JPH08264493A - Dicing apparatus - Google Patents

Abstract

PURPOSE: To provide a dicing apparatus which can improve productivity. CONSTITUTION: When a setup segment 86 is moved upward and downward with an air cylinder 94, the lower end thereof takes the lower and upper positions for a blade 58. When a spindle motor 60 moves downward and the setup segment 86 is placed in contact with the upper surface of a chuck table, the setup segment 86 moves and movement thereof is measured with a measuring instrument 102. On the basis of the measured value of this measuring instrument 102, the upper surface position of the chck table for the setup segment 86 can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing apparatus for cutting a semiconductor wafer.

[0002]

2. Description of the Related Art In dicing processing in semiconductor manufacturing, it is necessary to accurately control the depth to which a blade cuts a semiconductor wafer in order to keep the processing quality constant. For this reason, in the dicing device, first, the NC device (numerical control device) or the like recognizes the height of the upper surface of the semiconductor wafer with respect to the blade before processing. However, since the thickness of the semiconductor wafer is known in advance, actually, first, a setup operation for detecting the upper surface position of the chuck table on which the semiconductor wafer is mounted is performed. Then, the position of the blade with respect to the semiconductor wafer is controlled by adding the thickness of the semiconductor wafer to the detected upper surface position of the chuck table to obtain the upper surface position of the semiconductor wafer. In recent years, as a setup operation, in order to prevent damage to the blade, a non-contact setup in which the positional relationship between the two is recognized without bringing the blade into contact with the chuck table has been performed.

FIG. 8 is a schematic view showing a part of a conventional dicing apparatus for performing non-contact type setup. As shown in this figure, in the conventional dicing device,
A setup table 12 having an upper surface 12a lower than the upper surface 10a is fixed to the chuck table 10. A touch sensor 18 is fixed to a spindle 16 that rotates the blade 14 as indicated by an arrow via a fixing member (not shown). The touch sensor 18 is configured to perform ON / OFF switching when the upper end 21a of the guide bar 21 that interlocks with the setup piece 20 contacts the contact point 18a. This touch sensor 18
Has a very small response distance, and in the past, in order to prevent erroneous movement caused by switching due to vibration, a constant gap a (for example, 0..0) between the contact point 18a and the upper end 21a of the guide bar 21 is prevented. 3 mm) was provided.
In addition, in the vicinity of the chuck table 10, its upper surface 10
By the laser beam 22a projected at a predetermined height (reference position) with respect to a, the member (blade 14,
A laser sensor 22 for non-contact detection of the setup piece 20) is installed.

In the conventional dicing apparatus, the setup operation is performed as follows. That is, the laser light 22
By sequentially lowering the lower ends of the blade 14 and the setup piece 20 to the position a, the height of the reference position with respect to the blade 14 and the setup piece 20 is first detected. Then, the setup piece 20 is brought into contact with the setup base 12, and the touch sensor 1 at that time
The height of the upper surface 12a of the setup table 12 with respect to the setup piece 20 is detected from the switching operation of 8.

After the above setup operation is completed, the height of the upper surface 10a of the chuck table 10 with respect to the blade 14 is determined from the detected positional relationship between the respective parts. That is, first, the upper surface 12 of the setup table 12
The vertical distance b between a and the reference position is obtained, and the upper surface 12a and the chuck table 1 which are known in advance are obtained.
The height c of the upper surface 10a of the chuck table 10 with respect to the reference position is calculated by adding a step c of 0 with the upper surface 10a (b + c). However, the touch sensor 18 and the setup piece 20
Since a gap a is present between the and, a calculation of (b + c) + a is actually performed using the gap a as a correction value, whereby the height of the upper surface 10a of the chuck table 10 with respect to the reference position is calculated. Ask. Since the positional relationship between the blade 14 and the reference position has been confirmed by the above-described setup operation, next, by adding (b + c) + a to the height of the reference position with respect to the blade 14, the chuck table for the blade 14 is added. The height of the upper surface 10a of 10 is obtained.
Then, the chuck table 10 obtained as described above
The cutting depth of the blade 14 is controlled based on the height information on the upper surface 10a of the blade.

