JPH08275549A - Power supply - Google Patents

Abstract

PURPOSE: To reduce the overall size of a power supply by incorporating an inverter means in a power semiconductor module. CONSTITUTION: A space surrounded by a front panel 2, a rear panel 3 and left and right side covers 4, 5 is partitioned by an internal intermediate chassis 1 into upper and lower regions 64, 63. A cooling heat sink 12 is disposed in the lower region 63. A non-heat generating 62, and a heat generating device, i.e., a power semiconductor module 11, are disposed in the upper region 64. An power semiconductor module may be employed so long as a power semiconductor switching element constituting an inverter is included and it may includes an input side rectifier additionally. Since the power semiconductor switching element constituting an inverter is included in the power semiconductor module 11, the size of power supply can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power supply device, for example, an arc welding machine, a plasma arc welding machine, an arc cutting machine, a plasma arc cutting machine, a charger, a precious metal plating or the like.

[0002]

2. Description of the Related Art Conventionally, in the above-mentioned power supply device, for example, a power supply device for a plasma arc cutting machine, as shown in FIG.
A commercial AC power source is used as an input side rectifier 102 and a capacitor 103.
Is rectified and smoothed by and converted to DC power. This DC power source is, for example, a transistor, an IGBT or a MOS.
Power semiconductor switching elements 104, 10 such as FETs
High frequency switching is performed by an inverter 108 having 5, 106 and 107 to convert into a high frequency power source.
Further, this high-frequency power source is stepped down by the high-frequency transformer 110, converted into a direct current by the output side rectifier 116 composed of the rectifying diodes 112 and 114, and the output terminal 11
Output from 8 and 120. The power semiconductor switching elements 104 to 107 are driven by the drive unit 124 according to the control signal from the control unit 122. Control unit 12
2 detects the current flowing through the load by the current detector 126 and controls each of the power semiconductor switching elements 104 to 107 so that the current becomes equal to a predetermined reference value. Further, the output terminals 118 and 120 are connected to, for example, the torch and the base material, but since there is a gap between them, a high frequency generation unit is provided in order to generate an arc between the gaps at the start of cutting. 128 are provided. Since this power supply device does not require a large transformer or a large choke, the entire device can be downsized.

In such a power supply device, for example, Japanese Unexamined Patent Application Publication No. Hei 6
As disclosed in Japanese Laid-Open Patent Publication No. -178553, one power semiconductor switching element 104, 106 is built in a module, and the power semiconductor switching element 105,
In some cases, 107 is built in another module, and these modules are attached to one radiation fin.

[0004]

However, in the above power supply device, since the input side rectifier 102 and the output side rectifier 116 are required in addition to using a plurality of modules, the number of electric components used increases. Moreover, since the circuit is complicated, a heat-generating component, for example, a plurality of modules and a non-heat-generating component, for example, the control unit 132 may be provided in a mixed manner, and the control unit 132 may be provided by the heat generated by the power semiconductor switching element. May malfunction. Further, in addition to the plurality of modules, the heat radiating fins must be provided with the input side rectifier 102 and the output side rectifier 116, which are also heat generating components, insulated from each other, and the power supply device can be completely miniaturized. There wasn't.

[0005]

The first aspect of the present invention is to provide an input side rectifying means for converting an AC power supply into a DC power supply, and an inverter means including a plurality of semiconductor switching elements for converting the DC power supply into a high frequency power supply. An output side rectifying means for converting the high frequency power source into a DC power source and a driving means for driving the inverter means are provided, and at least the inverter means among the input side rectifying means, the inverter means and the output side rectifying means. Is built in the power semiconductor module.

A second aspect of the present invention is the same as the first aspect, wherein the input side rectifying means is also incorporated in the power semiconductor module. In addition, in the third invention, in the first or second invention, the output side rectifying means is also built in the power semiconductor module.

A fourth aspect of the present invention is the first, second or third aspect, wherein the first and second side plates are spaced apart from each other and arranged substantially parallel to each other, and the first and second side plates. End portions are respectively coupled to the side plates, partitioning the first and second side plates into two regions, a middle chassis having an opening communicating with the two regions, and closing the opening. Of the two heat-dissipating members, a heat-dissipating member provided on one side of the two regions, a heat-generating component provided on the surface of the heat-dissipating member located on the one-region side, and a non-heat-producing part on the other region side. And a power semiconductor module provided on the surface of the heat radiator facing the other area.

