JPH08307063A - Electric circuit board and its production - Google Patents

Abstract

PURPOSE: To form a pattern using photolithography technology by composing the electric insulation film in an electric circuit board, having through holes for connecting the electric insulation film with a conductor layer, of a heat- resistant resin formed by resin coating method. CONSTITUTION: Copper is deposited, as a conductor 2, on the entire surface of a ceramic board 1, e.g. an alumina board. A mask pattern of photoresist is then formed by photolithography technology. Subsequently, unnecessary part of the conductor 2 is removed by etching to obtain a desired pattern. After removing the photoresist, a heat-resistant polyimide resin layer 5 is formed by photolithography technology and through holes are made therein before being heat treated. An insulation film is provided using a convenient facility, e.g. a spin coater, and a pattern can be formed using photolithography technology.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric circuit board on which electronic component elements used in an electronic device or the like are mounted to form an electric circuit.

[0002]

2. Description of the Related Art Conventionally, an electric circuit board for mounting an electronic component element used in an electronic device or the like to form an electric circuit includes a multilayer wiring printed board, a ceramic multilayer wiring board,
And thin-film multilayer wiring boards. The multilayer wiring printed circuit board is formed by forming a conductive pattern by etching a copper foil attached to the printed circuit board made of a glass epoxy material, and simultaneously forming a plurality of conductive pattern layers via an insulating resin.

Further, in the ceramic multilayer wiring board, ceramic fine powder and ceramic ink made of a binder resin, and metal fine powder made of silver or the like and metal ink made of a binder resin are alternately printed to form a conductive pattern and overlap each other. After that, the binder resin is sublimated and then the ceramic and the metal are simultaneously burned to produce the resin.

On the other hand, the thin film multi-layer wiring board is a ceramic multi-layer wiring board or a silicon substrate on which a conductive metal and an insulating material are deposited by a thin film deposition technique such as vacuum deposition, sputter deposition, or CVD deposition and photolithography technique. It is manufactured by alternately forming the patterns of the conductor and the insulating film by the etching technique of the constituent materials.

[0005]

However, in the above-mentioned multilayer wiring printed circuit board and ceramic multilayer wiring board, it is difficult to realize miniaturization of the board by fine wiring because the conductor width and the conductor spacing are required to be at least 50 μm or more. It was

On the other hand, the thin-film multi-layer wiring board, which is capable of finer wiring, has the drawback that the film-forming process requires a high cost and becomes a high-priced board.

SUMMARY OF THE INVENTION Therefore, a technical object of the present invention is to provide an electric circuit board and a method of manufacturing the electric circuit board capable of stably producing a high-performance multilayer wiring board capable of fine wiring at a low cost.

[0008]

According to the present invention, at least two conductor layers formed on a ceramic substrate or a silicon substrate, an electric insulating film formed between the conductor layers, and the electric insulating film are formed on the electric insulating film. An electric circuit board having a through hole for electrically connecting the conductor layer, wherein the electric insulating film is made of a heat-resistant resin formed by a resin coating method. To be

According to the present invention, in the electric circuit board, the resin coating method is at least one method selected from coating, dipping, printing, and spray coating. A circuit board is obtained.

Further, according to the present invention, in any one of the electric circuit boards, at least one of the conductor layers is formed by a thin film process selected from at least one of vacuum vapor deposition and sputter vapor deposition. An electric circuit board is obtained.

According to the present invention, in any one of the above-mentioned electric circuit boards, the electric circuit board is mounted with at least one of electronic parts and module parts to form an electric circuit. An electric circuit board is obtained.

According to the present invention, in the electric circuit board, the electronic component is a semiconductor bare chip, a resistor,
An electric circuit board is obtained, which is at least one selected from a capacitor and a coil, and the module component is a hybrid IC (integrated circuit) in which a plurality of the electronic components are mounted.

According to the present invention, in any one of the electric circuit boards described above, the heat resistant resin is a photosensitive resin and the through holes are formed by a photolithography technique. A substrate is obtained.

