JPH0829423B2 - Automatic teaching device for laser processing machine - Google Patents

Automatic teaching device for laser processing machine

Info

Publication number
JPH0829423B2
JPH0829423B2 JP62076107A JP7610787A JPH0829423B2 JP H0829423 B2 JPH0829423 B2 JP H0829423B2 JP 62076107 A JP62076107 A JP 62076107A JP 7610787 A JP7610787 A JP 7610787A JP H0829423 B2 JPH0829423 B2 JP H0829423B2
Authority
JP
Japan
Prior art keywords
signal
laser
workpiece
light
teaching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62076107A
Other languages
Japanese (ja)
Other versions
JPS63242481A (en
Inventor
隆 池田
久保  学
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62076107A priority Critical patent/JPH0829423B2/en
Publication of JPS63242481A publication Critical patent/JPS63242481A/en
Publication of JPH0829423B2 publication Critical patent/JPH0829423B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、教示用レーザ光を使用して自動テイーチ
ングを行う装置、特に被加工物の変位を距離として測定
するのみならず被加工物の表面状態例えば被加工物の表
面に貼付されたテープ等も検出できるレーザ加工機用自
動テイーチング装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a device for performing automatic teaching using a laser beam for teaching, and more particularly to measuring not only the displacement of a workpiece as a distance but also the workpiece. The present invention relates to an automatic teaching device for a laser processing machine capable of detecting a surface condition such as a tape attached to the surface of a workpiece.

〔従来の技術〕[Conventional technology]

特願昭59−227,226号には、レーザ加工機の加工ヘツ
ドに教示用レーザを取り付けた距離測定装置や、教示用
レーザ光を加工用レーザ光で兼用した距離測定装置が開
示されている。また、加工ヘツドと教示ヘツドを必要に
応じて取り換えることも従来から行われている。
Japanese Patent Application No. 59-227,226 discloses a distance measuring device in which a teaching laser is attached to the processing head of a laser processing machine, and a distance measuring device in which the teaching laser light is also used as the processing laser light. Further, it has been conventionally practiced to replace the processing head and the teaching head as needed.

第2図は、例えば特公昭58−42411号公報に開示され
た従来の非接触型の距離測定装置を示す一般的な構成図
である。図において、(1)は測定ヘツドであり、この
測定ヘツド(1)は光源(2)と、この光源(2)から
放射された光ビームを集光して被測定物(3)上に光ス
ポツト(4)として結像させる投光レンズ(5)と、光
スポツト(4)を集光する受光レンズ(6)と、この受
光レンズ(6)の結像面に配置され、光スポツト(4)
の結像位置に対応した電気信号例えば電流信号Ia,Ibを
送出する光検出器例えば半導体位置検出素子(以下PSD
と略す)(7)とを含む。(8a),(8b)は電流信号I
a,Ibをそれぞれ電圧信号VAとVBに変換する電流/電圧変
換回路、(9)は電圧信号VAとVBを加算して和信号VA
VBを送出する加算回路、(10)は和信号VA+VBと所定の
基準値との誤差を検知してその差信号を送出する誤差検
知回路、(11)は差信号に基づいて光源(2)を出力可
変点灯させる光源駆動回路、そして(12)は電流/電圧
変換回路(8a),(8b)からそれぞれ送出されて来た電
圧信号VA,VBに基づき、後述するように被測定物(3)
の変位を距離として演算し、もつて距離出力を送出する
距離演算回路である。
FIG. 2 is a general configuration diagram showing a conventional non-contact type distance measuring device disclosed in, for example, Japanese Patent Publication No. 58-42411. In the figure, (1) is a measurement head, and this measurement head (1) collects a light source (2) and a light beam emitted from this light source (2) to emit light onto an object to be measured (3). The light projecting lens (5) for forming an image as the spot (4), the light receiving lens (6) for condensing the light spot (4), and the light receiving lens (6) are disposed on the image forming surface of the light spot (4). )
Of a photodetector such as a semiconductor position detecting element (hereinafter referred to as PSD) that sends out an electric signal corresponding to the image forming position of
Abbreviated) (7) is included. (8a) and (8b) are current signals I
A current / voltage conversion circuit for converting a and Ib into voltage signals V A and V B , respectively, and (9) adds the voltage signals V A and V B to obtain a sum signal V A +
An adder circuit that sends V B , (10) an error detection circuit that detects an error between the sum signal V A + V B and a predetermined reference value, and sends a difference signal between them, and (11) a light source based on the difference signal A light source drive circuit for variably lighting the output of (2), and (12) based on the voltage signals V A and V B sent from the current / voltage conversion circuits (8a) and (8b), respectively, as will be described later. DUT (3)
Is a distance calculation circuit that calculates the displacement of as a distance and sends the distance output.

