JPH08292567A - Photosensitive resin composition and multilayered printed circuit board using its cured body as interlaminar insulating layer - Google Patents

Abstract

PURPOSE: To provide a photosensitive resin compsn. developable with an aq. soln. and excellent in flame retarding property because of an added flame retardant causing no problem on safety, environment, etc., and to provide a printed circuit board using the resin compsn. CONSTITUTION: An acrylate which cures when irradiated with light and a photopolymn. initiator are blended with condensed phosphoric acid amide. At least one among epoxy resin, epoxy acrylate having an epoxy residue and carboxyl group-contg. epoxy acrylate having an epoxy residue and an epoxy resin curing agent are further incorporated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photosensitive resin composition having excellent flame retardancy and a printed wiring board using the same as an interlayer insulating material.

[0002]

2. Description of the Related Art As electronic devices have become smaller, lighter and more multifunctional, higher density has been required for multilayer printed wiring boards. For this reason, in recent years, an insulating resin layer that is cured by irradiation with light is formed on an insulating substrate on which a circuit is formed, and a minute via hole is formed in the insulating resin by a photo process.
A method of electrically connecting circuits formed in different layers via this via hole has been proposed (Sho 63-).
No. 126296, Japanese Patent Publication No. 4-55555).

The interlayer insulating material is roughly classified into a solvent developing type, a quasi-water developing type and an alkali developing type according to the type of developing solution used in the photo process. In order to make the interlayer insulating material flame-retardant, a halide is generally used in the solvent development type, and antimony trioxide is used in the quasi-water development type and the alkali development type.

[0004]

However, halides are regarded as a problem with the toxicity of halogen-based gas generated during combustion, and antimony trioxide is also a deleterious substance defined in Article 2 of the Act on Poisonous and Poisonous Control. It is designated as a toxic substance, and it is specified as a poisonous substance in Appended Table 4 of Article 3 of the Dangerous Goods Regulations. Furthermore, in a solvent-developable material that uses an organic solvent such as chlorothene as a developing solution, there are concerns about safety and environmental problems due to the use of such an organic solvent.

An object of the present invention is to develop a photosensitive resin composition which is excellent in flame retardancy by adding a flame retardant which can be developed by an aqueous solution having no problem in safety and environment and which has no problem in safety and environment. And to provide a printed wiring board using the same.

[0006]

The present invention is a photosensitive resin composition comprising an acrylate which is cured by irradiation with light and a photopolymerization initiator and condensed phosphoric acid amide.

This photosensitive resin composition contains at least one member selected from the group consisting of an epoxy resin, an epoxy acrylate having an epoxy residue and a carboxyl group-containing epoxy acrylate having an epoxy residue in order to improve adhesiveness and heat resistance. It is preferable that an epoxy resin curing agent is included and curing is performed by a combination of light curing and heat curing.

The acrylate which is cured by irradiation with light is obtained by an ester reaction of an unsaturated carboxylic acid and a polyhydroxy compound having a valence of 2 or more. Examples of the compound obtained by the ester reaction of an unsaturated carboxylic acid and a polyhydroxy compound having a valence of 2 or more include polyethylene glycol diacrylate, trimethylolpropane triacrylate, diethylene glycol diacrylate,
Butylene glycol diacrylate, hexanediol diacrylate, triethylene glycol diacrylate, neopentyl glycol diacrylate, pentaerythritol triacrylate, dipentaerythritol hexaacrylate, tricyclodecane dimethylol diacrylate, polycarbonate diol diacrylate, phenoxy polyethylene glycol acrylate , Bisphenol A acrylate, phenoxyethyl acrylate, nonylphenoxyethyl acrylate, tetrahydrofurfuryloxyethyl acrylate, cyclohexaneoxyethyl acrylate, tricyclodecanyloxy acrylate, glycerol acrylate and methacrylates thereof.
Further, epoxy acrylate obtained by reaction of an epoxy resin with acrylic acid or methacrylic acid, urethane acrylate, polyester acrylate and the like can be mentioned. The compounding amount is not particularly limited, but 5 to 50 parts by weight is preferable.

The carboxyl group-containing epoxy acrylate is obtained by reacting a polybasic acid anhydride with a product obtained by reacting an epoxy resin with an unsaturated carboxylic acid.

As the epoxy resin used for the synthesis of the carboxyl group-containing epoxy acrylate, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, cyclic type Examples thereof include aliphatic epoxy resins, glycidyl ester resins, glycidyl amine resins, and heterocyclic epoxy resins. Particularly, a novolac type epoxy resin having excellent heat resistance is useful.

