JPH0828397B2 - Resin-sealed semiconductor device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-encapsulated semiconductor device, and more particularly to a resin-encapsulated semiconductor device (hereinafter referred to as a composite type flat package) using a composite film carrier tape and a lead frame.

[0002]

2. Description of the Related Art Semiconductor device packages are roughly classified into two types, resin-sealed types and ceramic-sealed types, but resin-sealed types are the mainstream because they are inexpensive and suitable for mass production. .

Further, in response to recent demands for smaller and thinner electronic parts such as semiconductor devices and multifunctionalization, the conventional lead frame has a limit in pattern workability, and a lead frame having a multi-pin narrow pitch is manufactured. Since this has become difficult, a composite flat package in which a film carrier tape and a lead frame are composited is being considered as a countermeasure.

2A and 2B are a plan view and a sectional view taken along the line AA 'showing an example of a conventional resin-sealed semiconductor device.

As shown in FIGS. 2 (a) and 2 (b), the island 4 supported by the suspension leads 4a connected to the frame 3 and the tie bar 12 connected to the frame 3 and the periphery of the island 4 are supported. The semiconductor chip 1 mounted with the silver paste 2 on the island 4 of the lead frame having the inner lead 5 arranged on the outer side and the outer lead 6 provided on the outer extension of the inner lead 5, and the insulating film frame 13 such as polyimide. Is connected to the outside of the internal lead 8 and an internal lead 8 made of a metal foil such as copper that has been inner lead bonded (hereinafter referred to as ILB) to a bump 10 formed on the electrode of the semiconductor chip 1 by being bonded onto the internal lead 8. A tape carrier having an inner lead 5 of a lead frame and an outer lead 9 which is outer lead bonded (hereinafter referred to as OLB). Is configured to have a, in a subsequent step, resin sealing semiconductor chip 1 including the inner leads 5 of the lead frame with epoxy resin, the composite type flat package.

Here, by interposing a tape carrier having an internal lead 8 and an external lead 9 connected between the bump 10 of the semiconductor chip 1 and the internal lead 5 of the lead frame, it is possible to cope with the narrowing of the number of pins. A complex flat package can be constructed.

[0007]

In this conventional resin-encapsulated semiconductor device, the strength of the insulating film frame bonded between the inner lead and the outer lead in order to prevent deformation of the lead of the film carrier is weak. The insulating film frame is deformed by the flow of resin during resin encapsulation, and as a result the semiconductor chip does not fit in the center of the package, or the resin flowing in the mold die is out of balance and the resin flows up and down. There is a problem that voids are generated on the package surface because they do not flow evenly.

Further, in this film carrier, the insulating film frame is expanded by the heat from the mold when it is placed in the mold, and the carrier tape is already deformed before the resin is injected into the mold so that a predetermined amount is obtained. There is also the problem of ups and downs from the position.

Further, when thermal stress such as temperature cycle test (hereinafter referred to as T / C) or IR reflow is applied to the package, the thermal expansion coefficient of the film carrier tape causes thermal expansion of other package constituent materials (for example, sealing resin). Since the coefficient is larger than the coefficient, there is a problem that the insulating film frame relatively expands and contracts greatly, and the joining reliability of the ILB portion or the OLB portion deteriorates. Further, in some cases, lead cutting or stress concentration on the semiconductor element may cause cracks.

[0010]

A resin-sealed semiconductor device of the present invention is mounted on an island, a lead frame having a first internal lead arranged around the island, and the island. A semiconductor chip, a second inner lead and an outer lead that are provided by being bonded on an insulating film frame, and the second inner lead is connected to an electrode of the semiconductor chip, and the outer lead is connected to the first inner lead. In a resin-sealed semiconductor device having a film carrier connected to a lead, the insulating film frame is a metal foil tape or a resin film in which an insulating film tape and end portions of the insulating film tape are connected to each other to form a frame shape. Have.

[0011]

Next, the present invention will be described with reference to the drawings.

FIG. 1 is a plan view showing an embodiment of the present invention.

