JPH08288325A - Resin sealing system for semiconductor - Google Patents

Abstract

PURPOSE: To simplify recovery from an abnormal stop due to power interruption during mold clamping operation, for example. CONSTITUTION: An upper die 24 is secured to an upper platen 23 at the upper end of a tie bar 22 and a lower die 26 is mounted on a platen 25 movable up and down. A die feed mechanism moves the movable platen 25 to fit the lower die 26 to the upper die 24 or separate the lower die 26 therefrom. A mold clamp mechanism comprises a press ram 29, a pressure booster 31, and a pressure spacer 32 inserted retractibly between the press ram 29 and a transmission block 27. The lower die 26 is provided with a mechanism for pressure injecting resin material into the molding die through ascend of a plunger 34. Pressure acting on the plunger 34 is detected by a pressure detector and a controller inhibits unclamping of the mold clamping mechanism 28 when a pressure higher than a predetermined level is detected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor resin encapsulation device which is designed to simplify recovery after the device has abnormally stopped due to a power failure or the like during mold clamping molding.

[0002]

2. Description of the Related Art Generally, a semiconductor resin sealing device used for resin molding of semiconductor parts is constructed as shown in FIG. That is, the upper platen 4 having the upper mold 3 is fixed to the upper ends of the plurality of tie bars 2 erected on the base 1, and the lower mold 5 is provided between the base 1 and the upper platen 4. A movable platen 6 included therein is provided so as to be movable along the tie bar 2.

The moving platen 6 is moved by a mold feeding mechanism such as a servo motor (not shown), so that the lower mold 5 and the upper mold 3 are aligned and opened. A mold clamping mechanism 7 is provided for clamping the two molds 3 and 5 at high pressure with hydraulic pressure. The mold clamping mechanism 7 includes a pressure ram 8 provided on the base 1, a pressure booster 9 for sending hydraulic oil to the pressure ram 8, and a transmission block 1 provided on the movable platen 6.
0, the pressure ram 8 and the transmission block 10, and is composed of a pressure spacer 11 and the like which transmits and receives the pushing force of the pressure ram 8 and which is taken in and out. Further, a hydraulic pressure detector 12 is provided in a pipe line connecting the pressure booster 9 and the pressure ram 8.
Is provided.

In the die-matching state in which the die is not clamped, the pressure spacer 11 can be taken in and out. Therefore, a small dimension A (for example, 0. A gap of 5 mm) is secured. When the mold clamping mechanism 7 is performing mold clamping, the pressure ram 8 is pushed up to eliminate the gap. Therefore, for example, to obtain a mold clamping force of 100 tons,
It is necessary to extend the tie bar 2 by about 2 mm, but at this time, the pressure ram 8 operates about 2.5 mm.

Further, although not shown in detail, the lower die 5 is provided with a resin injecting mechanism for injecting a resin material under pressure into the cavity of the closed mold. This resin injection mechanism is configured to push out the resin material (tablet) supplied into the pot 5a by the plunger 13 which is vertically moved by the plunger driving servomotor.

[0006]

By the way, in the semiconductor resin sealing device as described above, an abnormal stop may occur due to, for example, a power failure. However, in the conventional device, such an abnormal stop occurs during mold clamping molding. When the above occurs, the following problems may occur.

That is, first, it is necessary to release the mold clamping by the mold clamping mechanism 7 at the time of turning on the power after the abnormal stopping, but the abnormal stopping occurs during the operation of the plunger 13 of the resin injection mechanism. If generated, the pressure is applied to the plunger 13, and if the mold clamping is released in this state, the pressure applied to the plunger 13 may push the moving platen 6 downward. When the moving platen 6 is pushed back in this way, a gap is created between the upper die 3 and the lower die 5, while the pressure spacer 11 is sandwiched between the transmission block 10 and the pressure ram 8. There is a problem that you will not be able to pull it out.