The unsaturated carboxylic acid used for the synthesis of the carboxyl group-containing epoxy acrylate includes acrylic acid, methacrylic acid, crotonic acid, cinnamic acid and the like.
Polybasic acid anhydrides used in the synthesis of carboxyl group-containing epoxy acrylates include maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride. Acid, methylendomethylenetetrahydrophthalic anhydride, methylbutenyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, trimellitic anhydride,
Examples thereof include pyromellitic anhydride, benzophenone tetracarboxylic acid anhydride, dodecenyl succinic anhydride, methylcyclohexene dicarboxylic acid anhydride, and polyazelaic anhydride. The addition amount of these polybasic acid anhydrides is not particularly limited, but the acid value of the obtained carboxyl group-containing epoxy acrylate is preferably in the range of 15 to 100 mgKOH / g.

The reaction between the epoxy resin and the unsaturated carboxylic acid is carried out by dissolving the epoxy resin in an organic solvent such as methyl ethyl ketone, methyl cellosolve acetate, ethyl cellosolve acetate, cyclohexanone, propylene glycol monomethyl ether acetate, etc., and using triethylamine or triethylamine as a catalyst. -N-butylamine, tertiary amines such as diethylcyclohexylamine, quaternary ammonium salts such as benzyltrimethylammonium chloride and benzyltriethylammonium chloride, and hydroquinone, p-methoxyphenol and the like as a polymerization inhibitor,
Stir and mix at 60 to 150 ° C to react. Further, a carboxyl group-containing epoxy acrylate is obtained by adding a polybasic acid anhydride and reacting it in the same manner.

As the photopolymerization initiator, benzophenone,
2,2-dimethoxy-1,2-diphenylethane-1-
On, 2,4-diethylthioxanthone, p-dimethylaminobenzoic acid isoamyl ester, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- [4-
(Methylthio) phenyl] -2-monforinopropanone, 2-benzyl-2-dimethylamino-1- (4-monforinophenyl) -butanone, 2-hydroxy-2
-Methyl-1-phenylpropan-1-one, 2,4
6-trimethylbenzoyldiphenylphosphine oxide, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propane-1
-One, bis (cyclopentadiphenyl) -bis [2,2
6-difluoro-3- (pyrr-1-yl) titanium], bisacylphosphine oxide, (η ⁵ −
2,2-cyclopentadiene) [(1,2,3,4,
5,6-η)-(1-Methylethyl) benzene] -iron (1 +)-hexafluorophosphate (1-)
Etc., and one or more of these can be used. Further, known photopolymerization accelerators such as benzoic acid type and tertiary amine type may be used in combination. The blending amount of such a photopolymerization initiator is used in the range of 0.2 to 10 parts by weight.

The condensed phosphoric acid amide is a compound obtained by condensing ammonium phosphate, and usually contains phosphorus in an amount of 20 to 40.
%, And nitrogen in the range of 5 to 30%. The content of the condensed phosphoric acid amide is 1 to 30% by weight.

As the epoxy resin, the same ones as those described as the epoxy resin used for the synthesis of the carboxyl group-containing epoxy acrylate can be used. The content of these components is preferably 10 to 50 parts by weight. When the content is large, the developability is deteriorated, and when the content is small, the adhesiveness and heat resistance are deteriorated.

The epoxy acrylate having an epoxy residue is obtained by reacting less than 1 equivalent of the unsaturated carboxylic acid with 1 equivalent of the epoxy resin. The carboxyl group-containing epoxy acrylate having an epoxy residue is obtained by reacting the epoxy acrylate having an epoxy residue with a polybasic acid anhydride.

Epoxy resin curing agents include diaminodiphenyl sulfone, diaminodiphenylmethane, piperidine,
Amine curing agents such as tetramethylguanidine, acid anhydrides such as trimellitic anhydride, tetrahydrophthalic anhydride, and hexahydrophthalic anhydride, 2-heptadesluimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole Imidazoles such as, boron trifluoride amine complex, dicyandiamide and its derivatives, organic acid hydrazide, melamine, aromatic diazonium salts, diallyl iodonium salts, triallyl sulfonium salts, phenol resins, amine resins, polyvinylphenol and the like are used, You may use it in combination of 1 or more types of these.

Further, the photosensitive resin composition of the present invention may contain fine powder silica, talc, titanium oxide, calcium carbonate, barium sulfate, zirconium silicate, aluminum hydroxide or the like as a fine particle filler.