従来の距離測定装置は上述したように構成されてお
り、光源駆動回路(11)によつて駆動された光源(2)
から放射された光ビームは、投光レンズ(5)によつて
集光され、被測定物(3)上に光スポツト(4)として
投射される。この光スポツト(4)は、さらに受光レン
ズ(6)によつて集光され、PSD(7)上に投射、結像
される。このPSD(7)の各端から送出される電流信号I
a,Ibは、PSD(7)上における光スポツト(4)の受光
像の位置に応じて変化する。すなわち、受光像がPSD
(7)の中央にあるときにはIa=Ibであるが、受光像が
Ia側にふれるとIaは大きくなるとともにIbは小さくな
り、反対に受光像がIbの方に移るとIbは大きくなるとと
もにIaは小さくなる。従つて、被測定物(3)の変位す
なわち光スポツト(4)の位置の変化は、PSD(7)の
中心位置からPSD(7)上の受光像の位置までの距離と
して、下記の(1)式で計算されるPに或る変換係数を
乗算したものとして演算することができる。
The conventional distance measuring device is configured as described above, and the light source (2) driven by the light source driving circuit (11).
The light beam emitted from the light source is collected by the light projecting lens (5) and projected as a light spot (4) on the DUT (3). The light spot (4) is further condensed by the light receiving lens (6) and projected and imaged on the PSD (7). Current signal I sent from each end of this PSD (7)
a and Ib change according to the position of the light-receiving image of the optical spot (4) on the PSD (7). That is, the received image is PSD
When in the center of (7), Ia = Ib, but the received light image
When Ia is touched, Ia increases and Ib decreases, and conversely, when the received image shifts to Ib, Ib increases and Ia decreases. Therefore, the displacement of the object to be measured (3), that is, the change of the position of the optical spot (4), is defined as the distance from the center position of the PSD (7) to the position of the light-receiving image on the PSD (7) as shown in (1) below. ) Can be calculated as P multiplied by a certain conversion coefficient.

また、下記の(2)式もしくは(3)式によれば、PS
D(7)の各端から受光像までの距離が求まるから、同
様な三角測量の原理で、これらを被測定物(3)までの
距離に換算できる。
Also, according to the following equation (2) or equation (3), PS
Since the distance from each end of D (7) to the received light image is obtained, these can be converted into the distance to the object to be measured (3) by the same principle of triangulation.

このとき、(1)式〜(3)式の分母(Ia+Ib)を一
定に保てば、P,PA,PBは近似的に、 P′ =Ia−Ib (1′) PA′=Ia (2′) PB′=Ib (3′) となるので、これらをもとに距離に換算しても良い。
At this time, if the denominator (Ia + Ib) of the equations (1) to (3) is kept constant, P, P A and P B are approximated by P ′ = Ia−Ib (1 ′) P A ′ = since the Ia (2 ') P B' = Ib (3 '), it may be converted to distance them based.

