JPH08288362A - Plate-shaped member transporting apparatus and plate-shaped member treating apparatus using it - Google Patents

Abstract

PURPOSE: To obtain a wafer transporting apparatus and a wafer treating apparatus for transporting and treating a wafer in a standing state. CONSTITUTION: A wafer transporting apparatus 10 comprises a holding base 15 moved forward and backward relative to a movable base 13 by a pantagraph apparatus 14 supported at one end thereof by the movable base 13, and the holding base 15 holds a wafer 1 in a standing state. A wafer treating apparatus 5 comprises treating sections 21, 22, 41, 42, 61, 62 and each treating section treats the wafer in the standing state. The movable base 13 is moved to a waiting position in each treating section, and the holding base 15 is reciprocated between the treating section and the movable base by the pantagraph apparatus 14. Thus, the wafer can be transported and treated in the standing state so that the floor area occupied by the wafer transporting apparatus and the wafer treating apparatus can be decreased. The wafer in the standing state is made parallel to the down flow so that dust adhesion to the wafer due to the down flow can be suppressed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for transporting a plate-like material, and more particularly to a technique for transporting a plate-like material in an upright state. Hereinafter, it will be referred to as a wafer), and is related to a technology effectively used for carrying the wafer.

[0002]

2. Description of the Related Art In a photoresist developing apparatus in a semiconductor device manufacturing factory, a wafer, which is a work, is transferred to each processing section such as a loading section, a prebaking section, a cooling section, a development processing section, an afterbaking section and an unloading section. It is sequentially conveyed by the device. A wafer transfer apparatus used in such a wafer processing apparatus is configured to transfer a wafer with a processed main surface (hereinafter referred to as a processed surface) facing upward. But
It is common.

Incidentally, as an example in which a photoresist developing device used in a semiconductor device manufacturing factory is described, "J92 latest semiconductor process technology" P172-Published November 1, 1991, Press Journal Co., Ltd. P1
There are 75.

Further, as a document describing a special example of carrying a wafer in an upright state, Japanese Patent Laid-Open No. 63-57451.
There is a gazette.

[0005]

However, the conventional photoresist developing apparatus has the following problems because the wafer is transferred with the surface to be processed facing upward. (1) The floor area of the transfer line and each processing unit is required to be the outer diameter of the wafer even at the minimum, so that the floor area occupied by the photoresist developing apparatus becomes large. (2) Further, when the temperature of the atmosphere of the entire transfer line and each processing unit is adjusted, the volume for adjusting the temperature becomes large, and the auxiliary equipment required for this also becomes large. (3) When the entire photoresist developing apparatus is constructed in a clean bench structure, the area of the wafer that is in vertical contact with the downflow becomes large, and therefore the probability that dust in the downflow air will adhere to the wafer increases. . (4) In addition, since the wafer becomes an obstacle to the downflow, air may generate a vortex on the wafer to disturb the airflow of the downflow, and as a result, dust is more likely to adhere to the wafer. Increase more.

An object of the present invention is to provide a plate-like material conveying technique capable of conveying a plate-like object in an upright state.

A second object of the present invention is to provide a plate-like material processing technique using the plate-like material conveying technique.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0009]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, the plate-shaped object conveying device is provided with a holding table which is moved forward and backward with respect to the moving table by a pantograph device whose one end is supported by the moving table, and the holding table holds the plate-shaped object in a standing state. It is characterized in that it is configured to.

Further, in the plate-shaped article processing apparatus, a plurality of processing sections are arranged outside the moving table in the plate-shaped article transfer apparatus, and each processing section processes the plate-shaped article in an upright state. Further, the moving table is configured to move to a position facing each processing unit, and the holding table is configured by the pantograph device to treat the processing unit and the moving table facing the processing unit. It is characterized in that it is configured to reciprocate between.

[0012]

In the plate-like material processing apparatus described above, when the plate-like material which is the object to be processed is held in a state of standing on the holding table,
The moving table moves to the standby position facing the predetermined processing unit together with the holding table holding the plate-shaped object. When the moving table moves to the standby position, the pantograph device advances the holding table holding the plate-like object with respect to the moving table to convey the plate-like object to the processing unit facing the moving table. In the transported processing unit, the plate-shaped object is received from the holding table or is held in the holding table and is subjected to a predetermined process in an upright state.

In the processing section, when the processed plate-shaped object that has been subjected to a predetermined process is set up on the holding table, the pantograph device places the holding table holding the processed plate-shaped object outside the processing section. The plate-like object is carried out from the processing section by retracting it to the moving stand waiting at. When the holding table holding the plate-like object returns, the moving table moves to the standby position in the next processing unit. After that, by repeating the above-described operation, the processing in each processing unit is sequentially performed on the plate-shaped material.

