JPH08302422A - Heat treatment for inside wall surface of hole and device therefor - Google Patents

Abstract

PURPOSE: To provide a heat treatment device for the inside wall surfaces of a hole with which the depth of a heat treatment is exactly obtd. and the heat treatment does not exert the unnecessary influence on other parts. CONSTITUTION: The temp. TIN of the inside wall surface of a water cooling hole 12 formed in a metal mold 10 is so controlled by an inside wall surface temp. control means 74 that the inside wall surfaces of the water cooling hole 12 attains a preset annealing temp. TAN at the time of heat treating the branching part 16 of the water cooling hole 12. Besides, the target temp. TOUTT of the outside wall surfaces of the metal mold 10 is calculated in accordance with the preset annealing temp. TAN, the treatment depth DAN and the heat radiation characteristics of the metal mold 10 by a means 68 for calculating the target temp. of the outside wall surfaces. The temp. of the outside wall surfaces of the metal mold 10 is so controlled by a means 72 for controlling the temp. of the outside wall surfaces that the temp. TOUT of the outside wall surfaces of the metal mold 10 attains the target temp. TOUTT of the outside wall surfaces of the metal mold 10. Then, the depth of the heat treatment of the inside wall surfaces of the water cooling hole 12 is controlled to the preset value DAN with good accuracy and the heat treatment does not exert the influence on the other parts in the metal mold 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat treatment method and apparatus for a hole inner wall surface for heat treating an inner wall surface of a hole formed in a predetermined member.

[0002]

2. Description of the Related Art When heat treatment such as quenching or annealing is performed on the inner wall surface of a hole formed in a predetermined member,
An inner wall surface heating device is used to heat the inner wall surface of the hole to a predetermined heat treatment temperature for a predetermined time. For example, in order to prevent heat cracks in the branched portion of the water cooling hole formed in the die for aluminum die casting, that portion is annealed.

[0003]

By the way, in the above heat treatment method, since the inner wall surface of the hole is exclusively heated to a predetermined heat treatment temperature for a predetermined time, only the depth of the heat treatment varies. However, there was a possibility that the influence of the heat treatment would extend to other parts and change the hardness unnecessarily.

The present invention has been made in view of the above circumstances, and an object thereof is to obtain an accurate depth of heat treatment and to prevent the influence of heat treatment from reaching other portions unnecessarily. To provide a heat treatment apparatus for use.

[0005]

A first object of the present invention to achieve the above object is to provide a heat treatment method for hole inner wall surface for heat treating the inner wall surface of a hole formed in a predetermined member. And (a) an inner wall surface temperature control step of controlling the temperature of the inner wall surface of the hole so that the inner wall surface of the hole has a preset heat treatment temperature, and (b) a preset heat treatment temperature and heat treatment. An outer wall target temperature calculation step of calculating a target temperature of the outer wall surface of the predetermined member based on the depth and the heat dissipation characteristics of the predetermined member, and (c) the temperature of the outer wall surface of the predetermined member is And an outer wall surface temperature adjusting step of controlling the temperature of the outer wall surface of the predetermined member so that the target temperature of the outer wall surface is calculated by the outer wall target temperature calculating step.

[0006]

In this way, the inner wall surface temperature control step controls the temperature of the inner wall surface of the hole so that the inner wall surface of the hole reaches the preset processing temperature, while the outer wall surface target temperature is calculated. By the process, the target temperature of the outer wall surface of the predetermined member is calculated based on the preset processing temperature, the processing depth, and the heat radiation characteristics of the predetermined member, and by the outer wall surface temperature adjusting step, The temperature of the outer wall surface of the predetermined member is controlled so that the temperature of the outer wall surface of the predetermined member becomes the target temperature of the outer wall surface calculated in the outer wall target temperature calculating step.

[0007]

Therefore, according to the present invention, the predetermined temperature of the predetermined member is adjusted so that the target temperature calculated based on the preset processing temperature, the processing depth, and the heat radiation characteristics of the predetermined member. Since the temperature of the outer wall surface is controlled, the heat treatment depth of the inner wall surface of the hole can be accurately obtained to a preset value, and the influence of the heat treatment does not affect other portions.