一方、十分な精度を必要とするときには、(1)式〜
(3)式のどれかを用いて距離の演算を行なうが、この
場合にも被測定物(3)の状態に応じて変化する分母
(Ia+Ib)が距離の測定精度に影響しないように、光源
(2)の光量を制御して分母(Ia+Ib)がほぼ一定とな
るようにする。
On the other hand, when sufficient accuracy is required, equation (1) ~
The distance is calculated using one of the equations (3), and in this case also, the light source is set so that the denominator (Ia + Ib), which changes according to the state of the DUT (3), does not affect the distance measurement accuracy. The light amount of (2) is controlled so that the denominator (Ia + Ib) becomes almost constant.

〔発明が解決しようとする問題点〕[Problems to be solved by the invention]

従来の距離測定装置では、被測定物(3)上の光スポ
ツト(4)からの光の戻り量として得られる被測定物表
面状態の変化を光源駆動回路(11)で打ち消すのみで、
積極的な信号処理を何等せず、距離情報以外の情報を容
易に得ることができなかつた。このため、距離測定装置
を各種装置に装着して利用する場合には、被測定物
(3)の表面状態の特徴の抽出はもつぱら距離情報のみ
に依存するため表面状態の判別ができなかつたり、また
判別ができる場合でも距離測定値を用いた煩雑な演算を
行なう必要があつたりするという問題点があつた。
In the conventional distance measuring device, the change of the surface state of the object to be measured, which is obtained as the amount of light returned from the optical spot (4) on the object to be measured (3), is simply canceled by the light source drive circuit (11).
Information other than distance information could not be easily obtained without any aggressive signal processing. Therefore, when the distance measuring device is attached to various devices and used, the surface condition cannot be discriminated because the extraction of the surface condition feature of the object (3) depends only on the distance information. In addition, there is a problem that it is necessary to perform a complicated calculation using the distance measurement value even when the determination can be made.

この発明は、このような問題点を解決するためになさ
れたもので、被加工物の距離を測定しながら被加工物の
表面状態も容易に検出できるレーザ加工機用自動テイー
チング装置を得ることを目的とする。
The present invention has been made to solve such a problem, and an object of the present invention is to obtain an automatic teaching device for a laser processing machine that can easily detect the surface state of a work piece while measuring the distance of the work piece. To aim.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係るレーザ加工機用自動テイーチング装置
は、加工用レーザ光を、加工機本体に設けた唯一のヘツ
ドから被加工物に、照射してこの被加工物を加工する加
工用レーザと、教示用レーザ光を前記ヘツドから前記被
加工物に照射する教示用レーザと、これら加工用レーザ
光と教示用レーザ光を切替える手段と、前記被加工物か
らのレーザ光を受光してその受光量に対応する電流信号
を発生する受光系と、前記受光系からの前記電流信号を
電圧信号に変換する可変利得増幅器と、前記教示用レー
ザの出力を測定して他の電気信号に変換する出力測定器
と、前記可変利得増幅器からの前記電圧信号に基づいて
前記ヘツドから前記被加工物までの距離を表わす距離信
号を発生し、前記電圧信号が所定の値になるように前記
可変利得増幅器の利得を制御する制御信号を発生すると
共にこの制御信号を前記出力測定器からの前記電気信号
で除算して前記被加工物の表面状態を表わす表面状態信
号を発生する信号処理回路とを設けたものである。
An automatic teaching device for a laser processing machine according to the present invention includes a processing laser which irradiates a workpiece with a processing laser beam from a head provided in the main body of the processing machine to process the workpiece. A teaching laser for irradiating the workpiece with a working laser beam from the head, a means for switching between the working laser beam and the teaching laser beam, and receiving the laser beam from the workpiece and adjusting the received light amount. A light receiving system that generates a corresponding current signal, a variable gain amplifier that converts the current signal from the light receiving system into a voltage signal, and an output measuring device that measures the output of the teaching laser and converts it into another electric signal. And a distance signal representative of the distance from the head to the workpiece based on the voltage signal from the variable gain amplifier, and the gain signal of the variable gain amplifier is controlled so that the voltage signal has a predetermined value. And a signal processing circuit for generating a surface state signal representing the surface state of the workpiece by dividing the control signal by the electric signal from the output measuring device. is there.

