JPH08300182A - Lead-free solder - Google Patents
Lead-free solderInfo
- Publication number
- JPH08300182A JPH08300182A JP13071396A JP13071396A JPH08300182A JP H08300182 A JPH08300182 A JP H08300182A JP 13071396 A JP13071396 A JP 13071396A JP 13071396 A JP13071396 A JP 13071396A JP H08300182 A JPH08300182 A JP H08300182A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- gold
- tin
- platinum
- bismuth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本願発明は、はんだとして有用な
合金組成物に関するものである。特に、有効量のビスマ
ス、スズ及び金から成る低融解温度を示す無鉛合金に関
するものである。FIELD OF THE INVENTION The present invention relates to an alloy composition useful as a solder. In particular, it relates to lead-free alloys having low melting temperatures consisting of effective amounts of bismuth, tin and gold.
【０００２】[0002]
【発明の背景】はんだは、電子アセンブリに広く用いら
れている。電子デバイスそしてその製造環境から鉛(Pb)
を排除することによって鉛のもつ毒性作用を克服するた
めに無鉛はんだが追求されてきた。無鉛で且つ低融解温
度を示すはんだが開発され、それらの働きは多くの電気
的相互接続に適合したものとなっている。しかし、ICデ
バイスのピッチがますます微細になるにつれ、その電気
的特性は十分であるとはいえ、無鉛低融解温度はんだの
機械的特性が問題となっている。BACKGROUND OF THE INVENTION Solder is widely used in electronic assemblies. From electronic devices and their manufacturing environment Lead (Pb)
Lead-free solders have been sought to overcome the toxic effects of lead by eliminating lead. Lead-free and low melting temperature solders have been developed and their work has been adapted to many electrical interconnects. However, as the pitch of IC devices becomes finer, the mechanical properties of lead-free low melting temperature solders are becoming a problem, although their electrical properties are sufficient.
【０００３】商業的に実行可能な消費材の相互接続に不
可欠な機械的特性には、十分な延性、強度及び疲労寿命
がある。共晶のビスマス−スズ(58Bi - 42Sn)等の無鉛
はんだは、低温度はんだ付けとしては妥当な融点を有す
るかも知れないが、必要とする機械的特性に欠けること
がある。Bi-Snは、延性と疲労抵抗が劣っており、従っ
て、電子アセンブリにおける有用性が限定される。低延
性及び疲労に対する抵抗力の低さは、輸送中及び取扱い
中の又は長期の使用後の（"熱−機械的応力 (thermo-me
chanical stress）を生ずる使用−不使用の繰り返し期
間に対応する温度サイクルによる）何れかの機械的スト
レスに起因する接続の物理的破壊の結果として、デバイ
ス故障につながるものである。The essential mechanical properties for commercially viable consumer material interconnections include sufficient ductility, strength and fatigue life. Lead-free solders such as eutectic bismuth-tin (58Bi-42Sn) may have reasonable melting points for low temperature soldering, but may lack the required mechanical properties. Bi-Sn has poor ductility and fatigue resistance, thus limiting its usefulness in electronic assembly. Low ductility and low resistance to fatigue are due to ("thermo-mechanical stress (thermo-mechanical stress)
device failure as a result of the physical destruction of the connection due to any mechanical stress (due to temperature cycling corresponding to repeated use-non-use cycles).
【０００４】電子アセンブリは、適切な延性、強度及び
疲労抵抗を示す無鉛低温はんだによって利益を得るであ
ろう。Electronic assemblies will benefit from lead-free low temperature solders which exhibit suitable ductility, strength and fatigue resistance.
【０００５】[0005]
【発明の目的】本発明は、従来の問題点を解決し、低融
点でかつ微細加工デバイスにも使用可能な優れた機械的
特性を備える鉛を含まないはんだ合金を得ることにあ
る。SUMMARY OF THE INVENTION It is an object of the present invention to solve the problems of the prior art and to obtain a lead-free solder alloy having a low melting point and excellent mechanical properties that can be used for microfabricated devices.
【０００６】[0006]
【発明の概要】本願明細書に教示された発明は、本質的
に無鉛の合金組成物を提供するものである。本発明はさ
らに、融点約138℃という低融解温度を有する合金組成
物も提供する。さらに本発明は、電気的相互接続に適
し、且つ、共晶のビスマス−スズと比べて100%を越える
延性の改善と、10%を上回る強度の向上およびそれに匹
敵する疲労寿命の向上見込みを示す合金組成物をも提供
するものである。SUMMARY OF THE INVENTION The invention taught herein provides an essentially lead-free alloy composition. The present invention also provides alloy compositions having a low melting temperature of about 138 ° C. Further, the present invention is suitable for electrical interconnection and exhibits greater than 100% improvement in ductility over eutectic bismuth-tin and greater than 10% strength and comparable fatigue life improvement prospects. An alloy composition is also provided.
