JPH06338235A - Electric contact material - Google Patents
Electric contact materialInfo
- Publication number
- JPH06338235A JPH06338235A JP5151172A JP15117293A JPH06338235A JP H06338235 A JPH06338235 A JP H06338235A JP 5151172 A JP5151172 A JP 5151172A JP 15117293 A JP15117293 A JP 15117293A JP H06338235 A JPH06338235 A JP H06338235A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- electric contact
- contact material
- alloy
- adhesion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Contacts (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、比較的小さな電流を開
閉するリレーやスイッチの電気接点に係り、特に電気接
点における粘着を抑制する電気接点材料に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric contact of a relay or a switch that opens and closes a relatively small current, and more particularly to an electric contact material that suppresses adhesion at the electric contact.
【0002】[0002]
【従来の技術と課題】従来、比較的小さな電流を開閉す
る電気接点、例えば小型継電器、小型スイッチは、開閉
時のアーク発生は少ない為、接点表面に酸化物、硫化物
等が生成すると分解できず、接触抵抗が不安定となる。
従って高価なAuを主体としたAu−Ag10wt%合金、
Au−Pd5wt%合金等が使用されていたが、プリント
基板に搭載後、基板洗浄時に超音波洗浄を行なうと、接
点部に微摺動が加わり、接点が粘着により開離不能にな
る現象が生じたり、リレー、スイッチを組立後輸送途中
の振動により接点粘着が発生するという課題があった。2. Description of the Related Art Conventionally, electrical contacts that open and close relatively small currents, such as small relays and small switches, generate less arc when opening and closing, and can be decomposed when oxides, sulfides, etc. are generated on the contact surface. The contact resistance becomes unstable.
Therefore, an Au-Ag 10 wt% alloy mainly composed of expensive Au,
Au-Pd 5wt% alloy was used, but if ultrasonic cleaning is performed at the time of cleaning the board after mounting it on the printed circuit board, a slight sliding force will be applied to the contact point and the contact will become stuck due to sticking. In addition, there is a problem that contact adhesion occurs due to vibration during transportation after assembling the relay and switch.
【0003】[0003]
【発明の目的】前記事情に鑑み、本発明は耐粘着性に優
れた電気接点材料を提供することを目的とするものであ
る。SUMMARY OF THE INVENTION In view of the above circumstances, an object of the present invention is to provide an electric contact material having excellent adhesion resistance.
【0004】[0004]
【発明の構成】上記課題を解決すべく、発明者は、耐粘
着性の優れた電気接点材料について様々な角度から検討
を加えた。その結果、以下の成分及び組成にて解決でき
るに至った。SUMMARY OF THE INVENTION In order to solve the above problems, the inventor has studied from various angles about an electric contact material having excellent adhesion resistance. As a result, the following components and compositions have been solved.
【0005】本発明の電気接点材料の1つは、Ag5〜
30wt%、Pd2〜10wt%、Ni 0.5〜5wt%残部Auの
合金からなることを特徴とするものである。更に、本発
明の電気接点材料の他の1つは、Ag5〜30wt%、Pt
3〜15wt%、Ni 0.5〜5wt%残部Auの合金からなる
ことを特徴とするものである。One of the electrical contact materials of the present invention is Ag5.
It is characterized by being composed of an alloy of 30 wt%, Pd 2 to 10 wt% and Ni 0.5 to 5 wt% balance Au. Furthermore, another one of the electrical contact materials of the present invention is Ag5-30 wt%, Pt.
It is characterized by being composed of an alloy of 3 to 15 wt% and Ni of 0.5 to 5 wt% balance Au.
【0006】[0006]
【作用】上記のように構成された本発明の電気接点材料
によればAu−Ag合金、Au−Pd合金等のAu系材
料特有の粘着性をPdまたはPtおよびNiさらにAg
等の相互作用による相乗効果により効果的に抑制すると
ともに、Au系材料の接触安定性を阻害することなく維
持することとなり目的にみあう電気接点材料が得られる
ものである。According to the electrical contact material of the present invention constructed as described above, the adhesiveness peculiar to Au-based materials such as Au-Ag alloy and Au-Pd alloy is imparted to Pd or Pt and Ni and Ag.