[0008]

According to the first invention, all of the plurality of semiconductor switching elements forming the inverter means are built in the power semiconductor module. According to the second invention, in addition to this, the input side rectifying means is also provided. According to the third invention, the inverter means, the input side rectifying means and the output side rectifying means are incorporated in the power semiconductor module, or the inverter means and the output side rectifying means are used for the power. It is built in the semiconductor module, and the drive unit and the control unit are not built in the power semiconductor module.

According to the fourth aspect of the invention, since such a power semiconductor module is attached to the surface of the heat radiator facing the other region, the heat generated by this semiconductor module passes through the heat radiator. The heat is radiated to one region side.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIGS. 1 and 7 to 10, a power supply device for a plasma arc cutting machine embodying the present invention includes a middle chassis 1, a first side plate, such as a front panel 2 and a second side plate. For example, it has a rear panel 3, a left side cover 4, and a right side cover 5.

As shown in FIG. 1, the middle chassis 1 is formed in a rectangular frame shape that is long in the front-rear direction, and has a rectangular opening 1a, which is described later, which is slightly smaller than a radiator, for example, a cooling heat sink 12. Have Behind the opening 1a (on the rear panel 3 side), there is provided a recess 1g into which an upper portion of a cooling fan 14 described later is fitted. In addition, the first end of the middle chassis 1, for example, the left and right corners of the front end face 1h, and the second end face, for example, the left and right corners of the rear end face 1i, are parallel to each other, and are forward and backward. Distracted portions 1j (see FIG. 5) that extend in the direction of the projections are provided in a protruding manner. Engagement protrusions 1k are provided in a protruding manner on the outer surface of the distal end portion of each of the extended portions 1j (in FIG. Three of parts 1j are shown). Then, as shown in FIG. 5, the front end face 1h and the rear end face 1 are arranged so that the extension portion 1j is easily bent inward.
A groove 1m is provided on i.

Insertion holes 2d are formed in the left and right edges of the front panel 2 at substantially the center in the vertical direction, and as shown in FIGS. 5 (a) and 5 (c), engaging projections 1k are formed. Engagement protrusion 1k in a state of being engaged with the insertion hole 2d
The engaging projections 1k and the insertion holes 2d are formed so that the front end edge, the rear end edge, the upper side edge, and the lower side edge of each contact with the corresponding inner side edges of the insertion hole 2d. The front edge, the rear edge, the upper edge, and the lower edge of the insertion hole 2d are the engaging edges 2e. The outer side surface 1n of the extension portion 1j is also in contact with the side edge of the insertion hole 2d. Similarly, the rear panel 3 also has the insertion hole 2
d is provided, and the remaining engaging projections 1k and the insertion holes 2d are also
Since it is formed similarly to that shown in FIGS. 5A and 5C, detailed description thereof is omitted.

With this configuration, when the pair of engaging projections 1k provided on the front end surface 1h of the middle chassis 1 are engaged with the pair of insertion holes 2d provided on the front panel 2, the middle chassis 1
And the front panel 2 are joined. Similarly, when the pair of engaging projections 1k provided on the rear end surface 1m of the middle chassis 1 are engaged with the pair of insertion holes 2d provided on the rear panel 3, the middle chassis 1 and the rear panel 3 are mutually attached. Be combined. Middle chassis 1 to front panel 2 or rear panel 3
When removing, the engaging protrusion 1k shown in FIG. 5A is pushed inward with a finger to insert the engaging protrusion 1k into the insertion hole 2
It can be removed from d (see FIGS. 5B and 5D). At this time, since the extension portion 1j is made of synthetic resin, the extension portion 1j is elastically deformed inward by the pressure of the finger.
It can be easily removed from d.

As shown in FIG. 1, the front panel 2 is provided with two output terminals 2f, 2f of this power supply unit at the lower part thereof, and one output section 2c as a gas outlet.
And are provided and attached to the three openings 2g, respectively. On the other hand, on the rear panel 3,
As shown in FIG. 1, an input portion 3c such as a gas inlet is provided in the lower portion, and an opening 3d for attaching the input portion 3c is provided. Except for these points, the front panel 2 and the rear panel 3 have the same shape.

That is, the front panel 2 and the rear panel 3
Both are rectangular plates that are vertically long, and for example, openings 2a and 3a for mounting an operation printed circuit board 21 to be described later, and a plurality of passages 2b and 2b for cooling air are provided in each upper part.

