JPH0829858B2 - Plate-shaped chuck device and transfer processing system - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plate-shaped chuck device and a transfer processing system, and more particularly to coating a surface to be processed of a plate-shaped body such as an electric circuit board, and electronic parts. The present invention relates to a chuck device used when mounting and a transfer processing system including the chuck device.

[0002]

2. Description of the Related Art In manufacturing an electronic circuit board, an electronic circuit pattern is formed on a board made of epoxy resin (containing glass fiber), an insulating coating is applied to the front and back surfaces of this board, and finally electronic parts are attached. Implement.

In a coating system for coating an insulating coating on a substrate, generally, a transport unit for transporting the substrate is provided over the entire length of the system, a heating unit for heating the substrate during transport, and then this substrate. A coating section for coating the surface to be treated, a drying section for drying the coated surface, and the like are arranged.

By the way, the transfer section is provided over the entire length of the system as described above and undergoes the processing steps by the above-mentioned devices together with the substrate. Therefore, the transfer section has a V-groove shape as shown in FIG. Has been formed. And the substrate P
Only the both side edges a, a are placed and supported on the inclined surface of the V groove b, and are conveyed while maintaining a substantially horizontal state. By being transported in such a posture, a space c is secured between the back surface of the substrate P and the V groove b, and the coating portion prevents the back surface of the substrate P from being contaminated due to adhesion of paint. To be done.

[0005]

However, such a structure can be applied to a substrate having a relatively large thickness, but cannot be applied to a thin substrate.

That is, in recent years, where the size and weight reduction and thinning of various electronic devices such as personal computers and word processors are becoming mainstream, it is indispensable to reduce the thickness of the electronic circuit board itself incorporated therein. The glass fiber-containing epoxy resin is particularly suitable as a future electronic circuit board material because it is excellent in heat resistance and elongation, regardless of its thickness.

However, in the V-groove structure such as the transfer section in the above coating system, both side edges a of the substrate P,
Since only a is supported, the flatness of the substrate P during transportation depends on the bending strength of the substrate P itself. For this reason, when the thickness of the conventional substrate P is relatively thick as about 1.6 mm to 2.0 mm, its bending strength is sufficient and its flatness can be maintained without bending. However (see the solid line in FIG. 15), on the other hand, in a thin substrate P having a wall thickness of about 0.1 mm to 0.8 mm, its bending strength becomes insufficient, and as a result, the center bends due to its own weight and the flatness is lost ( (Refer to the chain double-dashed line in FIG. 15), uniform coating cannot be applied to the entire surface.

The present invention has been made in view of the above conventional problems, and an object of the present invention is to carry out conveyance processing while maintaining its flatness regardless of the thickness of the plate-shaped body. (EN) It is possible to provide a chuck device that can perform the above, and a transfer processing system including the chuck device.

[0009]

In order to achieve the above object, the chuck device of the present invention has a plurality of frame members which are flat.
And a pair of first and second chuck means for elastically chucking and supporting both widthwise side edge portions of the plate-like body. At least one of them is movable in the width direction of the plate-like body by a guide supporting means, and its chuck interval can be adjusted, and the guide supporting means is a plate-like body.
Can be relocated between the treated side of the body and its back side
It is characterized by having an effective structure .

Further, in the transfer processing system of the present invention, a plurality of the chuck devices, a loader means for loading and supporting the plate-shaped bodies on these chuck devices, and a chuck device on which the plate-shaped bodies are loaded and supported are successively connected. Transporting means for transporting to
A processing means for performing a predetermined process on the upper surface of the plate-like body on each chuck device, and a reversing means for reversing the chuck device after the completion of the predetermined process so that the upper and lower surfaces of the plate-like body are arranged upside down. The inversion means includes the chuck device.
The guide supporting means of the plate-shaped body on the processed surface side and the back surface side thereof.
And a chuck device for changing the arrangement between
It is characterized by comprising a reversing unit for reversing the whole upside down.

[0011]

In the chuck device of the present invention, for example, the widthwise both side edges of the electronic circuit board are elastically supported by the first and second chucking means, so that the flat surface is integrated with the board. A lightweight plate-shaped unit is constructed and the entire substrate transfer processing line is performed as it is. In this case, even if the substrate is a thin plate, its flatness is surely maintained.