According to the present invention, in any one of the above-mentioned electric circuit boards, the through hole of the heat resistant resin has a mortar shape, and the conductor film of the through hole has an elevation angle with respect to a central axis direction of the through hole. An electric circuit board having a taper of 30 ° or more is obtained.

Further, according to the present invention, in any one of the above-mentioned electric circuit boards, the heat generation of the component is performed by a metal or a material having excellent thermal conductivity which is installed on the electric circuit or irrespective of the electric circuit. It is possible to obtain an electric circuit board having a structure for reducing a temperature rise of a surface on which components are mounted.

According to the present invention, in any one of the above electric circuit boards, at least a part of the shape and arrangement of the conductor layers of the electric circuit board has a strip line structure, and A ground conductor is arranged as the conductor layer above or below a signal conductor through which an electric signal is passed, via the electric insulating film, and a predetermined conductor width and a distance between the signal conductor and the ground conductor are designed to have a desired characteristic impedance. An electric circuit board is obtained which is characterized in that it is configured.

Further, according to the present invention, in any one of the above-mentioned electric circuit boards, an electric insulation is provided on an upper part or a lower part of a drive conductor through which a direct current or a low frequency current for driving the component in the conductor layer flows. An electric circuit board is obtained in which a ground conductor is arranged as the conductor layer via the electric insulating film having a.

Further, according to the present invention, in the electric circuit board, the electric circuit board is obtained in which the electric insulating film is a metal oxide film.

Further, according to the invention, in the electric circuit board, at least one of the drive conductor and the ground conductor is a plurality of layers, and one of them is sandwiched by the other through the electric insulating film. An electric circuit board is obtained.

Further, according to the present invention, an electric circuit board on which at least two conductor layers connected to each other through the through hole are formed on the ceramic substrate or the silicon substrate through the electric insulating film having the through hole. In the method of manufacturing the electric circuit board, the electric insulating film of the electric circuit board is formed by a resin coating method of heat resistant resin.

According to the present invention, in the method for manufacturing the electric circuit board, the resin coating method is at least one selected from coating, dipping, printing, and spray coating. A method of manufacturing an electric circuit board is obtained.

According to the present invention, in any one of the methods for manufacturing an electric circuit board, at least one of the conductor layers is formed by a thin film process selected from vacuum deposition and sputter deposition. A method of manufacturing a characteristic electric circuit board is obtained.

Further, according to the present invention, in any one of the methods for manufacturing an electric circuit board described above, an electric circuit is formed by mounting at least one of an electronic component and a module component. A method of manufacturing a substrate is obtained.

Further, according to the present invention, in the method of manufacturing an electric circuit board, the electronic component is at least one of a semiconductor bare chip, a resistor, a capacitor, and a coil, and the module component is a plurality of the above. A method for manufacturing an electric circuit board is obtained, which is a hybrid IC on which electronic components are mounted.

Further, according to the present invention, in any one of the above-mentioned methods for manufacturing an electric circuit board, the heat-resistant resin is a photosensitive resin, and the through hole is formed by a photolithography technique. A method of manufacturing a circuit board is obtained.

Further, according to the present invention, in any one of the methods for manufacturing an electric circuit board described above, the through hole of the heat resistant resin has a mortar shape, and the conductor film of the through hole has a central axis of the through hole. Elevation angle 30 to direction
A method for manufacturing an electric circuit board is obtained, which is characterized in that it is formed to have a taper of not less than °.

Further, according to the present invention, in any one of the above-described methods for manufacturing an electric circuit board, the heat generated by the component is placed on the electric circuit or irrespective of the electric circuit, or the metal is excellent in thermal conductivity. A method of manufacturing an electric circuit board is obtained in which the material is formed so as to reduce the temperature rise of the surface on which the component is mounted.

