JPH08281545A - Substrate surface polishing device - Google Patents

Abstract

PURPOSE: To provide a substrate surface polishing device which makes the pressure of a polishing tape coming into contact with a substrate face uniform. CONSTITUTION: In a substrate surface polishing device equipped with a stage 13 where a substrate 14 is installed; a polishing tape 18 which runs in a fixed direction for polishing the substrate surface; a supply mechanism 17 for supplying the polishing tape; and a polishing head 16 for guiding the polishing tape supplied from the supply mechanism 17 so as to come into contact with the face of the substrate 14, the polishing head 16 has a space where it expands under the supply of a medium.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate surface polishing apparatus for flattening the surface of a substrate such as a printed circuit board or a glass substrate and for removing protrusions and foreign matters on the substrate surface.

[0002]

2. Description of the Related Art A conventional substrate surface polishing apparatus is shown in FIG.
Will be described with reference to.

Reference numeral 41 denotes a stage on which a substrate 42 is fixed. Stage 41 is horizontal (arrow Y
It is configured to be able to move to 1). Also, stage 4
A head unit 43 is located above 1. The head unit 43 has a polishing head 44 incorporated therein.
And a pressure mechanism 45, a supply mechanism 46, and the like. The polishing head 44 has a roller-shaped portion 44a having elasticity. The pressing mechanism 45 located above the polishing head 44 has the function of moving the polishing head 44 up and down in the direction perpendicular to the surface of the substrate 42 (arrow Y2). The supply mechanism 46 is composed of a rotating body 46a for supplying the polishing tape 47, a rotating body 46b for winding the polishing tape 47, and the like.

Then, the rotating body 4 constituting the supply mechanism 46.
6a, the polishing tape 47 is continuously fed in a fixed direction (arrow Y3), and the roller-shaped portion 4 of the polishing head 44
It is guided along a part of the outer circumference of 4a. After that, the polishing tape 47 is wound around the rotating body 46b of the supply mechanism 6.
The polishing surface of the polishing tape 47 contacts the surface of the substrate 42 while being guided. Further, the entire head unit 43 is configured to move in the vertical direction (arrow Y4) by the action of the vertical mechanism 48.

Here, using the above-mentioned apparatus, the substrate 42
A polishing operation for flattening the surface or removing projections and foreign matters on the surface of the substrate 42 will be described. First, the substrate 42 is fixed on the stage 41. Next, the head unit 43 is lowered by the up-and-down mechanism 48 so that the polishing tape 47 guided by the polishing head 44 contacts the substrate 42.

At this time, the contact portion between the surface of the substrate 42 and the polishing tape 47 is as shown in FIG. Figure (b)
Then, the same code | symbol is attached | subjected to the part corresponding to FIG. After lowering the head unit 43, the pressurizing mechanism 4
5 pushes the polishing head 44 toward the substrate 42 so that the polishing tape 47 contacts the surface of the substrate 42. At this time,
The polishing head 44 is deformed by its elasticity, and the polishing tape 47 and the substrate 42 are in surface contact with each other. Then, in this state, the polishing tape 47 is run along the roller-shaped portion 44a of the polishing head 44. As a result, the surface of the substrate 42 is rubbed with the polishing tape 47 and polished. For example, if there is a protrusion or a foreign substance on the surface of the substrate 42, as shown in FIG.
7 travels along the surfaces of the projections and the foreign matter 49, and the projections and the foreign matter 49 are rubbed and removed by the surface of the polishing tape 47.

When the entire surface of the substrate 42 is polished, for example, the stage 41 is moved in the horizontal direction so that the entire surface of the substrate 42 contacts the polishing tape 47.

[0008]

In the conventional substrate surface polishing apparatus, the polishing tape 5 is run so that the polishing tape 47 and the surface of the substrate 42 are in surface contact with each other to polish the surface of the substrate 42. By the way, the polishing head 44 is usually a roller shape 44 in which an outer peripheral portion of a metal shaft is lined with an elastic material.
It is a. Therefore, the polishing head 44 is attached to the substrate 4
When pressed against the two surfaces, the roller-shaped portion 44a on the outer periphery of the polishing head 44 deforms so as to follow the surface of the substrate 42. Thereby, the polishing tape 47 guided by the polishing head 44
Is in surface contact with the surface of the substrate 42, and the polishing tape 47 is in contact with the surface of the substrate 42 at a predetermined pressure. As described above, the polishing head 44 has the roller-shaped portion 44 on the outer periphery thereof.
a has elasticity. Therefore, even if the surface of the substrate 42 has undulations in the width direction, for example, the roller-shaped portion 44a.
Deforms following the shape of the surface of the substrate 42, and the polishing tape 47
A good surface contact can be obtained between the substrate 42 surface and the substrate. However, although there is good surface contact between the polishing tape 47 and the surface of the substrate 42, the pressure at which the polishing tape 47 contacts the surface of the substrate 42 is not necessarily uniform.

