JPH0829798A - Electronic parts connecting device - Google Patents

Abstract

PURPOSE:To provide a connecting device for electronic parts with which a connecting state having high accuracy is always stably obtained without strictly aligning an optical axis of the positioning optical system. CONSTITUTION:An electrode 22 of IC 21 for driving the liquid crystal and a wiring electrode pattern 26 formed on a glass substrate 25 are temporarily aligned each other by an optical system 39 for confirming the connected state. In the state where temporary alignment is executed, the optical axis of an optical system 38 for alignment is adjusted by the optical system 39 for confirming the connected state. The relation of the connected locations can be checked without actually executing the connecting work, thus simplifying the alignment of the optical axis of the optical system 38 for positioning. When a thermocompression bonding is connected by an anisotropic adhesive 27, the positional relation between the electrode 22 and the wiring electrode pattern 26 is confirmed by the optical system 38 for positioning provided on the side opposite to a transparent stage 35 which fixes the glass substrate 25. Even if the misalignment of the optical axis of the optical system 38 for positioning occurs, the execution of the connecting work is achieved while observing the connected parts by the optical system 39 for confirming the connected state.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connecting device for electronic parts used for electrical and mechanical connection between electrodes of a semiconductor element and wiring electrode patterns of a substrate.

[0002]

2. Description of the Related Art Generally, in an electronic component for mounting a semiconductor element on a substrate, a method for mounting the electronic component is to use a bump formed on an electrode of the semiconductor element and a wiring electrode pattern for extraction formed on the substrate. There is known a face bonding method for directly connecting to each other. Then, a method of electrically and mechanically connecting using an anisotropic adhesive as a connecting material has been newly proposed as a method of realizing high-density mounting at low cost.

The one using this anisotropic adhesive is
For example, when the semiconductor element 11 is mounted on a substrate 12 as disclosed in Japanese Patent Publication No. 62-6652, for example, as shown in FIG. 5, the semiconductor element 11 is mechanically fixed to the substrate 12 and the semiconductor element is also mounted. The electrode 13 provided on the substrate 11
It is necessary to electrically connect to the wiring electrode pattern 14 formed on the wiring 12. In such a case, the electrodes 13 of the semiconductor element 11 and the wiring electrode patterns 14 of the substrate 12 are integrally bonded by the anisotropic adhesive 15.

The anisotropic adhesive 15 is, as is well known,
Conductive particles 17 are mixed and dispersed in an insulating adhesive 16, which has conductivity in the thickness direction and insulation in the surface direction. Then, at the time of bonding the semiconductor element 11 and the substrate 12, the anisotropic adhesive 15 is applied to the semiconductor element 11 as shown in the figure.
The bottom surface of the
The conductive particles 17 electrically connect the 13 and the wiring electrode pattern 14 to each other.

Next, the process of connecting the electric parts will be described with reference to FIGS. 6 and 7. In order to obtain a reliable connection to the electrode 13 of the semiconductor element 11, the bump 19 is integrally provided on the surface of the electrode 13, but it is basically the same as the configuration shown in FIG.

First, as shown in FIG. 6, an electrode 13 is formed on the lower surface of the semiconductor element 11, and a bump 19 is integrally formed on the surface of the electrode 13. The substrate 12 may be either rigid or flexible, and the wiring electrode pattern 14 is formed on the surface of the substrate 12 by etching or the like.

When mounting the semiconductor element 11 on the substrate 12 in a predetermined positional relationship, first, the upper surface of the semiconductor element 11 is vacuum-sucked by a head (not shown), and the substrate 12 is placed on a stage (not shown). Further, an anisotropic adhesive 15 having conductive anisotropy is interposed between the semiconductor element 11 and the substrate 12. The anisotropic adhesive 15 is a sheet-shaped one cut into a size slightly larger than the outer dimensions of the semiconductor element 11, and the sheet-shaped anisotropic adhesive 15 is attached to a predetermined position on the substrate 12. . The anisotropic adhesive 15 has adhesiveness and is attached in a state of being in close contact with the surface of the substrate 12 or the surface of the wiring electrode pattern 14.

