JPH08300421A - Mold device for optical disk substrate - Google Patents

Mold device for optical disk substrate

Info

Publication number
JPH08300421A
JPH08300421A JP13616795A JP13616795A JPH08300421A JP H08300421 A JPH08300421 A JP H08300421A JP 13616795 A JP13616795 A JP 13616795A JP 13616795 A JP13616795 A JP 13616795A JP H08300421 A JPH08300421 A JP H08300421A
Authority
JP
Japan
Prior art keywords
mold
die
disk substrate
optical disk
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13616795A
Other languages
Japanese (ja)
Inventor
Masaaki Motokawa
昌明 本川
Shinichi Hanzawa
伸一 半澤
Masahide Itoigawa
昌秀 糸魚川
Yoshikazu Hirai
良和 平井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Video Corp
Pioneer Corp
Original Assignee
Pioneer Video Corp
Pioneer Electronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Video Corp, Pioneer Electronic Corp filed Critical Pioneer Video Corp
Priority to JP13616795A priority Critical patent/JPH08300421A/en
Publication of JPH08300421A publication Critical patent/JPH08300421A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/263Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/263Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C2045/2646Means for adjusting the axial dimension of the mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

PURPOSE: To dispense with the installation precision of die exchange for disk substrates having different thickness by including the first and second dies which move relatively between a mold opening position and a die closing position, installing stamper in the first die, and injecting molten resin in a molding space formed between the first and second dies at die closing position. CONSTITUTION: A die device for an optical disk substrate has a fixed side mold part 2 (second mold) and a movable side die device 3 (first mold). The movable side die 3 has a movable side mirror surface board 13 having one surface of an optical disk substrate to be molded which is installed on a movable side die plate, or a surface for supporting a stamper 16, and the side wall 6a of the peripheral step part of a fixed side mirror surface board 6 which forms the other surface of the optical disk substrate to be molded and the inside surface 17a of a sliding outside surface stipulating ring 17 stipulate the outside surface of a molding space 10. Molded resin to be injected from a nozzle is lead into the space 10 through a sprue bush 11.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【0001】[0001]

【0002】[0002]

【産業上の利用分野】本発明は、厚さの異なる基板を成
形可能にした光ディスク基板用成形金型装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical disk substrate molding die apparatus capable of molding substrates having different thicknesses.

【0003】[0003]

【0002】[0002]

【0004】[0004]

【従来の技術】光ディスクなどの情報記録ディスクの透
明基板の多くは、PC(ポリカーボネート)やPMMA
(ポリメチルメタアクリレート)等を素材として射出成
形装置により形成される。この光デイスク基板を成形す
る射出成形装置は、図3に示すように、固定盤1上に設
けられた図示せぬ成形空間を有する固定金型部2と、こ
の固定金型部2の成形空間と対向する位置に図示せぬ成
形用スタンパを有し、且つ成形型面に対して直角な方向
に移動自在に設けられた可動金型部3とから成る可動盤
4を有している。また、この可動盤4を移動させると共
に、固定金型部2と可動金型部3とを互いに型締めする
図示せぬ型締手段としての油圧シリンダが設けられ、型
締めした後に射出装置5によって固定金型部2と可動金
型部3との間に形成された成形空間に被成形部材が射出
されデイスク基板を成形する。
2. Description of the Related Art Most transparent substrates for information recording disks such as optical disks are made of PC (polycarbonate) or PMMA.
(Polymethylmethacrylate) or the like is used as a material and is formed by an injection molding device. As shown in FIG. 3, an injection molding apparatus for molding this optical disk substrate has a fixed mold section 2 having a molding space (not shown) provided on a fixed platen 1, and a molding space for this fixed mold section 2. And a movable platen 4 having a molding stamper (not shown) and a movable mold part 3 movably provided in a direction perpendicular to the molding surface. Further, a hydraulic cylinder as a mold clamping means (not shown) for clamping the fixed mold part 2 and the movable mold part 3 with each other while moving the movable platen 4 is provided, and after the mold is clamped, the injection device 5 is used. The member to be molded is injected into the molding space formed between the fixed mold unit 2 and the movable mold unit 3 to mold the disk substrate.