【０００７】本願発明は、有効量のビスマス、スズ及び
金から成る組成物に関する。代わりに、その組成物は、
ビスマス、スズ及び銀、もしくはビスマス、スズ及び白
金を含んでよい。好適な合金は、所与の一組の凝固条件
下で粒子サイズの微細さ(grain size refinement)を改
善する。The present invention relates to compositions comprising effective amounts of bismuth, tin and gold. Instead, the composition is
It may include bismuth, tin and silver, or bismuth, tin and platinum. The preferred alloys improve grain size refinement under a given set of solidification conditions.
【０００８】[0008]
【実施例】粒子サイズの微細さ及びそれに関連した機械
的特性は、少量の金、銀又は白金をビスマスに添加する
ことにより改善することが可能である。好適な実施例で
は、重量約57.1〜57.9%のビスマスと、重量約41.0〜41.
9%のスズと、重量約0.1〜0.99%の量の金、銀又は白金の
少なくとも1つから成る合金である。EXAMPLES Particle size fineness and related mechanical properties can be improved by adding small amounts of gold, silver or platinum to bismuth. In the preferred embodiment, about 57.1-57.9% bismuth by weight and about 41.0-41% by weight.
An alloy consisting of 9% tin and at least one of gold, silver or platinum in an amount of about 0.1-0.99% by weight.
【０００９】発明の一実施例においては、その組成物
は、重量57.9%のビスマスと、重量41.9%のスズと、重量
0.2%の金から成る。Bi-Snのはんだ接合への金の添加
は、金が添加されたはんだ用合金を用いるか、又は以下
の例に示すように、はんだ面に金をめっきし、次いでめ
っきした金をはんだ付けの工程中に溶けたBi - Snの中
へ溶かし込むことによって、達成することができる。In one embodiment of the invention, the composition comprises 57.9% by weight bismuth and 41.9% by weight tin.
It consists of 0.2% gold. The addition of gold to the solder joint of Bi-Sn can be performed by using a soldering alloy to which gold is added, or by plating the solder surface with gold and then soldering the plated gold. It can be achieved by dissolving in Bi-Sn which is melted during the process.
【００１０】約１．２７×１０-5ｃｍ（５マイクロイン
チ（10-6インチ））と約１．２７×１０-4ｃｍ（５０マ
イクロインチ）の厚さの金めっきが施された銅板を用意
する。10ミル（10-3インチ）の厚さのはんだ接合部を金
めっきした2枚の銅板の間に58Bi - 42Snのはんだペース
トをリフローすることにより作製した。リフロー後、金
がはんだ接合部に均一に分布し、ほぼ（5マイクロイン
チめっきで）57.9Bi -41.9Sn - 0.2Auと、（50マイクロ
インチめっきで）56Bi - 41Sn - 2Auの組成物をそれぞ
れ形成した。A gold-plated copper plate having a thickness of about 1.27 × 10 -5 cm (5 microinch (10-6 inch)) and about 1.27 × 10 -4 cm (50 microinch) is prepared. . A 10 mil (10-3 inch) thick solder joint was made by reflowing 58Bi-42Sn solder paste between two gold-plated copper plates. After reflow, gold is evenly distributed on the solder joints, forming a composition of approximately 57.9Bi -41.9Sn -0.2Au (with 5 microinch plating) and 56Bi -41Sn -2Au (with 50 microinch plating) respectively. did.
【００１１】これら2つの組成物のはんだ接合部は、そ
れぞれ、室温で且つ2つのせん断速度（0.01／秒と0.001
／秒）でせん断試験にかけた。図1は4種類のはんだ接合
試料の0.01／秒におけるせん断試験の結果を示すもので
ある。57.9Bi - 41.9Sn - 0.2Auである58Bi - 42Sn / 5
マイクロインチと標識された試料は、58Bi - 42Snであ
る58Bi - 42Sn / Cuと標識された試料もしくは56Bi - 4
1Sn - 2Auである58Bi- 42Sn /40マイクロインチと標識
された試料の何れより大きい延性（はんだ接合分離前に
保持されたひずみ）と強度（最大応力）とを有する。The solder joints of these two compositions have room temperature and two shear rates (0.01 / sec and 0.001 respectively).