Next, an optical system (not shown) is inserted between the facing surfaces of the semiconductor element 11 and the substrate 12, and the images of these facing surfaces are captured. Then, based on the images of the semiconductor element 11 and the substrate 12, the electrode 13 of the semiconductor element 11 and the substrate
The mutual position with the wiring electrode pattern 14 on the wiring 12 is detected, and a stage (not shown) is moved in the XY-θ direction so that the electrode 13 of the semiconductor element 11 and the wiring electrode pattern 14 of the substrate 12 have a predetermined connection relationship. Correct and align.

After the alignment is completed, the optical system is withdrawn from between the facing surfaces, and the semiconductor element 11 fixed to the head (not shown) is pressure-bonded onto the substrate 12 via the anisotropic adhesive 15. Then, the head is heated and pressed from the upper surface side of the semiconductor element 11 in the drawing. By this heating and pressurization, the insulating adhesive 16 of the anisotropic adhesive 15 is melted and the semiconductor element 11 and the substrate 12 are bonded to each other as shown in FIG. And conductive particles 17 are electrically connected. After that, by releasing the heating, the adhesive 16 is cured and integrated.

By the way, in such an electronic component including the semiconductor element 11 and the substrate 12 supporting the semiconductor element 11,
The circuit structure has been densified, and the electrodes 13 and wiring electrode patterns 14
Is miniaturized. In order to connect many miniaturized electrodes to each other, it is necessary to align the optical axis of the alignment optical system exactly. Further, an optical system is required when aligning the semiconductor element 11 and the substrate 12,
This is because it is difficult to observe the optical system at the back surface of the semiconductor element 11 and the substrate 12. That is, the semiconductor element
This is because 11 is non-transparent and the anisotropic adhesive 15 diffusely reflects light because the substrate 12 is provided with the anisotropic adhesive 15.

For alignment using this optical system, an optical system (not shown) is used for the semiconductor element 11 and the substrate 12.
The electrodes of the semiconductor element 11 and the substrate 12 are aligned with each other, the optical system is retracted from the positions of the semiconductor element 11 and the substrate 12, and the electrodes are connected.

By the way, since this optical system must observe both the upper and lower electrodes of this optical system at the same time, a mirror or the like is required, and an accurate alignment can be achieved by shifting the angle of the mirror. Becomes difficult.
That is, if the optical axis is deviated, the actual positional relationship will be deviated even if the image is taken in by the optical system for alignment.

In order to align the optical axis of the optical system, it was necessary to repeat trial and error in which a connection sample was actually prepared, the accuracy was evaluated, and the optical axis was finely adjusted. In addition, it was not possible to evaluate when there was a deviation at the time of connection. Further, even if the optical axis of the optical system is deviated, the occurrence of the optical axis deviation cannot be recognized unless the actual connection portion is observed.

[0014]

As described above, in the conventional connecting device for electronic parts, it is necessary to precisely align the optical axis of the optical system for alignment, and if a deviation occurs during connection, There is a problem that the evaluation cannot be performed and, even if the optical axis is deviated, the occurrence is not known.

An object of the present invention is to provide a connecting device for electronic parts, which can always obtain a highly accurate connection state stably without strictly aligning the optical axis of an optical system for alignment. .

[0016]

According to the present invention, an alignment optical system is inserted between a semiconductor element and a substrate on which a wiring electrode pattern corresponding to an electrode of the semiconductor element is formed,
An electron for capturing the images of the semiconductor element and the substrate by the alignment optical system, aligning the semiconductor element and the substrate on the basis of these images, and thermocompression-bonding the semiconductor element and the substrate to each other. A component connecting device includes a transparent stage for fixing the substrate on one surface, and an optical system for capturing a positional relationship between a wiring electrode pattern of the substrate and electrodes of the semiconductor element.