According to the present invention, in any one of the methods for manufacturing an electric circuit board described above, at least a part of the shape and arrangement of the conductor layer of the electric circuit board has a strip line structure, A ground conductor is arranged as the conductor layer above or below a signal conductor through which an electric signal is passed through the electric insulating film, and a predetermined conductor width and a space between the signal conductor and the ground conductor have a desired characteristic impedance. A method of manufacturing an electric circuit board is obtained which is configured to have.

Further, according to the present invention, in the method of manufacturing the electric circuit board, an electric insulating film is formed on the upper or lower part of the drive conductor in the conductor layer through which direct current or low frequency current for driving the component flows. A method for manufacturing an electric circuit board is obtained, in which the ground conductor is arranged as the conductor layer via the conductor layer.

Also, according to the present invention, there is provided a method for manufacturing an electric circuit board, wherein the electric insulating film is a metal oxide film.

Further, according to the present invention, in the method for manufacturing an electric circuit board, at least one of the drive conductor and the ground conductor has a plurality of layers, and one of them is sandwiched by the other via the electric insulating film. A method for manufacturing an electric circuit board is obtained.

Furthermore, according to the present invention, in the method of manufacturing the electric circuit board, the method of manufacturing the electric circuit board is characterized in that the electric insulating film is formed of silicon nitride.

That is, according to the present invention, a plurality of conductor layers are formed on a ceramic substrate such as alumina or a silicon substrate using a thin film process such as vacuum vapor deposition or sputter vapor deposition, and an electrical resistance of a heat resistant resin is formed between the conductor layers. Insulation film is applied,
A semiconductor bare chip or an electronic component such as a resistor, a capacitor, a coil or the like, which is formed by a resin coating method such as dipping, printing or spray coating and has through holes for electrically connecting the upper and lower conductor layers to the electric insulating film. This is an electric circuit board on which a plurality of module parts such as a high frit IC on which individual electronic parts are mounted are mounted to form an electric circuit. Further, in the present invention, the resin has photosensitivity, and the through hole is formed by using a photolithography technique, so that the effect is further obtained.

Further, since the through hole has a mortar-like taper with an elevation angle of 30 ° or more with respect to the vertical direction of the conductor film, factors such as conductor disconnection due to step breakage can be eliminated and a highly reliable and stable product can be obtained. .

Further, in order to conduct heat to the heat generated by the semiconductor chip or the like regardless of the electric circuit pattern or the electric circuit, a material such as a metal having excellent thermal conductivity is installed to realize high density mounting and high reliability. To obtain products with higher performance.

Further, in order to pass a high-speed electric signal, a ground pattern is provided through a conductor pattern dimension and a predetermined interval in accordance with a desired characteristic impedance design, so that signal transmission efficiency is improved, and a conductor such as a semiconductor chip in which a driving current flows is provided. It has a structure in which a ground conductor is placed on the ground to cause electromagnetic noise, and the capacitance between the drive current conductor and the ground conductor is increased by using a very thin metal oxide insulating film. By alternately sandwiching and sandwiching, the electric capacity becomes larger, and the effect of electromagnetic noise countermeasures is further obtained.

[0037]

With the above electric circuit board structure, in the present invention, a fine high-density wiring board can be manufactured in a low cost process, and since the wall surface of the through hole has an inclination, there is no disconnection between the upper and lower conductors. It is possible to realize a high-performance and highly reliable electric circuit board that eliminates defects and also has a heat dissipation structure for heat-generating components.

Further, the above-mentioned electric circuit board has a structure capable of designing a transmission line of a strip line structure, whereby the efficiency of signal transmission is improved, and between the power supply line conductor and the ground conductor for driving the semiconductor chip or the like. A structure that can obtain a large electric capacity is realized, and good measures against electromagnetic noise can be achieved.

[0039]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view of an electric circuit product structure using the electric circuit board according to the first embodiment of the present invention.