Secondly, in the servomotor of the die feed mechanism, when the lower die 5 is in contact with the upper die 3, the servo driver is overloaded, or the current flows in only one phase to damage the output element. In order to avoid this, torque limitation is applied only when the lower mold 5 comes into contact with the upper mold 3. In other cases, torque limitation has not been applied because the tracking of servo control becomes unstable. However, when the power is turned on after the abnormal stop, the position of the moving platen 6 is unknown until the servo motor returns to the origin, and as described above, the torque limit is not applied in the initial state after the power is turned on. Therefore, if the mold matching state or the mold clamping state is not released promptly, there is a problem that a servo driver abnormality occurs. In this case, the operator has to release the mold fitting state or the mold clamping state by an operation different from usual.

The present invention has been made in view of the above circumstances. A first object of the present invention is to push back the movable mold in the mold opening direction by the pressure acting on the plunger when the power is turned on after the abnormal stop. It is an object of the present invention to provide a semiconductor resin encapsulation device that can prevent the occurrence of the above-mentioned problems and, by extension, can simplify the recovery after an abnormal stop. A second object of the present invention is to prevent the occurrence of an abnormality in the servo driver of the die feed mechanism when the power is turned on after the abnormal stop, and to simplify the recovery after the abnormal stop. The present invention provides a semiconductor resin sealing device capable of

[0010]

In order to achieve the first object, the semiconductor resin sealing device according to claim 1 of the present invention comprises:
A molding die including a fixed die and a movable die, a die feed mechanism for bringing the movable die into and out of contact with the fixed die, a die clamping mechanism for clamping the die with hydraulic pressure, and the molding by driving a plunger. A resin injecting mechanism for injecting a resin material into the mold under pressure, a pressure detecting means for detecting a pressure acting on the plunger, and a mold by the mold clamping mechanism when a pressure higher than a predetermined pressure is detected by the pressure detecting means. It has a prohibition means for prohibiting the release of tightening.

The semiconductor resin encapsulation device according to claim 2 is
A molding die including a fixed die and a movable die, a die feed mechanism for bringing the movable die into and out of contact with the fixed die, a die clamping mechanism for clamping the die with hydraulic pressure, and the molding by driving a plunger. A resin injection mechanism for injecting a resin material into the mold under pressure, a position detection means for detecting the position of the plunger, and a position detection means for detecting that the plunger is on the injection side with respect to a predetermined position. And a prohibiting means for prohibiting the release of the mold clamping by the mold clamping mechanism. In this case, the position detecting means may be configured to include an absolute encoder so that the position of the plunger can always be detected (semiconductor resin sealing device according to claim 3).

In order to achieve the second object, a semiconductor resin sealing device according to a fourth aspect of the present invention is a molding die including a fixed die and a movable die, and the movable die using a servo motor as a drive source. A mold feed mechanism for bringing the mold into and out of contact with a fixed mold, a mold clamping mechanism for clamping the mold by hydraulic pressure, a resin injection mechanism for injecting a resin material into the mold under pressure, and the mold clamping A mold clamping state detecting means for detecting the mold clamping state by the mechanism, and a torque control means for limiting the output torque of the servo motor to a predetermined value or less when the mold clamping state detecting means detects the mold clamping state. are doing.

According to a fifth aspect of the semiconductor resin sealing device,
A mold including a fixed mold and a movable mold; a mold feed mechanism that uses a servomotor as a drive source to bring the movable mold into and out of contact with the fixed mold; and a mold clamping mechanism that clamps the mold by hydraulic pressure or the like. When the resin injection mechanism for injecting a resin material into the molding die under pressure, the position detection means for detecting the position of the movable die, and the position detection means for detecting the contact state of the movable die with respect to the fixed die And a torque control means for limiting the output torque of the servo motor to a predetermined value or less.

[0014]

According to the semiconductor resin sealing device of the first aspect of the present invention, the movable die is brought into contact with the fixed die by the die feed mechanism, the die clamping is performed by the die clamping mechanism, and the molding die by the resin injection mechanism. A resin material is injected under pressure to seal the semiconductor with resin. The pressure acting on the plunger is detected by the pressure detecting means, and when the detected pressure is equal to or higher than the predetermined pressure, the prohibiting means prohibits the mold clamping mechanism from releasing the mold clamping.