[0017]

According to the present invention, when the electrodes of the semiconductor element and the wiring electrode patterns formed on the substrate are aligned with each other and the thermocompression bonding is performed using the anisotropic adhesive, the transparent stage on which the substrate is fixed is used. The optical system for checking the connection status provided on the opposite surface side allows you to check the positional relationship between the electrodes and the wiring electrode pattern, and to see the relationship of the connecting positions without making actual connections. It is possible to simplify the optical axis alignment of the optical system for alignment that is inserted into the. Also, since you can connect while observing the state, it is possible to evaluate when deviation occurs, and even if there is a deviation in the optical axis of the alignment optical system, you can use the optical system for checking the connection state to perform alignment. Since the optical axis of the optical system can be adjusted and connected, high-precision connection is always stable.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an electronic component connecting device according to the present invention will be described below with reference to a liquid crystal display manufacturing apparatus shown in the drawings.

As shown in FIG. 1, the liquid crystal driving IC 21 as a semiconductor element has 120 outputs and a size of about 2 mm × 10 mm. And a liquid crystal driving IC
An electrode 22 made of aluminum (Al) and a passivation film 23 which is a surface protection layer of the liquid crystal driving IC 21 are formed on the lower surface which is one surface of the electrode 21. (Ti), nickel (N
A barrier metal layer in which i) and gold (Au) are sequentially formed is formed. Then, a bump 24 made of gold is formed on the surface of the barrier metal layer by a plating method or the like. The bump 24 has a height of 22 μm and an area of 50 μm, and the connection pitch is 80 μm. The other surface portion of the surface provided with the bumps 24 is covered with the passivation film 23 as described above, and the passivation film 23 is made of silicon nitride or the like.

On the other hand, the glass substrate 25 is a main component of the liquid crystal display device, and the wiring electrode pattern 26 is formed on the upper surface which is one surface of the glass substrate 25 by etching or the like. The wiring electrode pattern 26 is a liquid crystal driving IC.
It is electrically conductively connected to the electrode 22 of 21 and is formed at a predetermined position on the glass substrate 25.

The anisotropic adhesive 27 is in the form of a sheet as shown in FIG. 2, and is formed in an area slightly larger than the lower surface of the liquid crystal driving IC 21 shown in the drawing. Further, this anisotropic adhesive 27 has tackiness, and as shown in FIG.
A predetermined position on the glass substrate 25, that is, a liquid crystal driving IC
Attached to 21 mounting positions. Anisotropic adhesive 27
Is based on an epoxy-based thermosetting resin adhesive 28, and has a characteristic that curing proceeds by holding 175 ° C. for about 30 seconds. Also, the conductive particles in this adhesive 28
For 29, a plastic ball coated with a metal film is used.

Further, 35 is a stage of an automatic bonding apparatus, and a glass substrate 25 is mounted on a predetermined position above the stage 35. The stage 35 is made of glass or the like and is transparent so that it can be corrected in each direction of XY-θ by a drive mechanism (not shown).

Further, 36 is a supporting head, and this supporting head 36 has a function of holding the upper surface of the liquid crystal driving IC 21 by vacuum suction and pressing the liquid crystal driving IC 21 onto the glass substrate 25. The support head 36 also has a function of heating the liquid crystal driving IC 21 to a predetermined temperature.

Further, 38 is an optical system for alignment, and this optical system 38 for alignment is between the liquid crystal driving IC 21 supported by the support head 36 and the glass substrate 25 mounted on the stage 35. Images of the connection surfaces facing each other are captured. Then, these images are used for detecting the displacement between the connecting surfaces, and the displacement amount and the direction thereof are determined by the X-direction of the stage 35 with respect to the drive mechanism.
It becomes a control command for correction in each direction of Y-θ.

On the other hand, 39 is an optical system for checking the connection state, and this optical system 39 for checking the connection state is the glass substrate of the stage 35.
An image of the connection state between the glass substrate 25 and the liquid crystal driving IC 21 is captured via the transparent stage 35 provided on the side opposite to the mounting and supporting surface of 25.

Next, the operation of the above embodiment will be described.