[0014]

1 is a plan sectional view showing a photoresist developing apparatus according to an embodiment of the present invention. 2A is a front sectional view taken along line aa of FIG. 1, and FIG. 2B is a cross-sectional view of FIG.
It is a front sectional view which follows a line. FIG. 3 is a partially omitted perspective view showing a wafer transfer device according to an embodiment of the present invention. FIG.
Is a partially omitted perspective view showing a loading part, FIG. 5 is a partially omitted perspective view showing a pre-baking part, and FIG. 6 is a partially omitted perspective view showing a developing part.

In the present embodiment, the plate-like material transfer device according to the present invention is configured as a wafer transfer device for transferring a wafer, and is incorporated in a photoresist developing apparatus which is an example of a plate-shaped material processing device. . The wafer 1, which is the object to be transferred and is the object to be processed, is supplied to the photoresist developing apparatus in a state in which the photoresist (not shown) has been subjected to the exposure process in the exposure step which is a step before the development step. Is coming. Further, a plurality of wafers 1 are supplied to the photoresist developing device in a state where a plurality of wafers 1 are stored in the wafer cassette 2. The wafer cassette 2 is provided with a main body 3 formed in a hexahedral box shape. A pair of main surfaces (hereinafter, referred to as upper and lower surfaces) of the main body 3 facing each other are opened, and inner surfaces of a pair of side walls facing each other are formed. A plurality of holding grooves 4 are engraved so as to face each other. And wafer 1
Is held in the wafer cassette 2 with the outer peripheral portions thereof being inserted between the holding grooves 4 and 4 facing each other.

A photoresist developing device 5 which is an embodiment of the plate-like material processing apparatus according to the present invention comprises a wafer transfer device, a loading part, a pre-baking part, a cooling part, a developing process part, an after-baking part and an unloading part. The temperature-controlled air flows down (not shown).
It is installed in the chamber 6 of the clean bench which is designed to be blown out. Further, the photoresist developing device 5 is provided with a controller (not shown), and the controller is constructed by using a personal computer and its software, etc., so as to centrally control the constituent parts such as the loading part. Is configured.

The wafer transfer device 10 is equipped with a transfer actuator 12 which constitutes a linear transfer line 11. The transfer actuator 12 is configured by using a rodless linear cylinder device, a linear motor, and a feed screw device, and is laid horizontally in the center of the chamber 6 so as to extend in the front-rear direction. The transfer actuator 12 is configured to reciprocate the moving table 13 in the front-rear direction.
It is designed to be sequentially stopped at predetermined standby positions.

A pantograph device 14 is horizontally installed on the moving base 13, and the pantograph device 14 is mounted on the holding base 1.
5 is configured to reciprocate in the left and right directions orthogonal to the transport line 11. A holding groove 16 is vertically recessed in the holding table 15 so as to extend in the front-rear direction which is a direction orthogonal to the advancing / retreating direction of the holding table 15 with respect to the moving table 13. The holding groove 16 is formed on the outer periphery of the wafer 1. By partially inserting the wafer 1 from above, the wafer 1 is held in an upright state.

The pantograph device 14 is provided with a pair of first link bars 14a and a second link bar 14b which are driving side link bars, and a pair of a third link bar 14c and a fourth link bar 14d which are driven side link bars. By assembling four link bars in a rhombus and rotatably connecting them, the holding table 15 supported by the pins 14e is provided on the connection point between the third link bar 14c and the fourth link bar 14d. It is configured to reciprocate in the left-right direction. That is, the first link bar 14a
Each one end of the second link bar 14b and the second link bar 14b are configured to be reciprocally rotated by a reciprocating rotation device (not shown), and a connection point of the third link bar 14c and the fourth link bar 14d. A holding table 15 is rotatably supported on the top by a pin 14e. The pre-baking section,
Guide rails (not shown) for preventing rotation of the holding table are horizontally laid in the cooling section, the developing section, and the afterbake section so as to extend in the left-right direction. When the vehicle stops at the standby position, the guide rails are aligned with each other and are guided by the guide rails as the pantograph device 14 moves, so that the pin 14e is prevented from freely rotating. ing.

A loading section 21 and an unloading section 22 are installed symmetrically with respect to the front end of the chamber 6 with the transfer line 11 interposed therebetween. A wafer cassette (hereinafter referred to as an actual cassette 2A) in which a wafer 1 to be processed is stored is loaded in the loading unit 21 arranged on the left side.
Say. ) Is installed, and a wafer cassette (hereinafter referred to as an empty cassette 2B) in which the processed wafer 1 is stored is installed in the unloading unit 22 arranged on the right side. There is. A wafer elevator 23 for a loading unit is installed below the actual cassette 2A in the loading unit 21, and a wafer elevator 24 for an unloading unit is installed below the empty cassette 2B in the unloading unit 22.