【0005】図4は、従来例における射出成形装置の成
形型の内部を詳細に示す断面図で、成形型の中央半分を
示している。図4に示すように、固定側金型部2は固定
側鏡面盤6、固定側ブッシュ7及び固定側ガイドリング
8等で構成され図示せぬ数本のボルトで固定側型板9上
に固定されている。鏡面処理された円盤状の固定側鏡面
盤6は、ディスク基板を成形する成形空間10の一方の
面を形成している。
FIG. 4 is a detailed cross-sectional view of the inside of the molding die of the conventional injection molding apparatus, showing the center half of the molding die. As shown in FIG. 4, the fixed-side mold section 2 is composed of a fixed-side mirror surface plate 6, a fixed-side bush 7, a fixed-side guide ring 8 and the like, and is fixed on the fixed-side mold plate 9 with several bolts (not shown). Has been done. The disk-shaped fixed-side mirror surface disk 6 that has been mirror-finished forms one surface of a molding space 10 for molding a disk substrate.

【0006】中空円筒状の固定側ブッシュ7は、固定側
型板9面から固定側鏡面盤6の中央部に挿入されてお
り、外周縁部には後述するカットパンチ20と協働して
不要となる成形材を切断するための刃部を有している。
また、固定側型板9の中央部に設けられたロケートリン
グ12には、射出装置5の先端部が接合されていて、こ
の射出装置5から加熱され溶融状態の被成形材が注入さ
れ中空構造をしたスプールブッシュ11を通して成形空
間10に注入される。
The hollow cylindrical fixed-side bush 7 is inserted from the surface of the fixed-side mold plate 9 into the central portion of the fixed-side mirror surface plate 6, and is unnecessary in the outer peripheral portion in cooperation with a cut punch 20 described later. It has a blade portion for cutting the molding material that becomes.
The tip of the injection device 5 is joined to a locate ring 12 provided in the center of the fixed-side template 9, and a material to be molded in a molten state heated by the injection device 5 is injected into the hollow structure. It is injected into the molding space 10 through the spool bush 11 having the above shape.

【0007】[0007]

【0003】一方、可動側金型部3は、可動側鏡面盤1
3、可動側ガイドリング14及び外周面規定リング17
等で構成され図示せぬ数本のボルトで可動側型板15上
に固定側されている。鏡面処理された円盤状の可動側鏡
面盤13は、固定側鏡面盤6に対応した位置に設けられ
成形空間10の他方の面を形成している。また、可動側
鏡面盤13上には所定の情報パターンが刻設された円盤
状のスタンパ16が積載され、このスタンパ16の内周
縁部を中空円筒状の外周縁部に鈎型部を有する内周スタ
ンパ押え18で固定し、スタンパ16の外周縁部は外周
面規定リング17で固定されている。また、この内周ス
タンパ押え18の他方端にはカム19が接続され、カム
19と連動して内周スタンパ押え18を移動させスタン
パ16を脱着可能にしている。内周スタンパ押え18の
中央部には、カットパンチ20が設けられ固定ブッシュ
7と協働して不要となる成形材を切断する。
On the other hand, the movable mold part 3 is a movable mirror surface plate 1
3, movable side guide ring 14 and outer peripheral surface defining ring 17
It is fixed on the movable side mold plate 15 with several bolts (not shown). The disk-shaped movable side mirror surface disk 13 subjected to mirror surface processing is provided at a position corresponding to the fixed side mirror surface disk 6 and forms the other surface of the molding space 10. Further, a disk-shaped stamper 16 having a predetermined information pattern engraved thereon is loaded on the movable side mirror surface disk 13, and the inner peripheral edge portion of this stamper 16 is an inner peripheral portion having a hollow cylindrical outer peripheral edge portion and having a hook-shaped portion. It is fixed by a peripheral stamper retainer 18, and the outer peripheral edge of the stamper 16 is fixed by an outer peripheral surface defining ring 17. A cam 19 is connected to the other end of the inner peripheral stamper retainer 18, and the inner peripheral stamper retainer 18 is moved in conjunction with the cam 19 so that the stamper 16 can be attached and detached. A cut punch 20 is provided at the center of the inner stamper retainer 18 and cooperates with the fixed bush 7 to cut unnecessary molding material.

【0008】上述した成形型において、成形型を閉型状
態にするため可動側金型部3を固定側金型部2の面に垂
直方向に近付けると、固定側ガイドリング8と可動側ガ
イドリング14が嵌合・当接して位置決めされ、型締め
状態となる。この閉型位置の状態で成形空間10に溶融
樹脂を注入し、冷却するとスタンパ16の表面上に刻設
された情報パターンが転写されたディスク基板が成形さ
れる。その後、可動側金型部3が固定側金型部2から離
れ、成形型を開型状態にしてディスク基板が取出され
る。
In the above-mentioned molding die, when the movable side mold part 3 is brought close to the surface of the fixed side mold part 2 in the vertical direction in order to close the molding die, the fixed side guide ring 8 and the movable side guide ring are formed. 14 is fitted and abutted to be positioned, and the mold is clamped. When the molten resin is poured into the molding space 10 in this closed mold position and cooled, a disk substrate on which the information pattern engraved on the surface of the stamper 16 is transferred is molded. After that, the movable side mold part 3 is separated from the fixed side mold part 2, the molding die is opened, and the disk substrate is taken out.