Further, at least one of the two chuck means is movable in the width direction of the substrate by the guide supporting means, and the chuck interval can be adjusted. Even when a board having a width dimension is placed, it is possible to deal with it without changing the setup. In this case, the guide supporting means can be arranged on the opposite side of the surface which is the surface to be processed of the substrate, that is, on the back surface side, and does not hinder the processing on the surface of the substrate.

In the transport processing system of the present invention, for example, the coating system for coating the electronic circuit board, once the substrate is loaded in the chuck device, a series of coating processing steps for the substrate is performed from the beginning to the end. This is performed with the substrate loaded in the device. That is, after the substrate is loaded and supported by the chuck device by the loader device, the chuck device is sequentially and continuously transported by the transport device, and the coating process is performed on the substrate surface by the coating device during the transport. When the coating processing on the front surface of the substrate is completed, the chuck device is reversed by the reversing means, and the coating processing by the coating means is performed on the back surface of the substrate this time.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 show a chucking device for a plate-like body according to the present invention. This chucking device 1 is specifically for coating a thin plate-shaped electronic circuit substrate P, and is shown in FIG. It is used as part of the system's components. Hereinafter, the chuck device 1 and each constituent device of the coating system will be described in detail.

A. Chucking device 1: As shown in the drawing, the chucking device 1 includes a plurality of aluminum alloy skeleton members having excellent heat resistance in a flat frame shape.
Are flattened lightweight unit structures are set comprising, its
A pair of substrate chuck portions (chucking means) 2 and 3, a guide support portion (guide support means) 4 and a support frame 5 are provided as the main parts of the .

The substrate chuck portions 2 and 3 elastically chuck and support both side edge portions of the substrate P in the width direction B, and are provided so as to extend parallel to the transport direction A of the substrate P. Of these, one of the substrate chuck portions 2 is a fixed side and the other substrate chuck portion 3 is a movable side, and both are supported on the support rods 6 and 6 of the guide support portion 4. .

The substrate chucks 2 and 3 are of the same structure which are symmetrical with respect to the left and right, and as shown in FIG.
0, and a plurality of pairs of upper and lower chuck claws 11, 11 arranged in the longitudinal direction (transport direction) A along the same. The main body bar 10 is a long object having a rectangular cross section, and a plurality of sets of chuck claws 11 and 11 are provided on the upper and lower surfaces of the main body bar 10.
Are fixedly supported by the fixing plates 12 and 12, respectively. By using a plurality of sets of chuck claws 11 in this way, a uniform chucking force is secured over the entire length of the main body bar 10 in the longitudinal direction. However, depending on the type of the substrate P to be handled, the adjacent chuck claws 11 are provided. , 11 can be integrally connected.

The chuck claws 11, 11 are made of a thin metal plate (elastic plate member) having elasticity, and their tips 11 are formed.
The a and 11a are elastically abutted in a direction to close each other, and have a beak shape. With such a thin plate-like chuck claw structure, even if the substrate P has irregularities (waviness), a chucking state along the irregularities is obtained, and the chucking portions 2 and 3 are evenly distributed over the entire length thereof. A chucking force can be secured. Elastic rubber members 13, 13 are provided inside the chuck jaws 11, 11 facing each other.
The front and back surfaces of the substrate P are sandwiched between the elastic rubber members 13, 13 by the elastic force of the chuck claws 11, 11.

Further, inside the elastic rubber member 13 of the upper and lower chuck claws 11, 11 (at the base end side), there are insertion holes 14a, 1 for a chuck opening / closing device 57 (see FIG. 10) which will be described later.
4a, ... and 14b, 14b, .. are provided, and these insertion holes 14a and 14b are formed at positions alternately displaced in the longitudinal direction, as shown in FIG.
The opening / closing operation of the upper and lower chuck claws 11, 11 will be described later.

The guide support portion 4 includes the pair of support rods 6 and 6. These support rods 6 and 6 form a frame of the substrate P together with a support frame 5 which will be described later, and also function as a movement guide member of the movable side substrate chuck section 3. Both support rods 6 and 6 extend in the width direction of the substrate P (perpendicular to the transport direction A) at the front and rear positions of the substrate P in the transport direction A and are arranged in parallel.

The fixed-side substrate chuck portion (first chuck means) 2 is fixedly supported by the support rods 6 and 6, and the movable-side substrate chuck portion (second
The chuck means 3 is supported so as to be movable in the axial direction.

