JPH08268632A - Automatic taping machine - Google Patents

Abstract

PURPOSE: To simply and certainly adhere an adhesive tape sent out from a table supporting shaft to a substrate by sticking and securing a substrate fast to the table surface by means of suction, and press down and revolving a revolving arm around the circumference of the table. CONSTITUTION: A print wiring plate la, which is placed in the center of a table 2, is drawn in by suction through a suction hole on the table 2 and secured to the table 2 by lowering a press-down cylinder 9. The end portion of the adhesive tape 3, which is sandwiched by a sandwich claw 6, is press down on the edge of the print wiring plate 1a. A revolving arm 5 is then revolved around the circumference of the table 2 by a motor 11 through a circular gear 10. The adhesive tape 3 is then sent out from the tape supporting shaft and its constant tension force is retained by a constant tension force device 12. The edge of the adhesive tape 3 is pressed down by sliding back and forth the cylinder 13 of a press-down device 7, which presses down the edge to which the adhesive tape is adhered, and the print wiring plate 1a is sandwiched by a press-down roller 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic tape applying machine for applying an adhesive tape 3 to an end surface of a substrate mounted on a table.

[0002]

2. Description of the Related Art A printed wiring board used for electronic equipment and electric equipment as an example of a board is provided with circuit patterns for forming mounting portions for mounting electronic components and electric components, connection terminals, etc. Via holes are formed to connect the circuit patterns on the front and back to the inner layer circuit pattern.

The printed wiring board on which the circuit pattern is formed is further plated with gold to improve the connection reliability of the mounting portion and the connection terminal.

As described above, the portion to be plated with gold is the mounting portion for the electronic parts and the like formed by the circuit pattern, the connection terminal, the via hole, etc., and the other portions need not be plated with gold. A plating resist was coated to protect the circuit pattern so that gold plating would not be applied. In particular, it is necessary to protect the end surface of the printed wiring board from being short-circuited by gold plating when the gold plating is applied to the circuit pattern formed in each layer.

However, since it is difficult to apply the plating resist to the end surface of the printed wiring board, it is necessary to mask the end surface of the printed wiring board with an adhesive tape or a sheet so as not to be gold-plated. For example, an adhesive tape wider than the thickness of the printed wiring board is attached to the end surface of the printed wiring board to prevent contact between the plating solution and the circuit pattern formed on the printed wiring board and gold plating is applied to the end surface. Was being prevented.

This adhesive tape is adhered to each side of the end surface of the printed wiring board, the adhered adhesive tape is folded back along the upper and lower surfaces of the substrate, and pressed onto the end surface of the adhesive tape to make a close contact. I was letting it.

FIG. 4 is a top view of a conventional tape applicator, and FIG. 5 is a side view of a main part of the tape applicator viewed from A shown in FIG.

As shown in FIGS. 4 and 5, the tape applying machine for applying the adhesive tape includes an adsorption head 20 for adsorbing the printed wiring board 1a, a pedestal 21 for mounting the printed wiring board 1a, and an adhesive tape. The holding claw 6 that holds the end portion of 3 and moves along the end face, the tape support shaft 4 that sends the adhesive tape 3, the pressing device 7 that presses the sent adhesive tape 3, and the sent adhesive tape 3. Cutter 16 to cut
It consists of.

A method of applying an adhesive tape to a printed wiring board using the tape applying machine having the above structure will be described.

First, the printed wiring board 1a is mounted on the pedestal 21. The end portion of the adhesive tape 3 mounted on the tape support shaft 4 is held by the holding claw 6. And the printed wiring board 1
The sandwiching claw 6 is moved along the end face of a, and the adhesive tape 3 delivered is arranged along the end face. Then, the pressure-sensitive adhesive tape 3 arranged along the end face is pushed forward by the pressing device 7 to be stuck to the end face. Then, the adhesive tape 3 is cut by the cutter 16. Further, the holding claw 6 releases the adhesive tape 3, returns to the original position by moving, and holds the end portion of the adhesive tape 3 mounted on the tape support shaft 4.