Further, the photosensitive resin composition of the present invention may be blended with a rubber component such as NBR, isoprene rubber, natural rubber or the like, polybutadiene and polybutadiene modified product, etc., which are dissolved in an oxidizing aqueous solution. In addition, dyes, pigments, dispersants, defoaming agents and the like may be contained.

Using the photosensitive resin composition described above,
A multilayer wiring board is manufactured by the process shown in FIG. A detailed description will be given according to the steps shown in FIG.

First, the insulating substrate 1 on which the first circuit 2 is formed
Are prepared (FIG. 1- (a)). The material of the insulating substrate 1 is not particularly limited, and ordinary wiring such as glass cloth-epoxy resin, paper-phenol resin, paper-epoxy resin, glass cloth / glass paper-epoxy resin, glass cloth-polyimide resin, etc. What is used for a board can be used. First
As a method of forming the circuit 2 of FIG.
Ordinary wiring board, such as a subtractive method of etching away unnecessary portions of copper foil by using a copper-clad laminate bonded to the substrate and an additive method of forming a circuit on the insulating substrate 1 by electroless plating Manufacturing methods can be used.

Next, a layer 3 made of the photosensitive resin composition of the present invention is formed on the surface of the insulating substrate 1 including the surface of the first circuit 2 (FIG. 1- (b)). As the forming method, a method in which a liquid resin is applied by a method such as roll coating, curtain coating, or dip coating, or a method in which the photosensitive resin composition is formed into a film and laminated together can be used.

Next, the photosensitive resin composition layer 3 is exposed through a photomask 41 to form a via hole connecting the first circuit 2 and the second circuit (FIG.
(C)), a via hole 61 is formed in the photosensitive resin composition layer 3 by a method of etching the unexposed portion with a developing solution (FIG. 1- (d)). For the exposure, the same method as the ordinary method for forming a resist on a wiring board is used. The developing solution for etching the unexposed portion is determined by the developing type of the photosensitive resin composition, but an alkaline developing solution, a semi-water developing solution or the like can be used.

Next, the photosensitive resin composition layer 3 is treated with an oxidizing roughening solution to form a roughened surface 71, and then copper plating is deposited on the photosensitive resin composition layer 3 to form a second surface. And the interlayer connection between the first circuit 2 and the second circuit 8 is performed by the via hole (FIG. 1- (e)). In this case, it is also possible to use a method in which the photosensitive resin composition layer 3 is cured with ultraviolet rays and ultraviolet rays and heat and then immersed in an oxidizing roughening solution. As the oxidizing roughening liquid, a chromium / sulfuric acid roughening liquid, an alkali permanganate roughening liquid, a sodium fluoride / chromium / sulfuric acid roughening liquid, a borofluoric acid roughening liquid, etc. can be used.

As a method of forming the second circuit 8, a catalyst for electroless plating is applied to the surface of the roughened photosensitive resin composition layer 3 to deposit electroless plated copper on the entire surface, and the necessary In that case, a plating resist is formed by a method of forming a circuit conductor by electroplating to a required thickness and removing unnecessary portions by etching, or by using a photosensitive resin composition layer 3 containing a plating catalyst. And a method for forming a circuit by electroless plating only at a necessary portion, and a step of roughening the photosensitive resin composition layer 3 containing no plating catalyst, applying a plating catalyst and then forming a plating resist, and performing electroless plating only at a necessary portion. The method of forming a circuit can be used.

When the wiring layers are to be further multilayered, the above (FIG. 1- (b) to FIG. 1- (e)) is repeated (FIG. 1-).
(F) to FIG. 1- (h)). That is, the second photosensitive resin composition layer 9 is formed on the second circuit 8 (see FIG. 1).
-(F)), exposing through the photomask 42 (FIG. 1-).
(G)), the unexposed portion is etched with a developing solution to form a via hole 62 and a roughened surface 72 (FIG. 1-).
(H)). Finally, the third circuit 10 is formed (FIG. 1-
(I)). In this step, preferably, before forming a photosensitive resin composition layer that supports the next circuit layer, the underlying circuit conductor surface is roughened to form irregularities, or used in a conventional multilayer wiring board. As described above, the surface of the circuit conductor is oxidized to form irregularities, or the irregularities formed by oxidation are reduced using an alkaline reducing agent such as sodium borohydride or dimethylamine borane to increase the adhesive force between layers. be able to.