That is, the base ends of the first support arms 20 are fixed to the one ends of the support rods 6 and 6, respectively, and the tips of the first support arms 20 are fixed to the fixed-side substrate chuck portion. In the front and rear positions of 2, the support shaft 20
It is rotatably connected via a.

Further, the base end of the second support arm 21 is attached to both support rods 6 and 6 via the slide pipe 22.
The second support arms 21 and 21 are respectively movably provided in the axial direction, and the tips of the second support arms 21 and 21 are rotatably connected to the front and rear positions of the movable-side substrate chuck portion 3 via support shafts 21a. ing.

The slide pipe 22 includes the support rod 6
Is key-fitted or spline-fitted (key fitting in the illustrated example), and is structured such that it can rotate integrally with the support rod 6 and is allowed to move in the axial direction. Reference numeral 23 denotes a key groove (see FIG. 2) provided in the support rod 6, and the movement stroke of the slide pipe 22, that is, the movable substrate chuck portion 3 is defined within the range in which the key groove 23 is provided.

However, the chuck distance W between the two substrate chuck portions 2 and 3 can be appropriately adjusted in accordance with the width dimension of the substrate P by moving the movable side substrate chuck portion 3 in the width direction B of the substrate P. It is said that. The operation of adjusting the chuck distance W will be described later.

In relation to this, a lock mechanism (lock means) 24 for fixing these to each other is provided between the second support arm 21 and the support rod 6. In this lock mechanism 24, as shown in FIG. 5, a support bracket 25 having a U-shaped cross section is attached and fixed to the second support arm 21, and a lock lever 26 attaches a pivot pin 27 to the support bracket 25. It is pivotally attached so as to be swingable in the horizontal direction.

The lock lever 26 has a lock hole 26a having a diameter larger than that of the support rod 6.
The support rod 6 is inserted through 6a. A compression spring 28 is interposed between the tip of the lock lever 26 and the support bracket 25, and the lock lever 26 is constantly urged to the lock position shown by the solid line in FIG. 7B. In this lock position, the lock hole 26 of the lock lever 26
As shown in the drawing, a is wedge-shaped locked to the support lot 6 to prevent the second support arm 21 from moving in the width direction B.

The support rods 6 and 6 are rotatably supported at the front and rear positions of the support frame 5 via a third support arm 29 fixed to the other ends. That is, the first support arm 20 on the support rod 6
A base end of a third support arm 29 is fixed to the other end opposite to the end to which is fixed, and the tip end of the third support arm 29 is supported by the support shaft 29a. The frame 5 is rotatably supported. The support frame 5 is a long member having a rectangular cross section, and specifically, is made the same member as the main body bar 10 of the substrate chuck portions 2 and 3 so that the components are commonly used.

Therefore, a link structure (arrangement changing mechanism) via the first to third support arms 20, 21, 29 is used.
Structure) , the guide support portion 4 including the support rods 6 and 6.
Is the substrate P chucked and supported by the substrate chuck portions 2 and 3.
Between the front side and the back side.
It is possible to replace. Thereby, the guide support 4
Is always processed in the coating process of the substrate P.
It could be located on the opposite side of the face. This rearrangement
The operation will be described later.

In this connection, the first to third support arms 20, 21, 29 have the same length dimension as each other and the support shafts 20a, 21a, 2 located on the same axis.
They are arranged at the same circumferential angular position with 9a as the center.
As a result, the two support rods 6 and 6 are rotatable with respect to the substrate chuck portions 2 and 3 while always maintaining the parallel state.

B. Coating system: The coating system shown in FIG. 5 uses the chuck device 1 configured as described above, and a carry-in belt conveyor 40 and a carry-out belt conveyor 41 for the substrate P are arranged at the front and rear ends thereof. In addition, the chuck device 1 is provided between the conveyors 40 and 41.
The transport device (transport means) 42 of is provided over substantially the entire length of the present system.

In addition, a loader (loader means) 43 is sequentially installed on the transfer path of the transfer device 42 from the upstream side thereof.
First preheating oven (processing means) 44, first coating device (processing means) 45, first room temperature dryer (processing means) 46, reversing device 47 (reversing means) , second preheating oven (processing means)
48, second coating device (processing means) 49, second room temperature dryer (processing means) 50, hot air dryer 51 and unloader 5
2 are provided, and these devices are controlled by a control device (control means) 53 in synchronization with each other.