【0009】[0009]

【0004】[0004]

【0010】[0010]

【発明が解決しようとする課題】所で、直径がCD(コ
ンパクド・ディスク)と同じ12cmで、厚さがCDの
1.2mmに対して0.6mmであるディスクを2枚貼
り合わせた光ディスクであるDVD(ディジタル・ビデ
オ・ディスク)が最近提案されている。
By the way, an optical disc having a diameter of 12 cm, which is the same as a CD (compacted disc), and a thickness of 0.6 mm, which is 1.2 mm of a CD, is used. A DVD (Digital Video Disc) has recently been proposed.

【0011】そこで、直径は同一であるのでCDとDV
Dのディスク基板の成形金型を共用することが考えられ
るが厚みが異なるため金型の一部を交換する必要があ
る。しかしながら、図4の成形金型では寸法の異なる固
定側鏡面盤及び固定側ブッシュを2組用意し、交換する
ことなり、又、それらは複数個の図示せぬ固定用ボルト
で正確に固定されているため、交換作業に多くの時間が
掛ると共に、交換作業後は取付け精度の微調整が必ず必
要になり試し成形を数回行なうのが一般的である。
Therefore, since the diameter is the same, CD and DV
It is conceivable that the molding die of the disk substrate of D is shared, but it is necessary to replace a part of the die because the thickness is different. However, in the molding die of FIG. 4, two sets of fixed-side mirror surface discs and fixed-side bushes having different sizes are prepared and replaced, and they are fixed accurately by a plurality of fixing bolts (not shown). Therefore, it takes a lot of time for the replacement work, and after the replacement work, it is necessary to finely adjust the mounting accuracy, and it is common to perform trial molding several times.

【0012】このように、従来タイプの金型において
は、交換作業に多くの時間がかかると共に、ディスク基
板の厚さ毎に別の固定側鏡面盤及び固定側ブッシュが必
要になり、金型コストが高騰するという問題があった。
As described above, in the conventional mold, the replacement work takes a lot of time, and a separate fixed-side mirror surface plate and fixed-side bush are required for each thickness of the disk substrate, which results in mold cost. There was a problem of rising prices.

【0013】本発明は、上述の問題点に着目して成され
たもので、DVDやCD等のようにディスク基板の厚み
が異なる光ディスク基板に対して、金型交換の取付け精
度が不要で、且つ安価な共用可能な光ディスク基板用成
形金型装置を提供することを目的とする。
The present invention has been made in view of the above-mentioned problems, and does not require mounting accuracy for die replacement for optical disc substrates such as DVDs and CDs having different disc substrate thicknesses. It is an object of the present invention to provide an inexpensive and sharable mold device for an optical disk substrate.

【0014】[0014]

【0005】[0005]

【0015】[0015]

【課題を解決するための手段】本発明は、開放位置と閉
型位置との間で相対的に移動可能第1及び第2の金型を
含み、第1の金型にスタンパが取付けられ、閉型位置で
前記第1及び第2の金型の間に形成される成形空間内に
溶融樹脂を射出することにより、前記スタンパの情報が
転写された光ディスク基板を成形するようにした光ディ
スク基板用成形金型装置において、前記第1及び第2の
金型が移動する方向に移動可能になるよう前記第2の金
型に取付けられて、前記閉型位置で前記成形空間の外周
面を規定する外周面規定リングと、前記外周面規定リン
グを前記第1の金型側に向かって突き出すよう付勢する
手段と、前記外周面規定リングの移動量を規制する手段
と、前記第1又は第2の金型の対向面の外周に取付けら
れ、前記閉型位置で前記成形空間の間隙を規定する着脱
可能なスペーサ部材とを備えたことを特徴とする。
SUMMARY OF THE INVENTION The present invention includes first and second molds movable relative to one another between an open position and a closed mold position, wherein a stamper is attached to the first mold. An optical disk substrate for molding an optical disk substrate on which information of the stamper is transferred by injecting a molten resin into a molding space formed between the first and second molds at a closed position. In a molding die device, the first and second dies are attached to the second die so as to be movable in a moving direction, and define an outer peripheral surface of the molding space at the closed die position. An outer peripheral surface defining ring, a means for urging the outer peripheral surface defining ring to project toward the first mold side, a means for restricting a movement amount of the outer peripheral surface defining ring, the first or second It is attached to the outer circumference of the facing surface of the mold of the Characterized in that a removable spacer member defining a gap between the molding space.