Here, if an abnormal stop occurs due to a power failure or the like during mold clamping, when the power is turned on after the abnormal stop,
Although pressure is acting on the plunger, at this time, release of the mold clamping is prohibited, so that the movable mold is prevented from being pushed back due to the pressure of the plunger.

According to another aspect of the semiconductor resin sealing device of the present invention, the position of the plunger is detected by the position detecting means, and when the plunger is on the injection side with respect to the predetermined position, the prohibiting means causes the mold to be clamped by the mold clamping mechanism. Unlocking is prohibited. Here, there is a correlation between the position of the plunger and the pressure acting on the plunger, and the larger the pressure is on the injection side, the same as above.
When pressure is applied to the plunger when the power is turned on after an abnormal stop, release of the mold clamp is prohibited, so it is possible to prevent the movable mold from being pushed back due to the pressure of the plunger. It

In this case, if an absolute encoder is adopted as the position detecting means (semiconductor resin sealing device according to claim 3), the position of the plunger can be accurately detected without returning to the origin even when the power is turned on. The position of the plunger can always be detected.

According to the semiconductor resin sealing device of the fourth aspect, the movable die is brought into contact with the fixed die by the die feed mechanism using the servo motor as a drive source, and the die clamping mechanism performs the die clamping. The resin injection mechanism pressurizes and injects a resin material into the molding die to perform resin sealing of the semiconductor.
Then, the mold clamping state by the mold clamping mechanism is detected by the mold clamping state detecting means, and when the mold clamping state is detected, the torque control means limits the output torque of the servo motor to a predetermined value or less.

Here, if an abnormal stop occurs due to a power failure or the like during mold clamping molding, it means that the mold is clamped when the power is turned on after the abnormal stop. It is possible to detect the mold clamping state by the mold clamping state detecting means, and at this time, since the output torque of the servo motor is limited to a predetermined value or less,
Regardless of whether the mold matching state or mold clamping state is released,
Abnormalities in the servo driver of the die feed mechanism will not occur.

According to another aspect of the semiconductor resin sealing device of the present invention, the position of the movable die is detected by the position detecting means, and when the movable die is in contact with the fixed die, the torque control means outputs the servo motor. The torque is limited to a predetermined value or less. Therefore, when the power is turned on after an abnormal stop,
When the movable die is in contact with the fixed die, the output torque of the servo motor is limited to a predetermined value or less.
Regardless of whether the mold matching state or mold clamping state is released,
Abnormalities in the servo driver of the die feed mechanism will not occur.

[0021]

EXAMPLES Some examples of the present invention will be described below.
Description will be made with reference to FIGS. 1 to 5. (1) First Embodiment First, a first embodiment (corresponding to claim 1) of the present invention will be described with reference to FIGS. 1 and 2.

FIG. 1 schematically shows the structure of a semiconductor resin encapsulation apparatus according to this embodiment, in which four corners are located on a base 21 which is rectangular and is installed on the floor. Tie bars 22 (only two of which are shown) are provided extending in the vertical direction. A rectangular upper platen 23 is fixed to the upper end of the tie bar 22, and an upper mold 24 as a fixed mold is provided on the lower surface of the upper platen 23.

A similar rectangular moving platen 25 is provided between the base 21 and the upper platen 23 so as to be vertically movable under the guidance of the tie bar 22. Then, on the upper surface portion of the moving platen 25, a lower mold 26 as a movable mold that constitutes a molding mold together with the upper mold 24.
Is provided. Although not shown in detail, the upper mold 2
A cavity for accommodating the lead frame is formed between the lower die 4 and the lower die 26, and the lower die 26 has a pot 26a communicating with the cavity via a runner or the like. It is provided.