First, the glass substrate 25 and the liquid crystal driving IC
In the state that the alignment optical system 38 is not inserted between 21,
While the liquid crystal driving IC 21 is lowered toward the glass substrate 25 and the electrodes of the glass substrate 25 and the liquid crystal driving IC 21 are brought close to each other, the glass substrate 25 and the liquid crystal driving are driven while checking with the optical system 39 for checking the connection state. Temporarily align the IC21 for use. The liquid crystal driving IC 21 is preset in an IC supply unit (not shown) and is supplied to the support head 36 from the IC supply unit.
Is vacuum-adsorbed and held in the illustrated state. Also, glass substrate
25 is mounted at a predetermined position on the stage 35. In addition,
At the time of temporary alignment, since the scattering of light is smaller when the anisotropic adhesive 27 is not attached to the glass substrate 25, the confirmation can be easily performed.

After the temporary alignment is completed, the liquid crystal driving IC
21 is raised, and an optical system 38 for alignment is inserted between the facing surfaces of the liquid crystal driving IC 21 and the glass substrate 25 as shown in the figure. The optical axis of the inserted alignment optical system 38 is adjusted based on the positions of the electrodes of the liquid crystal driving IC 21 and the glass substrate 25 that have been provisionally aligned, and the initial adjustment is completed.

At the time of actual mounting, the liquid crystal driving IC 21
A sheet-shaped liquid crystal driving IC is placed at a predetermined position where
A glass substrate 25 to which an anisotropic adhesive 27 having an area slightly larger than the mounting surface of 21 is attached is mounted at a predetermined position on a stage 35.

Then, in the alignment optical system 38 whose optical axis is adjusted by the initial adjustment, an image of the bonding surface of the liquid crystal driving IC 21 on which the electrode 22 is formed and the glass substrate on which the wiring electrode pattern 26 is formed The images of 25 mounting surfaces are captured respectively. In addition, the control device (not shown) uses an electrode 22 and a wiring electrode pattern 26 that are conductively connected to each other from these two images.
The positional deviation between and is detected. This detected displacement is
It is corrected by driving the stage 35 in the XY-θ directions by a drive mechanism (not shown), and the alignment is completed.

When the alignment is completed as described above, the alignment optical system 38 retreats from between the facing surfaces of the liquid crystal driving IC 21 and the glass substrate 25.

Next, the supporting head 36 holding the liquid crystal driving IC 21 descends, and the liquid crystal driving IC 21 is pressed against the glass substrate 25 from the upper surface side which is the non-bonding surface by about 9 kg, and 17
Hold for about 30 seconds while heating at 5 ° C. At this time, the stage 35 is heated to about 60 ° C.
25 is also heated from the back side.

By this pressurization and heating operation, the anisotropic adhesive 27 is melted and hardened, and the electrode 22 on the liquid crystal driving IC 21 side is formed.
As shown in FIG. 4, the bumps 24 and the wiring electrode patterns 26 on the glass substrate 25 side are conductively connected by the conductive particles 29 of the anisotropic adhesive 27. Further, the thermosetting resin-based adhesive agent 28 starts to cure by heating at 175 ° C., and the curing proceeds by holding this state for 30 seconds, and the surface of the passivation film 23 of the liquid crystal driving IC 21 and the surface of the glass substrate 25. Then, the entire liquid crystal driving IC 21 is firmly mounted on the glass substrate 25. After that, the mounting process is completed by removing the support head 36 from the liquid crystal driving IC 21.

In this way, when the mounting process is repeated and the optical axis of the alignment optical system 38 is deviated during the process, the initial setting is performed again, and then the mounting process is performed again.

Further, the above-mentioned state at the time of connection is the stage.
An optical system 39 for confirming the connection state provided on the opposite side of 35 allows observation through the stage 35. Further, the positional relationship between the glass substrate 25 and the electrode 22 of the liquid crystal driving IC 21 after connection can be confirmed.