As shown in FIG. 1, an island 4 of a lead frame having an island 4 supported by a suspension lead 4a on a frame 3 and an inner lead 5 and an outer lead 6 supported by a tie bar 12 as in the conventional example. The semiconductor chip 1 is mounted on the top, and the ends of the insulating film tape 12 made of polyimide or the like are connected to each other by the metal foil tape 14 and adhered onto the insulating film tape 12 of the insulating film frame formed on the frame to form a semiconductor. The internal leads 8 made of metal foil such as copper are connected to the bumps formed on the electrodes provided on the chip 1 by ILB, and the external leads 9 provided at the other end of the internal leads 8 are connected to the internal leads 5 of the lead frame by OLB. Connecting.

Here, an insulating film frame in which the insulating film tape 12 is connected to each other by a metal foil tape 14 (or an insulating film which is divided by cutting four corners of a frame-shaped insulating film and connected to each other by a metal foil tape) By using a film carrier consisting of a frame) and the inner leads 8 and the outer leads 9 adhered to the insulating film frame, the area of the insulating film tape 12 is reduced, and the resin flow during resin sealing and the molding die Since the deformation of the insulating film frame due to the heat of 1 is reduced, and the deformation of the insulating film frame can be suppressed by the metal foil tape 14, it is possible to suppress the fluctuation and ups and downs of the insulating film frame, and thus the positional displacement of the semiconductor chip 1 and the injection resin. It is possible to reduce the non-uniformity and to prevent the occurrence of voids.

A liquid resin (for example, CRP-3000 manufactured by Sumitomo Bakelite Co., Ltd.) is used instead of the metal foil tape 14.
/ CRH-300), the insulating film tapes 12 are connected to each other by a screen printing method or a potting method,
Thermosetting resin films may be connected to each other, and the resin film to be connected to the insulating film tape 12 may be connected to the insulating film tape 12.
Fixing with a harder resin film has an advantage that the deformation of the insulating film frame can be further reduced as compared with the first embodiment. Insulating film tape 1 is used as the resin film to be connected.
It is desirable that the coefficient of thermal expansion be smaller than 2.

Table 1 compares the ups and downs of the insulating film frame, the void occurrence rate, and the package defect occurrence rate for the first and second embodiments of the present invention and the conventional example.

[0017]

[Table 1]

As shown in Table 1, in the first embodiment, the amount of ups and downs of the insulating film frame is less than half the conventional amount, and the void generation rate becomes zero. Also, no electrical failure of the package occurs until the T / C 500 cycles. In addition, in the second embodiment, the amount of ups and downs of the insulating film frame is less than 1/3 of the conventional one, and the package reliability is T / C.
It can be maintained up to 1000 cycles.

[0019]

As described above, according to the present invention, the insulating film frame is divided by cutting the four corners of the insulating film frame for preventing the deformation of the leads of the film carrier, and is divided by the metal foil tape or the resin film. By adhering the tapes to each other, it is possible to prevent the insulating film frame from rising and falling due to the resin flow in the mold sealing and the thermal deformation of the insulating film frame that occurs when it is mounted in the mold, thus preventing the occurrence of voids. Has the effect.

Further, even when thermal stress is applied to the package, expansion and contraction of the insulating film frame can be suppressed, and deterioration of reliability of the package can be prevented.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of the present invention.

FIG. 2 is a plan view and an AA ′ line cross-sectional view showing an example of a conventional resin-encapsulated semiconductor device.

[Explanation of symbols]

 1 Semiconductor Chip 2 Silver Paste 3 Frame 4 Island 5,8 Inner Lead 6,9 Outer Lead 10 Bump 12 Insulating Film Tape 13 Insulating Film Frame 14 Metal Foil Tape

Claims (1)

[Claims] 1. A lead frame having an island, a first internal lead arranged around the island, a semiconductor chip mounted on the island, and an adhesive film provided on an insulating film frame. A resin-sealed semiconductor device having a film carrier having two inner leads and an outer lead, the second inner lead being connected to an electrode of the semiconductor chip, and the outer lead being connected to the first inner lead. The resin-encapsulated semiconductor device, wherein the insulating film frame has an insulating film tape and a metal foil tape or a resin film that connects the end portions of the insulating film tape to each other to form a frame shape.