〔作用〕[Action]

この発明においては、受光系が被加工物からのレーザ
光の受光量に対応する電流信号を発生し、可変利得増幅
器が上述した電流信号を電圧信号に変換し、出力測定器
が教示用レーザの出力を電気信号に変換し、そして信号
処理回路が上述した電圧信号に基づいて距離信号を発生
し、可変利得増幅器の利得を制御する制御信号を発生す
ると共にこの制御信号を上述した電気信号で除算して表
面状態信号を発生する。
In the present invention, the light receiving system generates a current signal corresponding to the amount of received laser light from the workpiece, the variable gain amplifier converts the above current signal into a voltage signal, and the output measuring device outputs the teaching laser light. The output is converted to an electric signal, and the signal processing circuit generates a distance signal based on the voltage signal described above to generate a control signal for controlling the gain of the variable gain amplifier and divide the control signal by the electric signal described above. And generate a surface condition signal.

〔実施例〕〔Example〕

第1図はこの発明の一実施例を示す構成図であり、
(21)は加工用レーザ光(21A)を照射する加工用レー
ザ例えばCO2レーザ、(22)は教示用レーザ光(22A)を
照射する教示用レーザ例えばHe−Neレーザ、(23)は加
工用レーザ光(21A)と教示用レーザ光(22A)を切替え
る手段であつて、教示用レーザ(22)の光路中に置かれ
かつ教示用レーザ光(22A)の一部を透過するが残部を
反射するハーフミラー(23A)、このハーフミラー(23
A)を透過した教示用レーザ光(22A)をチヨツピングす
るメカニカルチヨツパ(23B)およびレーザ光切替用シ
ヤツタ(23C)を含む。このシヤツタ(23C)によつて切
替えられたレーザ光は、レーザ加工機の本体(24)に設
けた唯一のヘツド(24A)中の投光レンズ(5)によつ
て被加工物(3A)に照射される。(25)はこの被加工物
(3A)の表面に貼布されたテープである。(26)は受光
系であつて、第2図について上述した受光レンズ(6)
および光検出器例えばPSD(7)から成る。第2図につ
いて上述した電流/電圧変換回路(8a),(8b)は、受
光系(26)詳しくはSPD(7)の出力側に接続されかつ
それぞれPSD(7)の各端からの電流信号Ia,Ibを増幅す
る前置増幅器(27A),(27B)および増幅された電流信
号を電圧信号すなわち被加工物(3A)からのレーザ光
(21A)または(22A)の受光量に対応する電気信号VA
VBに変換する可変利得増幅器(28A),(28B)から成
る。(29)はハーフミラー(23A)によつて反射された
教示用レーザ光(22A)からの教示用レーザ(22)の出
力を測定して電気信号Qに変換する出力測定器である。
(30)は切替手段(23)、受光系(26)および出力測定
器(29)に電気的に接続された信号処理手段であつて、
電圧信号VAとVBを切替えるマルチプレクサ(30A)、こ
のマルチプレクサ(30A)の出力をサンプルホールドす
るサンプルホールド回路(30B)、このサンプルホール
ドされた出力をアナロク/デイジタル変換するA/D変換
器(30C)、このA/D変換器(30C)の出力および出力測
定器(29)からの電気信号Qに基づいてヘツド(24A)
から被加工物(3A)までの距離を表わす距離信号を発生
し、電圧信号VA,VBが所定の値になるように可変利得増
幅器(28A),(28B)の利得を制御する制御信号VGを発
生すると共に被加工物(3A)の表面状態を表わす表面状
態信号を発生する信号処理回路(30D)、およびメカニ
カルチヨツパ(23B)に同期して上述した諸回路(30A)
〜(30D)にタイミングパルスを供給するタイミング回
路(30E)を含む。
FIG. 1 is a block diagram showing an embodiment of the present invention,
(21) is a processing laser that emits the processing laser light (21A), such as a CO 2 laser, (22) is a teaching laser that emits the teaching laser light (22A), such as a He-Ne laser, and (23) is the processing Means for switching between the teaching laser light (21A) and the teaching laser light (22A), which is placed in the optical path of the teaching laser (22) and transmits a part of the teaching laser light (22A) but leaves the rest. Reflective half mirror (23A), this half mirror (23A
A mechanical laser (23B) for tuning the teaching laser light (22A) that has passed through A) and a laser light switching shutter (23C) are included. The laser light switched by the shutter (23C) is transmitted to the work (3A) by the projection lens (5) in the only head (24A) provided in the main body (24) of the laser processing machine. Is irradiated. (25) is a tape attached to the surface of the work (3A). (26) is a light receiving system, which is the light receiving lens (6) described above with reference to FIG.
And a photodetector, eg PSD (7). The current / voltage conversion circuits (8a) and (8b) described above with reference to FIG. 2 are connected to the output side of the light receiving system (26), specifically, the SPD (7), and current signals from the respective ends of the PSD (7). Preamplifiers (27A) and (27B) for amplifying Ia and Ib, and an electric current corresponding to the amount of received laser beam (21A) or (22A) from the work piece (3A) as a voltage signal Signal V A ,
Variable gain amplifier is converted to V B (28A), consisting of (28B). Reference numeral (29) is an output measuring device for measuring the output of the teaching laser (22) from the teaching laser light (22A) reflected by the half mirror (23A) and converting it into an electric signal Q.
(30) is a signal processing means electrically connected to the switching means (23), the light receiving system (26) and the output measuring device (29),
A multiplexer (30A) that switches between voltage signals V A and V B , a sample hold circuit (30B) that samples and holds the output of this multiplexer (30A), and an A / D converter (analog / digital converter that converts the sampled and held output). 30C), the head (24A) based on the output of this A / D converter (30C) and the electric signal Q from the output measuring device (29).
A control signal that generates a distance signal that represents the distance from the workpiece to the workpiece (3A) and controls the gains of the variable gain amplifiers (28A) and (28B) so that the voltage signals V A and V B have predetermined values. A signal processing circuit (30D) that generates V G and a surface condition signal that represents the surface condition of the workpiece (3A), and the above-mentioned circuits (30A) in synchronization with the mechanical tipper (23B).
Includes a timing circuit (30E) for supplying timing pulses to (30D).

