JPH08306857A - Protective structure of circuit pattern in integrated circuit - Google Patents

Abstract

PURPOSE: To prevent direct contact of a circuit pattern formed in an integrated circuit with other members like a collet portion of an automatic mounter, so as to realize protection of the circuit pattern in a mounting process of the integrated circuit and improvement in yield of the integrated circuit in a production process. CONSTITUTION: In an integrated circuit 10 having a circuit pattern formed on the surface of a substrate 102, a protective layer 14 made of an insulating material having a height greater than the height of the highest portion of the circuit pattern is formed on a metal electrode of the circuit pattern on the surface of the substrate 102.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit pattern protection structure in an integrated circuit, and more particularly to a monolithic microwave integrated circuit including a resistor, an inductor or a capacitor as a constituent element and used in the field of communication. Circuit (Monolithic

Microwave Integrate
d Circuit: MMIC) and microwave IC (M
microwave Integrated Circuit
The present invention relates to a circuit pattern protection structure in an integrated circuit suitable for use in an integrated circuit for microwaves such as it: MIC).

[0003]

2. Description of the Related Art Generally, microwave integrated circuits such as MMIC and MIC include resistors, inductors or capacitors as constituent elements, and the resistors, inductors or capacitors described above are appropriately formed by a multilayer wiring structure. It is done like this.

FIG. 4 shows an explanatory view of a cross-sectional structure of an example of such an integrated circuit for microwaves, but the integrated circuit 100 should be in contact with other wiring formed on the surface of the substrate 102. A circuit pattern is formed using an air bridge (in-air wiring) 104 for performing appropriate wiring without using the above, a thin film laminated structure 106 in which thin films are laminated, and the like, and the substrate 1
A capacitor, an inductor, etc. are formed on 02.

[0005]

By the way, in the mounting process of the integrated circuit 100 having the circuit pattern having the air bridge 104 and the thin film laminated structure 106 as shown in FIG. 4, the integrated circuit is integrated in the collet part 200 of the automatic mounter. The circuit 100 is sucked and the integrated circuit 100 is moved.

Therefore, the circuit pattern may be destroyed by the direct contact between the circuit pattern formed on the surface of the substrate 100 and the collet portion 200, which may cause a decrease in the yield of the integrated circuit in the production process. There was a problem that it had become.

In particular, since the air bridge 104 formed so as to rise above the substrate 102 has low mechanical strength, the integrated circuit 100 has the collet portion 20 of the automatic mounter.
When the air bridge 104 is crushed downward due to the pressure F relatively generated when it is adsorbed to 0, and the air bridge 104 is crushed downward and short-circuited with another wiring, such an integrated circuit 100 must be discarded. Didn't get

Further, when the air bridge 104 is crushed, the above-mentioned pressure F is applied to the thin film laminated structure 106.
Then, the thin films forming the thin film laminated structure 106 having low mechanical strength are damaged and the thin film laminated structure 106 is destroyed, and such an integrated circuit 100 must be discarded.

The present invention has been made in view of the above-mentioned various problems of the prior art, and an object thereof is a circuit pattern formed on an integrated circuit and a collet portion of an automatic mounter. The circuit pattern in the integrated circuit is designed to prevent direct contact with other members such as, to protect the circuit pattern in the mounting process of the integrated circuit and to improve the yield of the integrated circuit in the production process. It is intended to provide a protective structure of.

[0010]

In order to achieve the above-mentioned object, a circuit pattern protective structure in an integrated circuit according to the present invention is a circuit pattern protection structure for an integrated circuit in which a circuit pattern is formed on a substrate surface. The protective layer having a height higher than the height of the highest portion of the circuit pattern is formed on the portion not formed.

When the protective layer is formed on the surface of the substrate, the protective layer is formed in a ring shape around the circuit pattern,
The circuit pattern may be surrounded by the protective layer.

Further, in an integrated circuit having a circuit pattern formed on the surface of the substrate, a protective layer higher than the height of the highest portion of the circuit pattern may be formed at a portion on the circuit pattern on the surface of the substrate.