[0008]

A second aspect of the present invention is an apparatus for suitably carrying out the method invention. The object of the invention is to provide a hole inner wall surface for heat-treating the inner wall surface of a hole formed in a predetermined member. A heat treatment apparatus, (a) an inner wall surface heating device for heating the inner wall surface of the hole to a predetermined heat treatment temperature,
(b) an outer wall surface cooling device for cooling the outer wall surface of the predetermined member, and (c) an inner wall surface heating device for controlling the inner wall surface heating device so that the inner wall surface of the hole has a preset heat treatment temperature. Wall surface temperature control means, and (d) Outer wall surface target temperature calculation for calculating the target temperature of the outer wall surface of the predetermined member based on the preset heat treatment temperature, heat treatment depth, and heat dissipation characteristics of the predetermined member. And (e) outer wall surface temperature adjusting means for controlling the outer wall surface cooling device so that the temperature of the outer wall surface of the predetermined member becomes the target temperature of the outer wall surface calculated by the outer wall target temperature calculating means. And are included.

[0009]

In this way, the inner wall surface temperature control means controls the temperature of the inner wall surface of the hole so that the inner wall surface of the hole reaches the preset processing temperature, while the outer wall surface target temperature is calculated. The means calculates the target temperature of the outer wall surface of the predetermined member on the basis of the preset processing temperature, the processing depth, and the heat radiation characteristics of the predetermined member, and the outer wall surface temperature adjusting means calculates the target temperature. The temperature of the outer wall surface of the predetermined member is controlled so that the temperature of the outer wall surface of the predetermined member becomes the target temperature of the outer wall surface calculated by the outer wall target temperature calculating means.

[0010]

Therefore, according to the present invention, the predetermined temperature of the predetermined member can be adjusted so that the target temperature calculated based on the preset processing temperature, the processing depth, and the heat radiation characteristic of the predetermined member. Since the temperature of the outer wall surface is controlled, the heat treatment depth of the inner wall surface of the hole can be accurately obtained to a preset value, and the influence of the heat treatment does not affect other portions.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.

FIG. 1 shows a water cooling hole 12 formed in a mold 10.
It is a figure which shows the deep hole heat treatment apparatus 14 which heat-treats (annealing treatment) the inner wall surface of the branch part in order to improve the heat crack resistance of the inner wall surface of the branch part. The mold 10 is
For example, a tool steel die for aluminum die casting as shown in FIG. 2 is annealed to prevent generation of heat cracks due to thermal stress on the inner wall surface of the branch portion 16 of the water cooling hole 12. Processing is performed. The water cooling hole 12 is a deep hole having a dimension in the axial direction, that is, a depth that is sufficiently larger than its diameter.

The deep hole heat treatment device 14 is an inner wall surface heating device 20 for heating the inner wall surface of the branch portion 16 which is the water cooling hole 12 of the mold 10, and the temperature of the outer wall surface of the mold 10 by cooling. To adjust the temperature of the inner wall surface of the water cooling hole 12 and the temperature of the outer wall surface of the mold 10 to adjust the inner wall surface of the branch portion 16 of the water cooling hole 12. And a temperature control device 24 for performing a desired heat treatment.

The inner wall surface heating device 20 includes the water cooling hole 1
2, a long high-frequency induction heating coil 26 bent in a flat loop shape to be inserted into the second high-frequency induction heating coil 26, and a high-frequency power supply device 28 that supplies high-frequency power of 200 kHz or more to the high-frequency induction heating coil 26, In accordance with a command from the temperature control device 24, the inner wall surface of the water cooling hole 12 is high frequency heated by the skin effect. The high frequency induction heating coil 26 is, for example, as shown in FIG. 3, FIG. 4 and FIG.
A metal pipe having a circular cross section is bent, and when used, a cooling medium such as water is circulated therein.

Further, the outer wall surface cooling device 22 is composed of a heat insulating wall and houses the mold 10, and a blower 32 for blowing cooling air into the temperature tank 30.
A drive circuit 34 that changes the amount of air blown by the blower 32 by changing the drive signal supplied to the blower 32, and adjusts the outer wall surface temperature of the mold 10 according to a command from the temperature control device 24.

The temperature control device 24 includes a signal ST _IN indicating the temperature T _IN of the inner wall surface of the water cooling hole 12 detected by the inner wall surface temperature detection device 36 for deep holes, and an outer wall surface temperature detection device 3.
The signal ST _OUT representing the outer wall surface temperature T _OUT of the mold 10 detected by 8 is supplied. The outer wall surface temperature detecting device 38 includes a temperature detecting element such as a thermocouple, and is mounted on the outer wall surface of the mold 10.