上述したように構成されたレーザ加工機用自動テイー
チング装置において、まず被加工物(3A)を加工中の場
合の動作を説明する。この場合は、切替手段(23)によ
つて加工用レーザ(21)からの加工用レーザ光(21A)
が選ばれる。シヤツタ(23C)、加工機本体(24)およ
びそのヘツド(24A)を通過した加工用レーザ光(21A)
は、投光レンズ(5)によつて絞られかつ被加工物(3
A)の表面上の所定の加工点を照射して被加工物(3A)
を加工する。このとき、加工点およびその近傍周辺にお
いて加工用レーザ光(21A)の一部が乱反射すると共に
残りの加工用レーザ光(21A)のエネルギーによつて被
加工物(3A)が熱せられて光を発する。これら光は受光
系(26)中の受光レンズ(6)によつてPSD(7)上に
投射,結像される。このSPD(7)の各端からの電流信
号Ia,Ibは、それぞれ電流/電圧変換回路(8a),(8
b)中の前置増幅器(27A),(27B)によつて増幅され
た後に、信号処理回路(30D)からの制御信号VGで利得
が制御されている可変利得増幅器(28A),(28B)によ
つて電圧信号VA,VBに変換される。この電圧信号VA,VB
は、信号処理手段(30)中のタイミング回路(30E)の
制御下でマルチプレクサ(30A)に交互に取り入れら
れ、サンプルホールド回路(30B)でサンプルホールド
され、A/D変換器(30C)でデイジタル信号に変換された
後に、信号処理回路(30D)で演算処理されて距離信号
となる。
In the automatic teaching device for a laser processing machine configured as described above, the operation when the workpiece (3A) is being processed will be described first. In this case, the processing laser light (21A) from the processing laser (21) is switched by the switching means (23).
Is selected. Laser light for processing (21A) that passed through the shutter (23C), processing machine body (24) and its head (24A)
Is squeezed by the projection lens (5) and the workpiece (3
A) Irradiate a predetermined processing point on the surface of (A) to be processed (3A)
To process. At this time, a part of the processing laser light (21A) is diffusely reflected at the processing point and the vicinity thereof, and the work (3A) is heated by the energy of the remaining processing laser light (21A) to emit light. Emit. These lights are projected and imaged on the PSD (7) by the light receiving lens (6) in the light receiving system (26). The current signals Ia and Ib from the respective ends of the SPD (7) are respectively converted into current / voltage conversion circuits (8a) and (8
Variable gain amplifiers (28A), (28B) whose gain is controlled by the control signal V G from the signal processing circuit (30D) after being amplified by the preamplifiers (27A), (27B) in (b). ), It is converted into voltage signals V A and V B. This voltage signal V A , V B
Are alternately taken into the multiplexer (30A) under the control of the timing circuit (30E) in the signal processing means (30), sample-held by the sample-hold circuit (30B), and digitally by the A / D converter (30C). After being converted into a signal, the signal processing circuit (30D) performs arithmetic processing to form a distance signal.

