JPH0826439A - Lead frame conveying apparatus and die bonding apparatus - Google Patents

Abstract

PURPOSE:To provide a lead frame conveying apparatus and die bonding apparatus such that the lead frame can be conveyed surely with a simple structure. CONSTITUTION:A slide guide 32 for guiding a lead frame is constituted to consist of a plurality of guide parts 38a-38b, 40a-40b, 42a-42b having a predetermined width corresponding to the kind of the lead frame, and have conveying means 44, 46 for conveying the lead frame along the slide guide.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame carrying device and a die bonding device.

[0002]

2. Description of the Related Art In the manufacture of a semiconductor device, a semiconductor chip is mounted on a lead frame and die-bonded. The lead frame is conveyed from the loader to the bonding head by the lead frame conveying device, and the semiconductor chip is supplied onto the lead frame.

There are many types of lead frames having different widths and lengths, and the lead frame transport device must transport lead frames of different types.
A conventional lead frame carrying device is provided with a slide guide for guiding the lead frame, and this slide guide is composed of a pair of guide portions divided in the width direction. further,
There is a driving means for driving the pair of guide portions, and by moving the pair of guide portions toward or away from each other, the selected lead frame is conveyed along the sliding guide. When the type of the lead frame changes, the data stored in the memory is called and the drive means is controlled to change the width of the sliding guide.

[0004]

However, when a split type sliding guide is used in the width direction, it is necessary to keep the pair of separated guides parallel to each other, and the parallelism is maintained even if the width is changed. Therefore, a complicated width changing mechanism was necessary. In particular, when the lead frame transfer device becomes long, it becomes difficult to keep the pair of separated guide parts parallel to each other, and the width changing mechanism becomes more complicated.

Therefore, there is a problem in that the cost of the conventional lead frame transfer device is high and the cost of the die bonding device using the same is also high. Furthermore, when problems occur in the parallelism of the guides and the reproducibility of the guide width, it is not easy to perform maintenance, which also affects the operating rate.

An object of the present invention is to provide a lead frame carrying device capable of reliably carrying a lead frame with a simple structure and a die bonding device using the same.

[0007]

A lead frame carrying device according to the present invention comprises a slide guide 32 for guiding the lead frame, and the slide guides have a plurality of guides having a predetermined width according to the type of the lead frame. Parts 38a-38b, 4
0a-40b, 42a-42b, and further comprises transporting means 44, 46 for transporting the lead frame along the sliding guides.

[0008]

In the above structure, there are a plurality of guide portions having a predetermined width, and one of them is selected and used according to the type of lead frame to be used. Since each guide portion has a predetermined width, it is not necessary to change the width as in the conventional case when the lead frame used is changed, and thus the width changing mechanism is not necessary. Since the width of each guide portion is fixedly determined, if the parallelism is confirmed first, the parallelism will not be disturbed during the subsequent use.

Preferably, the plurality of guide portions are provided in a stepped shape on the sliding guide body, the wide guide portion is on the upper side, and the narrow guide portion is on the lower side. In this case, since all the guide portions are integrally provided, even if the type of the lead frame to be used is changed, there is no room for change in parallelism, and the operability is assured.

In this case, in order to set one of the plurality of guide portions to a predetermined height, it is preferable that the sliding guide body is provided so that its height can be adjusted. In this case,
The height of the guide part used can be matched with other devices such as a loader of the reaver frame and a bonding head.

Further, the plurality of guide portions are provided on the sliding guide body selectively and detachably, and have a predetermined width when the selected guide portion is attached to the sliding guide body. It is good to have it. In this case,
Although it takes time to attach the selected guide portion to the sliding guide body, the width setting operation is not necessary because the selected guide portion has a predetermined width.

The present invention further connects the lead frame carrying device having the above-mentioned structure, a chip supply section for supplying a semiconductor chip to the lead frame carried by the lead frame carrying device, and the lead frame and the semiconductor chip. A die bonding apparatus having a bonding head is provided. This die bonding device can exhibit the features of the lead frame transfer device.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a die bonding apparatus 10. The die bonding apparatus 10 includes a lead frame transfer device 12, a chip supply unit 14 for supplying a semiconductor chip to the lead frame carried by the lead frame transfer device 12, and a lead. It has a bonding head 16 for connecting the frame and the semiconductor chip.

An example of the lead frame 22 is shown in FIG. The lead frame 22 is a semiconductor chip mounting portion 2
4, a lead 26 extending outward from the mounting portion 24,
A frame portion 28 is provided so as to surround the mounting portion 24, and the outer ends of the leads 26 are connected to the frame portion 28. The outer end portion of the lead 26 is finally the frame portion 2.
It is well known that it is separated from 8. further,
The frame portion 28 is provided with a square transport hole 30.