/ Sec) and subjected to a shear test. Figure 1 shows the results of a shear test at 0.01 / sec for four types of solder joint samples. 57.9Bi-41.9Sn-0.2Au which is 58Bi-42Sn / 5
The sample labeled microinch is 58Bi-42Sn which is 58Bi-42Sn / Cu labeled sample or 56Bi-4
It has greater ductility (strain retained before solder joint separation) and strength (maximum stress) than any of the samples labeled 1Sn-2Au, 58Bi-42Sn / 40 microinches.
【００１２】図2は、0.001／秒におけるせん断試験の結
果を示す。その結果は、57.9Bi -41.9Sn - 0.2Auの
延性がこの場合は63Sn - 37Pb、即ち電子パッケージン
グおよびアセンブリに最も広く用いられているはんだに
近づくことを除けば、0.01／秒の試験結果と類似してい
る。FIG. 2 shows the result of the shear test at 0.001 / sec. The result is 0.01 / sec test results, except that the ductility of 57.9Bi -41.9Sn-0.2Au approaches 63Sn-37Pb in this case, the most widely used solder for electronic packaging and assembly. Is similar.
【００１３】図3A、Bと図4は、57.9Bi - 41.9Sn - 0.2A
uと58Bi - 42Snに関する同一倍率での光学顕微鏡写真で
ある。本願発明の一実施例である57.9Bi-41.9Sn-0.2Au
の粒子（又は相）サイズは従来の58Bi - 42Snより著し
く小さいことはこれら写真より明かである。FIGS. 3A, 3B and 4 show 57.9Bi-41.9Sn-0.2A.
It is an optical microscope photograph in the same magnification about u and 58Bi-42Sn. 57.9Bi-41.9Sn-0.2Au, which is an embodiment of the present invention
It is clear from these photographs that the particle (or phase) size of is significantly smaller than the conventional 58Bi-42Sn.
【００１４】代替例においては、本発明は、重量で同様
の比率のビスマス、スズ及び銀のものと、重量で0.99%
を越えない銀のものから構成される。結果得られた組成
物は、微細なミクロ構造と改善された機械的特性を示す
ものである。AuとAgのどちらも残留はんだよりもさきに
凝固する針状金属間相(acicular intermetallic phase
s)を形成する。これらは不均質な核形成部位として作用
する可能性がある。白金(Pt)は、ビスマス−スズ−白金
の組成物で白金が重量で0.99を越えない場合において同
様の効果を有することが予測される。In an alternative embodiment, the present invention provides a similar ratio by weight of bismuth, tin and silver to 0.99% by weight.
Composed of silver that does not exceed. The resulting composition exhibits a fine microstructure and improved mechanical properties. Both Au and Ag solidify earlier than residual solder, which is an acicular intermetallic phase.
s) is formed. These may act as heterogeneous nucleation sites. Platinum (Pt) is expected to have a similar effect in a bismuth-tin-platinum composition where platinum does not exceed 0.99 by weight.
【００１５】本願明細書では、本願発明の合金群は、Pb
が無く、低融点であり、且つ優れた機械的特性を有する
ため、電子パッケージングおよびアセンブリの分野で多
くの用途を備えるものである。In the present specification, the alloy group of the present invention is Pb.
, Its low melting point and its excellent mechanical properties make it a versatile application in the field of electronic packaging and assembly.
【００１６】以上、本願発明を好適な実施例に関連して
詳述してきたが、それに関する種々の変更は熟練した当
業者には明らかであると理解される。上述の開示は本願
発明を限定するものとして意図ないしは解釈されるもの
ではなく、又は、別途、他の実施態様、改造又は等価の
装置を除外するものでもない。本願発明は、添付特許請
求の範囲並びにその等価物によってのみ限定されるもの
である。While the present invention has been described in detail with reference to the preferred embodiments, it is understood that various changes therein will be apparent to those skilled in the art. The above disclosure is not intended or interpreted as a limitation of the present invention, or otherwise excludes other embodiments, modifications, or equivalent devices. The present invention is limited only by the appended claims and their equivalents.
【００１７】[0017]
【発明の効果】以上説明したように、本発明に係るはん
だ合金は低融点で優れた機械的特性を備え、鉛を含まな
いので、その毒性による悪影響を排除することができ、
また、微細加工デバイスにも適用可能な広範な無鉛はん
だ合金を得ることができる。As described above, since the solder alloy according to the present invention has a low melting point and excellent mechanical properties and does not contain lead, it is possible to eliminate the adverse effects of its toxicity.
In addition, a wide range of lead-free solder alloys applicable to microfabricated devices can be obtained.
【図１】本発明にかかる無鉛はんだ合金と従来のはんだ
合金のせん断速度0.01／秒におけるせん断試験の結果を
示す図。FIG. 1 is a diagram showing the results of a shear test of a lead-free solder alloy according to the present invention and a conventional solder alloy at a shear rate of 0.01 / sec.
