JPH0829486A - Test head for testing device - Google Patents

Abstract

PURPOSE:To provide a test head which transmits high-speed signals at a low cost and at high quality by enabling the impedance matching in a high-frequency band for the purpose of inputting and outputting high-speed signals from the driver and comparator circuit of a testing device through a performance board to a device to be measured. CONSTITUTION:This test head for testing device is provided with both a guide pin 7 for positioning a contact pin housing 4 relative to a pin card 8 being a pin electronics card, and a spring 6 which mackes the contact pin housing 4 vertically movable, and the contact pin housing 4 to which contact pins A.1 are secured in a line is pressed and connected to a performance board 2 by the spring 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION A test head for a test apparatus for inputting / outputting a high-speed signal from a driver and a comparator circuit to a device to be measured through a performance board, such as a test head for a semiconductor test apparatus. Regarding

[0002]

2. Description of the Related Art As shown in FIG. 3, a test head portion of a conventional semiconductor testing apparatus is fixed by a pogo housing 4 on an upper portion of a pin card 8 and the tip of a pogo pin B10 which can be expanded and contracted by a built-in spring. It is connected by pressing it onto the performance board 2. In this method, the length t2 ・ 12 of the pogo pin B ・ 10 protruding from the upper surface of the pogo housing 4
The set value of becomes large. This is because when the performance board 2 is connected to the performance board 2 by the performance board lock mechanism 3, the dimensional tolerances of the pin card 8, the connector 9, the test head frame 5, etc., and the deflection 14 of the performance board 2 must be taken into consideration. Therefore, for example, the standard t2 · 12 size setting value cannot be set to a large value of about 3 ± 2 mm and a small tolerance. As a result, the inductance component due to the protrusion length t2.12 of the pogo pin B.10 becomes large, impedance matching cannot be achieved in the high frequency band, and high-speed signals cannot be transmitted accurately.

[0003]

In the conventional semiconductor test equipment, in order to input / output the high-speed signal in the high frequency band from the driver and comparator circuits to / from the semiconductor device to be measured through the performance board, performance performance is required. It is connected by pressing it using the board lock mechanism. However, in order to cover the dimensional error of the processing and assembly of the test head frame, the dimensional error when the connector and the pogo housing are attached to the pin card, and the difference in the degree of deflection of the performance board, the pogo pin There is a problem in that the protrusion dimension t2 must be set to a large value, which increases the inductance component due to the pogo pin.

Therefore, in the connection method according to the present invention, the impedance matching in the high frequency band is made possible while making the most of the convenience of the pogo pin, which is generally used in a large amount and is inexpensive, and the high speed signal can be transmitted at a low cost. Aimed at quality transmission.

[0005]

To achieve the above object, in the high-speed signal connection method of the present invention, as shown in FIG. 1, the pogo housing 4 positioned by the guide pin 7 provided on the pin card 8 is used. In addition, the spring 6 or the one having the spring property is configured to be movable up and down, and further, the method in which the spring 6 or the one having the spring property can be pressed against the performance board 2.

[0006]

[Action]

(1) The pogo pin has the convenience that the portion of the pin that serves as a contact point can be expanded and contracted by the built-in spring, and can be used without damaging it in the configuration of the method of the present invention. (2) Since the guide pins and springs are provided, even if dimensional errors due to processing and assembly of pin cards, connectors and test head frames are accumulated, they can be absorbed, so that the pogo pin protrusions The length can be set to the same size as the upper surface of the pogo housing, or the minimum, that is, 0.1 to 0.5 mm. (3) Further, the flexure of the performance board could be sufficiently absorbed by the connection method of the present invention. (4) Also, it has become possible to absorb the repeated operational difference of the performance board lock mechanism.

[0007]

1 and 2 are conceptual diagrams showing the structure of an embodiment according to the present invention. (1) As shown in FIG. 1, in the high frequency band according to the present invention,
In the configuration of the connection method for transmitting a high-speed signal with high quality, the pin card 8 is provided with the guide pin 7, and the spring 6 supports the pogo housing 4. As a result, the pogo housing 4 in which the pogo pins A. 1 are aligned and fixed can be moved up and down independently of the pin card 8, and a connection method of pressing the performance board 2 with the spring 6 is realized. (2) The length of the pogo pin A.1 protruding from the upper surface of the pogo housing 4 can be set to a minimum value from t2 = 3 ± 2 mm according to the prior art to t1 = 0.1 to 0.5 mm according to the present invention. Therefore, the length of the pogo pin A-1 could be shortened accordingly.

(3) As shown in FIG. 2, the support base 15 having a structure in which the pogo housing 4 is supported by the guide pin 7 and the spring 6 is not provided by the pin card 8 but is provided separately.
The connection method of the present invention is also possible. In this case, the accumulation of dimensional error due to machining / assembly is eliminated, so that the pogo pin A.1
It is possible to improve the accuracy of the set value of the protruding length t1 of, and the protruding length can be further shortened. Then, the pin card 8 and the pogo housing 4 are connected by the coaxial cable 13. (4) Furthermore, in the connection method of the present invention, the pogo pin A
-It is also possible to apply a coaxial type pogo pin instead of 1.

In the present specification, a semiconductor test apparatus has been described in detail as an example, but the present invention is not limited to the semiconductor test apparatus and is applied to all test apparatuses such as electronic parts to be tested at high frequency and high speed. It is what is done.

[0010]

Since the present invention is configured as described above, it has the following effects. (1) Pogo pins, which are generally used in large quantities and are inexpensive, in the connection method for inputting and outputting high-speed signals from the driver and comparator circuits in the test equipment to the device under test through the performance board. It has been possible to easily realize impedance matching in a high frequency band without impairing convenience, and to transmit a high-speed signal at low cost and with high quality. (2) In the connection method of the present invention, by shortening the protruding dimension of the pogo housing of the pogo pin, the inductance component is reduced and impedance matching is possible up to a high frequency band, but when the coaxial type pogo pin is applied. In addition, we were able to expand the range of impedance matching to the ultra-high frequency band.

[Brief description of drawings]

FIG. 1 is a conceptual diagram showing a configuration of a test head for connecting a high speed signal according to an embodiment of the present invention.

FIG. 2 is a conceptual diagram showing a configuration of a test head for connecting a high speed signal according to another embodiment of the present invention.

FIG. 3 is a conceptual diagram showing a configuration of a test head for connecting signals according to a conventional technique.

[Description of sign]

 1 Pogo Pin A 2 Performance Board 3 Performance Board Lock Mechanism 4 Pogo Housing 5 Test Head Frame 6 Spring 7 Guide Pin 8 Pin Card 9 Connector 10 Pogo Pin B 11 t1 12 t2 13 Coaxial Cable 14 Performance Board Deflection 15 Pogo Housing Support

Claims (3)

[Claims] 1. A pin card (8), which is a pin electronics card, is provided with a guide pin (7) for positioning the pogo housing (4), and a spring (6) that enables the pogo housing (4) to move up and down. ) Is provided, and the pogo housing (4) in which the pogo pin A (1) is aligned and fixed is attached so as to press and connect the pogo pin A (1) to the performance board (2) by the spring (6). A test head for a test apparatus, which is provided with the above configuration. 2. The test head for a test apparatus according to claim 1, wherein a guide pin (7) for positioning the pogo housing (4) is mounted on a support base (15) provided in the test head. 3. The test head for a test apparatus according to claim 1, wherein the pogo pin A (1) is replaced by a coaxial type pogo pin.