次に教示中の場合の動作を説明する。この場合は、教
示用レーザ(22)から発し、切替手段(23)中のハーフ
ミラー(23A)を透過しかつメカニカルチヨツパ(23B)
によつてチヨツピングされた教示用レーザ光(22A)が
シヤツタ(23C)で選ばれる。教示用レーザ光(22A)の
一部は、ハーフミラー(23A)で反射された後に、出力
測定器(29)によつて他の電気信号Qに変換されて信号
処理回路(30D)へ供給される。シヤツタ(23C)で選ば
れた教示用レーザ光(22A)も加工機本体(24)および
その唯一のヘツド(24A)を通過し、投光レンズ(5)
によつて絞られた後に被加工物(3A)へ投射される。そ
してヘツド(24A)と被加工物(3A)の相対的位置関係
を保ちながら、矢印で示した方向にヘツド(24A)を移
動させると、被加工物(3A)の表面状態例えば被加工物
(3A)の表面に貼布されたテープ(25)を検出すること
ができる。詳しく云えば、テープ(25)およびその近傍
周辺において反射された教示用レーザ光(22A)は、加
工中の場合と同様に、受光系(26)で受光されて電流信
号Ia,Ibに変換され、電流/電圧変換回路(8a),(8
b)で電圧信号VA,VBに変換され、信号処理手段(30)
中のマルチプレクサ(30A)、サンプルホールド回路(3
0B)およびA/D変換器(30C)によつて信号処理された後
に、信号処理回路(30D)へ供給される。この信号処理
回路(30D)は、受光系(26)からの電流信号IA,IB
いては可変利得増幅器(28A),(28B)からの電圧信号
VA,VBに基づいて上述の距離信号を発生し、上述した制
御信号VGを発生すると共にこの制御信号VGを電気信号Q
で除算することによつて表面状態信号を発生する、つま
りテープ(25)を検出する。なお、表面状態信号は、Q
が一定ならばVGに相当するが、Qが一定でないならばVG
/Qに相当する。
Next, the operation during teaching will be described. In this case, it is emitted from the teaching laser (22), transmitted through the half mirror (23A) in the switching means (23) and the mechanical tip (23B).
The teaching laser beam (22A) that has been adjusted by the laser is selected by the shutter (23C). A part of the teaching laser light (22A) is reflected by the half mirror (23A), then converted into another electric signal Q by the output measuring device (29) and supplied to the signal processing circuit (30D). It The teaching laser light (22A) selected by the shutter (23C) also passes through the processing machine body (24) and its only head (24A), and the projection lens (5)
After being squeezed by, it is projected onto the workpiece (3A). When the head (24A) is moved in the direction shown by the arrow while maintaining the relative positional relationship between the head (24A) and the work piece (3A), the surface state of the work piece (3A), for example, the work piece (3A) The tape (25) attached to the surface of (3A) can be detected. More specifically, the teaching laser light (22A) reflected on the tape (25) and the vicinity thereof is received by the light receiving system (26) and converted into current signals Ia, Ib as in the case of processing. , Current / voltage conversion circuit (8a), (8
In b), it is converted into voltage signals V A and V B , and signal processing means (30)
Inside multiplexer (30A), sample and hold circuit (3
0B) and the A / D converter (30C) perform signal processing, and then supply the signal processing circuit (30D). This signal processing circuit (30D) uses current signals I A and I B from the light receiving system (26) and voltage signals from the variable gain amplifiers (28A) and (28B).
V A, the distance signal of the above-generated based on V B, the electric signal Q and the control signal V G with generating a control signal V G described above
A surface condition signal is generated by dividing by, that is, the tape (25) is detected. The surface condition signal is Q
But but corresponds to the V G if certain, if Q is not constant V G
Corresponds to / Q.