The left side cover 4 is, as shown in FIG.
The vertical cross-sectional shape is substantially U-shaped, and the right side cover 5 (see FIGS. 7 to 10) is bilaterally symmetrical to the left side cover 4. Therefore, when the left and right side covers 4 and 5 are joined by screws as shown in FIG. 8, the vertical cross section becomes a rectangular tubular shape. As shown in FIG. 1, a pair of ridges 4a, which are spaced apart from each other and are parallel to the cylinder direction, are provided on the inner side surfaces of the left and right side covers 4, 5, respectively, and as shown in FIG. The upper edge 1p and the lower edge 1q of the left side surface of the middle chassis 1 are sandwiched between the protrusions 4a of the side cover 4, and the right side upper edge 1p of the middle chassis 1 is interposed between the pair of protrusions 4a of the right side cover 5. And the lower edge 1q are sandwiched. Thereby, the middle chassis 1 is firmly supported so as not to move in the vertical direction. Further, as shown in FIG. 1, two recesses 4c are provided between the protrusions 4a of the left and right side covers 4 and 5 at intervals in the cylinder direction. The concave portions 4c are fitted with the positioning convex portions 1r provided on the left side surface and the right side surface of the middle chassis 1 to position the middle chassis 1 with respect to the side covers 4 and 5 of the middle chassis 1.

Further, as shown in FIG. 1, a supporting convex portion 4d is provided on each inner side surface of the rear portions of the left and right side covers 4 and 5 (only the supporting convex portion 4d of the left side cover is shown in FIG. 1). 6), the support protrusion 4d contacts the lower surface of the cooling fan 14 provided in the recess 1g provided in the middle chassis 1 and fitted therein, as shown in FIG.
Support so as not to come off from the concave portion 1g.

As shown in FIG. 1, the left and right side covers 4, 5 are provided with grips 4f formed on the upper and lower side covers 4, 5 in a combined state. A notch 4g is provided at the base end portion of the handle 4f, and a pair of hook portions 4h for hooking the annular portions 6a formed at both ends of the shoulder strap band 6 are provided. The power supply device can be carried around by hanging the band 6 on the shoulder. Then, four screw insertion holes 4i are formed in the upper and lower portions of the left and right side covers 4 and 5, respectively, for connecting the both.

Protruding edges 4j and 4k are provided inside the front and rear openings of the cylindrical portion formed by connecting the left and right side covers 4 and 5, respectively. These projecting edge portions 4j and 4k are fitted into the respective opening portions and engage with the outer peripheral edges of the front panel 2 and the rear panel 3 which close the respective opening portions, so that the front panel 2 or the rear panel 3 is detached to the outside. It is firmly locked so that it does not exist.

The space surrounded by the front panel 2, the rear panel 3, and the left and right side covers 4, 5 in this way is located in the upper region 64 by the middle chassis 1 inside.
And a lower region 63. The cooling heat sink 12 is provided in the lower region 63. The heat sink 12 is attached to the lower surface of the middle chassis 12 so as to close the opening 1a. Therefore, the upper surface of the heat sink 12 is exposed to the upper region 62 through the opening 1a. Further, in the lower region 63, heat generating components 61 such as the high frequency transformer 13, the high frequency unit 31, and the high frequency generating coupling coil 65 are provided.

The high frequency transformer 13 corresponds to, for example, the high frequency transformer 110 shown in FIG. The high frequency unit 31 corresponds to the high frequency unit 128 of FIG. 11, and the high frequency generating coupling coil 65 is
It is used together with the high frequency unit 128 to generate a high frequency.

The high frequency transformer 13 has a mounting portion 13 on the upper portion.
It has a and is fixed to the lower surface of the middle chassis 1 with screws. The high frequency unit 31 is attached to the lower surface of the heat sink 12, and the coupling coil 65 is attached to the high frequency transformer 13.

In the upper region 64, the non-heat generating component 62 and the power semiconductor module 11 which is a heat generating component are provided. The power semiconductor module 11 corresponds to the input side rectifier 102, the power semiconductor switching elements 104 to 107 constituting the inverter 108, and the output side rectifier 116 shown in FIG. 11, and cooperates with the semiconductor switching elements 104 to 107. A flywheel diode or the like is built in and attached to the upper surface of the cooling heat sink 12.