The pressure with which the polishing tape contacts the substrate surface will be described with reference to FIG. Note that (a) is a side view and (b) is a front view. And (c) has shown the state which the polishing tape contacts a board | substrate surface. Reference numeral 51 denotes a support that constitutes a polishing head, and the support 51 supports the polishing head portion 52. The outer periphery of the polishing head portion 52 has a roller shape 52, and this portion is made of an elastic material. Further, 53 is a substrate, and 54 is a polishing tape guided along the roller shape 52. At this time,
The polishing tape 54 is applied with pressure P from above, and the substrate 5
It is pressed against three sides.

When the surface of the substrate 53 has undulations, for example, in its width direction as shown in FIG. 3B, the amount of deformation of the roller shape 52a differs between the ridges and the valleys of the undulations. Therefore, the contact pressure between the polishing tape 54 and the surface of the substrate 53 is different. For example, polishing tape 5
4, the pressure received by the peak portion of the substrate 53 surface is P1, the pressure received by the valley portion is P3, and the pressure received by the intermediate portion thereof is P2, P1 ≧ P2 ≧ P3. At this time, polishing tape 5
The area of contact between the surface 4 and the surface of the substrate 53 is also different between the peak portion and the valley portion. For example, the distance L in the running direction in which the polishing tape 54 contacts the surface of the substrate 53 is, as shown in FIG.
1, L3 is the valley part and L2 is the middle part, L1 ≧ L
2 ≧ L3. In this way, the polishing tape 54 is attached to the substrate 5
The distance that the polishing tape 54 contacts becomes longer as the portion that strongly contacts the three surfaces. Conversely, the weaker the contact portion, the shorter the contact distance of the polishing tape 54. As a result, if the surface of the substrate 53 has undulations, the polishing amount varies depending on the position.

The pressure with which the polishing tape contacts the substrate surface has a great influence on the polishing state of the substrate surface.
If the contact pressure is too strong, the surface of the substrate may be damaged. In addition, when the contact pressure is insufficient, the polishing performance is deteriorated or the insufficient polishing region is partially generated.

The present invention solves the above-mentioned drawbacks, and an object of the present invention is to provide a substrate surface polishing apparatus in which the pressure of the polishing tape in contact with the substrate surface is made uniform.

[0013]

According to the present invention, there is provided a stage on which a substrate is installed, a polishing tape which travels in a predetermined direction to polish the surface of the substrate, a supply mechanism for supplying the polishing tape, and a supply mechanism for supplying the polishing tape. In a substrate surface polishing apparatus including a polishing head that guides the supplied polishing tape so as to contact the substrate surface, the polishing head has a space that swells when a medium is supplied.

Further, a relief valve is provided in the passage of the medium supplied to the space.

Further, the space is constructed so as to surround the rotating shaft.

A passage for the medium to be supplied to the space is provided in the rotating shaft.

A pressure adjusting device for adjusting the supply pressure of the medium supplied to the space is provided.

[0018]

According to the above-mentioned structure, the polishing head portion is provided with a space which swells when the pressurized medium is supplied. Therefore, when the polishing tape guided along the outer periphery of the polishing head is brought into contact with the substrate surface, the space formed in the polishing head deforms following the shape of the substrate surface. Therefore, good surface contact between the polishing tape and the substrate surface can be obtained. Further, when the substrate surface has undulations in the width direction, for example, the change in the volume inside the space is not uniform in the undulation direction, and the pressure at which the polishing tape contacts the substrate surface varies depending on the location. However, such a pressure difference is canceled by the function of a relief valve or the like provided in the medium passage, and the contact pressure between the polishing tape and the substrate surface becomes uniform.

