JPH08293628A - Thermoelectricity conversion device - Google Patents

Abstract

PURPOSE: To inhibit reduction in conversion efficiency of a thermoelectricity conversion device for converting electricity into heat and also to contrive the prolongation of the life of the device by a method wherein the device is provided with coupling means, which couple mechanically an electrode with electrodes adjacent to the electrode at normal temperatures. CONSTITUTION: When a current is supplied to thermionic elements 3 and the like, the end parts 4a and 5a of P-type and N-type semiconductors 4 and 5 generate heat and the end parts 4b and 5b of the semiconductors 4 and 5 are cooled. Accordingly, the heat generated at the end parts 4a and 5a is transmitted to a high temperature side heat exchanger 1 via a first electrode 7 and is dissipated through the outward surface 1a of the heat exchanger 1 and at the same time, the heat is absorbed through the outward surface 2a of a low temperature side heat exchanger 2 and the heat is transmitted to the end parts 4b and 5b of the semiconductors 4 and 5 via second electrodes 8. Moreover, in the case where the thermionic elements 3 and the like are in the state of an abnormal temperature for a long time by the heat and the deterioration of the element 3 and the like due to impact from the outside, insulating volatile parts 14 and 14 are dissolved to volatilize, whereby bonding parts 10, such as solder parts, are dissolved and flow in the those parts and electric circuits are respectively formed of the part 10, a conductive coupling part 13 and the part 10. As a result, the current, which is made to flow through the thermionic elements 3 and the like, is decreased and the abnormal heat generation of the thermionic elements 3 and the like is inhibited.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric converter for converting electricity into heat or heat into electricity.

[0002]

2. Description of the Related Art Conventionally, there is a thermoelectric converter that converts electricity into heat using the Peltier effect and heat into electricity using the Seebeck effect. This thermoelectric conversion device, as shown in FIG. 8, is a substantially flat plate heat exchanger arranged so as to face each other.
1, 2 and a thermoelectric element 3 having a plurality of P-type semiconductors 4 and N-type semiconductors 5 arranged in a grid pattern between the heat exchangers 1 and 2, and a P-type semiconductor 4 of the thermoelectric element 3. And N-type semiconductor 5
And a plurality of electrodes 6 attached to the heat exchangers 1 and 2 and connected so as to be alternately arranged in series. Aluminum is often used as a material for the heat exchangers 1 and 2 in order to improve heat conduction. In addition, the P-type semiconductor 4 and the N-type semiconductor 5 of the thermoelectric element 3 are
A P-type semiconductor 4 and an N-type semiconductor 5 and an electrode, which is a heavy metal substantially rectangular parallelepiped formed by sintering from 0 to several hundreds.
6 is joined at the joint 10 such as solder, and the electrode 6 is
It is attached to the heat exchangers 1 and 2 with an attachment portion 9 made of an insulating material such as an adhesive. Then, for example, electricity can be converted into heat by passing a current through the thermoelectric element 3.

In this thermoelectric converter, a heat quantity proportional to the current flowing through the thermoelectric element 3 is obtained by the Peltier effect, and one of the heat exchangers 1 and 2 can radiate heat and the other can absorb heat. However, the thermoelectric element 3 is vulnerable to heat and impact from the outside, and when the thermoelectric element 3 etc. rises to an abnormal temperature due to deterioration due to it, large thermal deformation etc. occurs due to the difference in thermal expansion between different materials and the thermoelectric element 3 Wire breakage may occur at 3. Moreover, the thermoelectric element 3 has the P-type semiconductor 4 and the N-type semiconductor 4 as described above.
Since the type semiconductors 5 are alternately arranged in series, even if only one of them is disconnected, the function of the thermoelectric conversion device as a whole will stop even though the deterioration of its thermal performance is small.