The power semiconductor module 11 may include at least a power semiconductor switching element forming an inverter, and the power rectifier and the power semiconductor switching element of the inverter may be connected to the power semiconductor switching element. The module 11 may include.
In this case, the output side rectifier may be attached to the lower surface of the heat sink 12, for example. Conversely, the power semiconductor switching module 11 may include the power semiconductor switching element of the inverter and the output side rectifier. Also in this case, the input side rectifier may be attached to the lower surface of the heat sink 12, for example.

The non-heat generating component 62 includes the control printed circuit board 16 having components corresponding to the control unit 122 and the drive unit 124 shown in FIG. Further, the main printed circuit board 15 to which at least the one corresponding to the smoothing capacitor 103 and the like is attached is also included. A control printed circuit board 16 is attached to the main printed circuit board 15. The main printed board 15 is fixed to a plurality of bosses 1c provided on the upper surface of the middle chassis 1 with screws.

Further, as shown in FIG. 1, on the upper surface of the power semiconductor module 11, there are four main terminals 11 forming one set.
Two sets of a extend upward in parallel to each other. These main terminals 11a are inserted into through holes 15b and 15b (only one of the through holes is shown in FIG. 1) provided in the main printed circuit board 15 corresponding to each set, and this inserted state is obtained. so,
Although not shown, each tip portion is coupled to the terminal fixing means 15a provided on the main printed board 15. These terminal fixing means 15a are connected to the smoothing capacitors of the main printed board 15.

Further, as shown in FIG. 1, from the upper surface of the power semiconductor module 11, eight control terminals extend upward in parallel with each other, and these control terminals are printed with a control cable via a flat cable 82. It is electrically connected to the substrate 16.

The control printed circuit board 16 is connected to the control printed circuit board 21 via a flexible electric wire 66. An indicator lamp, an output adjuster, and the like are provided on the operation printed circuit board 21, and they are coupled with the operation cover 22 by screws so as to cover the opening 2a of the front panel 2.

A power input fixing insulating plate 23 is fixed by screws so as to cover the opening 3a of the rear panel 3. Power supply input components such as a power supply cable 67 and a power supply switch 68 are attached to the power supply input fixing insulating plate 23. One end of a gas electromagnetic valve 24 that opens and closes a flow path of an operating gas used for a plasma arc is connected to an input portion 3c such as a gas inlet. The other end of the valve 24 is connected to the output section 2c of the front panel 2 via a joint, a pipe and the like.

In the power supply device configured as described above, the area occupied by the input side rectifier, the power semiconductor switching element forming the inverter, the output side rectifier, etc. is built in the power semiconductor module 11. The size of the power supply device can be reduced, and the size of the power supply device can be reduced.

Further, as shown in FIG. 2, the front panel 2, the rear panel 3, and the middle chassis 1 have an H-shaped structure, so that the power supply device receives a force such as compression, tension, and bending from any direction. On the other hand, it is hard to deform and has a strong structure.

Since the heat generating component 61 and the non-heat generating component 62 are partitioned by the middle chassis 1 and the cooling heat sink 12, the heat generated by the heat generating components such as the high frequency unit 31 and the high frequency transformer 13 is generated by the control printed circuit board 16. Is less likely to be transmitted to the non-heating component 62 such as
2 can be prevented from malfunctioning due to heat. Further, since the cooling heat sink 12 that radiates the heat generated by the heat-generating component 61 can be provided in the middle chassis 1, the weight of the cooling heat sink 12 causes the main printed circuit board 15 to move.
Etc. will not be damaged.

As shown in FIG. 1, a heat generating component 61 such as the high frequency unit 13 can be arranged on the lower surface side of the middle chassis 1, and a non-heat generating component such as the main printed circuit board 15 and the control printed circuit board 16 can be provided. Since 62 is arranged on the upper surface side of the middle chassis 1, it is possible to easily check, maintain and inspect all circuits and parts by removing one or both of the left and right side covers 4, 5.
Since the heat generating parts 61 and the like are provided by utilizing the upper and lower surfaces of the middle chassis 1, the intervals between the parts can be widened, and the parts can be easily assembled and fixed with screws.

Then, the lower region 6 provided with the heat generating component 61
3 and the upper region 64 on which the non-heat generating component 62 is provided are partitioned by the cooling heat sink 12 and the middle chassis 1, so that the heat generated by the heat generating component 61 other than the power semiconductor module 11 does not generate heat. It can be prevented from reaching the upper region 64 provided with the component 62. The heat generated by the heat-generating components 61 such as the power semiconductor module 11 and the high frequency transformer 13 is absorbed by the cooling heat sink 12 and radiated to the lower region 63. The heat emitted from the cooling heat sink 12 and the power semiconductor module 1
The heat directly emitted from the heat-generating components other than 1 is cooled by the cooling fan 14. That is, when the cooling fan 14 is driven, external cold air flows in from the passage 2b of the front panel 2, takes away the heat generated by the heat-generating component 61, and flows out of the passage 2b of the rear panel 3 to the outside. As a result, malfunction of the non-heat generating component 62 due to heat can be prevented.