【0016】[0016]

【0006】[0006]

【0017】[0017]

【作用】本発明の光ディスク基板用成形金型装置は、ス
タンパが取付けられる第1の金型と対向する第2の金型
に外周面規定リングを移動可能に設けると共に第1又は
第2の金型の対向面の外周に成形空間の間隙の寸法を規
定するスペーサ部材を着脱可能に設けているので、型締
め動作時、第2の金型に設けられた外周面規定リングが
第1の金型に取付けられたスタンパの外周縁部を狭持す
ると共にスペーサ部材が金型の対向面に当接して、金型
の型締めの移動が停止する。
According to the molding die apparatus for an optical disk substrate of the present invention, the outer peripheral surface defining ring is movably provided on the second die facing the first die to which the stamper is attached, and the first or second die. Since the spacer member for defining the size of the gap of the molding space is detachably provided on the outer periphery of the facing surface of the mold, the outer peripheral surface defining ring provided on the second mold is used for the first mold during the mold clamping operation. The outer peripheral edge portion of the stamper attached to the mold is sandwiched, and the spacer member comes into contact with the facing surface of the mold to stop the mold clamping movement.

【0018】[0018]

【0007】[0007]

【0019】[0019]

【実施例】以下、本発明の実施例としての光ディスク基
板用成形金型装置を添付図面を参照しつつ説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An optical disk substrate molding die apparatus as an embodiment of the present invention will be described below with reference to the accompanying drawings.

【0020】図1に示す如く、本発明の光ディスク基板
用成形金型装置は、固定側金型部2(第2の金型)と、
該固定側金型部2と成形面同士が対向するように、且つ
該成形面に対して直角な方向において移動自在に設けら
れた可動側金型部3(第1の金型)とを有している。
尚、図示してないが可動側金型部3を移動せしめると共
に固定側金型部2及び可動側金型部3を互いに型締めす
る油圧シリンダ等からなる型締め手段が設けられてい
る。固定側金型部2は、固定側型板9と、該固定側型板
9に取付けられ、成形すべき光ディスク用基板の一方の
面を形成する固定側鏡面盤6と、該固定側型板9に取付
けられる型締め時両金型部の位置決めを行う固定側ガイ
ドリング8及びガイドポスト26とからなる。固定側鏡
面盤6の中央を貫くように中空の固定側ブッシュ7が挿
入されており、該固定側ブッシュ7内には筒状のスプー
ルブッシュ11が設けられ、該スプールブッシュ11の
一方の端に図示せぬ射出手段のノズルの先端部と係合す
るロケートリング12が設けられている。射出手段のノ
ズルより射出される溶融樹脂はスプールブッシュ11を
通して成形空間10内に案内される。固定側鏡面盤6の
外周部に対応する部分には、型締め時スタンパ16の外
周縁部を狭持する外周面規定リング17が固定側鏡面盤
6の成形面に対して直交する方向に移動自在に固定側鏡
面盤6の外周段部に係合している。固定側鏡面盤6の外
周段部の側壁6aと摺動する外周面規定リング17の内
周面17aは成形空間10の外周面を規定している。該
外周面規定リング17はスプリング21からなる付勢手
段によって固定側鏡面盤6の成形面から、可動側金型部
3に向かって突き出すように付勢されていると共に、固
定側ガイドリング8の可動側金型部3に対向する面にボ
トル23によって着脱自在に取付けられた環状の第1の
スペーサ部材22と外周面規定リング17の外周段部が
係合し、その移動が規制されている。該第1のスペーサ
部材22は後述する可動側ガイドリング14と型締め時
(閉型位置)当接することによって成形空間10の間隙
の寸法を規定する。
As shown in FIG. 1, an optical disk substrate molding die apparatus according to the present invention comprises a stationary die section 2 (second die),
The fixed-side mold part 2 and the movable-side mold part 3 (first mold) provided so that the molding surfaces face each other and are movable in a direction perpendicular to the molding surface. are doing.
Although not shown, there is provided mold clamping means including a hydraulic cylinder or the like for moving the movable mold part 3 and clamping the fixed mold part 2 and the movable mold part 3 together. The fixed-side mold section 2 includes a fixed-side mold plate 9, a fixed-side mirror plate 6 that is attached to the fixed-side mold plate 9 and forms one surface of an optical disk substrate to be molded, and the fixed-side mold plate. It is composed of a fixed side guide ring 8 and a guide post 26 for positioning the two mold parts when the mold is clamped. A hollow fixed-side bush 7 is inserted so as to penetrate the center of the fixed-side mirror surface plate 6, and a cylindrical spool bush 11 is provided in the fixed-side bush 7, and one end of the spool bush 11 is provided. A locating ring 12 that engages with the tip of the nozzle of the injection unit (not shown) is provided. The molten resin injected from the nozzle of the injection means is guided into the molding space 10 through the spool bush 11. An outer peripheral surface defining ring 17 that holds the outer peripheral edge portion of the stamper 16 at the time of mold clamping moves in a direction orthogonal to the molding surface of the fixed-side mirror surface disk 6 at a portion corresponding to the outer peripheral portion of the fixed-side mirror surface disk 6. It is freely engaged with the outer peripheral step portion of the fixed-side mirror surface plate 6. The inner peripheral surface 17 a of the outer peripheral surface defining ring 17 that slides on the side wall 6 a of the outer peripheral step portion of the fixed-side mirror surface plate 6 defines the outer peripheral surface of the molding space 10. The outer peripheral surface defining ring 17 is biased by a biasing means composed of a spring 21 so as to protrude from the molding surface of the fixed side mirror surface plate 6 toward the movable side mold part 3, and at the same time, the fixed side guide ring 8 is pressed. An annular first spacer member 22 detachably attached by a bottle 23 to the surface facing the movable mold part 3 and an outer peripheral step part of the outer peripheral surface defining ring 17 are engaged with each other, and their movement is restricted. . The first spacer member 22 defines the size of the gap in the molding space 10 by contacting the movable side guide ring 14 described later when the mold is clamped (closed mold position).