In FIG. 1, a ground conductor 2 (hereinafter simply referred to as conductor 2) is formed on a ceramic substrate 1 made of alumina or the like. A heat-resistant insulating resin layer 5 made of polyimide resin having a through hole 5a is formed thereon, and a drive power line conductor 4 (hereinafter, simply referred to as the conductor 4) for driving the conductor 2 and mounted components such as semiconductor transistors is formed thereon. Called) is formed. Further, a heat resistant insulating resin layer 6 similar to the heat resistant insulating resin layer 5 having the through holes 6a and 6b is formed thereon. This heat-resistant insulating resin layer 6
Conductors 2 and 4 are formed on the upper side and on the through holes 6a and 6b. Furthermore, the through holes 7a-
Heat-resistant insulating resin layer 7 made of polyimide resin with 7f
Is provided. Furthermore, the conductors 2 and 4 and the wiring conductor 3 are provided on the heat-resistant insulating resin layer 7 and in the through holes 7a to 7f.
(Hereinafter, simply referred to as the conductor 3) are formed. Further, by covering them, the through holes 8a, 8b, 8
A heat-resistant insulating resin layer 8 made of a polyimide resin having c and 8d is provided. Conductors 2, 3, and 4 are provided thereon, respectively. On the heat-resistant insulating resin layer 8, the semiconductor bare chip 10 and the electronic components 11, 12 and the like are connected to the respective conductors 2, 3, and 4 via the bonding wires 13. The semiconductor bare chip 10 and the electronic components 11 and 12 are coated with a coating resin 9.

Next, a method of manufacturing the electric circuit board of FIG. 1 will be described. In FIG. 1, a conductor 2 is sputter-deposited on a ceramic substrate 1 made of alumina or the like to form a copper film having a thickness of 2 μm on the entire surface of the ceramic substrate 1, and then a mask pattern film made of photoresist is formed by using a photolithography technique. did. After that, an unnecessary portion of the conductor 2 is removed by etching to form a desired pattern, the photoresist film is removed, and then a through hole is formed in the heat resistant insulating resin layer 5 made of polyimide resin by using a photolithography technique, and heat treatment is performed. Filmed After that, the conductor 3 is formed in the same manner as the conductor forming method described above, and the heat-resistant insulating resin layer 6 made of polyimide resin is further formed thereon similarly to the method of forming the heat-resistant insulating resin layer 5, and the conductor 3 and Heat-resistant insulating resin layers 7 and 8 made of a polyimide resin were superposed to form a circuit board.

After that, after mounting the semiconductor bare chip 10 and the electronic components 11 and 12, the semiconductor bare chip 10 is electrically connected by the bonding wire 13, and these are coated with the coating resin 9 to manufacture an electric circuit product.

As described above, in the electric circuit board obtained in the first embodiment, the insulating film, which was conventionally formed by sputtering deposition or the like and patterned by etching, is applied by a simple equipment such as a spin coater. Since it is possible to form a film and form a pattern using photolithography technology, the productivity is dramatically improved and the cost related to the process is reduced.

FIG. 2 is a through-hole 17 of the heat-resistant insulating resin film 15 of the electric circuit board component according to the first embodiment of the present invention.
FIG. 7 is a schematic enlarged cross-sectional view of a connection portion between the wiring conductor and the wiring conductors 14 and 16. In FIG. 2, the through hole 17 of the heat resistant insulating resin film 15 is formed in a mortar shape, and the wall surface is processed so that the elevation angle θ with respect to the vertical direction of the conductor 16 is an angle between 30 ° and 60 °.

In such a structure, the through-holes of the heat-resistant insulating resin layer, which are the joints between the wiring conductors, have a mortar-shaped taper as shown in FIG. 2 and the problems such as disconnection and connection failure at the connection are eliminated. As a result, the yield of products has improved dramatically, and it has been possible to manufacture highly reliable circuit boards.