(A) Conveying device 42: The conveying device 42 conveys the chuck device 1 on which the substrate P is loaded and supported continuously in sequence, basically from a belt conveyor as shown in FIG. However, different structures are appropriately adopted depending on the purpose, such as the passage portions of the coating devices 45 and 49 described later.

Further, in relation to the transfer device 42, both end portions 6a, 6a of the support rod 6 of the chuck device 1 are
Each of the first support arm 20 and the third support arm 29 is projected outward in the width direction to form a transport support portion. .. are supported on the conveyor belt 42a of the belt conveyor 42 in a mounted state, and the chuck device 1 is conveyed while maintaining the horizontal state.

(B) Loader 43: The loader 43 is for loading and supporting the substrate P carried by the carry-in belt conveyor 40 on the chuck device 1, and as shown in FIG. A chuck width adjusting device 56, a chuck opening / closing device 57 and the like are provided.

Temporary chuck device 55: Temporary chuck device 55
Is for temporarily chucking the substrate P prior to loading it on the chuck device 1. As shown in FIG. 8, a pair of temporary chuck portions 58, 58 for chucking both front and back surfaces of both sides in the width direction of the substrate P are provided. Prepare

As shown in FIG. 9, the temporary chuck portion 58 is provided with a pair of upper and lower temporary chuck members 59 and 60. The upper temporary chuck member 59 can be moved up and down by an air cylinder 61 and the lower temporary chuck member 59. The chuck member 60 is fixedly mounted on the base 62 of the loader 43. This base 62 can also be moved up and down by a drive source (not shown).

The opposing surfaces 59a, 60a of the two chuck members 59, 60 are flat chuck surfaces extending in the transport direction A of the substrate P, and the loading side end of the chuck surface 60a of the lower chuck member 60 is formed. The arcuate surface is formed so that the substrate P can be smoothly introduced. Further, the lower chuck member 60 includes support rods 6, 6 of the chuck device 1.
Insertion grooves 63, 63 are provided.

Chuck width adjusting device 56: The chuck width adjusting device 56 is a movable side substrate chuck part 3 of the chuck device 1.
Is reciprocated in the width direction B to adjust the chuck distance W between the substrate chuck portions 2 and 3. The chuck width adjusting device 56 includes a fixed support portion 65 that supports the fixed-side substrate chuck portion 2 of the chuck device 1 and a movable support portion 66 that supports the movable-side substrate chuck portion 3.

The fixed support portion 65 is fixedly mounted on the base 62 in an upright state, and supports the first support arm 20 of the fixed-side substrate chuck portion 2 in a holding manner.

The movable support portion 66 is mounted on the nut body 67a of the ball screw device 67 arranged on the base 62, and holds the second support arm 21 and the lock mechanism 24 of the movable side substrate chuck portion 3 in a holding shape. To support. This movable support portion 66
Includes an air cylinder 66 for unlocking the lock mechanism 24.
a and its piston rod (not shown) presses the lock lever 26 of the lock mechanism 24 to the unlocked position (see the chain double-dashed line in FIG. 5B) against the biasing force of the compression spring 28. Is being done.

Further, in the ball screw device 67, the screw shaft 67b extends in the width direction B and is horizontally supported, and the nut body 67a is supported on the screw shaft 67b so that the nut body 67a can be screwed back and forth. The base end of the shaft 67b is the servo motor 6
Connected to eight.

The screw shaft 67 is driven by the servomotor 68.
When b is rotated, the movable support portion 66 moves in the width direction B via the nut body 67a, whereby the movable-side substrate chuck portion 3 is reciprocated, and the chuck distance W between the substrate chuck portions 2 and 3 is increased. Is adjusted according to the width of the substrate P.

Chuck opening / closing device 57: The chuck opening / closing device 57 is used for the substrate chucking portions 2 and 3 of the chucking device 1.
For opening and closing the chuck claws 11, 11 of
A pair of left and right is arranged with respect to the substrate chuck portions 2 and 3 of the chuck device 1 which is positioned and supported on the chuck width adjusting device 56. One of the chuck opening / closing devices 57 is
Although not shown, it is supported so as to be movable integrally with the movable supporting portion 66 of the chuck width adjusting device 56.

The chuck opening / closing device 57 is provided with a pair of upper and lower expanding members 57a and 57b.
7b is moved up and down in synchronization with each other by a drive source such as an air cylinder (not shown). Spreading members 57a, 57b
, A plurality of pressing rods 70, 70, ... Are arranged in a comb shape.