【0021】[0021]

【0008】一方、可動側金型部3は、可動側型板15
と、該可動側型板15に取付けられた成形すべき光ディ
スク基板の他方の面即ち、スタンパ16を坦持する面を
有する可動側鏡面盤13と、該可動側型板15に取付け
られ型締め時固定側ガイドリング8と嵌合して位置決め
を行う可動側ガイドリング14とからなる。該可動側ガ
イドリング14には、ガイドポスト26が嵌合する凹部
と該凹部内の内面にガイドポスト26の外周面と摺動す
るベアリング27が設けられている。スタンパ16の内
周部に対応する部分には、スタンパ16の内周縁部を押
圧して可動側鏡面盤13に固定する内周スタンパ押えリ
ング18が設けられている。また、スタンパ16の外周
縁部に対応する可動側鏡面盤13の面には図示せぬ真空
吸着手段が設けられており、スタンパ16の外周縁部は
真空吸着により可動側鏡面盤13に固定されている。該
内周スタンパ押えリング18内には成形面に対して直角
な方向に移動自在に筒状のカットパンチ20が設けられ
ている。カットパンチ20の先端部は、固定側ブッシュ
の端部と協働して光ディスク基板の中心孔を穿孔する。
図示の如く型締め時における固定側金型部2と可動側金
型部3の芯出し・位置決め、は、固定側ガイドリングの
テープ面8aと可動側ガイドリングのテーパ面14aと
の係合及びガイドポスト26とベアリング27の併用に
よってなされる。
On the other hand, the movable mold part 3 has a movable mold plate 15
A movable side mirror surface plate 13 having the other surface of the optical disk substrate to be molded attached to the movable side template 15, that is, a surface for supporting the stamper 16, and a mold clamp attached to the movable side template 15 The stationary side guide ring 8 is fitted to the movable side guide ring 14 for positioning. The movable guide ring 14 is provided with a recess into which the guide post 26 is fitted, and a bearing 27 on the inner surface of the recess that slides on the outer peripheral surface of the guide post 26. An inner peripheral stamper pressing ring 18 for pressing the inner peripheral edge of the stamper 16 and fixing it to the movable side mirror surface plate 13 is provided at a portion corresponding to the inner peripheral portion of the stamper 16. Further, a vacuum suction means (not shown) is provided on the surface of the movable side mirror surface plate 13 corresponding to the outer peripheral edge portion of the stamper 16, and the outer peripheral edge portion of the stamper 16 is fixed to the movable side mirror surface plate 13 by vacuum suction. ing. A cylindrical cut punch 20 is provided in the inner peripheral stamper pressing ring 18 so as to be movable in a direction perpendicular to the molding surface. The tip portion of the cut punch 20 cooperates with the end portion of the fixed-side bush to punch the center hole of the optical disc substrate.
As shown, centering and positioning of the fixed side mold part 2 and the movable side mold part 3 at the time of mold clamping are performed by engaging the tape surface 8a of the fixed side guide ring and the taper surface 14a of the movable side guide ring. This is done by using the guide post 26 and the bearing 27 together.