[0006]

However, in the conventional dicing apparatus, the distance of the gap a may change when the touch sensor 18 is maintained, and so on.
It was necessary to perform confirmation work for obtaining the value of the clearance a each time maintenance is performed. For example, the appropriate value of the gap a is obtained by changing the value of the gap a by a small amount (for example, 50 microns) and performing trial cutting on a plurality of dummy wafers. Therefore, work efficiency is deteriorated and productivity is adversely affected.

[0007] Therefore, an object of the present invention is to provide a dicing device capable of improving productivity.

[0008]

According to a first aspect of the present invention, a dicing device for cutting and processing a semiconductor wafer fixed to a processing table with a cutting tool rotated by a spindle is provided at a position where it can contact the processing table. The contact piece and the contact piece holding mechanism that holds the contact piece so that the contact piece can move forward and backward with respect to the upper surface of the machining table, and the position of the contact piece holding mechanism is controlled to make the contact with the upper surface of the machining table. Holding mechanism moving means for bringing the pieces into contact, withdrawal amount detecting means for detecting an amount of withdrawal of the contact piece when the holding mechanism moving means makes contact with the upper surface of the processing table, and withdrawal amount detecting means From the amount of moving out,
Processing table position recognition means for recognizing the upper surface position of the processing table with respect to the contact piece, non-contact measurement means for measuring the relative position of the contact piece and the cutting tool in a non-contact manner, and this non-contact measurement means Recognizing the positional relationship between the cutting tool and the upper surface of the processing table from the measured relative position of the contact piece and the cutting tool and the upper surface position of the processing table with respect to the contact piece recognized by the processing table position recognition means. The above-mentioned object is achieved by including a positional relationship recognizing means.

According to a second aspect of the present invention, the dicing apparatus according to the first aspect further comprises a fixing means for fixing the contact piece holding mechanism to the spindle, and the holding mechanism moving means moves the spindle. Performing position control of the contact piece holding mechanism, the contact piece holding mechanism causes the contact piece to retreat from the cutting tool at the time of cutting processing, and causes the contact piece to project from the cutting tool at the time of contact with the processing table. The purpose is achieved by providing the driving means. According to a third aspect of the invention, in the dicing apparatus according to the first aspect, the non-contact measuring means is located at the reference position by the sensor light projected to the reference position having a predetermined positional relationship with the upper surface of the processing table. Is provided with an optical sensor for non-contact detection, the optical sensor is used to detect the blade and the contact piece, and the relative position of the blade and the contact piece is obtained by respectively obtaining the position with respect to the reference position. The above object is achieved by measuring.

[0010]

In the dicing apparatus according to the first aspect, the holding mechanism moving means controls the position of the contact piece holding mechanism,
The contact piece is brought into contact with the upper surface of the processing table. As a result, the contact piece takes the retreat position, and the retreat amount detection means detects the retreat amount at this time. Then, the processing table position recognizing means recognizes the upper surface position of the processing table with respect to the contact piece based on the amount of retreat detected by the amount of retreat detecting means. The non-contact measuring means measures the relative position of the contact piece and the cutting tool in a non-contact manner. The positional relationship recognizing means detects the relative position between the contact piece and the cutting tool measured by the non-contact measuring means, and the upper surface position of the processing table with respect to the contact piece recognized by the processing table position recognizing means, Recognize the positional relationship with the top surface. Then, by controlling the position of the cutting tool based on the recognized positional relationship between the cutting tool and the processing table, the cutting depth of the cutting tool into the semiconductor wafer fixed to the processing table is controlled.

