GB9608501D0 - Bismuth-tin solder - Google Patents

Bismuth-tin solder

Info

Publication number
GB9608501D0
GB9608501D0 GBGB9608501.4A GB9608501A GB9608501D0 GB 9608501 D0 GB9608501 D0 GB 9608501D0 GB 9608501 A GB9608501 A GB 9608501A GB 9608501 D0 GB9608501 D0 GB 9608501D0
Authority
GB
United Kingdom
Prior art keywords
bismuth
tin solder
solder
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB9608501.4A
Other versions
GB2300197A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of GB9608501D0 publication Critical patent/GB9608501D0/en
Publication of GB2300197A publication Critical patent/GB2300197A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB9608501A 1995-04-28 1996-04-25 A low melting point solder Withdrawn GB2300197A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US43120195A 1995-04-28 1995-04-28

Publications (2)

Publication Number Publication Date
GB9608501D0 true GB9608501D0 (en) 1996-07-03
GB2300197A GB2300197A (en) 1996-10-30

Family

ID=23710910

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9608501A Withdrawn GB2300197A (en) 1995-04-28 1996-04-25 A low melting point solder

Country Status (3)

Country Link
JP (1) JPH08300182A (en)
DE (1) DE19538992A1 (en)
GB (1) GB2300197A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013163207A (en) * 2012-02-10 2013-08-22 Nihon Superior Co Ltd Sn-Bi-BASED SOLDER ALLOY
CN110004323B (en) * 2019-03-29 2020-08-14 北京理工大学 Low-melting-point high-strength thermosensitive material and preparation method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB388979A (en) * 1932-06-27 1933-03-09 Friedrich Strasser Solder for aluminium
DE2712517C2 (en) * 1977-03-22 1979-05-23 Et. Dentaire Ivoclar, Schaan (Liechtenstein) Use of a bismuth-tin alloy for the production of models in dental technology
JPS60246511A (en) * 1984-05-19 1985-12-06 中外電気工業株式会社 Contact for electric breaker
GB8807730D0 (en) * 1988-03-31 1988-05-05 Cookson Group Plc Low toxicity soldering compositions
US5389160A (en) * 1993-06-01 1995-02-14 Motorola, Inc. Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
US5393489A (en) * 1993-06-16 1995-02-28 International Business Machines Corporation High temperature, lead-free, tin based solder composition
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys

Also Published As

Publication number Publication date
GB2300197A (en) 1996-10-30
DE19538992A1 (en) 1996-10-31
JPH08300182A (en) 1996-11-19

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)