The deep hole inner wall surface temperature detecting device 36 has a width dimension that can be inserted into the water cooling hole 12 and is made of ceramics, heat-resistant glass, or the like, as shown in FIGS. 3, 4 and 5, respectively. Along with the high-frequency induction heating coil 26, for example, a ceramic heat-resistant insulating adhesive (commercial name:
It is fixed by a fixing band 42 made of Aron ceramic or the like. The inner wall surface temperature detection device 36 for deep holes
For example, as shown in FIG. 6, a pair of lead wires 44a and 44b made of dissimilar metals having their tips inserted into the water cooling hole 12 joined to each other are provided.
A thermocouple 48 that generates an electromotive force corresponding to the temperature of the joint portion 46 of 4a and 44b, and a ceramic that holds the thermocouple 48 by accommodating the thermocouple 48 up to the vicinity of its tip end by a pair of longitudinal holes 50. Insulator 5
2 and. Since the tip end surface of the insulator 52 is positioned so as to be close to the joint portion 46, the radiant energy from the inner wall surface of the water cooling hole 12 is absorbed by the tip end portion of the insulator 52 and is absorbed. The heat generated by is conducted to the joint portion 46 at the tip of the thermocouple 48. In the present embodiment, the tip of the insulator 52 functions as a radiant energy absorber.

The temperature control device 24 includes a CPU and RO.
It is composed of a so-called microcomputer including M, RAM, etc., processes an input signal in accordance with a program stored in advance in a ROM, etc., and outputs a command signal to the high-frequency power supply 28 and the drive circuit 34, whereby the water cooling hole 12 Annealing is applied to the inner wall surface of the branch portion 16.

In the temperature control device 24 of FIG. 1, a functional block diagram for explaining a main part of the control function of the temperature control device 24 is described. Each functional block is a temperature control device 2
4 corresponds to each main part of the control function.
Hereinafter, the temperature control device 2 will be described using the respective functional blocks.
The control function of No. 4 will be described.

The setting parameter reading means 60 reads setting parameters input from an input device (not shown).
The setting parameters are the heat treatment temperature T _AN applied to the inner wall surface of the branch portion 16, the heat treatment depth D _AN applied to the inner wall surface of the branch portion 16, the heat radiation characteristics of the mold 10 (heat conductivity derived from the material of the mold, The heat radiation coefficient, the heat exchange coefficient, or the heat transfer coefficient) K derived from the shape and size of the mold 10. The heat treatment temperature T _AN is set to a value of about 700 ° C., which is suitable for annealing.

The inner wall target temperature calculating means 62 calculates the heat treatment temperature T _AN from a plurality of types of time functions experimentally obtained in advance based on the heat treatment temperature T _AN applied to the inner wall surface of the branch portion 16 which is set and input. select a time function to rise the _aN as the final value, it changes at a predetermined rate to a final value and outputs the inner wall surface target temperature T _iN ^T for holding a predetermined time at the final value sequentially over time.

The control deviation calculation means 64 is a deviation (T _IN ^T −T) between the inner wall target temperature T _IN ^T and the actual inner wall temperature T _IN detected by the deep hole inner wall temperature detecting device 36.
Calculate T _IN ). The inner wall surface temperature control means 66, well-known that the deviation from the feedback controlled (T _IN ^T -T
Based on _IN), and outputs the difference ^(T _IN T -T _IN) to eliminate the cause magnitude of the command value SD _IN to the high-frequency power source 28. In the present embodiment, the inner wall target temperature calculating means 62,
Control deviation calculating means 64 and inner wall surface temperature adjusting means 66
The feedback control allows the mold 1 to be operated in a steady state.
It corresponds to the inner wall surface temperature control means 74 for setting the inner wall surface temperature T _IN of the water cooling hole 12 of 0 to the inner wall surface target temperature T _IN ^T, that is, the heat treatment temperature T _AN .

On the other hand, the outer wall target temperature calculating means 68 calculates the heat treatment temperature T _AN to be applied to the inner wall surface of the branch portion 16 and the heat treatment depth D to be applied to the inner wall surface of the branch portion 16 based on the relationship stored in advance. _The outer wall target temperature T _OUT ^T is calculated based on _AN , the heat radiation characteristics (heat radiation coefficient, heat exchange coefficient or heat transfer coefficient) K of the mold 10. The above relationship is determined based on parameters such as the temperature T _IN of the inner wall surface of the branch portion 16, the temperature T _OUT of the outer wall surface of the mold 10, the heat radiation coefficient K of the mold 10, as shown in FIG. 7, for example. It is a heat transfer curve (temperature distribution curve). Since the heat dissipation coefficient K is constant in the constant die 10, heat transfer curves satisfying the heat treatment temperature T _AN ^T and the heat treatment depth D _AN applied to the set inner wall surface of the branch portion 16 are uniquely determined. The outer wall surface temperature for forming the heat transfer curve is determined as the outer wall surface target temperature T _OUT ^T.