As a solution to this, Japanese Patent Laid-Open No. 6-8
Some are disclosed in 9955. This is shown in Figure 9.
Further, as shown in FIG. 10, the bypass circuit 30 arranged in parallel with the thermoelectric element 3 is formed on the electrode 6.

[0005]

In the thermoelectric conversion device described above, even if one of the thermoelectric elements is disconnected, the current bypasses the part and flows through the bypass circuit, so that the thermoelectric conversion device functions. Does not stop. However, since current flows through the bypass circuit even when the thermoelectric element is not broken, it is necessary to supply the thermoelectric conversion device with a current greater than that required for the thermoelectric element. The conversion efficiency is not good.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a thermoelectric conversion device capable of suppressing a decrease in conversion efficiency for converting electricity into heat and extending the life. It is to be.

[0007]

In order to solve the above-mentioned problems, the thermoelectric conversion device according to claim 1 is a substantially flat plate-shaped high-temperature side and low-temperature side heat exchanger arranged so as to face each other.
At least one pair of Ps arranged in parallel between the heat exchangers
Element having a N-type semiconductor and a P-type semiconductor and an N-type semiconductor, and a P-type semiconductor and an N-type semiconductor are alternately connected in series so as to be alternately arranged in series between the thermoelectric element and each heat exchanger A thermoelectric conversion device comprising a plurality of substantially flat plate-shaped electrodes to be attached is provided with a connecting means for mechanically connecting adjacent electrodes at room temperature.

Further, the thermoelectric converter according to claim 2 is
The connecting means according to claim 1 is formed so that the adjacent electrodes are electrically connected when the thermoelectric element or the like rises to an abnormal temperature.

The thermoelectric converter according to claim 3 is
The connection means according to claim 2 is disposed between adjacent electrodes, and a conductive connection part made of a conductive material, and the conductive connection part and at least one of the electrodes are connected to each other so that a thermoelectric element or the like is abnormal. An insulating volatile part made of an insulating material that volatilizes when the temperature rises is provided, and when the insulating volatile part volatilizes, the solder melts and flows into the position where the insulating volatile part exists, thereby forming a conductive connecting part. It is formed so as to be connected to the electrodes.

The thermoelectric conversion device according to claim 4 is
The conductive melting connection made of a conductive material, which is arranged between adjacent electrodes and is melted when a thermoelectric element or the like rises to an abnormal temperature to connect the adjacent electrodes to the connecting means according to claim 2. It is configured to have a section.

The thermoelectric converter according to claim 5 is
The connecting means according to claim 4 is provided with an insulating holding part for insulating the conductive melting connecting part and the thermoelectric element.

The thermoelectric conversion device according to claim 6 is
An insulating volatilization section made of an insulating material that volatilizes when the thermoelectric element or the like rises to an abnormal temperature is provided by connecting the conductive melting coupling section and at least one electrode to the coupling means according to claim 4 or 5. .

The thermoelectric converter according to claim 7 is
The connecting means according to claim 1 is formed so as to have the same electrical resistance as that of the thermoelectric element between the adjacent electrodes.

[0014]

According to the structure of claim 1, at room temperature,
Since the adjacent electrodes are mechanically connected by the connecting means, the electrodes do not easily move even if there is an impact from the outside, and the disconnection is suppressed.

According to the structure of claim 2, in addition to the function of claim 1, when the thermoelectric element or the like rises to an abnormal temperature, the connecting means works so that the adjacent electrodes are electrically conducted. , The temperature rise is suppressed and the thermoelectric element is less likely to be broken, and even if a break occurs in the thermoelectric element, current flows through the connecting means, so that the function of the thermoelectric conversion device is suppressed from stopping. It Furthermore, since the current flows through the connecting means only when the thermoelectric element or the like has risen to an abnormal temperature, a decrease in conversion efficiency for converting electricity into heat is suppressed when the temperature does not rise to the abnormal temperature.