[0027]

The present invention can provide a light-sensitive resin composition having excellent flame retardancy by addition of condensed phosphoric acid amide and having no problem in safety and environment, and a printed wiring board using the same.

[0028]

【Example】

Example 1 1 equivalent of a phenol novolac type epoxy resin having an epoxy equivalent of 190 and 1.05 equivalent of methacrylic acid were dissolved in ethyl cellosolve acetate, benzyltrimethylammonium chloride as a catalyst and hydroquinone as a polymerization inhibitor were added, and the mixture was reacted at 90 ° C. To obtain an epoxy acrylate. 65 parts by weight of the obtained compound, 10 parts by weight of diethylene diacrylate and 20 parts by weight of acrylonitrile-butadiene rubber (PNR-1H: manufactured by Nippon Synthetic Rubber Co., Ltd.) with methacrylic acid, 2,2-dimethoxy-1,
5 parts by weight of 2-diphenylethan-1-one, 5 parts by weight of condensed phosphoric acid amide (Taien-S: Taihei Chemical Industry Co., Ltd.), aluminum hydroxide (Hidilite H-42M:
10 parts by weight (manufactured by Showa Denko KK) was blended to obtain a photosensitive resin composition.

Example 2 1 equivalent of a phenol novolac type epoxy resin having an epoxy equivalent of 190 and 1.05 equivalent of methacrylic acid were dissolved in ethyl cellosolve acetate, and benzyltrimethylammonium chloride was added as a catalyst and hydroquinone was added as a polymerization inhibitor. Tetrahydrophthalic anhydride was reacted with the reaction product obtained by the reaction at 0 ° C. in an amount of 0.5 equivalent to 1 equivalent of a hydroxyl group to obtain a carboxyl group-containing epoxy acrylate. 75 parts by weight of the obtained compound and methacrylic acid-added acrylonitrile-butadiene rubber (P
NR-1H: manufactured by Nippon Synthetic Rubber Co., Ltd.) 20 parts by weight and 2,2-dimethoxy-1,2-diphenylethane-1-
5 parts by weight of ON, 5 parts by weight of condensed phosphoric acid amide (Taien-S: manufactured by Taihei Chemical Industry Co., Ltd.), aluminum hydroxide (Hidilite H-42M: manufactured by Showa Denko KK) 10
A photosensitive resin composition was obtained by blending parts by weight.

Example 3 50 parts by weight of the epoxy acrylate obtained in Example 1, 10 parts by weight of diethylene diacrylate, 12 parts by weight of a bis A type epoxy resin (Epicoat 834: manufactured by Yuka Shell Epoxy Co., Ltd.), methacrylic acid. Addition acrylonitrile butadiene rubber (PNR-1H: manufactured by Nippon Synthetic Rubber Co., Ltd.) 20 parts by weight, 2,4-diamino-6- [2-undecyl-imidazolyl- (1)]-ethyl-S-triazine 3 parts by weight, 2 , 2-dimethoxy-1,2-diphenylethan-1-one, 5 parts by weight, condensed phosphoric acid amide (Sumisafe P: manufactured by Sumitomo Chemical Co., Ltd.), 5 parts by weight, aluminum hydroxide (Hijilite H-42M: Showa Denko) (Manufactured by KK) was mixed to obtain a photosensitive resin composition.

Example 4 1 equivalent of a phenol novolac type epoxy resin having an epoxy equivalent of 190 and 0.6 equivalent of methacrylic acid were dissolved in ethyl cellosolve acetate, and benzyltrimethylammonium chloride was added as a catalyst and hydroquinone was added as a polymerization inhibitor. The reaction was carried out at ° C to obtain an epoxy acrylate. 55 parts by weight of the obtained compound, 15 parts by weight of diethylenediacrylate and 20 parts by weight of methacrylic acid-added acrylonitrile-butadiene rubber (PNR-1H: manufactured by Nippon Synthetic Rubber Co., Ltd.), 2,4-diamino-6- [2
-Undecyl-imidazolyl- (1)]-ethyl-S-
5 parts by weight of triazine, 5 parts by weight of 2,2-dimethoxy-1,2-diphenylethan-1-one, 5 parts by weight of condensed phosphoric acid amide (Sumisafe P: manufactured by Sumitomo Chemical Co., Ltd.),
10 parts by weight of aluminum hydroxide (Hijilite H-42M: Showa Denko KK) was blended to obtain a photosensitive resin composition.