〔発明の効果〕〔The invention's effect〕

上述したように、この発明は、加工用レーザ光を、加
工機本体に設けた唯一のヘツドから被加工物に照射して
この被加工物を加工する加工用レーザと、教示用レーザ
光を前記ヘツドから前記被加工物に照射する教示用レー
ザと、これら加工用レーザ光と教示用レーザ光を切替え
る手段と、前記被加工物からのレーザを受光してその受
光量に対応する電流信号を発生する受光系と、前記受光
系からの前記電流信号を電圧信号に変換する可変利得増
幅器と、前記教示用レーザの出力を測定して電気信号に
変換する出力測定器と、前記可変利得増幅器からの前記
電圧信号に基づいて前記ヘツドから前記被加工物までの
距離を表わす距離信号を発生し、前記電圧信号が所定の
値になるように前記可変利得増幅器の利得を制御する制
御信号を発生すると共にこの制御信号を前記出力測定器
からの前記電気信号で除算して前記被加工物の表面状態
を表わす表面状態信号を発生する信号処理回路とを設け
たので、被加工物の変位すなわち距離を測定できるのみ
ならず被加工物の表面状態も検出できるレーザ加工機用
自動テイーチング装置が容易に得られる効果を奏する。
As described above, according to the present invention, the processing laser light is applied to the workpiece from the only head provided in the main body of the processing machine to process the workpiece, and the teaching laser light is used. A teaching laser for irradiating the workpiece from the head, a means for switching between the processing laser light and the teaching laser light, and receiving a laser from the workpiece to generate a current signal corresponding to the received light amount. A light receiving system, a variable gain amplifier for converting the current signal from the light receiving system into a voltage signal, an output measuring device for measuring the output of the teaching laser and converting it into an electric signal, and the variable gain amplifier A distance signal representing a distance from the head to the workpiece is generated based on the voltage signal, and a control signal for controlling the gain of the variable gain amplifier is generated so that the voltage signal has a predetermined value. Since the control signal is divided by the electric signal from the output measuring device to generate a surface condition signal representing the surface condition of the workpiece, the displacement or distance of the workpiece can be calculated. It is possible to easily obtain an automatic teaching device for a laser processing machine that can not only perform measurement but also detect the surface state of a workpiece.