【0022】また、可動がエア鏡面盤13の外周段部に
は型締め時外周面規定リングと当接する環状の第2のス
ペーサ部材24がボルト25により着脱自在に取付けら
れる。
An annular second spacer member 24, which is movable and comes into contact with the outer peripheral surface defining ring at the time of mold clamping, is detachably attached to the outer peripheral step portion of the air mirror surface plate 13.

【0023】[0023]

【0009】次いで上述した構成の光ディスク基板用成
形金型装置の動作を説明する。
Next, the operation of the optical disk substrate molding die apparatus having the above-described structure will be described.

【0024】固定側金型部2と可動側金型部3とが離間
した開型位置から固定側金型部2に対して可動側金型部
3が閉型位置となるよう移動していくと、外周面規定リ
ング17がスタンパ16の外周縁部に当接すると共に可
動側金型部3の移動に伴い、スプリング21の付勢力に
坑して後退する。そして、第1のスペーサ部材22が可
動側ガイドリング14に当接し、可動側金型部3の移動
が停止し、閉型位置となり、型締がなされ、固定側鏡面
盤6と可動側鏡面盤13との間に成形空間10が形成さ
れる。この時、外周面規定リング17は第2のスペーサ
部材24と密接することによって、外周面規定リング1
7とスタンパ16の外周縁部との間にバリ等が出ない程
度の隙間が生じる。この隙間は、溶融樹脂を成形空間1
0内に射出する際の通気の役割を呈している。
From the open mold position where the fixed mold part 2 and the movable mold part 3 are separated from each other, the movable mold part 3 is moved to the closed mold position with respect to the fixed mold part 2. Then, the outer peripheral surface defining ring 17 comes into contact with the outer peripheral edge portion of the stamper 16 and with the movement of the movable side mold portion 3, the outer peripheral surface defining ring 17 is recessed by the biasing force of the spring 21. Then, the first spacer member 22 comes into contact with the movable side guide ring 14, the movement of the movable side mold part 3 is stopped, the mold is closed, and the mold is clamped, and the fixed side mirror surface plate 6 and the movable side mirror surface plate. A molding space 10 is formed between the molding space 10 and the molding space 10. At this time, the outer peripheral surface defining ring 17 is brought into close contact with the second spacer member 24, so that the outer peripheral surface defining ring 1
A gap is formed between 7 and the outer peripheral edge of the stamper 16 to the extent that no burr or the like appears. In this gap, the molten resin is molded into the space 1
It plays a role of ventilation when it is injected into 0.

【0025】図2(b)に示す如く第1のスペーサ部材
22を厚いものに交換することによって成形空間10の
間隙の寸法、即ち成形される光ディスク基板の厚さを変
更することができる。この時、外周面規定リング17は
第1のスペーサ部材22の厚さに応じて成形面に垂直な
方向に移動するので、第1のスペーサ部材22の厚さを
変えても摺動する固定側鏡面盤6の外周段部の側壁6a
と外周面規定リング17の内周面17aとの間に隙間が
生じることはなく、従って成形された光ディスク基板に
バリが発生することがない。
By replacing the first spacer member 22 with a thick one as shown in FIG. 2B, the size of the gap in the molding space 10, that is, the thickness of the optical disk substrate to be molded can be changed. At this time, since the outer peripheral surface defining ring 17 moves in a direction perpendicular to the molding surface according to the thickness of the first spacer member 22, the fixed side that slides even if the thickness of the first spacer member 22 is changed. Side wall 6a of the outer peripheral step of the mirror surface plate 6
There is no gap between the inner peripheral surface 17a of the outer peripheral surface defining ring 17 and the inner peripheral surface 17a of the outer peripheral surface defining ring 17, and thus no burr is formed on the molded optical disk substrate.