Although not shown, the base 21 is moved by moving the movable platen 25 up and down to align the molds and to open the mold (contact and separate the lower mold 26 from the upper mold 24). A mechanism is provided. This die feed mechanism is a servo motor driven by a servo driver,
It is composed of a ball screw mechanism or the like that converts the rotation of the servo motor into the vertical movement of the moving platen 25.

Further, a transmission block 27 is provided on the lower surface of the movable platen 25, and the movable platen 25 is pressed upward through the transmission block 27 on the base 21 side so that the pressure of the molding die is high. A mold clamping mechanism 28 for performing mold clamping is provided. This mold clamping mechanism 28
Is a pressurizing ram 29 provided on the base 21, a pressurizing booster 31 for pumping hydraulic oil to the pressurizing ram 29 through a conduit 30, and can be put in and taken out between the pressurizing ram 29 and the transmission block 27. It is composed of a pressure spacer 32 or the like which is inserted and transmits the pushing force of the pressure ram 29. Further, a hydraulic pressure detector 33 is provided in the pipe line 30 so that the mold clamping force is detected.

In the die-matching state in which the die is not clamped, the pressure spacer 32 can be taken in and out.
A gap of a small size A (for example, 0.5 mm) is secured between the transmission block 27 and the pressure spacer 32. While the mold is being clamped by the mold clamping mechanism 28, the gap is eliminated by pushing up the pressure ram 29. For example, in order to obtain a mold clamping force of 100 tons, it is necessary to extend the tie bar 22 by about 2 mm. At this time, the pressure ram 29 operates about 2.5 mm.

A resin injection mechanism for pressurizing and injecting a resin material into the cavity of the mold which has been clamped is provided in the lower mold 26. Although not shown in detail, this resin injection mechanism is configured to push out a resin material (tablet) (not shown) supplied into the pot 26a by a plunger 34 which is vertically moved by a servomotor for driving a plunger. The pressure acting on the plunger 34 is detected by a pressure detector (not shown) as a pressure detecting means.

The above-mentioned mechanisms are also controlled by a control device (not shown). As a result, the lead frame is supplied into the cavity and the resin material is supplied into the pot 26a in the mold open state of the upper mold 24 and the lower mold 26, the mold matching by the mold feeding mechanism, and the mold clamping mechanism 28. Clamping of the mold by, the resin injection mechanism (plunger 34) to inject the resin material into the mold under pressure, releasing the mold clamp, opening the mold, and taking out the molded product are automatically performed. Of.

At this time, the controller clamps the mold by the mold clamping mechanism 28 when a pressure higher than a predetermined level is detected based on the detection signal of the pressure detector which detects the pressure acting on the plunger 34. Prohibiting the release of
The mold clamping is released on the condition that the detected pressure is lower than a predetermined value. Therefore, this control device functions as a prohibition means. When the resin material is injected under pressure by the plunger 34, a constant injection pressure is ensured based on the detection signal from the pressure detector.

Next, the operation of the above configuration will be described with reference to FIG. As described above, the semiconductor resin sealing device supplies the lead frame into the cavity, the resin material into the pot 26a, and the mold feed in the mold open state of the upper mold 24 and the lower mold 26 by the control device. The mold is aligned by the mechanism, the mold is clamped by the mold clamping mechanism 28 at the preset pressure of the mold, the resin material is pressurized and injected into the mold by the resin injection mechanism, the mold clamping is released, the mold is opened, Taking out of the molded product is automatically executed in order.

By the way, in such a semiconductor resin sealing device, there is a case where the device is abnormally stopped due to a power failure or the like, and it is necessary to return the device to the initial state when the power is turned on after the abnormal stop. Then, if such an abnormal stop occurs during mold clamping molding, at the time of turning on the power after the abnormal stop, the plunger 34 is held in the mold clamping state by the mold clamping mechanism 28.
The pressure is acting on.