The control deviation calculating means 70 is a deviation (T _OUT ^T −T) between the outer wall target temperature T _OUT ^T and the actual outer wall temperature T _OUT detected by the outer wall temperature detecting device 38.
Calculate T _{OU T} ). The outer wall surface temperature adjusting means 72 uses the well-known feedback control method to calculate the deviation (T _OUT ^T
-T _OUT ) based on the deviation (T _OUT ^T -T _OUT )
A command value SD _OUT having a magnitude that eliminates the above condition is output to the drive circuit 34 to change the amount of cooling air sent from the blower 32. In the present embodiment, the outer wall target temperature calculating means 68,
Control deviation calculating means 70 and outer wall surface temperature adjusting means 72
Corresponds to the outer wall surface temperature control means 76 that sets the outer wall surface temperature T _OUT of the mold 10 to the outer wall surface target temperature T _OUT ^T by feedback control.

8 and 9 are flow charts for explaining the operation of the temperature control device 24. FIG. 8 shows an inner wall surface temperature control routine corresponding to the inner wall surface temperature control means 74 or the inner wall surface temperature control step. 9 shows an outer wall surface temperature control routine corresponding to the outer wall surface temperature control means 76 or the outer wall surface temperature control step.

Step SA1 in FIG. 8 (hereinafter, step is omitted) SA1 corresponds to the setting parameter reading means 60 or the setting parameter reading step, and the heat treatment temperature input from a setting input device such as a keyboard (not shown). That is, the annealing temperature T _AN is read. Then
At SA2, the inner wall surface temperature T _IN of the branch portion 16 detected by the deep hole inner wall surface temperature detecting device 36 is read.

Subsequently, the inner wall target temperature calculating means 62
In SA3 corresponding to, a plurality of types of time function obtained experimentally in advance, based on the heat treatment temperature T _AN subjecting the inner wall surface of the branch portion 16 that is set and input, the heat treatment temperature T _AN
To select the time function to rise as the final value, sequentially determines the inner wall surface target temperature T _IN ^T which changes at a predetermined rate to the final value with its time for a predetermined time at the final value.

Then, the control deviation calculating means 64 or
In SA4 corresponding to the control deviation calculation step, the inner wall surface
Standard temperature T_IN ^TAnd detected by the inner wall surface temperature detection device 36
The actual temperature T of the inner wall surface_INDeviation from (T_IN ^T−
T_IN) Is calculated and the deviation (T _IN ^T-T_IN) Is preset
Whether it is between the determined judgment reference range -α to + α
To be judged. This judgment reference range -α to + α is the above deviation.
Difference (T_IN ^T-T_IN) Is in the neutral range
Is for a relatively small value of about a few degrees ℃
Is set.

If the determination at SA4 is positive,
This routine is ended without changing the command value SD _IN for the high frequency power supply 28. However, the SA4
If the determination is negative and the deviation ^(T _IN T -T _IN) is greater than + alpha, at SA5, by a predetermined reduction value .DELTA.Sd _IN from the command value SD _IN ^-1 in the preceding control cycle subtracted The new command value SD _IN is updated. Further, determination of SA4 is negative and the deviation (T _IN ^T -
When T _IN ) is smaller than −α, in SA6,
By adding a predetermined increase value ΔSD _IN to the command value SD _IN ^-1 in the previous control cycle, a new command value SD
Updated to _IN .

[0030] By the above steps are repeated, it being feedback-controlled so that the difference ^(T _IN T -T _IN) is a criterion range -α to + the alpha. In this embodiment, SA5 and SA6 correspond to the inner wall surface temperature adjusting means 66 or the inner wall surface temperature adjusting step.

Further, SB1 in FIG. 9 corresponds to the setting parameter reading means 60 or the setting parameter reading step, and the heat treatment temperature, that is, the annealing temperature T _AN input from a setting input device such as a keyboard (not shown),
The heat treatment depth D _AN , heat dissipation characteristics of the mold 10 (heat conductivity derived from the material of the mold, heat dissipation coefficient derived from the shape and dimensions of the mold 10, heat exchange coefficient, or heat transfer coefficient) K, etc. are read. . Next, at SB2, the outer wall surface temperature T _{OUT of the} mold 10 detected by the outer wall surface temperature detecting device 38 is read.