As shown in FIG. 1, the lead frame 2
The second loader 18 is on the upstream side of the lead frame transport device 12, and the unloader 20 is on the downstream side of the lead frame transport device 12. Generally, the lead frame 22 includes a plurality of (for example, 6 to 10) semiconductor chip mounting portions 24. There are many types of lead frames 22, but they can be classified into 4 to 5 types in terms of width and 5 to 6 types in terms of length. The lead frame transport device 12 has a length such that 5 to 6 lead frame transport devices continuously flow.

As shown in FIGS. 1 to 3, the lead frame carrying device 12 comprises a sliding guide 32 for guiding the lead frame 22. As shown in FIG. 3, the sliding guide 32 is provided on the pedestal 34 together with the loader 18 and the unloader 20, and the sliding guide 32 is movably provided in the vertical direction with respect to the pedestal 34 as indicated by an arrow A. To be A manual wheel 36 for height adjustment is provided, and the manual wheel 36 is connected to a screw shaft (not shown) or a rack and pinion mechanism, and by rotating the manual wheel 36, the sliding guide 32 is perpendicular to the pedestal 34. Can be moved in any direction.

As shown in FIGS. 1 and 2, the sliding guide 32 has a plurality of guide portions 38a-38b, 40a-40b, each having a predetermined width according to the type of the lead frame 22.
42a-42b. In this embodiment, the plurality of guide portions 38a-38b, 40a-40b, 42a-
42b is provided integrally with the sliding guide body in a stepped shape, and the wide guide portions 42a and 42b are provided on the upper side,
The narrow guide portions 38a-38b are on the lower side. Each guide portion has a horizontal bearing surface and a vertical regulating surface that engages with the outer edge portion of the lead frame 22.

The lead frame carrying device 12 further comprises a carrying means for carrying the lead frame 22 along the sliding guide 32. In the embodiment, the conveying means is composed of a conveyor 44 provided along the sliding guide 32 on the side of the sliding guide 32, and a feeding pawl 46 attached to the conveyor 44. The feed claw 46 is the lead frame 22.
The lead frame 22 is to be transported by being inserted into the transport hole 30 (see FIG. 6). Although only one feed pawl 46 is shown in FIG. 1, it is clear that any number of feed pawls 46 can be provided.

FIG. 4 shows that the narrow lead frame 22 is correspondingly positioned in the narrow lower guide portions 38a-38b. In FIG. 5, the wide lead frame 22 corresponds to the wide guide portion 4 on the upper side.
It is located at 2a-42b.

Since the lead frame 22 having a narrow width and the lead frame 22 having a wide width have different positions of the transport holes 30, it is necessary to change the position of the feed claw 46. In the embodiment, a plurality of feed claws 46 suitable for each type of lead frame 22 are prepared, and the feed claws 46 are replaced when the lead frame 22 to be conveyed changes. The feed pawl 46 is fixed to the conveyor 44 or an extension member of the conveyor 44 with a screw 48.
Can be easily replaced.

In this way, the lead frame 22 can be transported along the sliding guide 32. on the other hand,
As shown in FIG. 1, the chip supply unit 14 and the bonding head 16 are arranged on the respective sides of the sliding guide 32 at positions in the middle of the sliding guide 32. Chip supply unit 14
Is composed of a transfer arm 54 for transferring the semiconductor chips 52 formed on the semiconductor wafer 50 and individually cut, and a positioning table 56 for positioning and mounting the transferred semiconductor chips 52 at a predetermined position. The transfer arm 54 is movable in the direction of arrow B, for example.

The bonding head 16 has a carriage 58 movable in the direction of arrow C.
Includes a suction head (not shown) that suction-holds the semiconductor chip 52. Therefore, the carriage 58 moves toward the positioning table 56, and the suction head moves to the positioning table 56.
Adsorb and hold the upper semiconductor chip,
It is transferred to the mounting portion 24 of the lead frame 22 on the sliding guide 32. When the semiconductor chip is mounted on the mounting portion 24 of the lead frame 22, die bonding is performed in a known manner. Since the lead frame 22 is provided with the plurality of mounting portions 24, the die bonding is performed one after another while advancing the lead frame 22. After the die bonding is completed, the lead frame 22 is picked up by the unloader 20 and sent to the next step.