Further, the space is constructed so as to surround the rotating shaft. In this case, the space is distributed over the entire circumference of the shaft. Therefore, regardless of the rotational position of the shaft, a space is sandwiched between the shaft and the substrate surface, and good contact between the polishing tape and the substrate surface can be obtained.

A passage for the medium to be supplied to the space is provided inside the rotating shaft. In this case, even if the shaft rotates, the position of the shaft axis does not change, so that the passage of the medium can be easily formed.

Further, a pressure adjusting device for adjusting the supply pressure of the medium supplied to the space is provided. In this case, the contact pressure between the polishing tape and the substrate surface can be controlled by adjusting the supply pressure of the medium, and the polishing conditions for the substrate surface can be changed.

If the elastic material forming the space is made of a rubber sheet, the thickness of the sheet can be reduced and the followability to the substrate surface is improved.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Before describing the embodiments of the present invention, one example of a polishing head used in the present invention will be described with reference to FIG. 2A is a cross-sectional view of the polishing head, and FIG. 2B is a perspective view showing the outer shape.
The same reference numerals are given to the same portions, and duplicate description will be omitted.

Reference numeral 21 is a shaft for transmitting rotation, and both ends of the shaft 21 are supported by bearings 22a and 22b. A space 24 surrounded by a wall 23 made of an elastic material such as rubber is formed in the outer peripheral portion of the shaft 21 located between the bearings 22a and 22b. The shaft 21
A passage 25 is formed in the center of the. The pressurized medium is supplied to the passage 25 from the medium supply device 26. The shaft 21 is formed with a plurality of holes 26 a to 26 e along the passage 25, and the medium supplied to the passage 25 passes through the holes 26 a to 26 e into the space 2.
Will be sent within 4. By supplying this medium, the space 24 becomes a shape that bulges into a cylindrical shape along the shaft 21. In this case, the pressure of the surface of the space 24 bulging in a cylindrical shape is made as uniform as possible. For this reason, for example, a relief valve (not shown) is incorporated in the middle of the passage through which the medium is supplied, so that the pressure inside the space 24 becomes a stable and constant pressure. Incidentally, 27 is a polishing tape guided along the outer surface of the space 24 of the polishing head. 28 is a substrate to be polished.

According to the polishing head having the above-described structure, when the polishing head brings the polishing tape 27 into contact with the surface of the substrate 28, the surface of the wall 23 forming the space 24 is deformed following the shape of the surface of the substrate 28. To do. As a result, good contact between the polishing tape 27 and the surface of the substrate 28 can be obtained. If there is undulation on the surface of the substrate, the change of the surface of the wall 23 becomes uneven and the space 24
The internal volume changes, and the medium 3 between the shaft 21 and the wall 23
The pressure of 3 fluctuates. However, such a pressure fluctuation is canceled by a function such as a relief valve, and the pressure is restored to a predetermined pressure set in advance. Even if the amount of deformation of the space 24 is different between the ridges and valleys of the undulations, the internal pressure of the medium supplied into the space 24 is kept constant, and the polishing tape 27 and the surface of the substrate 28 come into contact with each other. The pressure is equalized at all contact points. As a result, the surface of the substrate can be stably polished regardless of the surface condition of the substrate. Further, the polishing state can be adjusted by controlling the pressure of the medium supplied into the space formed of the elastic material. Further, when the elastic material is made of a rubber sheet, the thickness of the sheet can be reduced and the followability to the substrate surface can be improved.

Next, an embodiment of the present invention using the polishing head having the above structure will be described with reference to FIG.
FIG. 1 shows an example of removing protrusions and foreign matter on the surface of a liquid crystal panel color filter substrate.

Reference numeral 11 is a base, and a rail 12 is provided on the base 11. A stage 13 is mounted on the rail 12 and is movable in the horizontal direction. Further, the substrate 14 is fixed on the surface of the stage 13. A head unit 15 for polishing the surface of the substrate 14 is arranged.

The head unit 15 is composed of a polishing head 16 and a supply mechanism 17 incorporated inside. Then, the polishing tape 18 is continuously sent out from the supply roller 17a of the supply mechanism 17, and the sent out polishing tape 18 is guided in the direction of the arrow Y along the roller portion on the outer periphery of the polishing head 16 to the take-up roller 17b. It is configured to be wound up. The polishing tape 18 has a width slightly larger than the width of the substrate 14 to be polished, and is arranged so that its polishing surface faces the substrate 14 side. A vertical movement mechanism 19 has a function of moving the head unit 15 up and down. In this case, as the polishing head 16, as shown in FIG.
The polishing head having the configuration described in 1. is used.