In the dicing device according to the second aspect, the holding mechanism moving means controls the position of the contact piece holding mechanism by moving the spindle. The cutting process for the semiconductor wafer is performed by the holding mechanism moving means moving the spindle to a predetermined position. In the cutting process, the contact piece driving means moves the contact piece away from the blade. Further, when the holding mechanism moving means brings the contact piece into contact with the upper surface of the processing table, the contact piece drive means causes the contact piece to protrude from the cutting tool. Thereby, for example, even if the upper surface of the processing table with which the contact piece is brought into contact and the surface on which the semiconductor wafer is fixed are the same, the cutting tool and the contact piece do not interfere with each other. Further, the processing table position recognition means recognizes the position of the surface of the processing table on which the semiconductor wafer is fixed, that is, the back surface of the semiconductor wafer. In the dicing device according to claim 3, the non-contact measuring means detects the cutting tool and the contact piece with an optical sensor and obtains the positions of these with respect to the reference position, thereby determining the relative position of the cutting tool and the contact piece. taking measurement.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the dicing apparatus of the present invention will be described in detail below with reference to FIGS. FIG.
2A is a simplified representation of the dicing apparatus according to the present embodiment. As shown in this figure, the dicing device 30
Is a stocker 32 in which a plurality of semiconductor wafers are stored,
A wafer supply unit 34 that carries out and carries in a semiconductor wafer to and from the stocker 32, a dicing processing unit 36 that cuts the semiconductor wafer, a cleaning unit 38 that cleans the processed semiconductor wafer, and a wafer supply unit 34. It is provided with a transfer loader 40 for transferring a semiconductor wafer between the dicing processing section 36 and the cleaning section 38 as indicated by an arrow K.

FIG. 2 shows the dicing processing section 36. In this figure, the X axis and the Y axis which are orthogonal to each other in the horizontal direction are taken, and the Z axis is taken in the vertical direction. As shown in FIG. 2, the dicing processing unit 36 includes a chuck table 4 on which a semiconductor wafer (not shown) is placed.
2 is provided. The chuck table 42 holds the semiconductor wafer by air suction. The chuck table 42 is fixed on the X-axis table 44 and is rotated by a motor (not shown) as indicated by an arrow H. The X-axis table 44 is
When the ball screw 48 is rotated by the X-axis motor 46, it is guided by the guide rail 50 and horizontally moved in the X-axis direction.

Further, the dicing processing section 36 is provided with a Y-axis table 56 which is horizontally moved in the Y-axis direction by a Y-axis motor 52, a ball screw 54 and the like. A vertical movement mechanism 66 for vertically moving a spindle motor 60 for rotating a disk-shaped blade 58 in the Z-axis direction by a spindle vertical movement motor 62, a ball screw 64, etc. is fixed to the Y-axis table 56. The blade 58 is cut into the semiconductor wafer when the spindle motor 60 is lowered by the vertical movement mechanism 66. A microscope 68 is also fixed on the Y-axis table 56 via a fixing member 70. The microscope 68 has a chuck table 42.
The upper surface and the surface of the semiconductor wafer are enlarged and viewed, and are vertically moved in the Z-axis direction with respect to the fixed member 70 by a vertical movement mechanism (not shown). In addition,
The focus of the microscope 68 is adapted to move up and down. In addition, as shown in FIG.
A laser sensor 72 for setup is fixed on the top.

FIG. 3 shows the structure of the laser sensor 72. As shown in this figure, the laser sensor 72
Is a light projecting section 74 that emits a laser beam R, and a light receiving section 76.
And the laser light R emitted from the light projecting unit 74
The mirrors 78a and 78b that lead to In the laser sensor 72, the laser light R emitted from the light projecting unit 74 is focused at the central portion between the mirror 78a and the mirror 78b. Also, the laser sensor 72
Uses the fact that the blade 58 traverses the focal point P of the laser light R as shown in FIG. 3, which changes the amount of light received by the light receiving unit 76, thereby detecting the blade edge of the blade 58 or the like. It has become. Further, as shown in FIGS. 1 and 2, in this embodiment, a sensor mechanism 80 for performing a setup operation is attached to the spindle motor 60.