【図面の簡単な説明】[Brief description of drawings]

第1図はこの発明の一実施例を示す構成図、第2図は従
来の距離測定装置の構成図である。 図において、(21)は加工用レーザ、(21A)は加工用
レーザ光、(22)は教示用レーザ、(22A)は教示用レ
ーザ光、(23)は切替手段、(23C)はシヤツタ、(2
4)は加工機本体、(24A)はヘツド、(3A)は被加工
物、(25)はテープ、(26)は受光系、(28A)と(28
B)は可変利得増幅器、(29)は出力測定器、(30)は
信号処理手段、(30D)は信号処理回路である。 なお、各図中、同一符号は同一または相当部分を示す。
FIG. 1 is a block diagram showing an embodiment of the present invention, and FIG. 2 is a block diagram of a conventional distance measuring device. In the figure, (21) is a processing laser, (21A) is a processing laser beam, (22) is a teaching laser, (22A) is a teaching laser beam, (23) is a switching means, (23C) is a shutter, (2
4) is the machine body, (24A) is the head, (3A) is the work piece, (25) is the tape, (26) is the light receiving system, (28A) and (28A).
B) is a variable gain amplifier, (29) is an output measuring device, (30) is a signal processing means, and (30D) is a signal processing circuit. In each drawing, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】加工用レーザ光を、加工機本体に設けた唯
一のヘツドから被加工物に照射してこの被加工物を加工
する加工用レーザと、教示用レーザ光を前記ヘツドから
前記被加工物に照射する教示用レーザと、これら加工用
レーザ光と教示用レーザ光を切替える手段と、前記被加
工物からのレーザ光を受光してその受光量に対応する電
流信号を発生する受光系と、前記受光系からの前記電流
信号を電圧信号に変換する可変利得増幅器と、前記教示
用レーザの出力を測定して電気信号に変換する出力測定
器と、前記可変利得増幅器からの前記電圧信号に基づい
て前記ヘツドから前記被加工物までの距離を表わす距離
信号を発生し、前記電圧信号が所定の値になるように前
記可変利得増幅器の利得を制御する制御信号を発生する
と共にこの制御信号を前記出力測定器からの前記電気信
号で除算して前記被加工物の表面状態を表わす表面状態
信号を発生する信号処理回路とを備えたことを特徴とす
るレーザ加工機用自動テイーチング装置。
1. A processing laser for irradiating a workpiece with a processing laser beam from a single head provided in a main body of a processing machine to process the workpiece, and a teaching laser beam from the head to the workpiece. A teaching laser for irradiating a work, a means for switching between the working laser light and the teaching laser light, and a light receiving system for receiving the laser light from the work and generating a current signal corresponding to the received light amount. A variable gain amplifier for converting the current signal from the light receiving system into a voltage signal, an output measuring device for measuring the output of the teaching laser and converting it into an electric signal, and the voltage signal from the variable gain amplifier. A distance signal representing the distance from the head to the workpiece, and a control signal for controlling the gain of the variable gain amplifier so that the voltage signal has a predetermined value. Laser processing machine for automatic Teichingu apparatus characterized by comprising a signal processing circuit for generating a surface state signal representative of the surface condition of the said workpiece by dividing the electrical signal from the output measuring device.
JP62076107A 1987-03-31 1987-03-31 Automatic teaching device for laser processing machine Expired - Lifetime JPH0829423B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62076107A JPH0829423B2 (en) 1987-03-31 1987-03-31 Automatic teaching device for laser processing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62076107A JPH0829423B2 (en) 1987-03-31 1987-03-31 Automatic teaching device for laser processing machine

Publications (2)

Publication Number Publication Date
JPS63242481A JPS63242481A (en) 1988-10-07
JPH0829423B2 true JPH0829423B2 (en) 1996-03-27

Family

ID=13595670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62076107A Expired - Lifetime JPH0829423B2 (en) 1987-03-31 1987-03-31 Automatic teaching device for laser processing machine

Country Status (1)

Country Link
JP (1) JPH0829423B2 (en)

Also Published As

Publication number Publication date
JPS63242481A (en) 1988-10-07

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