FIG. 3 is a sectional view provided for explaining the heat dissipation structure of the heat generating component on the electric circuit board according to the first embodiment of the present invention. In FIG. 3, a heat dissipation structure 18 is provided to dissipate heat generated by the heat generating component 21 mounted on the electric circuit board 22.
The heat bath in which the conductor layers and the insulating layers are alternately stacked, or the heat path by the conductor metal shown in the heat dissipation structure 19, or the wiring circuit as shown in the heat dissipation structure 20.
A heat path densely packed in the vicinity of 1 was constructed. As described above, by providing the electric circuit board with the heat path heat dissipation structure, the heat generated by the heat generating component 21 is dissipated through the heat dissipation paths 23, 24, 2.
Since heat can be dissipated in step 5 and the temperature rise on the component mounting surface can be mitigated, problems due to temperature rise in the vicinity of heat-generating components have been eliminated, and a high-performance circuit board that has both high-density mountability and high reliability has been realized.

FIG. 4 is a schematic sectional view for explaining the stripline structure of the electric circuit board according to the first embodiment of the present invention. In FIG. 4, the transmission characteristic impedance of the electric signal line conductor 27 is set to 50Ω or 75Ω,
The thickness and width of the electric signal line conductor 27 inside the electric circuit board 26 and the thickness of the heat-resistant insulating resin layer 29 made of polyimide resin, which is the distance from the ground conductor 28, were controlled.

In this way, a stripline transmission line structure could be realized in order to propagate high-speed electrical signals and the like with higher efficiency.

FIG. 5 is a schematic sectional view for explaining a structure for grounding electromagnetic noise radiated from a power supply line for driving a semiconductor chip or the like of an electric circuit board according to the first embodiment of the present invention. In FIG. 5, a part of the drive power line conductor 33 is formed on the ground conductors 31 and 32 by the metal oxide films 34 and 3.
5, the heat-resistant insulating resin layer 36 or 37 made of polyimide resin is formed by the above-described insulating resin forming method as the method of forming the metal oxide films 34 and 35, and then tantalum is formed. A 1000 angstrom pattern was formed on the film by sputter deposition, photolithography and etching, tantalum was oxidized by anodization, and the electric circuit board 30 was manufactured by the above-mentioned method. The conductors 39 and 40 in the heat resistant insulating resin layer 38 are electric signal line conductors.

As described above, by constructing the structure shown in FIG. 5 for the electromagnetic noise due to the power supply line, etc., a very large capacity bypass capacitor can be provided and unnecessary noise can be grounded very effectively. And a highly reliable electric circuit board has been realized.

FIG. 6 is a sectional view of the electric circuit product structure using the electric circuit board according to the second embodiment of the present invention. Figure 6
In, a ground conductor 2 (hereinafter simply referred to as a conductor 2) is formed on a ceramic substrate 1 such as a Si wafer or alumina which is not doped with impurities. in addition,
A heat resistant insulating resin layer 5 made of silicon nitride (Si ₃ N ₄ ) having a through hole 5b is formed, and a conductor 2 and a drive power line conductor 4 (hereinafter, simply referred to as a drive power line conductor for driving a mounted component such as a semiconductor transistor) thereon. (Referred to as conductor 4) is formed. Furthermore, on it, through holes 6c and 6d
A heat-resistant insulating resin layer 6 made of a polyimide resin having a is formed. Conductors 2 and 4 are formed on the heat-resistant insulating resin layer 6 and on the through holes 6c and 6d. Furthermore, a heat-resistant insulating resin layer 7 made of polyimide resin having through holes 7h to 7j is provided thereon. Further, on the heat-resistant insulating resin layer 7 and through holes 7
The conductors 2 and 4 and the wiring conductor 3 (hereinafter, simply referred to as the conductor 3) are formed on h to 7j, respectively. Further, a heat resistant insulating resin layer 8 made of polyimide resin having through holes 8f to 8h is provided so as to cover them. Conductors 2, 3, and 4 are provided thereon, respectively. further,
A heat-resistant insulating resin layer 51 is provided on the heat-resistant insulating resin layer 8, and conductors 2, 3, and 4 are provided in the same manner as described above. Electronic components 54, 5 are provided on the conductors 2, 3, 4
5, 56 are provided respectively. These electronic components 54, 55 and 56 are coated with the coating resin 9 as in the first embodiment shown in FIG. Incidentally, reference numeral 57,
Reference numerals 58 and 59 denote a ground terminal, a power supply terminal and a signal line input terminal, respectively.