4 to 6 show the detailed shape of the sensor mechanism 80. FIG. 4 is a front view, FIG. 5 is a rear view, and FIG. 6 is a side view of the sensor mechanism 80. Shows. In addition, in these figures, the spindle motor 60 and the blade 58 are indicated by a two-dot chain line in order to show the mounting relationship. The sensor mechanism 80 includes a bolt 82.
It has a substantially L-shaped support block 84 attached to the upper and side portions of the spindle motor 60 by a, 82b and the like. A setup piece 86 is arranged at the lower end of the lift support portion 84a located on the side of the spindle motor 60 in the support block 84. The setup piece 86 is for performing a setup operation with respect to the laser sensor 72 and the chuck table 42 in the same manner as in the related art, and its lower end can be seen from the cross section taken along the line AA of FIG. 4 shown in FIG. A thin plate-shaped light-shielding part 8
6a is provided. The lower end surface of the light shielding portion 86a is
As shown in FIG. 4, it is formed of a curved surface having the same curvature as the outer peripheral portion of the blade 58.

In this embodiment, the setup piece 86 has two guide bars 88a, 88 as shown in the cross section of FIG.
It is fixed to the lower end of b. These guide bars 88
a and 88b are insertion holes 9 formed in the lifting support portion 84a.
0a and 90b respectively penetrate the up-and-down support part 84a up and down. Coil springs 91a and 91b in a compressed state are provided between the stepped portions formed at the lower ends of the insertion holes 90a and 90b and the upper end surface of the setup piece 86, respectively. It is urged downward.

On the other hand, a locking member 92 is fixed to the upper ends of the guide bars 88a and 88b.
As shown in FIG. 6, an air cylinder 94 is fixed to the. The air cylinder 94 includes a cylinder body 96 having a pressure chamber (not shown) therein and a cylinder body 9
6, a piston (not shown) housed in a pressure chamber (not shown) inside, and a piston rod 98 connected at the upper end side, and an air supply port 1 for supplying compressed air into the cylinder body 96.
00 and. The air supply port 100 is connected to an air supply means (not shown) such as a pump.

The lower end side of the piston rod 98 is fixed to the support block 84 so that it does not move with respect to the support block 84 together with a piston (not shown) in the cylinder body 96. Therefore, the air pressure acting on the piston acts so as to vertically move the cylinder body 96 while keeping the position of the piston rod 98 unchanged. Further, since the cylinder body 96 is in a fixed relationship with the guide bars 88a and 88b via the locking member 92, the drive of the air cylinder 94 consequently moves the setup piece 86 up and down. That is, by driving the air cylinder 94, the cylinder body 96 and the locking member 9
2, guide bars 88a, 88b, and setup piece 8
6 and the like vertically move integrally with the elevating and lowering support portion 84a.

However, the stroke length L in this vertical movement
(See FIG. 4) is regulated by the locking member 92 and the setup piece 86 contacting the upper end surface and the lower end surface of the elevating support portion 84a, respectively. 4 to 6, the compressed air is supplied into the cylinder body 96 to drive the air cylinder 94, and the setup piece 86 is
The uppermost end position T is obtained by contacting the lower end surface of the elevating / lowering support portion 84a against the biasing force of the coil springs 91a and 91b. In addition, the air inside the cylinder body 96 is released,
The locking member 92 is generated by the urging force of the coil springs 91a and 91b.
Is lowered until it abuts on the upper end of the up-and-down support portion 84a, the setup piece 86 takes the lowermost position U as shown by the dotted line in FIG.

In the present embodiment, when the setup piece 86 takes the uppermost end position T, the lower end thereof is located above the lower end position B of the blade 58, and
When the lowest end position U is taken, the lower end of the setup piece 86 is located below the lower end position B of the blade 58. On the other hand, as shown in FIG. 4, in the sensor mechanism 80 of the present embodiment, the length measuring device 102 is attached to the elevating and lowering support portion 84a.
Is provided. The length measuring device 102 is used for the lifting support 8
Length measuring device main body 1 fixed by being partially housed in 4a
02a and a probe 102c that moves up and down with respect to the length measuring device main body 102a by expanding and contracting the bellows-shaped cover 102b.
It is mainly composed of and.