In this case, if the mold clamping is released in this state, the movable platen 25 may be pushed back downward by the pressure acting on the plunger 34, and the transmission block 27 and the pressure ram may be pushed down. There is a problem that the pressure spacer 32 is sandwiched between the pressure spacer 29 and the pressure spacer 32 and cannot be removed. However, in this embodiment, as shown in FIG. 2, when the pressure above the predetermined level is applied to the plunger 34, the release of the mold clamping by the mold clamping mechanism 28 is prohibited, and the lowering operation of the plunger 34 is performed first. Along with, Plunger 3
After the pressure of 4 is released, the mold clamping is released.

Therefore, according to this embodiment, unlike the conventional one, when the power is turned on after an abnormal stop, the moving platen 25 (lower die 26) is pushed back in the die opening direction by the pressure acting on the plunger 34. It is possible to prevent this from happening, and as a result, the transmission block 27 and the pressure ram 29 are
It is possible to prevent the problem that the pressurizing spacer 32 is sandwiched between and and cannot be pulled out, and it is possible to simplify the recovery after the abnormal stop.

(2) Second Embodiment Next, a second embodiment of the present invention (corresponding to claims 2 and 3) will be described with reference to FIG. In this embodiment,
Most of the mechanical components of the apparatus are the same as those of the first embodiment, so the same parts as those in FIG. 1 are designated by the same reference numerals, and new illustration and description thereof will be omitted.

The difference of this embodiment from the first embodiment is that an absolute encoder is provided as position detecting means for detecting the vertical position of the plunger 34 of the resin injection mechanism, and at the same time, the controller is controlled by the absolute encoder. The point is that the release of the mold clamping by the mold clamping mechanism 28 is prohibited when it is detected that the plunger 34 is on the injection side, that is, the upper side of the predetermined position.

Here, when the resin material is injected under pressure, when the plunger 34 rises and exceeds a predetermined position, the pressure for pushing back the plunger 34 acts, so that the resin material is pushed. The predetermined position can be determined in advance based on the amount of the space and the size of the cavity.
As shown in FIG. 3, when the plunger 34 is located above a predetermined position, the control device prohibits the mold clamping mechanism 28 from releasing the mold clamping, and the lowering operation of the plunger 34 is performed first to cause the plunger 34 to move. After the pressure is released, the mold clamping is released.

Therefore, also in this embodiment, the first
Similar to the embodiment, it is possible to prevent the moving platen 25 (lower mold 26) from being pushed back in the mold opening direction by the pressure acting on the plunger 34 when the power is turned on after the abnormal stop. As a result, it is possible to prevent the problem that the pressure spacer 32 is sandwiched between the transmission block 27 and the pressure ram 29 and cannot be pulled out, and it is possible to simplify the recovery after the abnormal stop. It is possible.

(3) Third Embodiment Next, a third embodiment of the present invention (corresponding to claim 4) will be described with reference to FIG. Also in this embodiment, the overall configuration is almost the same as that of the first embodiment, so a new description will be omitted and only different points will be described below.

The detection signal of the oil pressure detector 33 is used to detect the mold clamping pressure of the molding die and perform the mold clamping at the set pressure. In this embodiment, the molding die is in the mold clamping state. It is also used as a mold clamping state detecting means for detecting whether or not The control device is configured to have a function as torque control means for limiting the output torque of the servo motor of the die feed mechanism to a predetermined value or less when the die clamping state is detected by the hydraulic pressure detector 33. There is.

Here, in the servo motor of the die feed mechanism, in order to prevent a servo driver abnormality in the state where the lower die 26 is in contact with the upper die 24, the torque is limited when the lower die 26 is in contact with the upper die 24. However, in the past, in other cases, torque limitation has not been applied because of the fact that the followability of servo control becomes unstable. However, when the power is turned on after an abnormal stop, the position of the moving platen 25 is unknown and the torque is not limited until the servo motor returns to the home position. If the mold fitting state or the mold clamping state is not promptly released by a human operation, there is a problem that a servo driver abnormality occurs.