As shown in FIG. 10, the pressing rods 70, 70, ... Are inserted into the insertion holes 14a of the chuck claws 11, 11 in accordance with the elevating operation of the expanding members 57a, 57b.
The chuck claws 11 are pressed from the inner side to the outer side via 14a, ... And 14b, 14b ,. As a result, the chuck claws 11 and 11 are expanded in the vertical direction against the elastic force of the chuck claws 11 and 11, while the pressing rods 70, 70 ,.
When the pressing force due to is released, the chuck claws 11 and 11 contract and close due to their own elastic force.

Operation of loader 43: Then, loader 43
The operation of loading the substrate P on the chuck device 1 in step 1 is as follows.

When the width of the substrate P to be carried in is detected by a substrate width detector (not shown) at the carry-in position of the loader 43, the temporary chucking device 55 is generated according to the detection result.
The temporary chuck width of is determined. Then, between the opened temporary chuck members 59 and 60, the substrate P is vacuumed in by means of, for example, a suction cup (not shown).
It is carried in and positioned by. In this state, the temporary chuck members 59 and 60 are closed, and the left and right side portions of the substrate P are temporarily chucked.

As a result, the wavy (usually about ± 30 mm in the vertical direction) generated on the substrate P is stretched by the chuck surfaces 59a and 60a of the temporary chuck members 59 and 60, and the substrate P is flattened. Therefore, the subsequent chucking device 1 can be inserted into the substrate chuck portions 2 and 3.

In the chuck device 1, the substrate chuck portions 2 and 3 are opened by the chuck opening / closing device 57, and the chuck space W between the substrate chuck portions 2 and 3 is set to the substrate P by the chuck width adjusting device 56. Adjusted according to width. In this case, the lock mechanism 24 is unlocked prior to the movement of the movable-side substrate chuck portion 3, and the lock mechanism 24 is again locked when the adjustment is completed.

At the end of this adjustment, the both widthwise edges of the temporarily chucked substrate P are simultaneously positioned between the chuck claws 11, 11 of the substrate chuck portions 2, 3, and the chuck claw 11 by the chuck opening / closing device 57. , 11, the substrate P is elastically clamped from above and below, and the loading and supporting of the chuck device 1 is completed.

(C) Coating device (processing means) 45, 49: The coating devices 45, 49 are for coating an insulating film on the upper surface (processed surface) of the substrate P on each chuck device 1. As shown in FIG. 11, the chuck device 1 is arranged so as to intersect with the transport path of the chuck device 1.

The coating devices 45 and 49 have the same structure, except that the insulating coating material R flows down from the upper position of the chuck device 1 like a waterfall or a curtain and is coated on the surface Pa of the substrate P. The paint R'is structured to be contained in a recovery tank (not shown). As the coating devices 45 and 49, for example, "curtain coater"
(Product name) is preferably used.

In connection with this, in order to prevent the portion of the chuck device 1 other than the substrate P from being coated, the coating preventing knives 71,
72 are arranged. Both of these paint prevention knives 7
Of the 1, 72, the coating prevention knife 72 on the side of the substrate chuck 2 which is the fixed side is fixedly provided, while the coating prevention knife 71 on the side of the substrate chuck 3 which is the movable side is
A drive mechanism (not shown) including a control motor or the like can appropriately move in the width direction B according to the width of the substrate P.

The structure of the transfer device 42 at the parts of the coating devices 45 and 49 is devised so that the surface of the substrate P is uniformly coated. That is, in the carrying device 42, the grip member 78 is integrally provided on the moving body 76 a of the timing belt 75 and the slide bearing 76 via the support bracket 77, and the grip member 78 allows the end portion of the chuck device 1 to be provided. (Transport support)
6a is supported in a hug shape. As a result, the chuck device 1 is guided by the slide bearing 76 while being given a thrust in the transport direction A by the timing belt 75, and the substrate P on the chuck device 1 is
While passing through the curtain-shaped paint R at a constant speed and height, vertical vibration and the like that occur during the passage are effectively prevented.

The substrate P preheated by the preheating oven 44 or 48 passes through the coating device 45 or 49 while maintaining a constant speed and height by the transfer device 42, and the surface of the substrate P is uniformly coated. After being subjected to the above, the drying treatment is performed by the room temperature dryer 46 or 50 subsequent thereto.