According to the third aspect of the invention, in addition to the effect of the second aspect, when the thermoelectric element or the like rises to an abnormal temperature, the insulating volatile portion volatilizes and the solder melts thereafter. The structure of the connection means is simplified because the conductive connection part and both electrodes thereof flow in electrically.

According to the structure of claim 4, in addition to the function of claim 2, when the thermoelectric element or the like rises to an abnormal temperature, the conductive melting connection portion is melted, so that the adjacent electrodes are conductive melted. Since electrical connection is established via the connecting portion, the structure of the connecting means is simplified.

According to the structure of claim 5, in addition to the function of claim 4, the electrically conductive melting connection part and the thermoelectric element are insulated by the insulation holding part, so that the thermoelectric element or the like rises to an abnormal temperature. When it is not performed, no current flows through the conductive melting connection portion, so that a decrease in conversion efficiency for converting electricity into heat is further suppressed.

According to the structure of claim 6, in addition to the effect of claim 4 or 5, the insulating volatilization part made of an insulating material has a conductive melting connection part when the thermoelectric element or the like does not rise to an abnormal temperature. Since it is connected to the electrode, the connecting means can be easily attached to the electrode.

According to the structure of claim 7, in addition to the function of claim 1, since the connecting means is a part of the thermoelectric element, there is no change in the electric resistance as a whole. The current supplied to the device does not increase, and the reduction in conversion efficiency of converting electricity into heat is suppressed.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. Members having the same basic functions as those described in the conventional example are designated by the same reference numerals. FIG. 1 is a cross-sectional view of a thermoelectric conversion device. The thermoelectric conversion device includes a high temperature side heat exchanger 1, a low temperature side heat exchanger 2, and a thermoelectric element 3 including a P-type semiconductor 4 and an N-type semiconductor 5. , Electrode 6
And the connecting means 11 are the main constituent members.

The high temperature side heat exchanger 1 includes a thermoelectric element 3 which will be described later.
It radiates the heat generated at one end to the outside, and is formed of a material having good heat conduction such as aluminum in a substantially flat plate shape having an outer surface 1a and an inner surface 1b. This outer surface 1a is
Contact with gases or solids that want to transfer heat. The low temperature side heat exchanger 2 absorbs heat from the outside as the other end of the thermoelectric element 3 described later is cooled.
Similarly to the above, the material is formed into a substantially flat plate shape having an outer surface 2a and an inner surface 2b from a material having good heat conduction such as aluminum. The outer surface 2a also comes into contact with a gas, a solid, or the like that wants to absorb heat. The low-temperature side heat exchanger 2 and the high-temperature side heat exchanger 1 have thermoelectric elements (to be described later) whose opposing inner surfaces 2b, 1b are substantially parallel to each other.
It is arranged so as to have a space for accommodating the electrodes 3 and the electrodes 6.

The thermoelectric element 3 is for converting electricity into heat and has a plurality of P-type semiconductors 4 and N-type semiconductors 5 although only one is shown in FIG. Each P-type semiconductor 4
And the N-type semiconductors 5 are made of heavy metal and are formed in a substantially rectangular parallelepiped shape. The P-type semiconductors 4 and the N-type semiconductors 5 are arranged side by side in a substantially grid pattern so that the P-type semiconductors 4 and the N-type semiconductors 5 are alternately arranged. The end surface of the mold semiconductor 5 is bonded to the electrode 6 described later. Therefore, the P-type semiconductors 4 and the N-type semiconductors 5 are alternately arranged in series with the electrodes 6 interposed therebetween. Then, the P-type semiconductor 4 and the N-type semiconductor 5 have their end portions 4 at the places where the current flows from the P-type semiconductor 4 to the N-type semiconductor 5.
Where a and 5a generate heat and current flows from the N-type semiconductor 5 toward the P-type semiconductor 4, the ends 4b and 5b thereof are cooled.