As described above, in the above structure, the plurality of guide portions 38a-38b, 40a-40 having a predetermined width are provided.
b, 42a-42b, of which the one suitable for the type of the lead frame 22 to be used is selected and used. Each guide portion 38a-38b, 40a-40b, 42
Since each of the a-42b has a predetermined width, it is not necessary to change the width as in the conventional case when the lead frame 22 used is changed, and therefore, the width changing mechanism is not necessary. Then, the guide portions 38a-38b, 40a-40
Since the widths of b and 42a-42b are fixedly determined, if the parallelism is first confirmed, the parallelism does not get disturbed during the subsequent use.

7 to 10 are views showing a second embodiment of the lead frame carrying device 12 of the present invention. The lead frame carrying device 12 includes a slide guide 32 for guiding the lead frame 22 and a carrying means (not shown, see FIG. 1). The sliding guide 32 has a plurality of guide portions 38a-38b having a predetermined width according to the type of the lead frame 22,
It consists of 40a-40b.

In this embodiment, these guide portions 38a-38b, 40a-40b are provided on the sliding guide body selectively and detachably, and the selected guide portions are attached to the sliding guide 32 body. It has a predetermined width when it is opened. That is, each guide portion 38a
38b, 40a-40b are formed as guide blocks separately from the sliding guide 32 main body, and are fixed to the sliding guide 32 main body by screws or other fixing means. The guide portions 38a-38b and 40a-40b are slidable guides 32.
The main body is formed in a predetermined shape so that it has a predetermined width when the corner is pressed against the corner.

That is, FIGS. 7 and 8 show the case where the narrow guide portions 38a-38b are fixed to the main body of the sliding guide 32, and FIGS. 9 and 10 show the wide guide portions 40a-40b. Is fixed to the main body of the sliding guide 32. In order to form the narrow guide portions 38a-38b, the guide blocks in FIGS. 7 and 8 are thicker than the guide blocks in FIGS. 9 and 10. The shape of the sliding guide 32 main body is constant.
Therefore, also in this configuration, the guide portions 38a-38
b, 40a-40b width adjustment is not required. Also, FIG.
Since the height of the guide block of FIG. 8 is the same as the height of the guide block of FIGS. 9 and 10, the height adjusting mechanism of the previous embodiment can be omitted in this embodiment.

[0027]

As described above, according to the present invention,
It is possible to obtain a lead frame carrying device that can reliably carry a lead frame with a simple structure and a die bonding device using the lead frame carrying device.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention.

FIG. 2 is a sectional view taken along the line II-II in FIG.

3 is a side view of the lead frame transport device of FIG. 1. FIG.

FIG. 4 is a diagram showing a case where a lead frame having a narrow width is conveyed.

FIG. 5 is a diagram showing a case where a wide lead frame is conveyed.

FIG. 6 is a diagram showing an example of a lead frame.

FIG. 7 is a diagram showing a second embodiment of the present invention.

8 is a cross-sectional view taken along the line VIII-VIII of FIG.

9 is a diagram showing a case where a lead frame wider than that in FIG. 7 is conveyed.

10 is a cross-sectional view taken along the line XX of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Dice bonding apparatus 12 ... Lead frame conveyance apparatus 14 ... Chip supply part 16 ... Bonding head 18 ... Fresnel lens 22 ... Lead frame 32 ... Sliding guide 38a, 38b ... Convergence optical transmission array 40a, 40b ... Convergence light Transmitter array 42a, 42b ... Convergent optical transmitter array 44 ... Conveyor 46 ... Feed claw

Front page continuation (72) Inventor Hisadachi Kawachi 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Within Fujitsu Limited (72) Inventor Akira Homon, 1015 Kamedotachu, Nakahara-ku, Kawasaki, Kanagawa within Fujitsu Limited (72) Inventor Katsutoshi Takahashi 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited

Claims (5)

[Claims] 1. A slide guide (32) for guiding a lead frame, said slide guide being provided with a lead frame (2).
A plurality of guide parts (3 having a predetermined width according to the type of 2)
8a-38b, 40a-40b, 42a-42b), and further provided with a transporting means (44, 46) for transporting the leadframe along the slide guide. 2. The sliding guide body is provided with a plurality of guide portions in a stepped shape, the wide guide portion is on the upper side, and the narrow guide portion is on the lower side. Item 1. The lead frame carrying device according to item 1. 3. The height of the sliding guide body is adjustable in order to set one of the plurality of guide portions to a predetermined height. Lead frame transfer device. 4. The plurality of guide portions are provided on the sliding guide body selectively and detachably, and have a predetermined width when the selected guide portions are attached to the sliding guide body. The method according to claim 1, wherein
The lead frame transfer device described in. 5. The lead frame carrying device (12) according to claim 1, a chip supply part (14) for supplying a semiconductor chip to the lead frame carried by the lead frame carrying device, and the lead frame. And a bonding head (16) for connecting the semiconductor chip to the semiconductor chip.