Next, a method for manufacturing the electric circuit board of FIG. 6 will be described. In FIG. 6, a conductor 2 is sputter-deposited on a ceramic substrate 1 such as alumina to form a copper film having a thickness of 2 μm on the entire surface of the ceramic substrate 1. Next, Si ₃ N
_A heat resistant insulating resin layer 5 made of ₄ was formed by using a photolithography technique to form through holes 5b and using a sputter deposition method. After that, the conductor 4 is formed in the same manner as the above-described conductor forming method, and the heat-resistant insulating resin layers 6 and 7 made of a polyimide resin are further formed thereon, and the heat-resistant insulating resin made of the conductor 3 and the polyimide resin is also formed. Layers 8 and 5
1 was superposed and formed. After forming the conductors 2, 3 and 4, respectively, and removing a part of them by etching, the peripheral portion is filled with the heat-resistant insulating resin layer 51, and the electronic component 5 is formed as in the first embodiment.
4, 55, and 56 were mounted and electrically connected by the bonding wire 13, and these were coated with the coating resin 9 (not shown) in the same manner as in Example 1 to manufacture an electric circuit product.

Although Si ₃ N ₄ is used as the heat-resistant insulating resin layer 5 in the above-mentioned embodiment, silicon dioxide (Si
O ₂ ) can be used. However, Si ₃ N ₄
Compared with SiO ₂ , it has a dielectric constant more than twice, has a high dielectric breakdown voltage, a high withstand voltage between conductors 2 and 4, and has a large capacity, so it can be used as a bypass capacitor. Si ₃ N ₄ is preferred. In addition, Si ₃
The N ₄ film is denser than SiO ₂ or the like, has no hygroscopicity, and can form a bypass capacitor that is resistant to moisture. Further, since Si ₃ N ₄ can form a dense thick film as compared with tantalum oxide or the like, a bypass capacitor having a relatively high withstand voltage and being hardly broken can be obtained.

As the method for forming the heat resistant insulating resin layer 5, sputter deposition was used, but it can be formed by the CVD method.

Although the alumina substrate is used in this embodiment, the same effects of the present invention can be obtained by using any ceramic substrate, silicon substrate, glass substrate, plastic substrate or other materials. Needless to say. Further, the conductor material is copper in the present embodiment, but the effect of the present invention can be obtained equally with any material through which electricity flows. Further, although the polyimide resin is used as the heat-resistant insulating resin in this embodiment, the same effect can be obtained as long as the structure of the present invention can be obtained with any material. Further, regarding the metal oxide film, even if any metal oxide film is applied by any manufacturing method, the effect of the present invention can be obtained regardless of the magnitude of the effect.

[0057]

As described above, according to the present invention,
The insulating film, which was conventionally formed by sputtering deposition and formed by etching, can be applied by a simple facility such as a spin coater to form a pattern using photolithography technology, which dramatically improves productivity. In addition, it is possible to provide an electric circuit board and a method for manufacturing the electric circuit board that can reduce the cost required for the process.

Further, according to the present invention, the through hole of the insulating resin layer, which is a joint between wiring conductors, has a mortar-like taper, and problems such as disconnection and connection failure at the connection portion are solved, and the product is dramatically improved. It is possible to provide an electric circuit board and a method for manufacturing the electric circuit board, which can improve the yield and realize the manufacture of a highly reliable circuit board.

Further, according to the present invention, the electric circuit board,
With the heat-path heat dissipation structure, the heat generated by the heat-generating components can be radiated through the heat-dissipating path, and the temperature rise on the component mounting surface can be mitigated. It is possible to provide an electric circuit board that can realize a high-performance circuit board and a manufacturing method thereof.