It is possible to obtain an electric contact material that meets the purpose by effectively suppressing the contact stability of the Au-based material without hindering it by a synergistic effect due to the interaction of the above.
【0007】なお、成分組成は以下の通りであることが
好ましい。Agは5wt%未満では、硬さの向上が不十分
で耐粘着性向上の効果が薄く、30wt%を超えると硫化し
てAg2 Sが生成され接触抵抗が不安定となるものであ
る。Pd2wt%未満またはPt3wt%未満では、硬さの
向上が不十分で耐粘着性向上の効果が薄く、Pd10wt%
を超えると、またはPt15wt%を超えると接点部に微摺
動が加わった時、有機ガスとPdまたはPtとが反応し
てブラウンパウダーが生成し、接触抵抗が不安定又は上
昇してしまうものである。Ni 0.5wt%未満では、硬さ
の向上が不十分で耐粘着性向上の効果が薄く、Ni5wt
%を超えると、微摺動時摩耗粉が発生し、この時にNi
が酸化物を作り、接触点に介在した場合に接触抵抗が不
安定になるものである。The component composition is preferably as follows. Ag is less than 5 wt%, in which thin the effect of improving the hardness is insufficient anti-stick improvement, is sulfided exceeds 30 wt% Ag 2 S is produced contact resistance becomes unstable. If the Pd is less than 2 wt% or the Pt is less than 3 wt%, the hardness is insufficiently improved and the effect of improving the adhesion resistance is small.
When Pt exceeds 15 wt% or when Pt exceeds 15 wt%, when fine sliding is applied to the contact portion, the organic gas reacts with Pd or Pt to generate brown powder, and the contact resistance becomes unstable or rises. is there. If the Ni content is less than 0.5 wt%, the hardness is insufficiently improved and the effect of improving the adhesion resistance is small.
%, Abrasion powder will be generated during fine sliding, and at this time Ni
Forms an oxide, and the contact resistance becomes unstable when it intervenes at the contact point.
【0008】更に、Auの含有量が従来に比べ少なくな
ることからコストメリットが得られるものである。な
お、本発明の電気接点材料は、少なくとも最外表接触面
に備わっていれば有効で例えば多層複合電気接点材料と
して使用できるのは勿論であり、その厚さ等は適宜設計
するものである。Further, since the content of Au is smaller than that of the conventional one, cost merit can be obtained. It is needless to say that the electric contact material of the present invention is effective as long as it is provided on at least the outermost surface contact surface, and can be used, for example, as a multilayer composite electric contact material, and its thickness and the like are appropriately designed.
【0009】[0009]
【実施例】以下に実施例、従来例について説明する。実
施例1としてAu66wt%−Ag25wt%−Pd8wt%−N
i1wt%の配合組成比で溶解、鋳造し、伸線加工、テー
プ圧延加工を行なった後、AgPd60wt%の上層に張り
合わせて、巾 1.0mm、高さ 0.6mm、張り厚 0.4mmのクロ
スバー接点とした。また、実施例2としてAu82wt%−
Ag10wt%−Pd4wt%−Ni4wt%の配合組成比とし
た他は、実施例1と同一にしてクロスバー接点とした。
更に実施例3としてAu61wt%−Ag25wt%−Pt12wt
%−Ni2wt%、また実施例4としてAu83wt%−Ag
8wt%−Pt5wt%−Ni4wt%の配合組成比とした他
は、実施例1と同一にしてクロスバー接点とした。EXAMPLES Examples and conventional examples will be described below. As Example 1, Au 66 wt% -Ag 25 wt% -Pd 8 wt% -N
After melting, casting, wire drawing, and tape rolling at a compounding ratio of i1 wt%, and then laminating it to the upper layer of AgPd60 wt%, a crossbar contact with a width of 1.0 mm, a height of 0.6 mm, and a thickness of 0.4 mm was formed. did. Further, as Example 2, Au 82 wt%-
A crossbar contact was made in the same manner as in Example 1 except that the composition ratio was Ag 10 wt% -Pd 4 wt% -Ni 4 wt%.