The lower end of the tracing stylus 102c is fixed to the upper end surface of the setup piece 86, and the setup piece 8c
It is designed to move up and down in conjunction with 6. Further, the length measuring device main body 102a outputs the movement amount of the tracing stylus 102c, that is, the movement amount of the setup piece 86 as an electric signal. As the length measuring device 102,
For example, an electric micrometer or the like having a resolution of 1 micron or less is used. It should be noted that the cover 102b is configured such that the coolant supplied to the cut portion during processing is the length measuring device 102.
It is provided to prevent entry into the interior of the car. In the present embodiment, the above-mentioned drive units, for example, the drive of the X-axis motor 46, the Y-axis motor 52, or the air cylinder 94 are controlled by a control device (not shown) such as an NC device. The position of each part is also recognized by the control device based on detection signals from various position sensors and the probe 102c.

Next, the setup operation in the embodiment thus constructed will be described. Although not described in the following description, each unit of the dicing device 30 operates under the control of a controller (not shown). In the dicing device 30 of this embodiment, the setup piece 86 is normally driven by the air cylinder 94.
Takes the uppermost position T shown in FIGS. Then, in this initial state, a setup start signal is generated in a control device (not shown), so that the setup operation by the sensor mechanism 80 is started.

(Set-up on the upper surface of the chuck table) First, the air in the cylinder body 96 is evacuated, and the sensor mechanism 80 is urged by the urging force of the coil springs 91a and 91b.
The setup piece 86 of is lowered to the lowermost position U. Subsequently, the X-axis motor 46 and the Y-axis motor 52 move the X-axis table 44 and the Y-axis table 56 to predetermined positions to position the sensor mechanism 80 above the chuck table 42. Then, the spindle vertical movement motor 62 of the vertical movement mechanism 66 lowers the spindle motor 60 to bring the setup piece 86 of the sensor mechanism 80 into contact with the upper surface of the chuck table 42.

In this embodiment, since the lower end of the setup piece 86 is located below the blade 58 at this time, the blade 58 does not contact the upper surface of the chuck table 42, and only the setup piece 86 is chuck table. 42. When the setup piece 86 comes into contact with the chuck table 42, the setup piece 86 causes the coil spring 91a,
It moves (raises) with respect to the elevating and lowering support portion 84a against the biasing force of 91b. On the other hand, the control device (not shown) monitors whether or not the setup piece 86 contacts the chuck table 42 by monitoring the output of the length measuring device 102 at this time.

When a signal according to the amount of movement of the setup piece 86 is output from the length measuring device 102, the control device (not shown) stops the lowering of the spindle motor 60 and
The movement amount of the setup piece 86 is recognized. Then, the recognized movement amount of the setup piece 86 is used as the spindle motor 6
The height at which the light-shielding portion 86a and the chuck table 42 are in contact with each other is obtained by subtracting from the amount of fall of zero. That is,
The height of the upper surface of the chuck table 42 with respect to the setup piece 86 is obtained.

(Set-up to the reference position) Once the height of the upper surface of the chuck table 42 is obtained, next, the light shielding portion 86
The spindle motor 60 is lifted to a height at which a is separated from the chuck table 42. Then, by moving the X-axis table 44 and the Y-axis table 56 again, the setup piece 86 is positioned immediately above the focusing point P (see FIG. 3) in the laser sensor 72, and the spindle motor 60 is lowered again. As a result, the lower end of the setup piece 86 descends to the height of the laser light R, which is detected by the laser sensor 72. When the laser sensor 72 detects the lower end of the setup piece 86, the control device (not shown) stops the lowering of the spindle motor 60 and
The height of the laser beam R with respect to the setup piece 86, that is, the height of the reference position is recognized from the position of the spindle motor 60 at that time.

(Chuck table 42 relative to the reference position
Calculation of Height of Top Surface of FIG. 7) FIG. 7 schematically shows the positional relationship of each part in the dicing device 30. When the reference position and the height of the upper surface of the chuck table 42 with respect to the setup piece 86 are obtained as described above, the control device (not shown) determines the reference position and the chuck table 42 from the movement amount of the spindle motor 60 in the Z-axis direction. A distance d (see FIG. 7) from the upper surface in the Z-axis direction is obtained. When the distance d is calculated, the set-up piece 86 is moved up to the uppermost position T again by the air cylinder 94, and
The respective units are returned to their original positions and a setup completion signal is generated, thereby ending the setup operation.