The electrode 6 is composed of the P-type semiconductor 4 and N of the thermoelectric element 3.
It is connected to the mold semiconductor 5 and is attached to the heat exchangers 1 and 2, and is composed of a plurality of first electrodes 7 and second electrodes 8. The first electrode 7 and the second electrode 8 are formed of a conductive material such as copper into a substantially flat plate shape. The first electrode 7 is on the inner surface 1a of the high temperature side heat exchanger 1, and the second electrode 8 is on the low temperature side. Heat exchanger
It is attached to the inner surface 2a of 2 via an attachment portion 9 made of an insulating material such as an adhesive or grease. The first electrode 7 and the second electrode 8 are joined to the thermoelectric element 3 at a joint 10 such as solder. Then, the high temperature side heat exchanger 1 and the low temperature side heat exchanger 2
Are fastened with screws or the like (not shown) so as to interpose the thermoelectric element 3, the electrode 6, and the like.

The connecting means 11 connects the adjacent electrodes 6 so that the adjacent electrodes 6 become conductive when the thermoelectric element 3 or the like rises to an abnormal temperature. It is a substantially rod-shaped member that is disposed so as to penetrate from the electrode 7 side to the second electrode 8 side, and has a conductive connecting portion 13 and insulating volatilizing portions 14, 1.
4, the electrodes 6 and 6 are mechanically connected at room temperature. The conductive connecting portion 13 is made of a conductive material such as copper and has a connecting means 11
Is arranged in the central part of the. The insulating volatilization parts 14 and 14 are melted and volatilized when an abnormal temperature is reached for a long time. For example, the insulating volatilization parts 14 and 14 are made of an insulating material made of a high melting point oil and fat, and are composed of the conductive connection part 13 and the joint part 10. It is arranged between.

In this device, when a current is passed in the direction shown in FIG. 1, the ends 4a and 5a of the P-type semiconductor 4 and the N-type semiconductor 5 generate heat and the ends 4b and 5b are cooled. Therefore, the ends 4a, 5a
The heat generated at the high temperature side heat exchanger 1 passes through the first electrode 7.
To the end portions 4b, 5b of the P-type semiconductor 4 and the N-type semiconductor 5 via the second electrode 8 while being radiated from the outer surface 1a and being absorbed by the outer surface 2b of the low temperature side heat exchanger 2. Heat is transmitted to.

Further, when the thermoelectric element 3 or the like is brought to an abnormal temperature for a long time due to deterioration due to heat or impact from the outside, the insulating volatilizing parts 14 and 14 are melted and volatilized, so that soldering is applied to the part. The joint portion 10 such as the above melts and flows in, and the joint portion 10, the conductive connecting portion 13, and the joint portion 10 form an electric path. As a result, the current flowing through the thermoelectric element 3 etc. is reduced and abnormal heat generation is suppressed, so that it is possible to prevent the disconnection in the thermoelectric element 3 etc., and even if the disconnection occurs in the thermoelectric element 3, Since the current flows through the electric path, the thermoelectric conversion device does not stop functioning.

The size of the insulating volatilization portion 14 is determined by
Is formed so as to melt and flow in to be in a conductive state.
Although it is provided at both ends, only one may be provided. Further, the shape and position of the connecting means 11 are not limited to those in this embodiment, and even if the connecting means 11 is formed in a substantially flat plate shape, the connecting means 11 are arranged not in the substantially central portion of the P-type semiconductor 4 and the N-type semiconductor 5 but in the periphery thereof. May be.

Next, a modification of the first embodiment will be described with reference to FIG. In this modified example, the shapes of the conductive connecting portion 13 and the insulating volatilizing portion 14 are changed, and the melting and volatilizing portion 14 is arranged over the entire periphery of the conductive connecting portion 13. By doing so, when the thermoelectric element 3 or the like does not have an abnormal temperature for a long time, current does not flow through the conductive connecting portion 13 made of a conductive material, so that the performance of the thermoelectric element 3 does not deteriorate. .

