JPH08279659A - Three-dimensional board and manufacture thereof - Google Patents
Three-dimensional board and manufacture thereofInfo
- Publication number
- JPH08279659A JPH08279659A JP10812095A JP10812095A JPH08279659A JP H08279659 A JPH08279659 A JP H08279659A JP 10812095 A JP10812095 A JP 10812095A JP 10812095 A JP10812095 A JP 10812095A JP H08279659 A JPH08279659 A JP H08279659A
- Authority
- JP
- Japan
- Prior art keywords
- substrate body
- film
- thermoplastic film
- substrate
- circuit pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＩＣ、ＬＳＩ、ＬＥＤ
等を高密度に実装するための凹凸やそれらを接続するた
めの回路パターンが形成された立体基板及びその製造方
法に関するものである。BACKGROUND OF THE INVENTION The present invention relates to ICs, LSIs, LEDs.
TECHNICAL FIELD The present invention relates to a three-dimensional substrate on which unevenness for mounting high density and the like and a circuit pattern for connecting them are formed, and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】従来より使用されている立体基板は、図
１３に示すようなモールド成形によるものであった。こ
の立体基板は、プラスチックの成形品からなる基板体２
と、その表面に形成された回路パターン部４とから構成
されていた。例えば、この基板体２は、チップ型ＬＥＤ
等に用いられている基板と同様に、直方体をなし、その
上面には断面が逆向きの台形をなすような凹部２ａが形
成されている。このような立体形状を有する基板体２
は、金属メッキが可能な熱可塑性プラスチック材をイン
ジェクション成形することにより形成されていた。ま
た、回路パターン部４は、基板体２の表面に無電解メッ
キ又は電気メッキを施すことにより形成されていた。2. Description of the Related Art Conventionally used three-dimensional substrates have been molded by molding as shown in FIG. This three-dimensional substrate is a substrate body 2 made of a plastic molded product.
And the circuit pattern portion 4 formed on the surface thereof. For example, this substrate body 2 is a chip type LED.
Similar to the substrate used in the above, a rectangular parallelepiped is formed, and a concave portion 2a having a trapezoidal cross section is formed on the upper surface thereof. Substrate body 2 having such a three-dimensional shape
Was formed by injection molding a thermoplastic material capable of metal plating. Further, the circuit pattern portion 4 is formed by subjecting the surface of the substrate body 2 to electroless plating or electroplating.
【０００３】[0003]
【発明が解決しようとする課題】上記従来の立体基板の
回路パターン部４の形成には、エッチング工程等におい
て基板体２の表面に紫外線を照射する露光工程が必要で
あった。このため、回路パターン部４をほぼ直角な角部
や複雑な形状の面上に形成する場合に、十分露光させる
ことができないことがあり、歩留りが低下するという課
題があった。The formation of the circuit pattern portion 4 of the conventional three-dimensional substrate requires an exposure step of irradiating the surface of the substrate body 2 with ultraviolet rays in an etching step or the like. Therefore, when the circuit pattern portion 4 is formed on a corner having a substantially right angle or on a surface having a complicated shape, it may not be possible to perform sufficient exposure, and there is a problem that the yield is reduced.
【０００４】また、超精密な０．１ｍｍ〜０．２ｍｍ程
度のピッチ間隔でパターンを形成するファインパターン
を基板体２の形状に沿って形成することも極めて困難で
あった。Further, it has been extremely difficult to form a fine pattern, which forms an ultra-precision pattern at a pitch interval of about 0.1 mm to 0.2 mm, along the shape of the substrate body 2.
【０００５】本発明は上記課題に鑑みなされたもので、
その目的は、回路パターンをほぼ直角又は複雑な形状を
有する部分に形成することを可能にして、品質の優れ
た、より高精度で高密度な回路パターンを有する立体基
板を提供することにある。The present invention has been made in view of the above problems.
It is an object of the present invention to provide a three-dimensional substrate having a high-precision, high-density and high-density circuit pattern, which enables a circuit pattern to be formed in a portion having a substantially right angle or a complicated shape.