On the other hand, the height of the reference position with respect to the blade 58 is obtained by lowering the spindle motor 60 immediately above the focusing point P and detecting the lower end of the blade 58 with the laser sensor 72. Therefore, similarly to the conventional case, the upper surface position of the chuck table 42 with respect to the blade 58 is calculated by adding the distance d to the obtained height of the reference position with respect to the blade 58. In the cutting process, the cutting depth of the blade 58 is controlled based on the position of the upper surface of the chuck table 42 obtained by the above process.

As described above, in the dicing apparatus 30 of this embodiment, the contact between the setup piece 86 and the chuck table 42 is detected by the analog signal obtained from the length measuring device 102 according to the movement amount of the setup piece 86. Therefore, the correction value (gap a) is not required unlike the conventional case. Therefore, since it is not necessary to confirm the correction value even after maintenance, the working efficiency is good and the productivity can be improved as compared with the conventional case.

Further, in the dicing device 30 of this embodiment, the setup piece 8 is driven by driving the air cylinder 94.
Since 6 takes an upper position (uppermost end position T) and a lower position (lowermost end position U) with respect to the lower end of the blade 58, the setup piece 86 and the blade 58 are set at the time of setting up or cutting the chuck table 42. It is possible to prevent interference with. Therefore, conventionally, the setup piece 2
0 to prevent interference between the blade 14 and the upper surface 10a of the chuck table 10 having a different height from the setup table 1
2 was required, but in this embodiment, the setup base 1
The setup can be performed directly on the upper surface of the chuck table 42 without using 2. Therefore, the calculation (b + c) in consideration of the step between the setup table 12 and the chuck table 10 need not be performed, and the manufacturing cost of the apparatus can be reduced because the setup table 12 is not provided.

In the above embodiment, the sensor mechanism 80
Although the setup operation is performed by the servo system in the vertical movement mechanism 66 by fixing the to the spindle motor 60, other vertical movement means may be used. For example, even in a vertical movement mechanism (not shown) of the microscope 68, since the position of the microscope 68 is recognized by using a pulse motor as a drive source thereof, the setup operation is performed by using the vertical movement of the microscope 68. You can go. That is, the sensor mechanism 80 is attached to the microscope 68 so that the setup piece 86 projects from the lower end of the microscope 68.
Similar to the setup operation described above, the setup piece 86
Is brought into contact with the upper surface of the chuck table 42, or the laser light R of the laser sensor 72 is blocked. Then, from the reference position recognized by the Z-axis coordinate in the vertical movement mechanism of the microscope 68 and the upper surface position of the chuck table 42, the distance z in the Z-axis direction between them is obtained. Then, the calculated distance z is
By adding the vertical movement mechanism 66 to the reference position for the blade 58 recognized on the Z-axis coordinate, the upper surface position of the chuck table 42 with respect to the blade 58 is obtained.

When the microscope 68 is provided with the sensor mechanism 80, the sensor mechanism 8 is caused by vibrations of the spindle motor 60 and the like.
It is possible to prevent the adverse effect on 0. Also, the microscope 6
Since 8 is located at a position distant from the cut portion, coolant does not adversely affect the sensor mechanism 80. Therefore, it is not necessary to provide the cover 102b, and the length measuring device 102
Can have a simpler structure.

Further, in the above embodiment, the setup piece 86 was brought into contact with one place on the chuck table 42 in the setup on the upper surface of the chuck table 42.
The parallelism of the chuck table 42 may be automatically measured by contacting two or more locations. For example, four places along the circumference of the chuck table 42 and one place in the center,
The set-up pieces 86 are brought into contact with a total of five places, and the height at each point is obtained in the same manner as in the above-mentioned embodiment. Then, the parallelism on the upper surface of the chuck table 42 is measured by calculating the distance between the points, the step, and the like. As a result of the measurement, if the parallelism is worse than a predetermined standard, a warning lamp is turned on or a buzzer is sounded to notify the operator of the defective state. Further, the measured parallelism may be fed back to the position control of the blade 58 during processing to perform more precise depth control in consideration of the shape error of the chuck table 42.