Since the wafer elevator 23 for the loading section and the wafer elevator 24 for the unloading section have the same configuration, the configuration will be described with the wafer elevator 23 for the loading section as a representative. The wafer elevator 23 for the loading part includes an elevating actuator 25 composed of an air cylinder device, a screw jack, etc., and the elevating actuator 25 is installed in the chamber 6 in a vertically upward direction. A holder 27 is supported vertically upward on the upper end of the rod 26 of the lift actuator 25, and the front-rear width of the holder 27 is set to be substantially equal to the front-rear width of the holding table 15 of the wafer transfer apparatus 10. A holding groove 28 extending in the front-rear direction is vertically recessed in the upper end surface of the holder 27, and the holding groove 28 is fitted with a part of the outer peripheral portion of the wafer 1 to stand the wafer 1. Configured to hold.

A wafer transfer device 30 is installed at the front end of the chamber 6 in the loading section 21 and the unloading section 22. The wafer delivery device 30 includes a transfer actuator 31. The transfer actuator 31 for the wafer transfer device is also configured by using a rodless linear cylinder device, a linear motor and a feed screw device, and the wafer transfer device is provided at the front end of the loading part 21 and the unloading part 22 in the chamber 6. It is laid horizontally in the left-right direction orthogonal to the transport line 11 of 10. The transfer actuator 31 for the wafer delivery device 10 is configured to reciprocate the movable table 32 in the left-right direction, and the movable table 32 is equipped with an elevating actuator 33. The elevating actuator 33 is configured by using a screw type jack or a fluid pressure jack, and elevates the elevating table 34. A holder 35 for the wafer delivery device 10 is horizontally projected on the elevating table 34 rearward.

The holder 35 for the wafer transfer device has a shaft-shaped portion 36 whose front end is supported by the elevating table 34 and a shaft-shaped portion 3.
6 is a semi-circular arc-shaped portion 3 whose front end is supported by the rear end of 6
7, the arc-shaped portion 37 is configured so that its opening is opened and closed in the radial direction by rotating the front portion and the rear portion around the pin 38 by an actuator (not shown). At the opening end of the arc-shaped portion 37, a pair of pad 3
9 and 39 are attached so as to face each other.
The pair of pads 39, 39 are pressed against a pair of opposing portions on the outer periphery of the wafer 1 when the arcuate portion 37 is closed. And
The holding tool 35 for the wafer transfer device holds the wafer 1 by pressing the outer periphery of the wafer 1 from both sides with both abutting tools 39, 39 in a state where the arc-shaped portion 37 is closed. The holding of the wafer 1 is released by separating both the applicators 39, 39 from the outer periphery of the wafer 1 in the opened state.

Loading section 21 in chamber 6
On the rear side of the unloading section 22, a pre-baking section 41 and an after-baking section 42 are installed symmetrically with the transport line 11 in between. On the upper side of the prebaking section 41 arranged on the left side, the wafer 1 to be developed is
A pre-bake oven 43 for pre-baking is installed vertically downward, and an after-bake oven 44 for after-baking the developed and processed wafer is vertically downward on the upper side of the after-baking section 42 arranged on the right side. is set up. A wafer elevator 45 for the pre-baking unit is installed directly below the pre-bake furnace 43, and a wafer elevator 46 for the after-baking unit is installed directly below the after-baking furnace 44.

The pre-bake furnace 43, the after-bake furnace 44, the pre-bake part wafer elevator 45, and the after-bake part wafer elevator 46 have the same structure. To do. The pre-bake furnace 43 includes a furnace body 47, and the furnace body 47 is formed in a box shape having a rectangular frame-shaped cross section. The furnace port 48 of the furnace body 47 is opened at the lower end surface so as to extend in the front-rear direction, and is configured so that the wafer 1 that is lifted and lowered by the pre-baking unit wafer elevator 45 can be taken in and out of the baking processing chamber 49. Has been done. Inside the pair of side walls on the long side of the furnace body 47, heating bodies 50 configured by using an electric heater or the like are laid, respectively, and the heating bodies 50 are mounted on the wafer 1 inserted in the baking processing chamber 49. By heating, the baking process can be performed.