In this way, the printed wiring board 1a
Stick the adhesive tape 3 on the side. Then, the suction head 20 sucks the printed wiring board 1a, and the suction head 20 is swung to swivel the printed wiring board 1a 90 °, and the adhesive tape 3 is sequentially attached to the other three sides in the same manner as above. I wore it.

In this way, since a series of operations is performed on each printed wiring board for each side, the clamping operation of the adhesive tape by the clamping claws and the adhesive tape by the cutter are performed on one printed wiring board. Since each of the cutting operations was performed four times, work efficiency was poor, and cutting errors and pinching errors often occurred, resulting in work problems and sticking failures.

[0013]

The automatic tape applicator according to the present invention has been made in view of the above circumstances, and its purpose is to adhere an adhesive tape to an end surface of a substrate and efficiently adhere the adhesive tape. It is an object of the present invention to provide an automatic tape applying machine that can perform.

[0014]

An automatic tape applying machine according to the present invention includes a table 2 on which a substrate 1 is mounted, and a tape support shaft 4 on which a roll-shaped adhesive tape 3 is mounted.
A swivel arm 5 having the tape support shaft 4 for swiveling around the table 2, a sandwiching claw 6 for sandwiching the adhesive tape 3 fed from the tape support shaft 4, and a table slidable forward and backward. It is characterized by comprising a pressing device 7 for pressing the end surface of the substrate 1 mounted on the substrate 2.

Further, the table 2 has a suction hole 8 on the surface thereof to suck the substrate 1.

The substrate 1 mounted on the table 2
Is provided with a pressing cylinder 9 for pressing from above.

[0017]

According to the automatic tape applicator according to the present invention, the end of the adhesive tape fed from the tape support shaft is held by the holding claws 6, and the periphery of the substrate mounted on the table having a flat surface is used as the turning arm. Since the attached tape support shaft is rotated, the adhesive tape mounted on the tape support shaft can be attached to the end surface of the substrate while being fed out.

Further, since the adhesive tape is attached while sandwiching the substrate with the pair of upper and lower pressing rolls provided in the pressing device, the adhesive tape can be pressed from the end surface of the substrate to the front and back surfaces.

Further, since the substrate is mounted on the table having the suction holes, and the substrate is sucked and sucked through the suction holes by using the suction device, the substrate can be surface-mounted and sucked on the table.

Further, since the automatic tape applicator of the present invention presses the substrate mounted on the table by the pressing cylinder from above, the substrate mounted on the table can be brought into close contact with the surface of the table.

An embodiment will be described in detail below with reference to the accompanying drawings.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a top view of an automatic tape applying machine according to an embodiment of the present invention, and FIG. 2 is a side view of the automatic tape applying machine viewed from A in FIG. Further, FIG. 3 is an enlarged sectional view of a main part of FIG.

As shown in the figure, an automatic tape applying machine according to an embodiment of the present invention is configured such that a table 2 on which a substrate 1 is mounted and an adhesive tape 3 wound in a roll are sent out to center the table 2. A tape support shaft 4 that rotates, a holding claw 6 that holds the unwinding end of the adhesive tape 3 fed from the tape support shaft 4, and a pressing device that slides back and forth corresponding to the respective end surfaces of the substrate 1. It is composed of 7.

The table 2 of this automatic tape applicator is not particularly limited, but it is preferable that the table 2 has a smooth surface and high adhesion to the substrate 1 to be mounted. In this embodiment,
A metal surface plate having a size of 475 × 211 mm was used, and a surface of which was coated with a resin was used. This coating is applied to cover the upper surface of the table 2 so that the substrate 1 to be mounted is not scratched.
The adhesion between the mounted substrate 1 and the upper surface of the table 2 can be improved.

A plurality of suction holes 8 are formed on the surface of the table 2. This suction hole 8 is connected to a suction device, and by operating this suction device, suction can be performed to suck the substrate 1 mounted on the table 2.