Further, when forming the protective layer on the portion on the circuit pattern, it may be formed on the portion having high strength on the circuit pattern.

Here, the high-strength portion on the circuit pattern is not a portion having a relatively low mechanical strength such as an air bridge or a thin film laminated structure, but is, for example, a thick film portion or a substrate surface. It is a part having a relatively high mechanical strength such as a metal electrode part formed on.

As described above, by forming the protective layer higher than the height of the circuit pattern on the surface of the substrate of the integrated circuit,
For example, the contact surface when the integrated circuit is adsorbed by the collet part of the automatic mounter becomes a protective layer, preventing direct contact between the collet part of the automatic mounter and the circuit pattern,
The circuit pattern can be protected.

As a material for the protective layer, an insulating material or a metal material can be appropriately selected and used.

When the material of the portion where the protective layer is formed is an insulating material, even if a conductive metal material is used as the protective layer, the electric power of the portion where the protective layer is formed is provided by providing the protective layer. Since it does not affect the physical characteristics,
A metal material can be used as the material of the protective layer.

When the material of the portion where the protective layer is formed is an insulating material, it goes without saying that an insulating material may be used as the material of the protective layer.

On the other hand, when the material of the portion where the protective layer is formed is a conductive material such as a metal material, if a conductive metal material is used as the protective layer, the protective layer is formed by providing the protective layer. An insulating material is used as the material of the protective layer because it may affect the electrical characteristics of the exposed portion.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A circuit pattern protection structure in an integrated circuit according to the present invention will be described below in detail with reference to the drawings.

It should be noted that, in order to facilitate understanding of the present invention and to simplify the description, the same or corresponding components as those in FIG. 4 are designated by the same reference numerals as those in FIG.

FIG. 1 is an explanatory view showing a cross-sectional structure of an integrated circuit in which a circuit pattern protection structure is implemented in the integrated circuit according to the first embodiment of the present invention. A circuit pattern is formed by the air bridge 104, the thin film laminated structure 106, and the like, and a protective layer 14 is formed to project on the metal electrode 12 which is a high-strength portion of the circuit pattern formed on the upper surface of the substrate 102. Has been done.

The protective layer 14 is formed so as to protrude to a height L2 higher than the height L1 of the highest portion of the circuit pattern formed on the surface of the substrate 102.

Further, in order to prevent the metal electrode 12 from being electrically affected, the protective layer 14 is made of an insulating material. The insulating material has an insulating property and has a predetermined thickness. Those that can be formed are preferred.

In the above structure, when the integrated circuit 10 is adsorbed by the collet part 200 of the automatic mounter in the mounting process of the integrated circuit 10, the collet part 200 and the protective layer 14 come into contact with each other, and the circuit pattern is formed. The collet portion 200 does not directly contact with the collet portion 200.

Therefore, the circuit pattern and the collet portion 20
Since the destruction of the circuit patterns such as the air bridge 104 and the thin film laminated structure 106 due to the contact with 0 can be prevented, the yield of the integrated circuit 10 in the production process can be improved.

FIG. 2 is an explanatory view showing a sectional structure of an integrated circuit in which a circuit pattern protection structure in the integrated circuit according to the second embodiment of the present invention is implemented.
, The air bridge 10 is provided on the upper surface of the substrate 102.
4, a thin film laminated structure 106 and the like form a circuit pattern, and a protective layer 22 is formed so as to project on the air bridge 104 and the thin film laminated structure 106.

It is desirable that the protective layer 22 does not have an electrical influence on the circuit pattern and can be formed to have a predetermined thickness and has elasticity, for example, polyimide of an organic material. Can be used.

In this integrated circuit 20, since the protective layer 22 can be grasped and moved by an appropriate instrument 300, the handling property of the integrated circuit 20 can be remarkably improved.

The pressure and impact applied to the protective layer 22 when the instrument 300 grips the protective layer 22 is absorbed by the protective layer 22 due to the cushioning action of the elastic force of the protective layer 22, so that the pressure and the impact cause the air to flow.・ Bridge 10
4 and the thin film laminated structure 106 are not affected and destroyed, and the circuit pattern is protected. For this reason,
The yield of the integrated circuit 10 in the production process can be improved.