Subsequently, the outer wall target temperature calculating means 68
In SB3 corresponding to, from the relationship stored in advance, the heat treatment temperature T _AN to be applied to the inner wall surface of the branch portion 16 that has been input and set,
Heat treatment depth D _AN applied to the inner wall surface of the branch portion 16, heat dissipation characteristics of the mold 10 (heat dissipation coefficient, heat exchange coefficient or heat transfer coefficient) K
The outer wall target temperature T _OUT ^T is calculated based on the above. The above relationship is determined based on parameters such as the temperature T _IN of the inner wall surface of the branch portion 16, the temperature T _OUT of the outer wall surface of the mold 10, the heat radiation coefficient K of the mold 10, as shown in FIG. 7, for example. It is a heat transfer curve (temperature distribution curve in a steady state). Since the heat dissipation coefficient K is constant in the fixed die 10, the heat treatment temperature T _AN and the heat treatment depth D applied to the set inner wall surface of the branch portion 16 are set.
_A heat transfer curve that satisfies each of _AN and _AN is uniquely determined,
The outer wall surface temperature for forming the heat transfer curve is determined as the outer wall surface target temperature T _OUT ^T.

Next, at SB4 corresponding to the control deviation calculating means 70 or the control deviation calculating step, the outer wall target temperature T _OUT ^T and the actual outer wall temperature T _OUT detected by the outer wall temperature detecting device 38 are detected. Deviation from (T _OUT ^T
-T _OUT ) is calculated and the deviation (T _OUT ^T -T _OUT )
Is within a preset judgment reference range -β to + β. This judgment reference range -β to + β
Is for determining whether or not the deviation (T _OUT ^T −T _OUT ) is in the neutral range, and β is set to a relatively small value of about several degrees Celsius.

If the determination at SB4 is positive,
Command value SD for drive circuit 34_{OU T}Don't change
This routine is ended. However, the above SB4 format
Disconnection is denied and deviation (T_OUT ^T-T_OUT) Is more than + β
If it is also larger, in SB5, the previous control cycle
Command value SD_OUT ^-1From the predetermined decrease value ΔSD
_OUTIs subtracted from the new command value SD_OUTTo
Will be updated. Also, the determination of SB4 is denied and the deviation
(T_OUT ^T-T_OUT) Is less than -β, S
At B6, the command value SD in the previous control cycle
_OUT ^-1A predetermined increase value ΔSD_OUTIs added
New command value SD_OUTWill be updated.

By repeating the above steps, the deviation (T _OUT ^T −T _OUT ) becomes equal to the judgment reference range −β.
The feedback control is performed so that the value is within the range from to + β. In this embodiment, SB5 and SB6 correspond to the outer wall surface temperature adjusting means 72 or the outer wall surface temperature adjusting step.

As described above, according to this embodiment, the mold 1
In heat treatment of the branch portion 16 of the water cooling hole 12 formed in 0
Inner wall temperature control means 74 or inner wall temperature control step
Due to, the inner wall surface of the water cooling hole 12 has a preset annealing temperature.
T_ANTemperature T of the inner wall surface of the water cooling hole 12_INBut
While being controlled, the outer wall target temperature calculating means 68 or the outside
Annealing temperature preset by the wall surface target temperature calculation process
T_AN, Processing depth D_AN, And the heat dissipation characteristics of the mold 10.
Based on the target temperature T of the outer wall surface of the mold 10, _OUT ^TBut
As well as being calculated, the outer wall surface temperature adjusting means 72 or the outside
The temperature of the outer wall surface of the mold 10 is adjusted by the wall surface temperature adjusting step.
T_OUTIs the target temperature T of the outer wall_OUT ^TSo that
The temperature of the outer wall surface of the mold 10 is controlled.

Therefore, as described above, the transmission shown in FIG.
Preset processing temperature, processing depth using the heat curve,
And the target temperature calculated based on the heat dissipation characteristics of the mold 10.
Degree T _OUT ^TTemperature T of the outer wall surface of the mold 10_OUT
Is controlled, the heat treatment depth of the inner wall surface of the water cooling hole 12 is controlled.
Is a value D that is accurately set in advance._ANAnd that heat treatment
Does not affect other parts in the mold 10.

Although one embodiment of the present invention has been described above with reference to the drawings, the present invention can be applied to other modes.