Power semiconductor module 1 which is a heat generating component
1 is provided in the upper region 64 provided with the non-heat generating component 62, but the power semiconductor module 11 is provided in contact with the cooling heat sink 12. Therefore, the heat of the power semiconductor module 11 can be radiated to the lower region 63 by the cooling heat sink 12, and the heat generated by the power semiconductor module 11 is hardly radiated to the upper region 64. The non-heat generating component 62 does not malfunction.

Further, in the upper region 64, the power semiconductor module 11 and the main printed circuit board 15 and the control printed circuit board 16 which are non-heat generating parts are arranged close to each other, so that they are electrically connected. The length of the main terminal 11a, the control terminal, and the flat cable 82 can be reduced. As a result, the wiring inductance can be reduced and the generation of noise can be reduced, so that the snubber circuit attached to the power semiconductor module 11 can be reduced.

Main terminal 11 of power semiconductor module 11
In order to electrically connect a and the terminal fixing means 15a of the main printed board 15, the main terminal 11a is inserted into the through hole 15b provided in the main printed board 15. Therefore, the main terminal 11a is connected to the main printed board. There is no need to make a detour to the outer edge of 15, and the main terminal 11a can be shortened as much as the detour is unnecessary,
The parasitic inductance and the snubber circuit can be made extremely small.

Further, the insertion holes 2d provided in the front panel 2 and the rear panel 3 and the engaging projections 1k of the middle chassis 1 are provided.
Since the front panel 2, the middle chassis 1 and the rear panel 3 are connected by engaging with each other, the engaging convex portion 1k can be easily removed from the insertion hole 2d. That is, the panels 2 and 3 and the middle chassis 1 can be easily assembled and disassembled without using a tool or the like.

Furthermore, the ridges 4 of the left and right side covers 4, 5
Since the upper edges 1p, 1q of the middle chassis 1 are sandwiched between a and 4a and supported, the left and right covers 4, 5 and the middle chassis 1 can be easily assembled and disassembled without using a tool or the like. it can. The middle chassis 1 can be reliably fixed to the left and right side covers 4 and 5 by the protrusions 4a.

The middle chassis 1 is firmly supported by the ridges 4a, 4a, and the grips 4 are provided on the left and right side covers 4, 5.
Since the f is provided, when the handle 4f is gripped and the cutting machine is lifted, most of the weight of the cutting machine is applied to the ridges 4a and 4a, and the extension portion 1j is not so heavy. Therefore, the extension 1j can be prevented from being damaged. Similarly, even when the shoulder strap band 6 is hung on the shoulder and is hung down, similarly, the extension portion 1j does not bear much weight.

Heat of the heat generating component 61, heat sink 1 for cooling
Since the emitted heat of 2 can be released to the outside by the cooling fan 14, it is possible to prevent overheating of the heat generating component 61, and by extension, the non-heat generating component 62. By engaging the cooling fan 14 with the concave portion 1g and the supporting convex portion 4d, the cooling fan 1
Since 4 is fixed, the cooling fan 14 can be attached to the middle chassis 1 very easily without using a tool or the like, and can also be removed very easily.

Although the above embodiments have been applied to the power supply device of the plasma arc cutting machine, the present invention can be applied to a plasma arc welding machine, an arc welding machine, a charger, or a power supply device for precious metal plating.

Further, in the above embodiment, the heat generating component 61 is provided on the lower surface side of the middle chassis 1 and the non-heat generating component 62 is provided on the upper surface side thereof as shown in FIG. 2, but as shown in FIG. The heat generating component 61 and components related thereto such as the cooling fan 14 are provided on the upper surface side of the chassis 1, and the non-heat generating component 62 on the lower surface side.
It is also possible to adopt a configuration provided with.

In the above-described embodiment, as shown in FIG. 1, the middle chassis 1 is provided in parallel with the horizontal direction with the power supply device standing up. However, the configuration is such that the middle chassis 1 is provided in parallel with the vertical direction. can do.