On the other hand, in this embodiment, as shown in FIG. 4, the output torque of the servo motor of the die feed mechanism is always limited based on the detection by the hydraulic pressure detector 33 during the die clamping. In addition, in other states, the torque limitation is released for reasons such as stabilizing servo control. Therefore, if an abnormal stop occurs due to a power failure or the like during mold clamping molding, it means that the mold is clamped when the power is turned on after the abnormal stop. Since it is limited to the following, the abnormality of the servo driver of the die feed mechanism does not occur regardless of whether or not the die fitting state or the die clamping state is released.

As a result, according to the present embodiment, when the power is turned on after the abnormal stop, it is possible to prevent the occurrence of the abnormality of the servo driver of the die feed mechanism, and the operator can promptly perform the die matching state. Alternatively, it is not necessary to perform the operation of releasing the mold clamping state, and the recovery after the abnormal stop can be simplified.

(4) Fourth Embodiment Finally, a fourth embodiment of the present invention (corresponding to claim 5) will be described with reference to FIG. This embodiment is different from the third embodiment in that the die feed mechanism is provided with, for example, an absolute encoder as a position detecting means for detecting the position of the lower die 26 (moving platen 25), and as a torque control means. On the basis of the detection of the absolute encoder, the control device of No. 1 is configured to limit the output torque of the servo motor of the die feed mechanism to a predetermined value or less when the lower die 26 is in contact with the upper die 24. is there.

In this case, as shown in FIG. 5, the output torque of the servo motor of the die feed mechanism is always limited as long as the die is in contact with the die including the clamping. In this state, the torque limit is released. Therefore, when the mold is in contact with the mold including the mold when the power is turned on after an abnormal stop due to a power failure, etc., the output torque of the servo motor is limited to a predetermined value or less. Regardless of whether or not it is released, the error in the servo driver of the die feed mechanism does not occur.

As a result, according to this embodiment, similarly to the third embodiment, when the power is turned on after the abnormal stop, the servo driver of the die feed mechanism can be prevented from being abnormal. Consequently, the operator does not have to promptly perform the operation of releasing the mold fitting state or the mold clamping state, and the recovery after the abnormal stop can be simplified.

The present invention is not limited to the above-described embodiments. For example, in the above-mentioned first and second embodiments, it is not always necessary to use a servomotor in the die feed mechanism, and the upper die is not used. A resin injection mechanism may be provided on the side, and various modifications can be made without departing from the scope of the invention.

[0047]

As is apparent from the above description, the present invention has the following excellent effects. That is, according to the semiconductor resin sealing device of the first aspect, the pressure detecting means for detecting the pressure acting on the plunger of the resin injecting mechanism, and the mold clamping mechanism when the pressure more than a predetermined pressure is detected by the pressure detecting means. Since it is provided with a prohibition means for prohibiting the release of the mold clamping by the, it is possible to prevent the movable mold from being pushed back in the mold opening direction by the pressure acting on the plunger when the power is turned on after the abnormal stop. Therefore, it is possible to simplify the recovery after the abnormal stop.

According to the semiconductor resin sealing device of the second aspect, the position detecting means for detecting the position of the plunger of the resin injecting mechanism and the plunger by this position detecting means are on the injection side with respect to the predetermined position. Since the movable die is pushed back in the mold opening direction by the pressure acting on the plunger when the power is turned on after the abnormal stop, the movable die is pushed back when the power is turned on. It is possible to prevent this from happening in advance, and thus to simplify the recovery after an abnormal stop.

In this case, if an absolute encoder is used as the position detecting means (semiconductor resin sealing device according to claim 3), the position of the plunger can be accurately detected without returning to the origin even when the power is turned on. Therefore, the position of the plunger can always be detected.

According to the semiconductor resin sealing device of the fourth aspect, the mold clamping state detecting means for detecting the mold clamping state by the mold clamping mechanism and the mold clamping state are detected by the mold clamping state detecting means. Sometimes, it is provided with a torque control means for limiting the output torque of the servo motor of the die feed mechanism to a predetermined value or less, so that when the power is turned on after an abnormal stop, the occurrence of an abnormality in the servo driver of the die feed mechanism is prevented. Therefore, it is possible to simplify the recovery after an abnormal stop.