Example 5 One equivalent of a phenol novolac type epoxy resin having an epoxy equivalent of 190 and 0.6 equivalent of methacrylic acid were dissolved in ethyl cellosolve acetate, and benzyltrimethylammonium chloride as a catalyst and hydroquinone as a polymerization inhibitor were added, The reaction product obtained by the reaction at 90 ° C. was reacted with tetrahydrophthalic anhydride in an amount of 0.5 equivalent to 1 equivalent of a hydroxyl group to obtain a carboxyl group-containing epoxy acrylate. 60 parts by weight of the obtained compound, 10 parts by weight of diethylene diacrylate and 20 parts by weight of methacrylic acid-added acrylonitrile butadiene rubber (PNR-1H: manufactured by Nippon Synthetic Rubber Co., Ltd.), 2,4-diamino-6- [2- Undecyl-imidazolyl- (1)]-ethyl-S-triazine 5 parts by weight, 2,2-dimethoxy-
1,2-diphenylethan-1-one 5 parts by weight, condensed phosphoric acid amide (Sumisafe P: manufactured by Sumitomo Chemical Co., Ltd.)
5 parts by weight, aluminum hydroxide (Heidilite H-42
(M: Showa Denko KK) 10 parts by weight was blended to obtain a photosensitive resin composition.

Example 6 60 parts by weight of the carboxyl group-containing epoxy acrylate obtained in Example 2, 12 parts by weight of a bis-A type epoxy resin (Epicoat 834: manufactured by Yuka Shell Epoxy Co., Ltd.) and methacrylic acid-added acrylonitrile-butadiene rubber. (PNR-1H: manufactured by Nippon Synthetic Rubber Co., Ltd.) 20 parts by weight, 2,4-diamino-6- [2-undecyl-imidazolyl- (1)]-ethyl-S-triazine 3 parts by weight,
2,2-dimethoxy-1,2-diphenylethane-1-
On 5 parts by weight, condensed phosphoric acid amide (Sumisafe P: manufactured by Sumitomo Chemical Co., Ltd.) 5 parts by weight, aluminum hydroxide (Hidilite H-42M: manufactured by Showa Denko KK) 10
A photosensitive resin composition was obtained by blending parts by weight.

Comparative Example 1 60 parts by weight of the carboxyl group-containing epoxy acrylate obtained in Example 2, 10 parts by weight of diethylene diacrylate, and 20 parts by weight of acrylonitrile butadiene rubber with added methacrylic acid (PNR-1H: manufactured by Nippon Synthetic Rubber Co., Ltd.) Parts, 2,2-dimethoxy-1,2-diphenylethan-1-one 7 parts by weight, antimony trioxide 3 parts by weight, and aluminum hydroxide (Hijilite H-42M: Showa Denko KK) 10 parts by weight. Then, a photosensitive resin composition was obtained.

Comparative Example 2 Cresol novolac type brominated epoxy resin (BREN
-S: 40 parts by weight of Nippon Kayaku Co., Ltd. and 40 parts by weight of bisphenol A type epoxy acrylate (VR-60: Showa Polymer Co., Ltd.) and methacrylic acid-added acrylonitrile butadiene rubber (PNR-1H: Nippon Synthetic Rubber) 20 parts by weight, 2,4-diamino-6-
[2-undecyl-imidazolyl- (1)]-ethyl-
5 parts by weight of S-triazine, 2,2-dimethoxy-1,2
5 parts by weight of diphenylethane-1-one and 10 parts by weight of aluminum hydroxide (Hijilite H-42M: Showa Denko KK) were mixed to obtain a photosensitive resin composition.

These photosensitive resin compositions were applied to a copper-clad glass cloth epoxy resin laminate and dried at 80 ° C. for 10 minutes to form a photosensitive resin composition layer having a thickness of 50 μm. Then, an ultraviolet ray having an exposure dose of 300 mJ / cm ² is irradiated through a photomask provided with a shielding portion at a position to be a via hole, and the unexposed portion is selectively removed with a developing solution at 30 ° C. for 2 minutes. To form a via hole. The developer used at this time was a 1% aqueous sodium carbonate solution for the photosensitive resin compositions of Examples 1 to 6 and Comparative Example 1, and for the photosensitive resin composition of Comparative Example 2, An N-methylpyrrolidone solution was used. After that, the photosensitive resin composition layer was irradiated with ultraviolet rays of ² J / cm ² for post-exposure, and then immersed in an alkaline permanganate solution at room temperature for 5 minutes for neutralization to form a roughened uneven shape on the photosensitive resin composition. It was formed on the layer surface. afterwards,
A plating catalyst was applied on the photosensitive resin composition layer, and a surface conductor was formed by electroless plating.