Furthermore, as Example 3, Au61wt% -Ag25wt% -Pt12wt
% -Ni2 wt%, and as Example 4 Au83 wt% -Ag
A crossbar contact was prepared in the same manner as in Example 1 except that the composition ratio was 8 wt% -Pt 5 wt% -Ni 4 wt%.
【0010】次に、従来例として、AuAg10wt%、従
来例2としてAu−Pd5wt%の配合組成比とした他
は、実施例1と同一にしてクロスバー接点とした。然し
て、同種接点対向の組合せにて、接点力15g、微摺動距
離 0.2mm、振動数50Hz、時間5分、試験台数各5台にて
接点試験を行った結果、以下の評価結果であった。Next, a crossbar contact was made in the same manner as in Example 1 except that the composition ratio of AuAg was 10 wt% as the conventional example and Au-Pd was 5 wt% as the conventional example 2. However, the contact evaluation was as follows as a result of the contact test with a combination of facing contacts of the same kind with a contact force of 15 g, a fine sliding distance of 0.2 mm, a frequency of 50 Hz, a time of 5 minutes, and 5 test units each. .
【0011】[0011]
【表1】 [Table 1]
【0012】以下のように従来例1、2においては接触
抵抗は安定しているものの粘着係数は高く開離不能が懸
念されるのに対し、実施例1〜4においては、接点抵抗
は同様に安定し、かつ粘着係数は格段に低く良好なもの
であった。As described below, in the conventional examples 1 and 2, the contact resistance is stable, but the adhesion coefficient is high and there is a concern that it cannot be separated. In the first to fourth examples, the contact resistance is the same. It was stable and had a significantly low adhesion coefficient and was good.
【0013】[0013]
【発明の効果】以上のように本発明の電気接点材料によ
れば、Au系材料特有の粘着性をPdまたはPtおよび
NiさらにAg等が効果的に抑制しかつAu系材料の接
触安定性を阻害することなく維持できることから接点特
性の良好な従って寿命の長い特性が得られるという優れ
た効果を有するものである。As described above, according to the electric contact material of the present invention, the adhesiveness peculiar to the Au-based material is effectively suppressed by Pd, Pt, Ni and Ag, and the contact stability of the Au-based material is improved. Since it can be maintained without hindrance, it has an excellent effect that good contact characteristics and therefore long life characteristics can be obtained.
Claims (2)
0.5〜5wt%残部Auからなることを特徴とする電気接
点材料。1. Ag 5-30 wt%, Pd 2-10 wt%, Ni
An electrical contact material comprising 0.5 to 5 wt% balance Au.
0.5〜5wt%残部Auからなることを特徴とする電気接
点材料。2. Ag 5-30 wt%, Pt 3-15 wt%, Ni
An electrical contact material comprising 0.5 to 5 wt% balance Au.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5151172A JPH06338235A (en) | 1993-05-28 | 1993-05-28 | Electric contact material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5151172A JPH06338235A (en) | 1993-05-28 | 1993-05-28 | Electric contact material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06338235A true JPH06338235A (en) | 1994-12-06 |
Family
ID=15512892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5151172A Pending JPH06338235A (en) | 1993-05-28 | 1993-05-28 | Electric contact material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06338235A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3024006A1 (en) | 2014-11-19 | 2016-05-25 | Omron Corporation | Limit switch |
-
1993
- 1993-05-28 JP JP5151172A patent/JPH06338235A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3024006A1 (en) | 2014-11-19 | 2016-05-25 | Omron Corporation | Limit switch |
CN105609332A (en) * | 2014-11-19 | 2016-05-25 | 欧姆龙株式会社 | Limit switch |
US9859067B2 (en) | 2014-11-19 | 2018-01-02 | Omron Corporation | Limit switch |
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