Further, according to the present invention, a stripline transmission line structure is realized in order to propagate a high-speed electric signal or the like with higher efficiency, and a bypass capacitor having a very large capacity for electromagnetic noise due to a power supply line or the like can be provided. Since the unnecessary noise is grounded very effectively, it is possible to provide an electric circuit board capable of realizing an electric circuit board having high performance and high reliability, and a manufacturing method thereof.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of an electric circuit product configuration using an electric circuit board according to a first embodiment of the present invention.

FIG. 2 is a schematic enlarged cross-sectional view of a through hole of a heat-resistant insulating resin, a wiring conductor, and a connecting portion of the electric circuit board according to the first embodiment of the present invention.

FIG. 3 is a cross-sectional view provided for explaining the heat dissipation structure of the heat generating component on the electric circuit board according to the first embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view illustrating a stripline structure of the electric circuit board according to the first embodiment of the present invention.

FIG. 5 is a schematic cross-sectional view provided for explaining a structure for preventing electromagnetic noise radiated from the power supply line of the electric circuit board according to the first embodiment of the present invention.

FIG. 6 is a cross-sectional view of an electric circuit product configuration using the electric circuit board according to the second embodiment of the present invention.

[Explanation of symbols]

1 Ceramic Substrate 2, 28, 31, 32 (Ground) Conductor 3, 14, 16 (Wiring) Conductor 4, 33 (Drive Power Supply Line) Conductor 5, 6, 7, 8, 15, 29a, 29b, 29c, 3
6,37,38,51 Heat-resistant insulating resin layer 9 Coating resin 10 Semiconductor bare chip 11,12,54,55,56 Electronic component 13 Bonding wire 17 Through hole 18,19,20 Heat dissipation structure 21 Heating component 22,26,30 Electric Circuit board 23, 24, 25 Heat dissipation path 27, 39, 40 Electric signal line conductor 34, 35 Metal oxide film

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location B05D 7/00 B05D 7/00 H H01L 21/768 H01L 21/90 B

Claims (25)