【0026】上述の実施例では、第1のスペーサ部材が
外周面規定リングの移動を制限する機能を兼ねている
が、これに限定されることはなく第1のスペーサ部材と
は別途のストッパ手段を設け、外周面規定リングの移動
を制限するようにしても良い。また、固定側金型部2と
可動側金型部3との芯出し・位置決めは主に固定側及び
可動側ガイドリングの嵌合によって行われ、補助的にガ
イドポスト及びベアリングで行われている。更に、スタ
ンパ及び第2のスペーサ部材を可動側金型部に、又外周
面規定リング及び第1のスペーサ部を固定側金型部に夫
々設けた例を示したが、前者を固定側金型部に、又後者
を可動側金型部に夫々設けるようにしても良いことは勿
論である。
In the above-mentioned embodiment, the first spacer member also has the function of limiting the movement of the outer peripheral surface defining ring, but the present invention is not limited to this, and the stopper means separate from the first spacer member. May be provided to limit the movement of the outer peripheral surface defining ring. Further, centering and positioning of the fixed-side mold part 2 and the movable-side mold part 3 are mainly performed by fitting the fixed-side and movable-side guide rings, and are additionally performed by guide posts and bearings. . Further, an example is shown in which the stamper and the second spacer member are provided in the movable side mold part, and the outer peripheral surface defining ring and the first spacer part are provided in the fixed side mold part. It is needless to say that the movable part and the latter part may be provided on the movable side mold part, respectively.

【0027】[0027]

【0010】[0010]

【0028】[0028]

【発明の効果】以上のように、本発明の光ディスク基板
用成形金型装置は、スタンパが固定される第1の金型と
対向する第2の金型に外周面規定リングを移動可能に設
けると共に第1又は第2の金型の対向面の外周に成形空
間の間隙の寸法を規定するスペーサ部材を着脱可能に設
ける事により、厚みの異なる光ディスク基板の成形に対
して、金型交換の取付け精度が不要で、且つ交換作業が
容易に行うことが可能となる。
As described above, in the molding die apparatus for an optical disk substrate of the present invention, the outer peripheral surface defining ring is movably provided in the second die facing the first die to which the stamper is fixed. At the same time, a spacer member that defines the size of the gap of the molding space is detachably provided on the outer periphery of the facing surface of the first or second mold, so that the mold can be replaced for the molding of optical disk substrates having different thicknesses. The accuracy is not required, and the replacement work can be easily performed.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の光ディスク基板用成形金型装置の一実
施例を示す断面図。
FIG. 1 is a sectional view showing an embodiment of a molding die apparatus for an optical disk substrate of the present invention.

【図2】図1の要部拡大図。FIG. 2 is an enlarged view of a main part of FIG.

【図3】従来の光ディスク基板用成形金型装置の概略
図。
FIG. 3 is a schematic view of a conventional molding die apparatus for an optical disc substrate.

【図4】従来の光ディスク基板用成形金型装置の部分断
面図。
FIG. 4 is a partial cross-sectional view of a conventional molding die device for an optical disc substrate.

【符号の説明】[Explanation of symbols]

1・・・・固定盤 2・・・・固定側金型部 3・・・・可動側金型部 4・・・・可動盤 5・・・・射出装置 6・・・・固定側鏡面盤 7・・・・固定側ブッシュ 8・・・・固定側ガイドリング 9・・・・固定側型板 10・・・成形空間 11・・・スプールブッシュ 12・・・ロケートリング 13・・・可動側鏡面盤 14・・・可動側ガイドリング 15・・・可動側型板 16・・・スタンパ 17・・・外周面規定リング 18・・・内周スタンパ押えリング 19・・・カム 20・・・カットパンチ 21・・・スプリング 22・・・第1のスペーサ部材 23、25・・ボルト 24・・・第2のスペーサ部材 26・・・ガイドポスト 1 ... ・ Fixed plate 2 ・ ・ ・ ・ Fixed side mold part 3 ・ ・ ・ ・ Movable side mold part 4 ・ ・ ・ ・ Movable plate 5 ・ ・ ・ ・ Injection device 6 ・ ・ ・ ・ ・ ・ Fixed side mirror surface plate 7: Fixed side bush 8: Fixed side guide ring 9 ... Fixed side template 10 ... Molding space 11 ... Spool bush 12 ... Locate ring 13 ... Movable side Mirror surface plate 14 ... Movable side guide ring 15 ... Movable side template 16 ... Stamper 17 ... Outer peripheral surface defining ring 18 ... Inner peripheral stamper retainer ring 19 ... Cam 20 ... Cut Punch 21 ... Spring 22 ... First spacer member 23, 25 ... Bolt 24 ... Second spacer member 26 ... Guide post

───────────────────────────────────────────────────── フロントページの続き (72)発明者 糸魚川 昌秀 山梨県中巨摩郡田富町西花輪2680番地 パ イオニアビデオ株式会社内 (72)発明者 平井 良和 山梨県中巨摩郡田富町西花輪2680番地 パ イオニアビデオ株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masahide Itoigawa 2680 Nishi Hanawa, Tatomi-cho, Nakakoma-gun Yamanashi Pioneer Video Co., Ltd. Within the corporation