(D) Reversing device 47: The reversing device 47 causes the second coating device 4 to remove the substrate P after the completion of the coating process by the first coating device 45 by reversing the chuck device 1.
This is for preparing for the coating process according to No. 9, and as shown in FIG. 12, it is provided with a rotation drive section 80 and a rotation support section 81.

The rotation drive unit 80 includes a drive unit frame 82.
There is rotatably supported via a reversing drive motor 83
Thus, the reversing portion is configured , and support rod rotating portions 84, 84 as arrangement changing portions are provided at both ends of the drive portion frame 82. This support rod rotating portion 8
Reference numeral 4 includes a rotating arm 85 and a support rod drive motor 86 for rotating the rotating arm 85. The rotation arm 85 has a shape and size corresponding to the third support arm 29 of the chuck device 1, and has fitting holes 85a and 85b for fitting the transport support portion 6a of the support rod 6 and the support shaft 29a, respectively.
It has. The rotation arm 85 and the third support arm 29 are integrated by fitting the transport support portion 6a and the support shaft 29a with the fitting holes 85a and 85b.

The rotation support 81 has a support frame 90 rotatably supported by a support shaft 91, and the rotation support arms 9 are provided at both ends of the support frame 90.
2, 92 are rotatably supported. The rotation support arm 92 has a shape and size corresponding to the first support arm 20 of the chuck device 1 and has fitting holes 92a and 92b for fitting with the transport support portion 6a of the support rod 6 and the support shaft 20a, respectively. I have it. Then, the transport support portion 6a and the support shaft 20a, and the fitting holes 92a and 9a.
The rotation support arm 92 and the first support arm 20 are integrated by fitting with 2b.

The rotary drive unit 80 and the rotary support unit 81 can be reciprocated in the width direction B by a drive device (not shown).

Operation of Reversing Device 47: The reversing operation of the chuck device 1 in the reversing device 47 is as follows.

The rotation drive unit 80 and the rotation support unit 81 are
By approaching the chuck device 1 from both sides, the rotating arms 85, 85 and the rotating support arm 9 are moved in the above-described manner.
2, 92 are integrally fitted to the third support arm 29 and the first support arm 20 of the chuck device 1, respectively.

The support rod drive motors 86, 86
It is driven to rotate and, as shown in FIG.
Rotate 6, 6 to the upper side of the substrate P(Relocation operation)
(See FIG. 13B).

The reversing drive motor 83 is rotationally driven to move the chuck device 1 to 18 degrees as shown in FIG. 13B.
The substrate P integrated with the chuck device 1 is rotated upside down by 0 ° (inversion operation) (FIG. 13C).
In this state, the back surface Pb of the substrate P is located on the upper surface side, and the guide support portion 4 including the support rod 6 is located on the lower side of the substrate P.

The rotation drive unit 80 and the rotation support unit 81 are
After being separated from the chuck device 1 on both sides, the preparation for the next coating process on the substrate 1 is completed.

(E) Unloader 52: The specific structure of the unloader 52 is for removing the substrate P from the chuck device 1, and specifically, it is almost the same as the loader 43 shown in FIG. The procedure is the reverse of that of the loader 43.

(F) Control device (control means) 53: The control device 53 automatically controls the operation of each drive unit of the coating system in cooperation with each other.
It is composed of a microcomputer including a RAM and an I / O port. The control unit 53 is electrically connected to the drive units and other drive units of the constituent devices 40 to 52 of the coating system.

C. Operation of the coating system: In the coating system configured as described above, however, each of the constituent devices 40 to 52 has a control device 53 as described below.
Are automatically controlled in relation to each other to sequentially operate the chuck device 1 to perform a predetermined coating process on the substrate P (see FIG. 6).

The target substrate P here is an epoxy resin plate material containing glass fibers, and the shape and size thereof are 200 mm to 500 mm in width and 30 in length.
0 mm to 610 mm, and the thickness dimension is 0.1 mm to
It is a 0.8 mm thin plate.

The substrates P sequentially carried in by the carry-in belt conveyor 40 are loaded and supported by the loader 43 on the chuck device 1 standing by there in the manner described above.

The chuck device 1 supporting the substrate P is
The transfer device 42 sequentially and continuously sends the transfer direction A,
First, a coating process is performed on the surface Pa of the substrate P. That is, the substrate P is preheated together with the chuck device 1 by the first preheating oven 44, and then coated in the above-described manner while passing through the curtain-like flow-down portion of the coating material R of the first coating device 45. 1 Room temperature dryer 46 dries.