FIG. 3 is a plan view showing a schematic structure of an integrated circuit in which a circuit pattern protection structure in an integrated circuit according to a third embodiment of the present invention is implemented. In the integrated circuit 30, a circuit pattern is formed. A columnar protective layer 32 and a ring-shaped protective layer 34 are provided on the surface of the formed substrate 102 where the circuit pattern is not formed.

That is, the columnar protective layer 32 is disposed in the gap between the circuit patterns on the surface of the substrate 102, and the ring-shaped protective layer 34 is disposed so as to surround the circuit pattern.

The columnar protective layer 32 and the ring-shaped protective layer 34 are formed on the surface of the substrate 102 by an insulating material, similarly to the protective layers 14 and 22 in the first and second embodiments described above. It is formed so as to project to a height higher than the height of the highest portion of the formed circuit pattern.

Therefore, when the integrated circuit 30 is attracted to the collet portion of the automatic mounter in the mounting process of the integrated circuit 30, the collet portion and the columnar protective layer 32 and the ring-shaped protective layer 34 are in contact with each other. Therefore, the circuit pattern and the collet portion do not come into direct contact with each other.

Therefore, the circuit pattern is prevented from being broken due to the contact between the circuit pattern and the collet portion.
The yield of the integrated circuit 30 in the production process can be improved.

In each of the embodiments described above, the protective layers 14, 22, 32, 3 for protecting the circuit pattern are provided.
4 is formed of an insulating material, but a metal material is used when there is no risk of electrically affecting the circuit pattern, for example, when a protective layer is formed on the insulating film formed on the substrate 102. You may form a protective layer using.

[0037]

Since the present invention is constructed as described above, it prevents direct contact between the circuit pattern formed on the integrated circuit and other members such as the collet portion of the automatic mounter. It is possible to secure the protection of the circuit pattern in the mounting process of the integrated circuit,
It has an excellent effect that the yield of the integrated circuit in the production process can be remarkably improved.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a cross-sectional structure of an integrated circuit in which a circuit pattern protection structure is implemented in the integrated circuit according to the first embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a cross-sectional structure of an integrated circuit in which a circuit pattern protection structure in the integrated circuit according to the second embodiment of the present invention is implemented.

FIG. 3 is a plan view showing a schematic configuration of an integrated circuit having a circuit pattern protection structure in the integrated circuit according to the third embodiment of the present invention.

FIG. 4 is an explanatory diagram showing a cross-sectional structure of an example of a conventional integrated circuit for microwaves.

[Explanation of symbols]

10, 20, 30, 100 Integrated circuit 12 Metal electrode 14, 22, 32, 34 Protective layer 102 Substrate 104 Air bridge 106 Thin film laminated structure 200 Collet part 300 Instrument

Claims (6)

[Claims] 1. An integrated circuit having a circuit pattern formed on a substrate surface, wherein a protective layer having a height higher than a height of the highest portion of the circuit pattern is formed on a portion of the substrate surface where the circuit pattern is not formed. A protection structure for a circuit pattern in an integrated circuit characterized by the above. 2. The protection structure for a circuit pattern in an integrated circuit according to claim 1, wherein the protection layer is formed in a ring shape around the circuit pattern, and the protection layer surrounds the circuit pattern. 3. An integrated circuit having a circuit pattern formed on a surface of a substrate, wherein a protective layer having a height higher than a height of the highest portion of the circuit pattern is formed on a portion of the substrate surface on the circuit pattern. Circuit pattern protection structure for integrated circuits. 4. An integrated circuit having a circuit pattern formed on a substrate surface, wherein a protective layer having a height higher than a height of the highest portion of the circuit pattern is formed on a portion of the substrate surface having a high strength on the circuit pattern. A protection structure for a circuit pattern in an integrated circuit characterized by the above. 5. The protective structure for a circuit pattern in an integrated circuit according to claim 1, 2, 3 or 4, wherein the protective layer is made of an insulating material. 6. The protection structure for a circuit pattern in an integrated circuit according to claim 1, wherein the protection layer is made of a metal material.