Next, a second embodiment of the present invention will be described with reference to FIGS.
It will be described based on. This is different from the first embodiment in the structure of the connecting means 11.

The connecting means 11 is a substantially prismatic column having a conductive melting connecting portion 15 and an insulating volatilizing portion 16, and is between the adjacent electrodes 6, for example, the second electrodes 8 and 8, and the second electrode 8 thereof. , 8 are arranged so as to abut. The conductive melting connection portion 15 is made of a conductive material such as solder that melts when the temperature rises to an abnormal temperature, and is formed in a substantially prismatic shape so as not to contact the second electrodes 8 and 8 when the temperature does not rise to the abnormal temperature. To be done. Insulation volatilization part 16
Is a material that melts and volatilizes when the temperature becomes abnormal for a long time, and is made of, for example, an insulating material made of a high melting point oil or fat, and is disposed over the entire periphery of the conductive melting connection portion 15. Contact the electrodes 8,8.

In the case where the thermoelectric element 3 and the like have an abnormal temperature for a long time, the insulating volatilization section 16 is melted and volatilized, and further the conductive melting connection section 15 is melted. Due to the surface tension of the conductive melting connection part 15,
The electrodes 8 and 8 are connected by the conductive melting connection portion 15 to form an electric path. As a result, the current flowing through the thermoelectric element 3 etc. is reduced and abnormal heat generation is suppressed, so that the occurrence of wire breakage in the thermoelectric element 3 is suppressed, and even if the wire breakage occurs in the thermoelectric element 3, Since the current flows through the thermoelectric conversion device, the thermoelectric conversion device does not stop functioning. This is also a thermoelectric element
When the temperature of 3 or the like does not become abnormal for a long time, the current does not flow through the conductive connecting portion 13 made of a conductive material, so that the performance of the thermoelectric element 3 does not deteriorate.

The shape of the connecting means 11 is not limited to this embodiment, and the insulating volatilization part 16 is the second electrode.
It may be interposed only between 8, 8 and the conductive melting connection portion 15.

Next, a third embodiment of the present invention will be described with reference to FIGS.
It will be described based on. This structure also differs from the first and second embodiments in the structure of the connecting means 11.

The connecting means 11 is a substantially prismatic column having a conductive melting connecting portion 17 and an insulating holding portion 18, and is a first electrode facing each other.
It is disposed between the P-type semiconductor 4 and the N-type semiconductor 5 between the 7 and the second electrode 8. The conductive melting connection part 17 is made of a conductive material such as solder that melts when the temperature rises to an abnormal temperature, and will be described later so as not to contact the joint part 10 when the thermoelectric element 3 etc. does not have an abnormal temperature for a long time. Insulation holder
It is arranged on the outer circumference of 18. The insulation holding portion 18 insulates the conductive melting connection portion 17 and the P-type semiconductor 4 or the N-type semiconductor 5 from each other.
Is arranged on the entire outer circumference of the.

In this case, when the thermoelectric element 3 or the like is in an abnormal temperature for a long time, the conductive melting connecting portion 17 melts,
As shown in FIG. 6, the first electrode 7 and the second electrode 8 are connected to form an electric path. As a result, the current flowing through the thermoelectric element 3 etc. is reduced, and abnormal heat generation is suppressed.
Even if a disconnection occurs at 3 or the like, the function of the thermoelectric conversion device does not stop because the current flows through the electric path.
Also in this case, when the thermoelectric element 3 or the like does not have an abnormal temperature for a long time, no current flows through the conductive melting connection portion 17 made of a conductive material, so that the performance of the thermoelectric element 3 does not deteriorate.

The shape of the connecting means 11 is not limited to this embodiment, and the insulating holding portion 18 is interposed only between the P-type semiconductor 4 and the N-type semiconductor 5 and the conductive melting connecting portion 17. May be.

Next, a fourth embodiment of the present invention will be described with reference to FIG. In this embodiment, the electrodes facing each other are electrically connected by the connecting means even when the thermoelectric element 3 or the like does not have an abnormal temperature for a long time.

