en) * | 2005-11-09 | 2007-12-12 | 华东理工大学 | Continuous fluidized bed for gas phase preparing silicon dioxide and its industrial application |
CN108878179A (en) * | 2018-08-15 | 2018-11-23 | 宁波科扬贵金属合金科技有限公司 | The contact material formula of siller tin oxide exacerbation rare earth |
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