The wafer elevator 45 for the pre-baking section is provided with an elevating actuator 51 composed of an air cylinder device and a screw type jack, and the elevating actuator 51 is installed in the chamber 6 vertically upward. A holding tool 53 having a concave shape is supported vertically upward on the upper end of a rod 52 of the lifting actuator 51, and a holding groove 54 extending in the front-rear direction is vertically recessed in the upper end surface of the holding tool 53. ing. The front-rear width of the central recess of the holder 53 is equal to that of the holding table 15 in the wafer transfer apparatus 10.
Is set larger than the front-rear width of the holding table 15 so as to accommodate The holding groove 54 is divided into front and rear by a central recess of the holder 53, and is configured so that a part of the outer peripheral portion of the wafer 1 is fitted and the wafer 1 is held in an upright state. .

A cooling unit 61 and a developing unit 62 are installed in the chamber 6 at the rear side of the pre-baking unit 41 and the after-baking unit 42 so as to be bilaterally symmetrical with the transport line 11 interposed therebetween. On the upper part of the cooling unit 61 arranged on the left side, a cooling furnace 63 for cooling the pre-baked wafer 1 to be developed is installed vertically downward. Below the developing section 62 arranged on the right side, a developing tank 64 for developing the wafer 1 is installed vertically upward. A wafer elevator 65 for the cooling unit is installed directly below the cooling furnace 63, and a wafer elevator 66 for the developing unit is installed directly above the developing tank 64.

The cooling furnace 63 has a furnace body 67, and the furnace body 67 is formed in a box shape having a rectangular frame-shaped cross section. The furnace opening 68 of the furnace body 67 is opened at the lower end surface so as to extend in the front-rear direction, and is configured so that the wafer 1 lifted and lowered by the cooling unit wafer elevator 65 can be taken in and out of the cooling processing chamber 69. ing. Cooling furnace 6
Inside the pair of side walls on the long side of the furnace body 67 of No. 3, a cooling body 70 configured by using a water pipe or the like is laid, and the heating body 70 is the wafer 1 inserted in the cooling processing chamber 69. The cooling treatment can be performed by cooling the. Since the wafer elevator 65 for the cooling unit has the same configuration as the wafer elevator 45 for the pre-baking unit, the description of the configuration is omitted because it is based on the description of the wafer elevator 45 for the pre-baking unit.

The developing tank 64 has a tank main body 71, and the tank main body 71 is formed in a box shape having a rectangular frame-shaped cross section. The inlet / outlet 72 of the tank body 71 is opened at the upper end surface so as to extend in the front-rear direction, and the developer 73 is stored inside the tank body 71. The wafer elevator 66 for the developing unit is configured so that the wafer 1 can be taken in and out of the developing solution 73.

The wafer elevator 66 for the developing section is equipped with an elevating actuator 74 composed of an air cylinder device and a screw type jack.
Are mounted vertically downward in the chamber 6. A holding tool 76 having a concave shape is supported vertically downward on the lower end of the rod 75 of the lifting actuator 74, and a holding groove 77 extending in the front-rear direction is recessed vertically upward on the lower end of the holding tool 76. It is set up. The front-rear width of the central recess of the holder 76 is set larger than the front-rear width of the holding table 15 so that the holding table 15 in the wafer transfer apparatus 10 can be accommodated. The holding groove 77 is divided into front and rear by a central recess of the holder 53, and a part of the outer peripheral portion of the wafer 1 is fitted to hold the wafer 1 in an upright state.

Next, the operation will be described. First, in the loading unit 21, the wafer elevator 2 for the loading unit
In step 3, the elevating actuator 25 is extended to hold one wafer 1 from the actual cassette 2A in the holding groove 28 formed in the upper end surface of the holder 27 and raise it. The wafer transfer device 30 holds the lifted wafer 1 from above by a wafer holder 35, transfers the wafer 1 to a holding table 15 of the wafer transfer device 10 waiting at the standby position of the loading section 21, and holds the holding table 15. The wafer 1 is inserted into the groove 16 from above and handed over in a vertically standing state.

When the wafer 1 is received by the holding table 15, the wafer transfer device 10 moves the moving table 13 together with the wafer 1 and the holding table 15 by the transfer actuator 12 to the standby position in the pre-baking section 41. At this time, with the wafer 1 standing vertically on the holding table 15,
In addition, since the wafer 1 is held so as to coincide with the transfer line 11, the transfer space (the transfer occupied floor area) of the wafer 1 on the transfer line 11 can be extremely small.

Subsequently, at the standby position of the pre-baking section 41, the wafer transfer apparatus 10 extends the pantograph apparatus 14 in the direction of the pre-baking furnace 43 (leftward) and holds it in a state of standing on the holding table 15. The wafer 1 is translated directly above the wafer elevator 45 for the pre-baking section. At this time, the wafer 1 is moved in parallel to the transfer line 11 at a right angle, but the transfer space for the wafer 1 is smaller than that in the conventional example in which the wafer 1 is transferred horizontally.