[0045]

According to the invention described in claim 1, since at least all the power semiconductor switching elements are mounted on the power semiconductor module, the space occupied by these power semiconductor switching elements can be reduced. Therefore, the power supply device can be downsized.

According to the second or third aspect of the present invention, in addition to the power semiconductor switching element, the input side rectifying means and the output side rectifying means can be incorporated in the power semiconductor module, so that space is increasingly used. Can be made smaller.

According to the fourth aspect of the present invention, a heat-generating component such as a power semiconductor module is provided on the surface of the heat-dissipating member, the heat of the heat-dissipating component is rescued by the heat-dissipating member, and the non-heat-generating member is not provided. Since it is released to the area, it is possible to prevent the non-heat generating component from malfunctioning. Further, since the heat-generating component and the non-heat-generating component are partitioned by the middle chassis, the heat of the heat-generating component is hard to be transmitted to the non-heat-generating component, and the non-heat-generating component can be prevented from malfunctioning due to the heat. Furthermore, a power semiconductor module that generates heat is provided in the same region as the non-heat generating component, but since this power semiconductor module is attached to the radiator on the region side where the non-heat generating component is provided, It is possible to prevent the non-heat generating components from malfunctioning due to the heat generated by the power semiconductor module. Furthermore, since the first side plate, the second side plate, and the middle chassis form an H-shaped structure, compression and pulling from any direction,
Hard to be deformed by bending force.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a mounted state of a power supply device according to an embodiment of the present invention.

FIG. 2 is a side view showing an H-shaped structure formed by the front panel, the middle chassis and the rear panel of the embodiment.

FIG. 3 is a side view showing a modified example of the same embodiment.

FIG. 4 is a partially omitted front view of the same embodiment.

FIG. 5A is a cross-sectional view showing an engagement state between the engagement protrusion of the embodiment and the engagement edge of the insertion hole, and FIG. 5B is a relation between the engagement protrusion and the insertion hole of the embodiment. A sectional view showing a non-engagement state with a mating edge,
(C) is a plan view showing the engagement state of the engagement protrusion of the embodiment and the engagement edge of the insertion hole, and (d) shows the engagement protrusion of the embodiment and the engagement edge of the insertion hole. It is a top view which shows a non-engagement state.

FIG. 6 is a side view showing a coupled state of the middle chassis and the cooling fan in the embodiment.

FIG. 7 is a right side view of the embodiment.

FIG. 8 is a front view of the embodiment.

FIG. 9 is a rear view of the embodiment.

FIG. 10 is a plan view of the embodiment.

FIG. 11 is a block diagram of a conventional power supply device.

[Explanation of symbols]

 1 Middle Chassis 2 Front Panel (1st Side Plate) 3 Rear Panel (2nd Side Plate) 4 Left Side Cover 5 Right Side Cover 11 Power Semiconductor Module 12 Cooling Heat Sink (Radiator) 14 Cooling Fan 61 Heating Component 62 Non Heating component 63 Lower area 64 Upper area

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kenzo Dangami 2-14-3 Awaji, Higashiyodogawa-ku, Osaka City, Osaka Prefecture Sansha Electric Manufacturing Co., Ltd. (72) Inventor Seiji Tanaka 2 Awaji, Higashiyodogawa-ku, Osaka 14th-3rd Sansan Electric Co., Ltd.

Claims (4)

[Claims] 1. An input side rectifying means for converting an AC power supply into a DC power supply, an inverter means including a plurality of semiconductor switching elements for converting the DC power supply into a high frequency power supply, and an output side for converting the high frequency power supply into a DC power supply. A rectifying means and a driving means for driving the inverter means are provided, and at least the inverter means among the input side rectifying means, the inverter means, and the output side rectifying means is built in the power semiconductor module. Power supply. 2. The power supply device according to claim 1, wherein the input side rectifying means is also incorporated in the power semiconductor module. 3. The power supply device according to claim 1 or 2, wherein the output side rectifying means is also incorporated in the power semiconductor module. 4. The power supply device according to claim 1, 2 or 3, wherein first and second side plates are arranged at a distance from each other and are substantially parallel to each other, and the first and second side plates are respectively provided. The ends are joined,
A middle chassis that partitions the first and second side plates into two regions and has an opening communicating with the two regions;
A radiator provided to close the opening and release heat to one of the two regions; a heat-generating component provided on a surface of the radiator located on the one region side; A power supply device comprising: a non-heat-generating component provided on the other region side; and the power semiconductor module provided on the surface of the heat radiator facing the other region.