【０００６】[0006]
【課題を解決するための手段】本発明の立体基板は、所
定の立体形状に形成された基板体と、表面に回路パター
ンが形成され前記基板体の表面に沿って一体化されたフ
ィルムと、からなるものである。A three-dimensional substrate of the present invention comprises a substrate body formed in a predetermined three-dimensional shape, and a film having a circuit pattern formed on the surface and integrated along the surface of the substrate body. It consists of
【０００７】上記基板体とフィルムは、フィルムを熱変
形させた後それをインサート成形加工することにより基
板体を一体成形するか、又はフィルムを熱変形させた後
基板体に嵌合し熱カシメすることにより一体化するか、
又はフィルムを熱変形させた後基板体に嵌合し超音波融
着することにより一体化するか、又はフィルムと基板体
を金型内で塑性加工するか、又はフィルムを熱変形させ
た後基板体に接着することにより一体化している。The substrate body and the film are heat-deformed and then insert-molded to integrally form the substrate body, or the film is heat-deformed and then fitted to the substrate body and heat-crimped. By integrating,
Alternatively, the film is heat-deformed and then integrated with the substrate by fitting and ultrasonic fusion, or the film and the substrate are plastically processed in a mold, or the film is thermally deformed and then the substrate is formed. It is integrated by adhering to the body.
【０００８】[0008]
【作用】本発明における立体基板は、必要な立体形状に
形成された基板体と、予め回路パターンが形成されたフ
ィルムとから構成されている。このフィルムは熱可塑性
を有するものであり、回路パターンを形成した後基板体
の形状に合わせて変形される。このため、高精度かつ高
密度に回路パターンをフィルム上に形成することがで
き、更にそのフィルムを基板体に合わせて変形させるこ
とにより複雑な形状に沿って回路パターンを確実に形成
することができる。The three-dimensional substrate according to the present invention comprises a substrate body formed into a required three-dimensional shape and a film on which a circuit pattern is formed in advance. This film has thermoplasticity and is deformed according to the shape of the substrate after forming the circuit pattern. Therefore, the circuit pattern can be formed on the film with high accuracy and high density, and by further deforming the film according to the substrate body, the circuit pattern can be reliably formed along a complicated shape. .
【０００９】[0009]
【実施例】図１は本発明の一実施例に係る立体基板の斜
視図、図２はその断面図である。図中の６はプラスチッ
クからなる基板体であり、本実施例においては直方体を
なし、その上面６ａの中央には凹部６ｂが設けられてい
る。この凹部６ｂは、上面６ａ等と同様に水平な底面６
ｃとこの底面６ｃからほぼ垂直に立ち上がる内側面６ｄ
で囲まれて形成されている。FIG. 1 is a perspective view of a three-dimensional substrate according to one embodiment of the present invention, and FIG. 2 is a sectional view thereof. Reference numeral 6 in the drawing denotes a substrate body made of plastic, which is a rectangular parallelepiped in this embodiment, and a recess 6b is provided at the center of the upper surface 6a thereof. The recess 6b has a horizontal bottom surface 6 as well as the top surface 6a.
c and the inner side surface 6d that rises almost vertically from the bottom surface 6c
It is formed surrounded by.
【００１０】８は熱可塑性ポリイミドフィルムからなる
フィルムである。このフィルム８は、図３に示すよう
に、平坦な帯状をなすものであり、加熱しながら塑性変
形させることにより所望の形状に変形することができる
ものである。このフィルム８の表面には、超精密なファ
インパターンからなる回路パターン１０が変形前に形成
されている。Reference numeral 8 is a film made of a thermoplastic polyimide film. As shown in FIG. 3, the film 8 has a flat band shape and can be deformed into a desired shape by being plastically deformed while being heated. On the surface of this film 8, a circuit pattern 10 consisting of an ultra-precision fine pattern is formed before deformation.
【００１１】上記フィルム８は、図１及び図２に示すよ
うに、基板体６の表面の形状に合致するように変形され
て一体化されている。即ち、基板体６の上面６ａだけで
なく、凹部６ｂ内の内側面６ｄや底面６ｃ、更には外側
面６ｆや下面６ｅにまで回り込むようにフィルム８は熱
変形され、基板体８に密着するように一体化されてい
る。As shown in FIGS. 1 and 2, the film 8 is deformed and integrated so as to match the shape of the surface of the substrate body 6. That is, not only the upper surface 6a of the substrate 6 but also the inner surface 6d and the bottom surface 6c in the recess 6b, and further the outer surface 6f and the lower surface 6e, the film 8 is thermally deformed and adheres to the substrate 8. Is integrated into.