[Claims] 1. A method for electrically connecting at least two conductor layers formed on a ceramic substrate or a silicon substrate, an electric insulation film formed between the conductor layers, and the electric insulation film to the conductor layers. An electric circuit board having a through hole, wherein the electric insulating film is made of a heat-resistant resin formed by a resin coating method. 2. The electric circuit board according to claim 1, wherein the resin coating method is at least one method selected from coating, dipping, printing, and spray coating. 3. The electric circuit board according to claim 1, wherein at least one of the conductor layers is formed by a thin film process selected from at least one of vacuum vapor deposition and sputter vapor deposition. An electric circuit board characterized by. 4. The electric circuit board according to claim 1, wherein at least one of an electronic component and a module component is mounted on the electric circuit substrate to form an electric circuit. An electric circuit board characterized in that 5. The electric circuit board according to claim 4,
The electronic component is at least one selected from a semiconductor bare chip, a resistor, a capacitor, and a coil, and the module component is a hybrid IC in which a plurality of the electronic components are mounted. substrate. 6. The electric circuit board according to claim 1, wherein the heat resistant resin is a photosensitive resin, and the through holes are formed by a photolithography technique. Electric circuit board. 7. The electric circuit board according to claim 1, wherein the through hole of the heat resistant resin has a mortar shape, and the conductor film of the through hole extends in a central axis direction of the through hole. On the other hand, an electric circuit board having a taper with an elevation angle of 30 ° or more. 8. The electric circuit board according to any one of claims 4 to 7, wherein a metal or a material having excellent thermal conductivity is installed on the electric circuit for generating heat of the component or irrespective of the electric circuit. An electric circuit board having a structure for reducing a temperature rise of a surface on which the component is mounted. 9. The electric circuit board according to claim 1, wherein at least a part of the shape and arrangement of the conductor layer of the electric circuit board is a strip line structure, A ground conductor is arranged as the conductor layer above or below a signal conductor through which an electric signal is passed through the electric insulating film, and a predetermined conductor width and a distance between the signal conductor and the ground conductor are set to a desired characteristic impedance. An electric circuit board that is designed and configured. 10. The electric circuit board according to any one of claims 4 to 9, wherein an electric circuit is provided above or below a drive conductor in which a DC or low-frequency current for driving the component in the conductor layer flows. An electric circuit board, wherein a ground conductor is arranged as the conductor layer via the electrically insulating film having an insulating property. 11. The electric circuit board according to claim 10, wherein the electric insulating film is a metal oxide film. 12. The electric circuit board according to claim 11, wherein at least one of the drive conductor and the ground conductor is a plurality of layers, and one is sandwiched by the other via the electric insulating film. And electrical circuit board. 13. A method for manufacturing an electric circuit board, comprising: forming on a ceramic substrate or a silicon substrate at least two conductor layers connected via the through holes via an electric insulating film having through holes. A method of manufacturing an electric circuit board, characterized in that the electric insulating film of the electric circuit board is formed by a resin coating method of heat resistant resin. 14. The method of manufacturing an electric circuit board according to claim 13, wherein the resin coating method is at least one selected from coating, dipping, printing, and spray coating. Production method. 15. The method of manufacturing an electric circuit board according to claim 13, wherein at least one of the conductor layers is formed by a thin film process selected from vacuum deposition and sputter deposition. Manufacturing method of electric circuit board. 16. The method for manufacturing an electric circuit board according to claim 13, wherein at least one of an electronic component and a module component is mounted to form an electric circuit. Manufacturing method of electric circuit board. 17. The method of manufacturing an electric circuit board according to claim 16, wherein the electronic component is at least one of a semiconductor bare chip, a resistor, a capacitor, and a coil, and the module component is a plurality of the electronic components. A method for manufacturing an electric circuit board, wherein the method is a hybrid IC mounted with. 18. The method for manufacturing an electric circuit board according to claim 13, wherein the heat-resistant resin is a photosensitive resin, and the through holes are formed by a photolithography technique. Method for manufacturing electric circuit board. 19. The method for manufacturing an electric circuit board according to claim 13, wherein the through hole of the heat resistant resin has a mortar shape, and the conductor film of the through hole is formed of the through hole. A method for manufacturing an electric circuit board, which is formed so as to have a taper with an elevation angle of 30 ° or more with respect to a central axis direction. 20. The method of manufacturing an electric circuit board according to claim 13, wherein the heat generated by the component is installed on the electric circuit or independently of the electric circuit. A method of manufacturing an electric circuit board, which is formed by using an excellent material so as to reduce a temperature rise of a surface on which the component is mounted. 21. The method of manufacturing an electric circuit board according to claim 13, wherein at least a part of the shape and arrangement of the conductor layer of the electric circuit board has a strip line structure, A ground conductor is arranged as the conductor layer above or below the signal conductor through which an electric signal is passed in the conductor layer through the electric insulation film, and a predetermined conductor width and a space between the signal conductor and the ground conductor have desired characteristics. A method of manufacturing an electric circuit board, which is configured to have impedance. 22. The method of manufacturing an electric circuit board according to claim 21, wherein a direct-current or low-frequency current for driving the component in the conductor layer flows through an electric insulating film above or below the drive conductor. A method of manufacturing an electric circuit board, wherein the ground conductor is arranged as a conductor layer. 23. The method of manufacturing an electric circuit board according to claim 22, wherein the electric insulating film is a metal oxide film. 24. The method for manufacturing an electric circuit board according to claim 22, wherein at least one of the drive conductor and the ground conductor has a plurality of layers, and one of the drive conductor and the ground conductor is sandwiched by the other via the electric insulating film. And a method for manufacturing an electric circuit board. 25. The method of manufacturing an electric circuit board according to claim 22, wherein the electric insulating film is formed of silicon nitride.