When the coating process of the front surface Pa of the substrate P is completed, the chuck device 1 is reversed by the reversing device 47 in the above-described manner, the back surface Pb of the substrate P is arranged on the upper surface side, and again by the transport device 42. After being sent in the carrying direction A, the coating process for the back surface Pb of the substrate P is performed in the second
The preheating oven 48, the second coating device 49, and the second room temperature dryer 50 perform the same as above.

When all the coating processes on the front and back surfaces Pa and Pb of the substrate P are completed, the hot air dryer 51 performs complete drying, and then the unloader 52 removes the substrate P from the chuck device 1 in the reverse order. Then, it is carried out by the carry-out belt conveyor 41.

It should be noted that the above-described embodiment is merely for showing a preferred specific example of the present invention, and various design changes can be made to each constituent device and its specific structure.

For example, the chuck device of the present invention can be applied to the electronic component mounting system as shown in FIG. 14 in addition to the above-described coating system. In this case, the substrate P loaded and supported by the chuck device 1 can be used. An electronic component mounting robot 100 automatically mounts an electronic component 101 such as an IC at a predetermined position of the electronic circuit pattern on the surface Pa.

In the illustrated coating system,
The coating process for the front and back surfaces Pa and Pb of the substrate P is performed by the coating devices 45 and 49, which are independent of each other.
For example, the chuck device 1 reversed by the reversing device 47.
Is again returned to the first preheating oven (processing means) 44, and then the coating process is performed by the first coating device 45. For example, the coating process for the front and back surfaces Pa and Pb of the substrate P is performed by one coating device. It may be configured as follows.

Further, the chuck device 1 of the present invention is not limited to the thin plate-like substrate P as shown in the drawing by changing the design of the structural dimensions of the chuck device 1 as appropriate, but also the conventional thick plate-like substrate and other plate-like substrates. It can also be applied to body transport processing.

Further, in the illustrated example, the substrate chuck portions 2, 3 are provided with a plurality of pairs of upper and lower chuck claws 11, 11, but the pair of upper and lower chuck claws are long and extend over the entire length of the main body bar 10. It may be composed of a thin plate-like elastic metal plate (not shown), and by adopting such a simple structure, it is possible to achieve ease of processing and assembly and further reduction of manufacturing cost.

[0079]

As described in detail above, according to the chucking device of the present invention, the flatness of the plate-like body is maintained by elastically supporting the side edges of the plate-like body in the width direction. While it is integrated with the plate-shaped body to form a flat lightweight plate-shaped unit and can be placed in the plate-shaped plate processing step as it is, its flatness is maintained regardless of the thickness of the plate-shaped body. Transport processing can be performed while maintaining the degree.

In this case, there is no extra structure on the surface side which is the surface to be processed of the plate-like body, the predetermined processing steps can be smoothly carried out, and the chuck interval of the chuck device can be adjusted. Therefore, even when a plate-shaped body having a plurality of types of width dimensions is placed on one conveyance processing line, it is possible to deal with it without performing setup change.

Further, according to the transfer processing system of the present invention, the chuck device is sequentially operated to start a series of transfer processing steps for the plate while the plate is still loaded in the chuck. It is possible to consistently perform from the end to the end, and it is also possible to perform the conveyance processing of the plate-shaped body completely automatically.

Further, since the chuck device has a simple structure and a small size, it is suitable for mass production, and is most suitable for a transfer processing line which requires a large number of chuck devices, such as a coating system for electronic circuit boards ( (Several 100 to 1000 sheets are required for one coating line).

[Brief description of drawings]

FIG. 1 is a perspective view showing a chuck device for an electronic circuit board that is an embodiment according to the present invention.

FIG. 2 is a plan view showing the chuck device.

FIG. 3 is a side view showing the chuck device by partially cutting it.

FIG. 4 is a front view showing the chuck device by partially cutting it.

5A and 5B are views showing a brake mechanism of a movable side chuck portion of the chuck device, wherein FIG. 5A is a perspective view and FIG. 5B is a plan sectional view.

6A and 6B are views showing an overall configuration of a coating system for an electronic circuit board, which is an embodiment of a transfer processing system including the chuck device, FIG. 6A being a side view and FIG. It is a top view.

FIG. 7 is a front cross-sectional view showing a transfer section of the coating system.

FIG. 8 is a front view showing the entire configuration of the loader of the coating system with a part thereof cut away.