The adhesive tape 3 is preferably made of a material having high adhesiveness with the substrate 1 and resistance to the plating solution.

The tape support shaft 4 on which the adhesive tape 3 is mounted can rotate and deliver the adhesive tape 3 wound in a roll. Further, the tape support shaft 4 is installed on a revolving arm 5 attached to a circular gear 10 provided on the lower portion of the table 2 so that the motor 11 is driven by the circular gear 1.
By transmitting to 0, it is possible to turn around the table 2.

Further, the tape support shaft 4 is provided with a constant tension device 12 so that the tension of the adhesive tape 3 delivered does not change.

The holding claw 6 holds the end of the adhesive tape 3 fed from the tape support shaft 4 and presses it against the end face of the printed wiring board to prevent the adhesive tape 3 from peeling off from the end face. I'm out.

Further, four pressing devices 7 are installed on four sides of the table 2 so as to face the four sides of the substrate 1. The pressing device 7 includes a cylinder 13 that slides back and forth,
A pressing roll 14 is attached to the tip of the cylinder 13. The pressing rolls 14 are arranged in a pair in a vertical direction so as to press the end surface of the substrate 1 and sandwich the substrate 1. The length of each roll is one side of the substrate 1 mounted on the table 2. It is longer than the length and the end face can be easily pressed.

The pressing roll 14 is preferably lined with resin or rubber, and preferably has elasticity. Even if unevenness exists on the end surface of the substrate 1 due to this elasticity, the shape of the resin changes in accordance with the unevenness, and the adhesive tape 3 can be adhered and stuck to the end surface of the substrate 1.

A pressing cylinder 9 is provided above the table 2.
It is possible to fix the substrate 1 on the table 2 by pressing the substrate 1 mounted on the table 2 against the table 2. Further, the pressing cylinder 9 has a suction pad 15 and can suck and convey the substrate 1. Furthermore, when the substrate 1 is pressed by the suction pad 15, the substrate 1 is prevented from being scratched or uneven.

Further, a cutter 16 for cutting the adhesive tape 3 attached to the substrate 1 is provided. Next, the operation of the above-described automatic tape applying machine will be described by using an example of applying an adhesive tape to the end surface of the printed wiring board.

The printed wiring board 1a used in this embodiment has a size of 510 × 255 mm, and the adhesive tape 3 has a width of 25.
mm. The pressing roll 14 attached to the pressing device 7 has a diameter of 36 mm and a length of 560 mm and 30 mm.
The surface is 0 mm and its surface is coated with urethane.

First, the printed wiring board 1a is mounted in the center of the table 2. Since the printed wiring board 1 a mounted on the table 2 has a larger size than the table 2, the end surface thereof protrudes from the table 2. Then, the printed wiring board 1a is sucked through the suction holes 8 of the table 2, and the pressing cylinder 9 located above is lowered to fix the printed wiring board 1a to the table 2.

Next, the adhesive tape 3 sandwiched by the sandwiching claws 6
Is pressed against the end surface of the printed wiring board 1a. Then, the circular gear 10 is moved by the drive of the motor 11, and the turning arm 5 turns around the table 2.

When the revolving arm 5 revolves, the adhesive tape 3 is delivered from the tape support shaft 4. The tension of the pressure-sensitive adhesive tape 3 that is fed from the clamping claw 6 as a starting point varies depending on the amount of feeding, but the tension is kept constant by the constant tension device 12, and the amount of the pressure-sensitive adhesive tape 3 that is fed from the tape support shaft 4 is reduced. Adjusted.

The adhesive tape 3 delivered from the tape support shaft 4 is adhered to the first end face after the turning arm 5 has passed the first corner of the printed wiring board 1a. Further, the revolving arm 5 continues to revolve, but at this time, the cylinder 13 of the first pressing device 7 that presses the end surface to which the adhesive tape 3 is adhered slides back and forth to press the end surface and the pressing roll 14 The printed wiring board 1a is sandwiched by.