【００１２】上記のようにフィルム８と基板体６とを一
体化して立体基板を完成するには以下に示すような第１
乃至第５の製造方法がある。即ち、第１の製造方法にお
いては、はじめに、図３に示すような回路パターン１０
が形成されたフィルム８を加熱し塑性加工を施して図４
に示すような形状に熱変形させる。この形状は図１に示
す基板体６の外形に合致するものであり、インジェクシ
ョン成形機等を用いてフィルム８をインサート成形加工
することにより基板体６を成形する。この結果、フィル
ム８が表面に一体にインサートされた基板体６が成形さ
れ、立体基板が完成する。In order to complete the three-dimensional substrate by integrating the film 8 and the substrate body 6 as described above, the following first
To the fifth manufacturing method. That is, in the first manufacturing method, first, the circuit pattern 10 as shown in FIG.
4 is formed by heating the film 8 on which the film has been formed and performing plastic working.
It is thermally deformed into a shape as shown in. This shape conforms to the outer shape of the substrate body 6 shown in FIG. 1, and the substrate body 6 is molded by insert molding the film 8 using an injection molding machine or the like. As a result, the substrate body 6 in which the film 8 is integrally inserted on the surface is molded, and the three-dimensional substrate is completed.
【００１３】また、第２の製造方法においては、図５に
示すような複数の熱カシメ用穴１２を設けたフィルム８
とその熱カシメ用穴１２に適合する位置に熱カシメ用突
起１４を設けた基板体６を使用する。はじめに、図５に
示すフィルム８を前述した第１の製造方法と同様に図６
に示すように熱変形させて、基板体６の外形に合致する
形状に変形させる。次に、予めプラスチックにて成形さ
れた図７に示す基板体６に変形されたフィルム８を図８
に示すように嵌合させる。フィルム８は弾性を有するも
のであるため、図６中の下方端部８ａ、８ｂを広げるよ
うにして基板体６に被せることにより嵌合させることが
できる。このときに、図８に示すように、熱カシメ用穴
１２に熱カシメ用突起１４が嵌入し、熱カシメ用穴１２
から熱カシメ用突起１４の先端が突出する。ここで図９
に示すように、この熱カシメ用突起１４の先端を熱カシ
メしてつぶすことにより基板体６とフィルム８とを密着
させて一体化する。Further, in the second manufacturing method, the film 8 having a plurality of thermal caulking holes 12 as shown in FIG.
Also, the substrate body 6 having the heat-crimping projections 14 provided at positions matching the heat-crimping holes 12 is used. First, the film 8 shown in FIG.
As shown in (1), it is thermally deformed to be deformed into a shape that matches the outer shape of the substrate body 6. Next, the film 8 deformed to the substrate body 6 shown in FIG.
Fit as shown in. Since the film 8 has elasticity, it can be fitted by covering the substrate body 6 such that the lower end portions 8a and 8b in FIG. 6 are widened. At this time, as shown in FIG. 8, the thermal caulking holes 12 are fitted into the thermal caulking holes 12, and the thermal caulking holes 12 are inserted.
The tip of the thermal caulking projection 14 projects from the above. Figure 9
As shown in, the tip of the thermal crimping projection 14 is thermally crimped and crushed to bring the substrate body 6 and the film 8 into close contact with each other and integrate them.
【００１４】第３の製造方法においては、図３及び図４
に示す第１の製造方法におけるフィルム８と同様に、は
じめにフィルム８を熱変形させて基板体６の外形に合致
する形状に変形させる。次に、この変形させたフィルム
８を予めプラスチックにて成形した図１０に示す基板体
６に嵌合させる。このときに、第２の製造方法と同様に
フィルム８の下方端部を広げるようにして基板体６に被
せて嵌合させる。その後、図１１及び図１２に示すよう
に、複数個所を超音波融着することにより融着部１６を
形成し、フィルム８を基板体６に密着させて一体化す
る。In the third manufacturing method, FIGS.