According to another aspect of the semiconductor resin sealing device of the present invention, the position detecting means for detecting the position of the movable die and the die when the position detecting means detects the contact state of the movable die with the fixed die. Since the servo motor of the feeding mechanism is provided with a torque control means for limiting the output torque to a predetermined value or less, it is possible to prevent the occurrence of an abnormality in the servo driver of the die feeding mechanism when the power is turned on after the abnormal stop. As a result, it is possible to simplify the recovery after an abnormal stop.

[Brief description of drawings]

FIG. 1 shows a first embodiment of the present invention, and is a front view schematically showing the entire configuration.

FIG. 2 is a flowchart showing a main part of control.

FIG. 3 is a view corresponding to FIG. 2 showing a second embodiment of the present invention.

FIG. 4 is a flowchart showing a main part of control showing a third embodiment of the present invention.

FIG. 5 is a view corresponding to FIG. 4 showing a fourth embodiment of the present invention.

FIG. 6 is a view corresponding to FIG. 1 showing a conventional example.

[Explanation of symbols]

In the drawings, 21 is a base, 23 is an upper platen, 24 is an upper mold (fixed mold), 25 is a movable platen, 26 is a lower mold (movable mold), 26a is a pot, 27 is a transmission block, 28 is a mold clamping mechanism, 29 is a pressure ram, 31 is a pressure booster, 32
Is a pressure spacer, 33 is an oil pressure detector, and 34 is a plunger.

Claims (5)

[Claims] 1. A mold including a fixed mold and a movable mold, a mold feed mechanism for bringing the movable mold into and out of contact with the fixed mold, a mold clamping mechanism for clamping the mold by hydraulic pressure, and a plunger. A resin injection mechanism for injecting a resin material into the molding die under pressure, a pressure detection means for detecting a pressure acting on the plunger, and a pressure detection means for detecting a pressure higher than a predetermined value. A semiconductor resin encapsulation device comprising: a prohibition unit that prohibits release of mold clamping by a mold clamping mechanism. 2. A mold including a fixed mold and a movable mold, a mold feeding mechanism for bringing the movable mold into and out of contact with the fixed mold, a mold clamping mechanism for clamping the mold by hydraulic pressure, and a plunger. The resin injection mechanism for pressurizing and injecting a resin material into the molding die by the driving of, the position detection means for detecting the position of the plunger, and the position detection means may cause the plunger to be on the injection side from a predetermined position. A semiconductor resin encapsulation device comprising: a prohibition unit that prohibits release of the mold clamping by the mold clamping mechanism when detected. 3. The semiconductor resin encapsulation device according to claim 2, wherein the position detecting means includes an absolute encoder, and is capable of always detecting the position of the plunger. 4. A mold including a fixed mold and a movable mold, a mold feed mechanism that uses a servomotor as a drive source to bring the movable mold into and out of contact with the fixed mold, and mold clamping of the mold by hydraulic pressure or the like. A mold clamping mechanism, a resin injecting mechanism for injecting a resin material into the mold under pressure, a mold clamping state detecting means for detecting a mold clamping state by the mold clamping mechanism, and a mold clamping state by this mold clamping state detecting means. Is detected, the semiconductor resin sealing device is provided with torque control means for limiting the output torque of the servo motor to a predetermined value or less. 5. A mold including a fixed mold and a movable mold, a mold feed mechanism that uses a servomotor as a drive source to bring the movable mold into and out of contact with the fixed mold, and mold clamping of the mold by hydraulic pressure or the like. A mold clamping mechanism, a resin injecting mechanism for injecting a resin material into the molding die under pressure, a position detecting means for detecting the position of the movable die, and a position detecting means for contacting the movable die with a fixed die. A semiconductor resin encapsulation device comprising: torque control means for limiting the output torque of the servo motor to a predetermined value or less when detected.