FIG. 9 is a perspective view showing a main part of a temporary chuck portion of the loader.

FIG. 10 is a perspective view for explaining an opening / closing operation of the chuck device by the chuck opening / closing device of the loader.

FIG. 11 is a front view showing a coating section of the coating system.

FIG. 12 is a plan view showing a partial cross section of an inversion portion of the coating system.

FIG. 13 is a diagram showing a reversing operation of the chuck device in the reversing unit.

FIG. 14 is a perspective view showing a main part of an electronic component mounting system for an electronic circuit board, which is another embodiment of the transfer processing system including the chuck device.

FIG. 15 is a front cross-sectional view showing a carrying section in a conventional electronic circuit board coating system.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Chuck device 2 Fixed side substrate chuck part (1st chuck means) 3 Movable side substrate chuck part (2nd chuck means) 4 Guide support part (Guide support means) 5 Support frame 6 Support rod 11 Chuck claw 20 1st support arm 21 Second Support Arm 22 Slide Pipe 24 Lock Mechanism (Locking Means) 29 Third Support Arm 40 Carrying In Belt Conveyor 41 Carrying Out Belt Conveyor 42 Conveying Device (Conveying Means) 43 Loader (Loader Means) 44 First Preheating Oven (Processing) Means) 45 First coating device (treatment means) 46 First room temperature dryer (treatment means) 47 Inversion device (inversion means) 48 Second preheating oven (treatment means) 49 Second coating device (treatment means) 50 Second room temperature Dryer (Treatment Means) 51 Hot Air Dryer 52 Unloader 53 Control Device (Control Means) P Substrate Pa Base Front surface of plate Pb Back surface of substrate A Transfer direction of substrate B Width direction of substrate W Chuck interval (= width of substrate)

Claims (8)

[Claims] 1. A framework in which a plurality of framework members are in the shape of a flat frame.
A flat lightweight unit structure , which comprises a pair of first and second chuck means for elastically chucking and supporting both widthwise side edges of the plate-like body, and at least one of these chuck means is The guide support means is movable in the width direction of the plate-like body, and the chuck spacing is adjustable, and the guide support means includes the processed surface side of the plate-like body and the back side thereof.
A chuck device for a plate-shaped body, which is provided with a structure that can be rearranged between the surface side and the surface side . 2. The plate-shaped chuck device according to claim 1, wherein a width direction of the plate-shaped body is a direction perpendicular to a transport direction of the plate-shaped body. 3. The plate-shaped chuck device according to claim 1, wherein the chuck means includes chuck claws composed of upper and lower elastic plate members that elastically sandwich both sides of the plate-shaped body. 4. The guide support means includes a support rod extending in the width direction of the plate-shaped body, and the first chuck means is fixedly supported to the support rod in the axial direction thereof. The plate-shaped chuck device according to claim 1, wherein the second chuck means is supported so as to be movable in the axial direction of the support rod. 5. The guide supporting means includes a pair of front and rear support rods arranged in parallel to the front and rear positions in the transport direction of the plate-shaped body, and a first support arm fixed to one end of these support rods.
But each is pivotally connected to the first chuck means longitudinal position, a second that is movable in the axial direction to these support rods
A support arm is rotatably connected to each of the front and rear positions of the second chuck means, and both support rods are supported via a third support arm fixed to the other end. Each of the first, second, and third support arms is rotatably supported at the front and rear positions of the frame, and is arranged at the same circumferential angular position about the support rod .
The chuck device for a plate-shaped body according to claim 2. 6. The plate-shaped chuck device according to claim 5, further comprising a lock unit that fixes the second support arm to the support rod. 7. A plurality of chuck devices according to any one of claims 1 to 6, loader means for loading and supporting a plate-shaped body on these chuck devices, and a plate-shaped body loaded and supported. Conveying means for sequentially and sequentially conveying the chuck device, processing means for performing a predetermined process on the upper surface of the plate-shaped body on each chuck device, and reversing the chuck device after completion of the predetermined process,
And a reversing means for upside down placing upper and lower surfaces of the plate-like body, the reversing means, the guide support means of the chuck device,
Change the arrangement between the surface of the plate to be processed and the back surface of the plate.
Reversing the chucking device and the entire chuck device
And a reversing unit . 8. The transporting system for a plate-like body according to claim 7 , further comprising a control means for controlling the transporting means, the loader means, the processing means and the reversing means in synchronization with each other.