【図２】本発明にかかる無鉛はんだ合金と従来のはんだ
合金のせん断速度0.001／秒におけるせん断試験の結果
を示す図。FIG. 2 is a diagram showing the results of a shear test of a lead-free solder alloy according to the present invention and a conventional solder alloy at a shear rate of 0.001 / sec.
【図３Ａ】本発明の一実施例である無鉛はんだ合金の表
面を示す顕微鏡写真。FIG. 3A is a micrograph showing the surface of a lead-free solder alloy that is an example of the present invention.
【図３Ｂ】従来のはんだ合金の表面を示す顕微鏡写真。FIG. 3B is a micrograph showing the surface of a conventional solder alloy.
【図４】従来のはんだ合金の表面を示す顕微鏡写真。FIG. 4 is a micrograph showing the surface of a conventional solder alloy.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 チー・シー・シー アメリカ合衆国カリフォルニア州サンノ ゼ、ビッグ・サー・ドライブ 1070 ─────────────────────────────────────────────────── ——————————————————————————————————————————————————— Inventor Chi C Sea Big Sur Drive 1070, San Jose, California, USA
Claims (3)
組成物であって、約138℃という共晶に近い融解温度を
有することを特徴とする無鉛はんだ合金。1. A lead-free solder alloy comprising an effective amount of bismuth-tin and gold having a near eutectic melting temperature of about 138.degree.
8%を越えないビスマスとから成る請求項1記載の無鉛は
んだ合金。2. About 42% by weight tin, less than 1% gold, and 5% by weight.
The lead-free solder alloy according to claim 1, which is composed of bismuth not exceeding 8%.
と、金と銀と白金から成る群から選択された重量約0.1
から0.99%の元素とを含む無鉛はんだ合金。3. Bismuth at a weight of about 58%, tin at a weight of about 42%, and a weight of about 0.1 selected from the group consisting of gold, silver and platinum.
Lead-free solder alloy containing from 0.99% element.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US43120195A | 1995-04-28 | 1995-04-28 | |
| US431,201 | 1995-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08300182A true JPH08300182A (en) | 1996-11-19 |
Family
ID=23710910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13071396A Pending JPH08300182A (en) | 1995-04-28 | 1996-04-26 | Lead-free solder |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH08300182A (en) |
| DE (1) | DE19538992A1 (en) |
| GB (1) | GB2300197A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013163207A (en) * | 2012-02-10 | 2013-08-22 | Nihon Superior Co Ltd | Sn-Bi-BASED SOLDER ALLOY |
| CN110004323A (en) * | 2019-03-29 | 2019-07-12 | 北京理工大学 | A kind of low melting point high intensity thermo-sensitive material and preparation method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB388979A (en) * | 1932-06-27 | 1933-03-09 | Friedrich Strasser | Solder for aluminium |
| DE2712517C2 (en) * | 1977-03-22 | 1979-05-23 | Et. Dentaire Ivoclar, Schaan (Liechtenstein) | Use of a bismuth-tin alloy for the production of models in dental technology |
| JPS60246511A (en) * | 1984-05-19 | 1985-12-06 | 中外電気工業株式会社 | Contact for electric breaker |
| GB8807730D0 (en) * | 1988-03-31 | 1988-05-05 | Cookson Group Plc | Low toxicity soldering compositions |
| US5389160A (en) * | 1993-06-01 | 1995-02-14 | Motorola, Inc. | Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties |
| US5368814A (en) * | 1993-06-16 | 1994-11-29 | International Business Machines, Inc. | Lead free, tin-bismuth solder alloys |
| US5393489A (en) * | 1993-06-16 | 1995-02-28 | International Business Machines Corporation | High temperature, lead-free, tin based solder composition |
-
1995
- 1995-10-19 DE DE1995138992 patent/DE19538992A1/en not_active Ceased
-
1996
- 1996-04-25 GB GB9608501A patent/GB2300197A/en not_active Withdrawn
- 1996-04-26 JP JP13071396A patent/JPH08300182A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013163207A (en) * | 2012-02-10 | 2013-08-22 | Nihon Superior Co Ltd | Sn-Bi-BASED SOLDER ALLOY |
| CN110004323A (en) * | 2019-03-29 | 2019-07-12 | 北京理工大学 | A kind of low melting point high intensity thermo-sensitive material and preparation method thereof |
| CN110004323B (en) * | 2019-03-29 | 2020-08-14 | 北京理工大学 | Low-melting-point high-strength thermosensitive material and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| DE19538992A1 (en) | 1996-10-31 |
| GB2300197A (en) | 1996-10-30 |
| GB9608501D0 (en) | 1996-07-03 |
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