Similarly to the film 8 in the first manufacturing method shown in FIG. 1, the film 8 is first thermally deformed to be deformed into a shape that matches the outer shape of the substrate body 6. Next, this deformed film 8 is fitted to the substrate body 6 shown in FIG. At this time, similarly to the second manufacturing method, the lower end portion of the film 8 is widened to cover and fit the substrate body 6. Then, as shown in FIGS. 11 and 12, a plurality of locations are ultrasonically fused to form a fused portion 16, and the film 8 is brought into close contact with the substrate 6 to be integrated.
【００１５】更に、第４の製造方法においては、図３に
示すような平坦な帯状のフィルム８をそのまま金型にセ
ットし、そこでフィルム８に塑性加工を施すと同時に金
型内にプラスチック材を射出することにより基板体６を
成形し、この基板体６の表面にフィルム８をインサート
成形して一体化する。Further, in the fourth manufacturing method, the flat strip-shaped film 8 as shown in FIG. 3 is set in the mold as it is, and the film 8 is subjected to plastic working and at the same time a plastic material is placed in the mold. The substrate body 6 is molded by injection, and the film 8 is insert-molded on the surface of the substrate body 6 to be integrated.
【００１６】この他、フィルム８と基板体６とを接着剤
等を用いて接着する第５の製造方法がある。この製造方
法においては、第３の製造方法等と同様に、はじめにフ
ィルム８を熱変形させて基板体６の外形に合致する形状
に変形させる。次に、フィルム８と基板体６の接着する
面の一方又は両方に接着剤、粘着性薄膜、接着層等を塗
布又は付着させることにより接着部を形成する。その
後、フィルム８を基板体６の表面に嵌合させて接着し、
一体化する。尚、接着部は、フィルム８と基板体６の接
着する面の全体に形成しても良いし、また、一部分に形
成しても良いものである。In addition to the above, there is a fifth manufacturing method in which the film 8 and the substrate 6 are bonded together by using an adhesive or the like. In this manufacturing method, similarly to the third manufacturing method and the like, first, the film 8 is thermally deformed to be deformed into a shape that matches the outer shape of the substrate body 6. Next, an adhesive, an adhesive thin film, an adhesive layer, or the like is applied or attached to one or both of the surfaces of the film 8 and the substrate 6 to be adhered to form an adhesive portion. After that, the film 8 is fitted onto the surface of the substrate body 6 and bonded,
Unify. The adhesive portion may be formed on the entire surface where the film 8 and the substrate body 6 are adhered to each other, or may be formed on a part thereof.
【００１７】尚、本実施例においては、帯状のフィルム
８を用いて基板体６の一部を被覆するように一体化して
いるが、基板体６の全表面を被覆するように構成しても
良い。また、２以上のフィルム８を用いてそれらを組み
合わせたり、重ね合わせるように一体化して、より複雑
な回路パターンを形成可能にしても良い。更に、基板体
６も複数の凹部や凹凸を有するものであっても良い。In this embodiment, the strip-shaped film 8 is used to cover a part of the substrate body 6, but the whole surface of the substrate body 6 may be covered. good. Further, two or more films 8 may be used to combine them, or they may be integrated so as to be overlapped with each other so that a more complicated circuit pattern can be formed. Further, the substrate body 6 may also have a plurality of recesses and irregularities.
【００１８】[0018]
【発明の効果】本発明によれば、基板体に回路パターン
を有するフィルムを一体化することにより、ほぼ直角に
折曲する部分や複雑な表面形状を有する基板体に、その
形状に沿って回路パターンを確実に形成することがで
き、品質の優れた、高精度で高密度な回路パターンを有
する立体基板を提供することができる。According to the present invention, by integrating a film having a circuit pattern on a substrate body, a circuit board can be formed along the shape of a substrate body having a bent portion at a substantially right angle and a complicated surface shape. It is possible to provide a three-dimensional substrate that can form a pattern reliably and has a high-precision, high-density circuit pattern that is excellent in quality.