Further, in the above embodiment, the position of the setup piece 86 is made variable so that the setup operation can be performed directly on the chuck table 42 without using the conventional setup table 12 (see FIG. 8). I was doing
Instead of providing a mechanism for moving the setup piece 86 up and down, the chuck table 42 may be a processing table provided with a setup table, so that the setup operation for the setup table may be performed as in the conventional case. Further, as the contact piece driving means for raising and lowering the setup piece 86, for example, an oil cylinder or the like may be used instead of the air cylinder 94.

[0036]

According to the dicing apparatus of the present invention, productivity can be improved.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing an entire dicing apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a dicing processing part of the same apparatus.

FIG. 3 is a side sectional view showing a detailed structure of a laser sensor in the same device.

FIG. 4 is a front view of a sensor mechanism in the device.

FIG. 5 is a partially cutaway side view of a sensor mechanism in the device.

FIG. 6 is a rear view of a sensor mechanism in the same device.

FIG. 7 is a front view schematically showing the positional relationship of each part in the same device.

FIG. 8 is an explanatory view schematically showing the positional relationship of each part in a conventional dicing device.

[Explanation of symbols]

 30 Dicing device 42 Chuck table 44 X-axis table 46 X-axis motor 48, 54, 64 Ball screw 50 Guide rail 52 Y-axis motor 56 Y-axis table 58 Blade 60 Spindle motor 62 Spindle vertical movement motor 66 Vertical movement mechanism 68 Microscope 72 Laser sensor 80 sensor mechanism 84 support block 84a lift support 86 setup piece 88a, 88b guide bar 91a, 91b coil spring 92 locking member 94 air cylinder 96 cylinder body 98 piston rod 100 air supply port 102 length-measuring machine 102a length-measuring machine 102b Cover 102c probe R laser light

Claims (3)

[Claims] 1. A dicing apparatus for cutting and processing a semiconductor wafer fixed to a processing table with a cutting tool rotated by a spindle, wherein a contact piece disposed at a position capable of contacting the processing table and the processing piece A contact piece holding mechanism that holds the contact piece so that it can move forward and backward with respect to the upper surface of the table, and a holding mechanism moving means that brings the contact piece into contact with the upper surface of the machining table by controlling the position of the contact piece holding mechanism. A moving amount detecting means for detecting a moving amount of the contact piece when the mechanism moving means makes contact with the upper surface of the working table; and a moving table for the contact piece based on the moving amount detected by the moving amount detecting means. Machining table position recognizing means for recognizing the upper surface position, and a non-contact measuring hand for non-contact measuring the relative position of the contact piece and the cutting tool. Step, from the relative position of the contact piece and the cutting tool measured by the non-contact measuring means, and the upper surface position of the processing table with respect to the contact piece recognized by the processing table position recognition means, the cutting tool, A dicing apparatus comprising: a positional relationship recognizing unit that recognizes a positional relationship with the upper surface of the processing table. 2. A fixing means for fixing the contact piece holding mechanism to the spindle, wherein the holding mechanism moving means controls the position of the contact piece holding mechanism by moving the spindle. The holding mechanism retracts the contact piece from the cutting tool at the time of cutting processing, and when contacting the processing table,
The dicing apparatus according to claim 1, further comprising a contact piece driving unit that causes the contact piece to protrude from the cutting tool. 3. The non-contact measuring means includes an optical sensor for non-contactly detecting a member at the reference position by sensor light projected to a reference position having a predetermined positional relationship with the upper surface of the processing table. The relative position between the cutting tool and the contact piece is measured by detecting the cutting tool and the contact piece with an optical sensor and obtaining the positions of these with respect to the reference position. Dicing equipment.