The connecting means 11 is for always connecting the first electrode 7 and the second electrode 8 which face each other, and has a conductive connecting portion 20. The conductive connecting portion 20 has substantially the same electrical resistance as that of the thermoelectric element 3 and is a substantially rod-shaped member made of a conductive material having a high strength, and the substantially central portion of the P-type semiconductor 4 and the N-type semiconductor 5 is the first electrode. 7 and the second electrode 8 are arranged to be connected to each other. Specifically, the conductive connecting portion 20 is formed by a method such as sintering after mixing a metal that is a good conductor and an inorganic compound that is a non-conductor with an appropriate blending.

In this case, even if a break occurs in the thermoelectric element 3, a current flows through the conductive connecting portion 20, so that the function of the thermoelectric conversion device does not stop. Further, since the conductive connection portion 20 has substantially the same electric resistance as the thermoelectric element 3, there is no change in the electric resistance of the thermoelectric conversion device as a whole, so that the current supplied to the thermoelectric conversion device does not increase, and The conversion efficiency of converting heat into heat does not decrease.

Although the thermoelectric conversion device of the present invention has been described as one that converts electricity into heat by utilizing the Peltier effect, it can also be used by converting heat into electricity by utilizing the Seebeck effect. . Further, the once melted solder or the conductive melting connection portion is solidified when the temperature thereof is lowered, and the electrically conductive state is maintained.

[0042]

In the thermoelectric conversion device according to the first aspect of the present invention, at room temperature, since the adjacent electrodes are mechanically connected by the connecting means, the electrodes are moved even if there is an impact from the outside. Since it is difficult and the breakage is suppressed, the life can be extended.

The thermoelectric converter according to claim 2 is
In addition to the effect of the first aspect, when the thermoelectric element or the like rises to an abnormal temperature, the connecting means works so that the adjacent electrodes are electrically conducted, so that the temperature rise is suppressed and the thermoelectric element is less likely to break. At the same time, even if a break occurs in the thermoelectric element, a current flows through the connecting means, so that the function of the thermoelectric conversion device is suppressed from stopping. further,
Since the electric current flows through the connecting means only when the thermoelectric element or the like rises to an abnormal temperature, a decrease in conversion efficiency for converting electricity into heat is suppressed when the temperature does not rise to an abnormal temperature.
The life is further extended and the performance is improved.

The thermoelectric converter according to claim 3 is
In addition to the effect of claim 2, when the thermoelectric element or the like rises to an abnormal temperature, the insulating volatilization part volatilizes and the solder melts and flows in after that, and the conductive connection part and both electrodes are electrically connected. Therefore, since the structure of the connecting means is simple,
Productivity is improved.

The thermoelectric converter according to claim 4 is
In addition to the effect of claim 2, when the temperature of the thermoelectric element or the like rises to an abnormal temperature, the adjacent electrodes melt due to the melting of the conductive melting connecting portion, so that the adjacent electrodes are electrically conducted through the conductive melting connecting portion. Since the structure is simple, productivity is improved.

The thermoelectric converter according to claim 5 is
In addition to the effect of claim 4, since the electrically conductive melting connecting portion and the thermoelectric element are insulated by the insulation holding portion, no electric current flows through the electrically conductive melting connecting portion when the thermoelectric element or the like does not rise to an abnormal temperature, so that further electrical Since the decrease in conversion efficiency for converting heat into heat is suppressed, the performance is further improved.

The thermoelectric converter according to claim 6 is
In addition to the effect of claim 4 or 5, the insulating volatilization part made of an insulating material connects the conductive melting connection part with the electrode when the thermoelectric element or the like does not rise to an abnormal temperature, so that the connection means can be attached to the electrode. Since it becomes easy, the productivity is further improved.