【００１９】特に、熱変形させる前にフィルム上に回路
パターンを形成しているので、超精密なファインパター
ンからなる回路パターンや極めて複雑な回路パターンも
容易に形成することができる。In particular, since the circuit pattern is formed on the film before it is thermally deformed, it is possible to easily form an extremely precise circuit pattern or a very complicated circuit pattern.
【００２０】また、種々の回路パターンを有するフィル
ムと各種形状を有する基板体とを組み合わせることによ
り、各種機器に対応する立体基板をまとめて大量に製造
することができる。Further, by combining films having various circuit patterns and substrate bodies having various shapes, it is possible to collectively manufacture a large number of three-dimensional substrates corresponding to various devices.
【図１】本発明の一実施例に係る立体基板の斜視図であ
る。FIG. 1 is a perspective view of a three-dimensional substrate according to an embodiment of the present invention.
【図２】図１に示す立体基板の断面図である。FIG. 2 is a cross-sectional view of the three-dimensional substrate shown in FIG.
【図３】第１の製造方法における変形前のフィルムを示
す斜視図である。FIG. 3 is a perspective view showing a film before deformation in the first manufacturing method.
【図４】図３に示すフィルムの熱変形後の状態を示す斜
視図である。4 is a perspective view showing a state after thermal deformation of the film shown in FIG.
【図５】第２の製造方法における変形前のフィルムを示
す斜視図である。FIG. 5 is a perspective view showing a film before deformation in the second manufacturing method.
【図６】図５に示すフィルムの熱変形後の状態を示す斜
視図である。6 is a perspective view showing a state after thermal deformation of the film shown in FIG.
【図７】第２の製造方法における基板体を示す斜視図で
ある。FIG. 7 is a perspective view showing a substrate body in a second manufacturing method.
【図８】図６に示すフィルムを図７に示す基板体に嵌合
した状態を示す斜視図である。8 is a perspective view showing a state in which the film shown in FIG. 6 is fitted to the substrate body shown in FIG.
【図９】図８に示すフィルムを基板体に熱カシメにより
一体化した状態を示す断面図である。9 is a cross-sectional view showing a state in which the film shown in FIG. 8 is integrated with a substrate body by thermal crimping.
【図１０】第３の製造方法における基板体を示す斜視図
である。FIG. 10 is a perspective view showing a substrate body in a third manufacturing method.
【図１１】図１０に示す基板体に図４に示すフィルムと
同じ構成のフィルムを一体化した状態を示す斜視図であ
る。11 is a perspective view showing a state in which a film having the same structure as the film shown in FIG. 4 is integrated with the substrate body shown in FIG.
【図１２】図１１に示す立体基板の断面図である。12 is a cross-sectional view of the three-dimensional substrate shown in FIG.
【図１３】従来の立体基板を示す斜視図である。FIG. 13 is a perspective view showing a conventional three-dimensional substrate.
６ 基板体 ６ｂ 凹部 ８ フィルム １０ 回路パターン １２ 熱カシメ用穴 １４ 熱カシメ用突起 １６ 融着部 6 Substrate 6b Recessed portion 8 Film 10 Circuit pattern 12 Thermal caulking hole 14 Thermal caulking projection 16 Fusion part
Claims (6)
て一体化されたフィルムと、 からなることを特徴とする立体基板。1. A three-dimensional substrate comprising: a substrate body formed in a predetermined three-dimensional shape; and a film having a circuit pattern formed on the surface and integrated along the surface of the substrate body.
ルムを熱変形させて基板体に適合する形状に変形させる
工程と、 変形された熱可塑性フィルムをインサート成形加工する
ことにより前記基板体を一体成形する工程と、 からなることを特徴とする立体基板の製造方法。2. A step of thermally deforming a thermoplastic film on which a circuit pattern is formed so as to be deformed into a shape suitable for a substrate body, and the substrate body is integrally molded by insert molding the deformed thermoplastic film. A method of manufacturing a three-dimensional substrate, comprising:
する熱可塑性フィルムを熱変形させて前記熱可塑性フィ
ルムの熱カシメ用穴に対応する位置に複数の熱カシメ用
突起を有する基板体に適合する形状に変形させる工程
と、 前記基板体の表面に変形された前記熱可塑性フィルムを
嵌合する工程と、 前記熱可塑性フィルムの熱カシメ用穴から突出する熱カ
シメ用突起を熱カシメすることにより前記熱可塑性フィ
ルムを前記基板体に一体化する工程と、 からなることを特徴とする立体基板の製造方法。3. A circuit pattern and a thermoplastic film having a plurality of thermal caulking holes are heat-deformed to be suitable for a substrate body having a plurality of thermal caulking protrusions at positions corresponding to the thermal caulking holes of the thermoplastic film. A step of deforming the shape into a shape, a step of fitting the deformed thermoplastic film on the surface of the substrate body, and a thermal caulking projection for thermal caulking protruding from a thermal caulking hole of the thermoplastic film, And a step of integrating the thermoplastic film with the substrate body.