Since the optical system 39 for confirming the connection state is provided on the opposite side of the stage 35 as described above, the glass substrate 25 and the liquid crystal driving IC 21 mounted on the glass substrate 25 are mutually connected through the transparent stage 35. You can capture the relationship.
Therefore, the connection positional relationship between the glass substrate 25 and the liquid crystal driving IC 21 can be determined without making an actual connection, and the optical axis alignment of the alignment optical system 38 can be simplified. Also, since the connection work can be performed while monitoring the connection state, it is possible to evaluate when deviation occurs and the operation can be performed to eliminate this deviation, so that a highly accurate connection state can always be obtained stably. It becomes possible.

It should be noted that the present invention is not limited to the above embodiment. For example, heating may be stopped during pressurization by the support head 36, the support head 36 and the liquid crystal driving IC 21 may be cooled, and the pressurization step may be ended. .

The alignment of the liquid crystal driving IC 21 and the glass substrate 25 is performed by driving the stage 35, which supports the glass substrate 25, in the XY-θ directions, but it is relative. Yes, on the contrary, the support head 36 holding the liquid crystal driving IC 21 is driven in the same direction, or
The corrections may be performed by driving each other.

Further, as shown in FIG.
Positioning optical system to be inserted between the facing surfaces of the liquid crystal driving IC 21 held on the substrate and the glass substrate 25 on the stage 35.
38 may be, for example, a CCD camera, or may be one in which an optical path such as a half mirror or a prism is inserted and the image is led to an externally provided imaging camera.

Although the above embodiment has been described with respect to mounting on a liquid crystal display device, the present invention is not limited to the liquid crystal display device, and is applied to all electronic components for mounting a semiconductor element such as an IC on a substrate. It is possible.

[0041]

According to the connecting device for electronic parts of the present invention,
When the electrodes of the semiconductor element and the wiring electrode pattern formed on the substrate are aligned with each other and the thermocompression bonding is performed using an anisotropic adhesive, the connection is provided on the opposite surface side of the transparent stage on which the substrate is fixed. The optical system for checking the status allows you to check the positional relationship between the electrodes and the wiring electrode pattern, so you can see the relationship of the connection positions without making actual connections, and adjust the optical axis of the optical system for positioning. Can be simplified. Also, since the connection can be performed while observing the state, it is possible to evaluate when a deviation occurs, and even when the optical axis of the alignment optical system is deviated, the connection part can be observed. Since it can be connected, it can always be stable in a highly accurate connection state.

[Brief description of drawings]

FIG. 1 is a side view showing an entire embodiment of an electronic component connecting device according to the present invention.

FIG. 2 is a side view showing a state before attachment of the relationship between the substrate and the anisotropic adhesive shown in FIG. 1 above.

FIG. 3 is a side view showing a state after attachment of the relationship between the substrate and the anisotropic adhesive shown in FIG. 1 above.

FIG. 4 is a side view showing a connection state of the electronic components of the above.

FIG. 5 is a side view showing a general connection state using the same anisotropic adhesive.

FIG. 6 is a side view showing a state before bonding when the semiconductor element and the substrate are connected by an anisotropic adhesive.

FIG. 7 is a side view showing a state after bonding when a semiconductor element and a substrate are connected by an anisotropic adhesive.

[Explanation of symbols]

 21 Liquid crystal driving IC as semiconductor element 22 Electrode 25 Glass substrate 26 Wiring electrode pattern 35 Stage 38 Optical system for alignment 39 Optical system for checking connection status

Claims (1)

[Claims] 1. An alignment optical system is inserted between a semiconductor element and a substrate on which a wiring electrode pattern corresponding to an electrode of the semiconductor element is formed, and the alignment optical system is used to insert the semiconductor element and the semiconductor element. In an electronic component connection device for capturing an image of the substrate, aligning the semiconductor element and the substrate based on these images, and thermocompression-bonding the semiconductor element and the substrate to each other, the substrate is fixed on one surface. And a transparent stage, and an optical system for confirming a connection state for grasping a positional relationship between the wiring electrode pattern of the substrate and the electrodes of the semiconductor element.