When the wafer 1 is directly above, the pre-baking unit wafer elevator 45 extends the elevating actuator 51 so that the wafer 1 held on the holding table 15 is held on the upper end surface of the holder 53. Formed holding groove 54
Hold it upright and raise it.
At this time, since the holding table 15 is in the state of being recessed in the center of the holding tool 53, the holding table 15 and the holding tool 53 do not interfere with each other. Thus, the wafer elevator 4 for the pre-baking section
The wafer 1 lifted by 5 is accommodated in the baking processing chamber 49 of the pre-baking furnace 43 while being inserted from the furnace port 48 and standing upright, and pre-baked by the pre-baking furnace 43.

On the other hand, the wafer transfer device 10 which has transferred the wafer 1 on the holding table 15 to the wafer elevator 45 for the pre-baking section, shortens the pantograph device 14 toward the standby position (to the right), and holds it empty. The table 15 is moved right above the moving table 13. Then, while the pre-baking process is performed in the pre-baking furnace 43, the wafer transfer device 10 moves the moving table 13 to a standby position in another processing section such as the loading section 21 and executes a predetermined delivery operation. That is, the wafer transfer apparatus 10 is sequence-controlled so as to execute parallel processing in which the delivery work is simultaneously performed while the processing work is being performed.

When the pre-baking process is completed, the wafer elevator 45 for the pre-baking section moves the lift actuator 5
1 is shortened and the wafer 1 held vertically by the holder 53 is lowered to the delivery position. On the other hand,
The wafer transfer device 10 moves the movable table 13 to the standby position of the pre-baking section 41 by the transfer actuator 12. The wafer transfer device 10 is the pantograph device 1
4 is extended to move the empty holding table 15 to the central recess of the holder 53. When the wafer elevator 45 for the pre-baking section further shortens the raising / lowering actuator 51 by one step, the wafer 1 held by the holder 53 is handed over to the holding table 15 of the wafer transfer device 10 in a standing state. When the wafer 1 is received by the holding table 15,
The wafer transfer device 10 operates the pantograph device 14 in a shortened manner so that the holding table 15 having received the wafer 1 is moved to the moving table 13.
Move back to position.

When the wafer 1 is returned to the standby position, the wafer transfer device 10 holds the wafer 1 in an upright state.
At the same time, the moving table 13 is moved to the cooling unit 61 which is the next processing step by the transfer actuator 12.

Then, at the standby position of the cooling unit 61,
The wafer transfer device 10 includes a pantograph device 14 and a cooling furnace 6.
The wafer 1 held in the state of being erected on the holding table 15 is moved in parallel to directly above the wafer elevator 65 for the cooling unit by extending the wafer 1 in the direction of 3 (forward direction).

When the wafer 1 is located right above, the cooling part wafer elevator 65 receives the wafer 1 held by the holding table 15 in a vertically standing state and raises it. The wafer 1 lifted by the cooling part wafer elevator 65 is inserted into the processing chamber 69 of the cooling furnace 63 from the furnace port 68 and accommodated in a vertically standing state, and is cooled by the cooling furnace 63.

On the other hand, the wafer transfer device 10 in which the wafer 1 on the holding table 15 is transferred to the cooling part wafer elevator 65.
Causes the pantograph device 14 to be shortened toward the standby position (retracting direction) to move the vacant holding table 15 directly above the moving table 13. While the cooling process is performed in the cooling furnace 63, the wafer transfer device 10 moves the moving table 13
Is moved to a standby position in another processing unit, and a predetermined delivery work is executed.

When the cooling process is completed, the wafer elevator 65 for the cooling unit lowers the wafer 1 held in a vertically standing state to the delivery position. On the other hand, the wafer transfer apparatus 10 causes the transfer actuator 12 to move the movable table 13 to the cooling unit 6.
1 Move to the standby position. The wafer transfer device 10 extends the pantograph device 14 to move the empty holding table 15 to the delivery position of the cooling part wafer elevator 65. The wafer elevator 65 for the cooling unit delivers the wafer 1 that has been cooled to the holding table 15 of the wafer transfer device 10 in a vertically standing state. When the wafer 1 is received by the holding table 15, the wafer transfer device 10 operates the pantograph device 14 in a shortened manner to return the holding table 15 receiving the wafer 1 to the position of the moving table 13.

When the wafer 1 returns to the standby position, the wafer transfer apparatus 10 transfers the holding table 15 holding the wafer 1 to the developing section 62 for the next processing step, and the pantograph apparatus 14 to the developing tank 6.
It is extended and moved in the direction 4 (forward direction). At this time, since the cooling unit 61 and the developing unit 62 are arranged at symmetrical positions, the wafer transfer device 10 does not move the moving table 13 by the transfer actuator 12 and moves the pantograph device 14 in the direction of the cooling unit 61 ( It suffices to extend the developing tank 64 in the direction opposite to the left direction (to the right).