Here, the operation of removing the protrusions and foreign matters on the substrate surface by the above-mentioned substrate surface polishing apparatus will be described with reference to FIG.
Will be described with reference to. First, the substrate 31 for removing the protrusions and foreign matter is fixed on the stage 32 by the operator. Then, when a start command is given, the stage 32 starts moving in the direction of the arrow Y1 in FIG. 4A by the start command, and stops in a state where the polishing start position of the substrate 31 is located immediately below the polishing head 33. . Then, simultaneously with the stop, the polishing tape 35 is continuously sent out from the supply mechanism 34.
The direction in which the polishing tape 35 travels is indicated by arrow Y2.

After that, the up-and-down mechanism 36 starts to operate, the head unit 37 is moved down in the direction of arrow Y3 as shown in FIG. 3B, and the polishing tape 3 guided by the polishing head 33.
5 is brought into contact with the surface of the substrate 31. Then, when the polishing tape 35 and the surface of the substrate 31 come into contact with each other, the stage 32
Starts moving again in the direction of arrow Y1. This stage 32
By the movement of, the contact position between the polishing tape 35 and the surface of the substrate 31 changes. During this time, since there is a space formed of an elastic material in the outer peripheral portion of the polishing head 33, the shape of its surface is deformed following the shape of the surface of the substrate 31. Therefore, the polishing tape 35 and the substrate 31 are in good surface contact, and at the same time, the polishing tape 35 is in contact with the surface of the substrate 31 at a predetermined pressure.

When the polishing of the substrate 31 is completed, the head unit 37 is raised in the direction of the arrow Y4 as shown in FIG. 3C, and the feeding of the polishing tape 35 by the supply mechanism 34 is stopped. Then, the stage 32 is moved in the arrow Y5 direction and returned to the initial position. After that, the substrate 31 is taken out and the polishing operation is completed.

By the way, when polishing the surface of the substrate, if the surface of the substrate has, for example, undulations, the change in the shape of the outer surface of the polishing head becomes uneven, and the volume of the space inside the polishing head changes. As a result, the pressure of the medium between the shaft forming the polishing head and the wall forming the space fluctuates. However, such pressure fluctuation is restored to a preset pressure state by the function of the relief valve provided in the medium passage, and becomes a stable pressure state. Therefore, the contact state between the polishing tape and the substrate surface is less affected by the surface state of the substrate, and the substrate surface is satisfactorily polished.

[0033]

According to the present invention, it is possible to realize a substrate surface polishing apparatus which is less affected by the surface condition of the substrate and which can perform excellent polishing.

[Brief description of drawings]

FIG. 1 is a perspective view illustrating an embodiment of the present invention.

FIG. 2 is a diagram illustrating a polishing head used in the present invention.

FIG. 3 is a diagram for explaining the operation of the present invention.

FIG. 4 is a diagram illustrating a conventional example.

FIG. 5 is a diagram illustrating a conventional example.

[Explanation of symbols]

 11 ... Base 12 ... Rail 13 ... Stage 14 ... Substrate 15 ... Head unit 16 ... Polishing head 17 ... Supply mechanism 18 ... Polishing tape 19 ... Vertical mechanism

Claims (5)

[Claims] 1. A stage on which a substrate is installed, a polishing tape that travels in a predetermined direction to polish the surface of the substrate, a supply mechanism that supplies the polishing tape, and the polishing tape that is supplied from the supply mechanism. In a substrate surface polishing apparatus including a polishing head that guides the substrate surface so as to contact the substrate surface,
A substrate surface polishing apparatus, wherein the polishing head has a space that swells when a medium is supplied. 2. The substrate surface polishing apparatus according to claim 1, wherein a relief valve is provided in the passage of the medium supplied to the space. 3. The substrate surface polishing apparatus according to claim 1, wherein the space is configured so as to surround the rotating shaft. 4. The substrate surface polishing apparatus according to claim 1, wherein a passage for the medium to be supplied to the space is provided in the rotating shaft. 5. The substrate surface polishing apparatus according to claim 1, further comprising a pressure adjusting device for adjusting the supply pressure of the medium supplied to the space.