The thermoelectric converter according to claim 7 is
In addition to the effect of claim 1, since the connecting means is part of the thermoelectric element, there is no change in the electric resistance as a whole, so that the current supplied to the thermoelectric conversion device does not increase and the electricity is converted into heat. Since the decrease in conversion efficiency due to the reduction of the conversion efficiency is suppressed, the performance is improved.

[Brief description of drawings]

FIG. 1 is a sectional view of a thermoelectric conversion device showing a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of a thermoelectric conversion device showing a modification thereof.

FIG. 3 is a sectional view of a thermoelectric conversion device showing a second embodiment of the present invention.

FIG. 4 is a cross-sectional view showing when the thermoelectric converter rises to an abnormal temperature.

FIG. 5 is a sectional view of a thermoelectric conversion device showing a third embodiment of the present invention.

FIG. 6 is a cross-sectional view showing when the thermoelectric converter rises to an abnormal temperature.

FIG. 7 is a sectional view of a thermoelectric conversion device showing a fourth embodiment of the present invention.

FIG. 8 is a cross-sectional view of a thermoelectric conversion device showing a conventional example of the present invention.

FIG. 9 is a simplified circuit diagram of a thermoelectric conversion device showing another conventional example of the present invention.

FIG. 10 is a perspective view of the thermoelectric conversion device.

[Explanation of symbols]

 1 High temperature side heat exchanger 2 Low temperature side heat exchanger 3 Thermoelectric element 4 P-type semiconductor 5 N-type semiconductor 6 Electrode 7 First electrode 8 Second electrode 11 Connection means 13 Conductive connection part 14 Insulating volatilization part 15 Conductive melting connection part 16 Insulation volatilization part 17 Conductive melting connection part 18 Insulation holding part 20 Conduction connection part 30 Bypass circuit

Claims (7)

[Claims] 1. A substantially flat plate-shaped high-temperature-side and low-temperature-side heat exchanger arranged to face each other, and at least one pair of P-type semiconductor and N-type semiconductor arranged in parallel between the heat exchangers. A thermoelectric element having the substantially flat plate shape connected to the heat exchanger by solder so that the P-type semiconductor and the N-type semiconductor are alternately arranged in series between the thermoelectric element and each heat exchanger. The thermoelectric conversion device, comprising: a plurality of electrodes, and a connecting means for mechanically connecting adjacent electrodes at room temperature. 2. The thermoelectric conversion device according to claim 1, wherein the connecting means is formed so that the adjacent electrodes are electrically connected when the thermoelectric element or the like rises to an abnormal temperature. 3. A thermoelectric element or the like, wherein the connecting means is provided between adjacent electrodes and is made of a conductive material, and the conductive connecting portion is connected to at least one electrode. An insulating volatilization part made of an insulating material that volatilizes when the temperature rises to an abnormal temperature is provided, and when the insulating volatilization part volatilizes, the solder melts and flows into the position where the insulating volatilization part exists, so that the conductive connection part is formed. The thermoelectric conversion device according to claim 2, wherein the thermoelectric conversion device is formed so as to be connected to the electrode. 4. A conductive melt made of a conductive material, which is arranged between adjacent electrodes to the connecting means, and which melts when a thermoelectric element or the like rises to an abnormal temperature and connects the adjacent electrodes. The thermoelectric conversion device according to claim 2, wherein a connecting portion is provided. 5. The thermoelectric conversion device according to claim 4, wherein the connecting means is provided with an insulating holding part that insulates the electroconductive melting connecting part from the thermoelectric element. 6. The insulating volatilization part made of an insulating material, which is volatilized when a thermoelectric element or the like rises to an abnormal temperature, is provided by connecting the conductive melting connection part and at least one electrode to the connecting means. The thermoelectric conversion device according to claim 4 or 5. 7. The thermoelectric conversion device according to claim 1, wherein the connecting means is formed so as to have an electric resistance of the same level as a thermoelectric element between adjacent electrodes.