Pantograph device 1 of wafer transfer device 10
The wafer 1 is transferred to the main body 71 of the developing tank 64 by the extension operation of
Wafer elevator 66 for the developing unit
Receives the wafer 1 held on the holding table 15 in an upright state. That is, the wafer elevator 66 for the developing unit extends the lifting actuator 74 so that the holding groove 77 of the holder 76 faces the lower side of the outer periphery of the wafer 1 held by the holding table 15. Then, when the elevating actuator 74 is shortened by one step, the wafer 1 held by the holding table 15 is inserted into the holding groove 77 of the holder 76 and is received in a state of being vertically erected.

When the wafer 1 is received, the wafer elevator 66 for the developing section is extended to lower the wafer 1. The wafer 1 lowered by the developing unit wafer elevator 66 is inserted into the developing solution 73 stored in the main body 71 of the developing tank 64 through the inlet / outlet port 72, and immersed in the vertically standing state, and then the developing solution is left as it is. Development processing is performed by 73.

On the other hand, the wafer transfer device 10 in which the wafer 1 on the holding table 15 is transferred to the wafer elevator 66 for the developing section.
Causes the pantograph device 14 to be shortened toward the standby position (retracting direction) to move the vacant holding table 15 directly above the moving table 13. Then, while the developing process is being carried out in the developing tank 64, the wafer transfer device 10 moves the moving table 13
Is moved to a standby position in another processing unit to perform a predetermined delivery work.

When the developing process is completed, the developing unit wafer elevator 66 raises the wafer 1 held upright by the holder 76 to a predetermined delivery position. On the other hand, the wafer transfer device 10 moves the moving table 13 to the standby position of the developing section 62 by the transfer actuator 12. The wafer transfer device 10 extends the pantograph device 14 to move the empty holding base 15 forward to the delivery position of the developing unit wafer elevator 66. Wafer elevator 66 for developing section
The wafer 1 that has undergone the development processing is handed over to the holding table 15 of the wafer transfer device 10 in an upright state. When the wafer 1 is received by the holding table 15, the wafer transfer device 10 operates the pantograph device 14 in a shortened manner to return the holding table 15 receiving the wafer 1 to the position of the moving table 13.

When the wafer 1 returns to the standby position, the wafer transfer device 10 moves the moving table 13 together with the holding table 15 holding the wafer 1 to the after-baking section 42 which is the next processing step by the transfer actuator 12.

Subsequently, at the standby position of the afterbaking section 42, the wafer transfer apparatus 10 extends the pantograph apparatus 14 in the direction of the afterbaking furnace 44 (to the right) to hold the wafer held on the holding table 15 in a standing state. 1 is moved in parallel directly above the wafer elevator 46 for the afterbaking section.

When the wafer 1 comes directly above, the wafer elevator 46 for the afterbaking section raises the held wafer 1 while standing on the holding table 15 of the wafer transfer device 10. The wafer 1 lifted by the after-baking unit wafer elevator 46 is subjected to after-baking processing while being kept in a standing state by the after-baking furnace 44.

On the other hand, the wafer transfer device 10 which has transferred the wafer 1 on the holding table 15 to the after-baking part wafer elevator 46, shortens the pantograph device 14 toward the standby position (to the left), and holds it empty. The table 15 is moved right above the moving table 13. And afterbake furnace 4
While the after-baking process is performed at 4, the wafer transfer device 10 moves the movable table 13 to a standby position in another processing unit to perform a predetermined delivery work.

When the after-baking process is completed, the after-baking unit wafer elevator 46 lowers the wafer 1 to the delivery position. On the other hand, the wafer transfer device 10 causes the transfer actuator 12 to move the movable table 13 to the standby position of the afterbaking section 42. The wafer transfer device 10 extends the pantograph device 14 to move the empty holding table 15 to the delivery position of the after-baking part wafer elevator 46, and the wafer 1 is erected by the holding table 15 from the after-baking part wafer elevator 46. Receive as is. When the wafer 1 is received by the holding table 15 in an upright state, the wafer transfer device 10 operates the pantograph device 14 in a shortened manner to receive the wafer 1.
5 is moved in parallel to the position of the movable table 13.

When the wafer 1 returns to the standby position, the wafer transfer device 10 moves the moving table 13 together with the holding table 15 holding the wafer 1 to the unloading section 22 which is the next processing step by the transfer actuator 12.

When the movable table 13 is moved to the standby position of the unloading section 22, the wafer transfer device 30 holds the wafer 1 held on the holding table 15 from above by the holder 35. Then, it is conveyed right above the predetermined holding groove 4 in the empty cassette 2B installed in the unloading section 22.