For example, in the outer wall target temperature calculating means 68 of the above-mentioned embodiment, the heat radiation characteristic of the mold 10 was used, but the constituent material and size and shape of the mold 10 are set and automatically calculated from them. It does not matter if the calculated heat dissipation coefficient is used. Even in such a case, the heat radiation characteristic of the mold 10 is substantially the same as that set.

Further, the deep hole heat treatment apparatus 1 of the above-mentioned embodiment
Although 4 is for annealing the inner wall surface of the branch portion 16 of the water cooling hole 12, it may be for quenching.

Further, in the above-mentioned embodiment, it is explained that the inner wall surface of the branch portion 16 of the water cooling hole 12 is locally annealed, but there is no problem even if it is at a place other than the branch portion 16. .

Further, in the above-described embodiment, the outer wall surface cooling device 22 is of the type that is cooled by the air blown by the blower 32, but it may be of the type that is cooled by using a liquid such as water. In such a case, the insulation of the high frequency induction heating coil 26 and the thermocouple 48 can be maintained by closing the openings of the holes other than the holes into which the high frequency induction heating coil 26 and the thermocouple 48 are inserted.

Further, although the high frequency induction heating coil 26 of the above-mentioned embodiment is a metal pipe having a circular cross section, it may be a metal pipe having a rectangular cross section.

Although not illustrated one by one, the present invention can be implemented in various modified and improved modes based on the knowledge of those skilled in the art.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a configuration of a deep hole heat treatment apparatus including an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing an example of the mold of FIG. 1 in detail.

FIG. 3 is a front view showing a state in which the deep hole inner wall surface temperature detecting device of the embodiment of FIG. 1 is fixed to a long holding plate together with a high frequency induction heating coil.

FIG. 4 is a plan view showing a state in which the deep hole inner wall surface temperature detecting device of the embodiment of FIG. 1 is fixed to a long holding plate together with a high frequency induction heating coil.

5 is a bottom view showing a state in which the deep hole inner wall surface temperature detecting device of the embodiment of FIG. 1 is fixed to a long holding plate together with a high frequency induction heating coil. FIG.

FIG. 6 is a partially cutaway view showing a main part of the deep hole inner wall surface temperature detecting device of FIG. 3;

7 is a diagram showing a heat transfer curve used by an outer wall surface target temperature calculating means included in the control device of FIG.

FIG. 8 is a flowchart illustrating a main part of control operation of the control device of FIG. 1, showing an inner wall surface temperature control routine.

9 is a flowchart illustrating a main part of control operation of the control device of FIG. 1, showing an outer wall surface temperature control routine.

[Explanation of symbols]

 10: Mold 12: Water cooling hole (deep hole) 20: Inner wall surface heating device 22: Outer wall surface cooling device 68: Outer wall surface target temperature calculating means 72: Outer wall surface temperature adjusting means 74: Inner wall surface temperature controlling means

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location F27D 19/00 F27D 19/00 A

Claims (2)

[Claims] 1. A heat treatment method for a hole inner wall surface for heat-treating an inner wall surface of a hole formed in a predetermined member, wherein the inner wall surface of the hole is heated to a preset heat treatment temperature. An inner wall surface temperature control step of controlling the temperature of the wall surface, and an outer wall surface temperature control step of calculating a target temperature of the outer wall surface of the predetermined member based on a preset heat treatment temperature, heat treatment depth, and heat radiation characteristics of the predetermined member. A wall surface target temperature calculating step, and an outer surface for controlling the temperature of the outer wall surface of the predetermined member such that the temperature of the outer wall surface of the predetermined member becomes the target temperature of the outer wall surface calculated by the outer wall target temperature calculating step. And a wall surface temperature adjusting step. 2. A heat treatment apparatus for hole inner wall surface for heat treating an inner wall surface of a hole formed in a predetermined member, wherein the inner wall surface heating device heats the inner wall surface of the hole to a predetermined heat treatment temperature. An outer wall surface cooling device for cooling the outer wall surface of the predetermined member, and an inner wall surface temperature control means for controlling the inner wall surface heating device so that the inner wall surface of the hole has a preset heat treatment temperature. An outer wall target temperature calculating means for calculating a target temperature of an outer wall surface of the predetermined member based on a preset heat treatment temperature, a heat treatment depth, and a heat radiation characteristic of the predetermined member; So that the temperature of the outer wall surface becomes the target temperature of the outer wall surface calculated by the outer wall target temperature calculating means,
An outer wall surface temperature adjusting means for controlling the outer wall surface cooling device, the heat treatment device for the inner wall surface of the hole.