As shown in FIG. 3, by this operation, the pressure-sensitive adhesive tape 3 is bent by the pressing roll 14 at the end surface of the printed wiring board 1a, and is further pressed and adhered to the front and back surfaces. When the adhesive tape 3 is attached, the sandwiching claw 6 releases the end of the sandwiched adhesive tape 3.

Next, the adhesive tape 3 is sent out starting from the first corner of the printed wiring board 1a, and when the turning arm 5 passes the second corner of the printed wiring board 1a, the adhesive tape 3 is applied to the second end face. Are glued together. Then, the cylinder 13 of the second pressing device 7 slides to press the end face, and the press roll 14 holds the printed wiring board 1a and the adhesive tape 3 is attached.

Thereafter, the adhesive tape 3 is sequentially attached to the third and fourth end faces. When the adhesive tape 3 is attached to the fourth end face, the swivel arm 5 stops swiveling. When the revolving arm 5 is stopped, the feeding of the adhesive tape 3 fed from the tape support shaft 4 is also stopped.

The adhesive tape 3 connected to the tape support shaft 4 from the fourth end face is kept in tension by the tension maintained by the constant tension device 12. In this state, the adhesive tape 3 is held by the holding claws 6, and the fourth end surface and the holding claws 6 are held.
A cutter 16 is used to cut the gap between and.

In this way, by swiveling the swivel arm 5 once around the table 2, the adhesive tapes 3 can be attached to the four end faces of the printed wiring board 1a. Then, since the pressure-sensitive adhesive tape 3 is pressed by the pressing device 7 and sandwiched by the respective end faces, the pressure-sensitive adhesive tape 3 can be adhered.

[0044]

According to the automatic tape applying machine of the present invention, a table on which a substrate is mounted, a swivel arm having a tape support shaft for mounting an adhesive tape, and swiveling around the table,
It is composed of a sandwiching claw that sandwiches the adhesive tape fed from this tape support shaft and a pressing device that slides back and forth to press the end surface of the substrate mounted on the table. The adhesive tape can be attached to the substrate by swiveling arms swiveling around the table.

Further, as compared with the conventional case, since the adhesive tape can be attached around the substrate by turning once, the production efficiency can be greatly improved.

Since the substrate is fixed to the table by suction and pressing, the substrate can be brought into close contact with the table even if the substrate is warped.

[Brief description of drawings]

FIG. 1 is a top view of an automatic tape applying machine according to an embodiment of the present invention.

FIG. 2 is a side view of the automatic tape applying machine shown in FIG.

FIG. 3 is an enlarged cross-sectional view of a main part of FIG.

FIG. 4 is a top view of a conventional tape applying machine.

5 is a side view of the tape applying machine shown in FIG. 4. FIG.

[Explanation of symbols]

 1 Substrate 2 Table 3 Adhesive Tape 4 Tape Support Shaft 5 Swivel Arm 6 Clamping Claw 7 Pressing Device 8 Suction Hole 9 Pressing Cylinder

Claims (3)

[Claims] 1. A table (2) on which a substrate (1) is mounted.
And a tape support shaft (4) on which the adhesive tape (3) wound into a roll is mounted, and a revolving arm (5) equipped with the tape support shaft (4) and revolving around the table (2).
And a holding claw (6) for holding the adhesive tape (3) delivered from the tape support shaft (4), and slidingly moving back and forth to press the end face of the substrate (1) mounted on the table (2). An automatic tape applying machine comprising a pressing device (7) for 2. An automatic tape applying machine having a suction hole (8) on the surface of the table (2) according to claim 1 and sucking the substrate 1. 3. The automatic tape applying machine according to claim 1 or 2, further comprising a pressing cylinder (9) for pressing the substrate (1) mounted on the table (2) against the table (2) from above. An automatic tape applying machine that is characterized by that.