を熱変形させて基板体に適合する形状に変形させる工程
と、 前記熱可塑性フィルムを前記基板体の表面に嵌合する工
程と、 前記熱可塑性フィルムと前記基板体を超音波融着により
一体化する工程と、 からなることを特徴とする立体基板の製造方法。4. A step of thermally deforming a thermoplastic film having a circuit pattern to a shape suitable for a substrate body, a step of fitting the thermoplastic film on a surface of the substrate body, and the thermoplastic film. And a step of integrating the substrate body by ultrasonic fusion, and a method for manufacturing a three-dimensional substrate.
と基板体とを金型内で塑性加工することにより前記熱可
塑性フィルムを前記基板体の表面に沿って一体化するこ
とを特徴とする立体基板の製造方法。5. A three-dimensional substrate characterized in that the thermoplastic film having a circuit pattern and the substrate body are plastically processed in a mold to integrate the thermoplastic film along the surface of the substrate body. Production method.
を熱変形させて基板体に適合する形状に変形させる工程
と、 前記熱可塑性フィルム及び前記基板体の接着する面の一
方又は両方に接着部を形成する工程と、 前記熱可塑性フィルムを前記基板体の表面に嵌合させて
接着する工程と、 からなることを特徴とする立体基板の製造方法。6. A step of thermally deforming a thermoplastic film having a circuit pattern to be deformed into a shape suitable for a substrate body, and an adhesive portion is formed on one or both of the adhering surfaces of the thermoplastic film and the substrate body. And a step of fitting the thermoplastic film onto the surface of the substrate body and adhering the same to the surface of the substrate body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10812095A JP3695789B2 (en) | 1995-04-07 | 1995-04-07 | Three-dimensional substrate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10812095A JP3695789B2 (en) | 1995-04-07 | 1995-04-07 | Three-dimensional substrate and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08279659A true JPH08279659A (en) | 1996-10-22 |
| JP3695789B2 JP3695789B2 (en) | 2005-09-14 |
Family
ID=14476438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10812095A Expired - Fee Related JP3695789B2 (en) | 1995-04-07 | 1995-04-07 | Three-dimensional substrate and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3695789B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001023413A (en) * | 1999-07-02 | 2001-01-26 | Yazaki Corp | Rear combination lamp |
| JP2010232310A (en) * | 2009-03-26 | 2010-10-14 | Nof Corp | Resin box body with built-in electronic circuit |
| JP2016111366A (en) * | 2014-12-02 | 2016-06-20 | フレックストロニクス エーピー エルエルシー | Stretchable sheets with printed wiring to electrically connect uneven two-dimensional and three-dimensional surfaces |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104168711B (en) * | 2014-08-29 | 2018-03-27 | 广州美维电子有限公司 | The compression method of cavity circuit plate and its preparation method of pressing structure |
-
1995
- 1995-04-07 JP JP10812095A patent/JP3695789B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001023413A (en) * | 1999-07-02 | 2001-01-26 | Yazaki Corp | Rear combination lamp |
| JP2010232310A (en) * | 2009-03-26 | 2010-10-14 | Nof Corp | Resin box body with built-in electronic circuit |
| JP2016111366A (en) * | 2014-12-02 | 2016-06-20 | フレックストロニクス エーピー エルエルシー | Stretchable sheets with printed wiring to electrically connect uneven two-dimensional and three-dimensional surfaces |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3695789B2 (en) | 2005-09-14 |
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