When the processed wafer 1 is conveyed right above the predetermined holding groove 4 in the empty cassette 2B, the wafer elevator 24 for the unloading section rises and the wafer 1 is erected from the wafer transfer device 30. Receive as is. When the wafer 1 is received, the wafer elevator 24 for the unloading section descends and stores the processed wafer 1 in the predetermined holding groove 4 of the empty cassette 2B.

After that, by repeating the above operation, the wafers 1 in the actual cassette 2A are sequentially developed, and the developed wafers 1 are sequentially stored in the empty cassette 2B. During this time, the loading work, the pre-baking work, the cooling work, the developing work, the after-baking work and the unloading work are simultaneously carried out, and the carrying work by the wafer carrying device 10 to each part is processed in parallel while these works are in progress. . Then, these controls are centrally executed by a controller (not shown) constructed by a computer or the like.

According to the above embodiment, the following effects can be obtained. (1) Wafer transfer device 1 so that holding table 15 holding wafer 1 upright is moved by moving table 13.
By configuring 0, since the wafer 1 can be transported in an upright state, the transportation space can be suppressed to be extremely small. As a result, the wafer transportation device 10 and the photoresist developing device using the same can be suppressed. The occupied floor area of No. 5 can be suppressed small.

(2) By configuring the holding table 15 so that the main surface thereof is aligned with the transfer line 11 to hold the wafer 1, the transfer space (transfer floor area) of the wafer 1 on the transfer line 11 is further increased. It can be suppressed even smaller.

(3) The holding table 15 is attached to the pantograph device 1
Since the wafer 1 can be transferred while being held upright on the holding table 15 by being configured to be moved in parallel by the extension and shortening operations of 4, the transfer space can be suppressed to be extremely small. As a result, the floor area occupied by the wafer transfer device 10 and the photoresist developing device 5 using the same can be suppressed.

(4) By controlling the floor space occupied by the wafer transfer device 10 and the photoresist developing device 5, the temperature of the atmosphere of the wafer transfer device 10 and the photoresist developing device 5 is adjusted when the temperature of the entire atmosphere is adjusted. Since the volume to be operated can be reduced, the energy and the like consumed for this temperature adjustment can be saved.

(5) When the wafer transfer device 10 and the photoresist developing device 5 are constructed in a clean bench structure as a whole, the downflow air of the downflow air of the wafer 1 becomes small because the area of the wafer 1 in contact with the downflow becomes small. It is possible to reduce the probability that the dust inside adheres to the wafer.

(6) Further, since it is possible to prevent the wafer 1 from becoming an obstacle to the downflow, air may generate a vortex on the wafer 1 to disturb the downflow airflow. Therefore, the adhesion of dust can be prevented, the quality and reliability of the wafer transfer device and the photoresist developing device can be improved, and the yield of wafer manufacturing can be improved.

FIG. 7 is a plan sectional view showing a photoresist developing apparatus which is Embodiment 2 of the present invention.

The main difference of the second embodiment from the first embodiment is that the wafer transfer device 10 is configured to transfer the wafer 1 in a state of standing in a direction orthogonal to the transfer line 11. It is in. That is, the holding groove 1 of the holding table 15
6 extends in a direction parallel to the advancing / retreating direction of the holding table 15. Further, the loading section, the pre-baking section, the cooling section, the developing section, the after-baking section, and the unloading section are also set in directions orthogonal to the transport line 11.

FIG. 8 is a plan sectional view showing a photoresist developing apparatus which is Embodiment 3 of the present invention.

The main difference of the third embodiment from the first embodiment is that the actuator for moving the moving table 13 in the wafer transfer apparatus 10 is configured to rotate the moving table 13. That is, the moving table 13 is configured to be intermittently rotated by the rotary actuator on the center of rotation, and the respective processing units are arranged around the moving table 13. Then, the rotary actuator is configured to stop the moving table 13 at an angle at which the holding table 15 faces the desired processing section and send the holding table 15 to the desired processing section.

Although the invention made by the present inventor has been specifically described based on the embodiments, the invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the wafer holding table is not limited to be configured to stand and carry and process wafers one by one, but may be configured to stand and hold a plurality of wafers. Especially 2
When the wafers are configured to be transferred and processed with the main surface to be processed (front main surface) outside and the main surface not to be processed (back main surface) back-to-back, two wafers are processed at a time. It can be handled.

The processing section installed around the transfer line of the wafer transfer apparatus is not limited to the loading section, the pre-baking section, the cooling section, the developing section, the after-baking section and the unloading section, but other photoresist processing sections and others. ,
A processing unit that performs a predetermined process on the wafer can be installed.