With respect to the printed wiring board produced as described above, the via hole forming property, the adhesive property and the flame retardancy were examined. Table 1 shows the results. Regarding the via hole formability, exposure was performed through a mask having a hole diameter of 50 to 300 μm, and the minimum diameter after development was observed. Adhesiveness is 17 after the copper plated conductor is formed.
After heating at 0 ° C. for 30 minutes, the adhesive strength was measured. Flame retardancy was measured according to UL standards.

[0038]

[Table 1] Note) A: Via hole formation, B: Adhesiveness, C: Flame retardance

[0039]

From the above, by using the photosensitive resin composition of the present invention, it is possible to form a coating film having no problem in safety, environment and the like and excellent in flame retardancy, and It can be used as a solder resist, a plating resist, and an interlayer insulating layer.

[Brief description of drawings]

1 (a) to (i) relate to an embodiment of the present invention,
FIG. 9 is a cross-sectional view for illustrating the manufacturing process for the multilayer printed wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 2 ... 1st circuit 3 ... 1st photosensitive resin composition layer 4 ... Photomask 5 ... Ultraviolet ray 61 ... Via hole 62 ... Via hole 71 ... Roughened surface 72 ... Roughened surface 8 ... 2nd Circuit 9 ... Second photosensitive resin composition layer 10 ... Third circuit

─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] August 29, 1995

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 4

[Correction method] Change

[Correction content]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] 0027

[Correction method] Change

[Correction content]

[0027]

DETAILED DESCRIPTION OF THE INVENTION The present invention has excellent flame retardancy by the addition of condensed phosphoric acid amides can provide safety and no sensitive photosensitive resin composition environmentally problematic such a printed wiring board using the same.

[Procedure 3]

[Document name to be amended] Statement

[Name of item to be corrected] 0030

[Correction method] Change

[Correction content]

Example 3 50 parts by weight of the epoxy acrylate obtained in Example 1, 10 parts by weight of diethylene diacrylate and bisphenone
Le A type epoxy resin (Epicoat 834: manufactured by Yuka Shell Epoxy Co., Ltd.) 12 parts by weight, methacrylic acid-added acrylonitrile butadiene rubber (PNR-1H: manufactured by Japan Synthetic Rubber Co., Ltd.) 20 parts by weight, 2,4-diamino- 6
3 parts by weight of-[2-undecyl-imidazolyl- (1)]-ethyl-S-triazine, 2,2-dimethoxy-1,
5 parts by weight of 2-diphenylethan-1-one, 5 parts by weight of condensed phosphoric acid amide (Sumisafe P: manufactured by Sumitomo Chemical Co., Ltd.), aluminum hydroxide (Hidilite H-42M:
10 parts by weight (manufactured by Showa Denko KK) was blended to obtain a photosensitive resin composition.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] Explanation of code

[Correction method] Change

[Correction content]

[Explanation of Codes] 1 ... Insulating substrate 2 ... First circuit 3 ... First photosensitive resin composition layers 41, 42 ... Photomask 5 ... UV ray 61 ... Via hole 62 ... Via hole 71 ... Roughened surface 72 ... Roughened surface 8 ... Second circuit 9 ... Second photosensitive resin composition layer 10 ... Third circuit

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Rinko Kawamoto 1500 Ogawa, Shimodate City, Ibaraki Prefecture Hitachi Chemical Co., Ltd. Shimodate Research Center

Claims (6)

[Claims] 1. A photosensitive resin composition comprising an acrylate, a photopolymerization initiator, and a condensed phosphoric acid amide, which are cured by irradiation with light, as essential components. 2. The photosensitive resin composition according to claim 1, wherein a part or all of the acrylate that is cured by irradiation with light is epoxy acrylate. 3. The photosensitive resin composition according to claim 2, wherein a part or all of the epoxy acrylate is an epoxy acrylate having an epoxy residue, and a curing agent for the epoxy resin is further mixed. Stuff. 4. The photosensitive resin composition according to claim 2, wherein the epoxy acrylate is an epoxy acrylate having a carboxyl group. 5. An epoxy resin is compounded in addition to an acrylate that is cured by irradiation with light.
The photosensitive resin composition according to 2, 3 or 4. 6. The insulating layer between the conductor layers is defined by claim 1,
A multilayer printed wiring board comprising the cured product of the photosensitive resin composition according to 3, 4, or 5.