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 開放位置と閉型位置との間で相対的に移
動可能第1及び第2の金型を含み、前記第1の金型にス
タンパが取付けられ、前記閉型位置で前記第1及び第2
の金型の間に形成される成形空間内に溶融樹脂を射出す
ることにより、前記スタンパの情報が転写された光ディ
スク基板を成形するようにした光ディスク基板用成形金
型装置であって、 前記第2の金型の成形面に直交する方向に移動可能にな
るよう前記第2の金型に取付けられて、前記閉型位置で
前記成形空間の外周面を規定する外周面規定リングと、 前記外周面規定リングを前記第1の金型側に向かって突
き出すよう付勢する手段と、 前記外周面規定リングの移動量を規制する手段と、 前記第1又は第2の金型の対向面の外周に取付けられ、
前記閉型位置で前記成形空間の間隙の寸法を規定する着
脱可能なスペーサ部材とを有することを特徴とする光デ
ィスク基板用成形金型装置。
1. A first mold including a first mold and a second mold which are relatively movable between an open position and a closed mold position, a stamper being attached to the first mold, and the first mold having the stamper attached to the first mold. 1st and 2nd
An optical disk substrate molding die apparatus configured to mold an optical disk substrate to which information of the stamper has been transferred by injecting a molten resin into a molding space formed between the dies. An outer peripheral surface defining ring which is attached to the second mold so as to be movable in a direction orthogonal to the molding surface of the second mold and defines an outer peripheral surface of the molding space at the closed mold position; Means for urging the surface defining ring to project toward the first mold side; means for restricting the amount of movement of the outer peripheral surface defining ring; and outer circumference of the facing surface of the first or second mold. Mounted on the
A molding die apparatus for an optical disk substrate, comprising: a detachable spacer member that defines a size of a gap of the molding space at the closed position.
【請求項2】 前記スペーサ部材は、前記第2の金型の
外周に取付けられると共に前記外周面規定リングの移動
量を規制する手段を兼ねることを特徴とする請求項1記
載の光ディスク基板用成形金型装置。
2. The molding for an optical disk substrate according to claim 1, wherein the spacer member is attached to the outer periphery of the second mold and also serves as a means for regulating the movement amount of the outer peripheral surface defining ring. Mold equipment.
【請求項3】 前記第1の金型は可動側金型であり、前
記第2の金型は固定側金型であることを特徴とする請求
項1又は2記載の光ディスク基板用成形金型装置。
3. The molding die for an optical disk substrate according to claim 1, wherein the first die is a movable die, and the second die is a stationary die. apparatus.
JP13616795A 1995-05-10 1995-05-10 Mold device for optical disk substrate Pending JPH08300421A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13616795A JPH08300421A (en) 1995-05-10 1995-05-10 Mold device for optical disk substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13616795A JPH08300421A (en) 1995-05-10 1995-05-10 Mold device for optical disk substrate

Publications (1)

Publication Number Publication Date
JPH08300421A true JPH08300421A (en) 1996-11-19

Family

ID=15168897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13616795A Pending JPH08300421A (en) 1995-05-10 1995-05-10 Mold device for optical disk substrate

Country Status (1)

Country Link
JP (1) JPH08300421A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0882562A1 (en) * 1997-06-05 1998-12-09 SEIKOH GIKEN Co., Ltd. Disc molding die
NL1012165C2 (en) * 1999-05-27 2000-11-28 Axxicon Moulds Eindhoven Bv Injection moulding tool for making e.g. CD's or DVD discs, includes tool section with contact sections movable in height direction for altering mould cavity thickness
CN1072097C (en) * 1997-06-12 2001-10-03 株式会社精工技研 Disc molding die
SG90020A1 (en) * 1997-06-02 2002-07-23 Seiko Giken Kk Disc molding die

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG90020A1 (en) * 1997-06-02 2002-07-23 Seiko Giken Kk Disc molding die
EP0882562A1 (en) * 1997-06-05 1998-12-09 SEIKOH GIKEN Co., Ltd. Disc molding die
CN1072097C (en) * 1997-06-12 2001-10-03 株式会社精工技研 Disc molding die
NL1012165C2 (en) * 1999-05-27 2000-11-28 Axxicon Moulds Eindhoven Bv Injection moulding tool for making e.g. CD's or DVD discs, includes tool section with contact sections movable in height direction for altering mould cavity thickness

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