In the above description, the case where the invention made by the present inventor is mainly applied to the wafer transfer technology and the wafer processing technology, which are the fields of application which are the background, has been described, but the invention is not limited thereto. In particular,
Among wafer processing technology, not only photoresist development technology,
The present invention can be applied to a wafer cleaning technique and a wet etching technique, and further can be applied to a general technique for transporting a plate-like object such as a liquid crystal panel or a printed wiring board and a general processing technique therefor.

[0070]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

By conveying the plate-shaped object in an upright state, the space for conveying the plate-shaped object can be suppressed to a very small level. The occupied floor area can be suppressed.

[Brief description of drawings]

FIG. 1 is a plan sectional view showing a photoresist developing apparatus according to an embodiment of the present invention.

2 (a) is a front sectional view taken along the line aa of FIG.
(B) is a front sectional view taken along the line bb of FIG. 1.

FIG. 3 is a partially omitted perspective view showing a wafer transfer device according to an embodiment of the present invention.

FIG. 4 is a partially omitted perspective view showing a loading unit.

FIG. 5 is a partially omitted perspective view showing a pre-baking unit.

FIG. 6 is a partially omitted perspective view showing a developing unit.

FIG. 7 is a plan sectional view showing a photoresist developing apparatus which is Embodiment 2 of the present invention.

FIG. 8 is a plan sectional view showing a photoresist developing apparatus which is Embodiment 3 of the present invention.

[Explanation of symbols]

1 ... Wafer (plate-shaped object, object to be processed, object to be transferred), 2 ... Wafer cassette, 2A ... Actual cassette, 2B ... Empty cassette, 3
... main body, 4 ... holding groove, 5 ... photoresist developing device (plate material processing device), 6 ... clean bench chamber, 10
... Wafer transfer device (plate-shaped object transfer device), 11 ... Transfer line, 12 ... Transfer actuator, 13 ... Moving base, 14 ...
Pantograph device, 14a ... 1st link bar, 14b ...
Second link bar, 14c ... Third link bar, 14d ... Fourth link bar, 14e ... Pin, 15 ... Holding table, 16 ... Holding groove, 21 ... Loading section, 22 ... Unloading section, 23 ... Wafer for loading section Elevator, 24 ...
Wafer elevator for unloading unit, 25 ... Lifting actuator, 26 ... Rod, 27 ... Holding member, 28 ... Holding groove, 30 ... Wafer transfer device, 31 ... Transfer actuator, 32 ... Moving base, 33 ... Lifting actuator, 34
... Elevating table, 35 ... Wafer transfer device holder, 36 ... Shaft-shaped section, 37 ... Arc-shaped section, 38 ... Pin, 39 ... Abutment tool, 41 ... Pre-baking section, 42 ... After-baking section, 43
... pre-bake furnace, 44 ... after-bake furnace, 45 ... pre-bake part wafer elevator, 46 ... after-bake part wafer elevator, 47 ... furnace body, 48 ... furnace opening, 49 ... baking processing chamber, 50 ... heating body, 51 ... lift actuator , 52 ... Rod, 53 ... Retaining tool, 54 ... Retaining groove, 61
... cooling unit, 62 ... developing unit, 63 ... cooling furnace, 64 ... developing tank, 65 ... cooling unit wafer elevator, 66 ... developing unit wafer elevator, 67 ... cooling furnace body, 68 ... furnace opening,
69 ... Cooling processing chamber, 70 ... Cooling body, 71 ... Developing tank main body, 72 ... Inlet / outlet port, 73 ... Developer, 74 ... Elevating actuator, 75 ... Rod, 76 ... Holder, 77 ... Holding groove.

Claims (6)

[Claims] 1. A holding table that is moved forward and backward with respect to the moving table by a pantograph device having one end supported by the moving table is provided, and the holding table is configured to hold a plate-shaped object in an upright state. A plate-shaped material conveying device characterized by the above. 2. The plate-like object transfer device according to claim 1, wherein the moving table is configured to reciprocate along the transfer line. 3. The plate-like object conveying device according to claim 1, wherein the movable table is configured to rotate. 4. The plate-like object conveying device according to claim 1, wherein the holding table is configured to hold the plate-like object in a direction orthogonal to the advancing / retreating direction. 5. The plate-like object conveying device according to claim 1, wherein the holding table is configured to hold the plate-like object in a direction parallel to the advancing / retreating direction. 6. A plurality of processing units are disposed outside a moving table in the plate-shaped object conveying device according to claim 1, and each processing unit performs processing in a state in which the plate-shaped object is erected. The moving table is configured to move to a position facing each processing unit, and the holding table is provided between the processing unit and the moving table facing the processing unit by a pantograph device. A plate-like object processing device, which is configured to be reciprocally moved.