JPH08262103A - Method for re-sorting ic circulated with ic carrier in auto-handler - Google Patents

Abstract

PURPOSE: To provide a method by which ICs can be re-sorted in an auto-handler in which IC carriers are circulated without remounting trays on a supplying loader from a housing loader. CONSTITUTION: A control section 3 which operates an auto-handler is provided with a sorting means 3A and re-storing and discriminating means 3C and sorting conditions 3B for sorting measured ICs and re-sorting conditions 3D for re- sorting measured ICs are set in the section 3 in advance. ICs 1A which are decided to be re-sorted by the means 3C are reserved in an IC carrier 10 at a classifying section 14 and the carrier 10 is moved to a supplying section 11 for the retest of the ICs 1A.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of re-sorting an auto handler in which an IC carrier internally circulates.

[0002]

2. Description of the Related Art Next, the structure of an auto handler according to the present invention will be described with reference to FIG. 3A is a plan view of the auto handler, and FIG. 3A is a front view. In FIG. 3, 10 is an IC carrier, 11 is a supply unit, 12 is a preheating unit, 13 is a measuring unit, 14 is a sorting unit, and 15 is a housing unit. Further, 20 is a tray, 21 is a supply loader, 22 to 24 are accommodating loaders,
Reference numeral 25 is a standby unit.

In FIG. 3, 50 trays 20 each having a plurality of ICs 1A mounted thereon are mounted on a supply loader 21. The supply hand 31 starts from the uppermost tray 20 of the supply loader 21 to the IC 1
A is sequentially transferred to the IC carrier 10 of the supply unit 11. When the feeding operation of the supply unit 11 to the IC carrier 10 is completed, the moving mechanism 40 horizontally moves to detect the presence or absence of the IC 1A in the tray 20. The empty tray 20 is transported by the moving mechanism 40 and stored in the standby unit 25.

The IC carrier 10 of the supply unit 11 has a preheating unit 12
Then, the IC 1A in the IC carrier 10 is heated for a certain period of time. After a certain period of time, the IC carrier 10 is measured by the measuring unit 13
, And IC1A is tested. 3 is a high temperature handler, and the preheating unit 12 and the measuring unit 13 are built in a high temperature tank. In the case of the low temperature handler, the preheating unit 12 is a precooling unit, and the precooling unit and the measuring unit are built in the low temperature tank.

After the IC 1A completes the test, the IC carrier 10 moves to the sorting section 14. In the classifying unit 14, the accommodating hand 32 classifies and transfers the IC 1A onto the tray 20 of the accommodating loader in accordance with the test results and preset classification conditions. The empty IC carrier 10 returns to the supply unit 11.

In FIG. 3, three storage loaders are prepared. The first accommodating loader 22 can mount 50 trays 20 for accommodating ICs, but when the IC 1A1 is insufficiently accommodating, the tray 20 confirmed to be empty is supplied from the standby unit 25. . The empty tray 20 is transferred from the standby unit 25 to the second storage loader 23. A plurality of empty trays 20 are mounted on the third storage loader 24. The third accommodating loader 24 is used, for example, when classifying the IC 1A by grade. The tray 20 of the third accommodating loader 24 moves to the accommodating portion 15 and the accommodating hand 32 moves the IC.
1A is stored and the operation returns to the third storage loader 24.

Next, the control method of the auto handler in which the IC carrier shown in FIG. 3 internally circulates will be described with reference to the functional block diagram of FIG. Reference numeral 1 in FIG. 4 is an auto handler described in FIG. 3, 2 is an IC tester, and 3 is a control unit.

In FIG. 4, when the test start request signal 2A is transmitted from the measuring section 13 to the IC tester 2, the IC tester 2 tests the IC 1A of the measuring section 13. As for the IC1A in the IC carrier 10 of the measuring unit 13, for example, 32 IC1A are measured in parallel. After the test is completed, the IC tester 2 sends a test end signal 2B to the measuring unit 13.

The IC tester 2 sends a test end signal 2B and sends the measurement data 2C of the IC 1A to the control unit 3.
Send to. The measurement data 2C is input to the selection unit 3A of the control unit 3. The selection condition 3B in the control unit 3 includes I
The selection condition for selecting C1A is preset, and the control unit 3 compares the measurement data 2C with the selection condition 3B.

According to the comparison result, the control unit 3 commands the sorting in the sorting unit 14. In accordance with the selection command, in the classification unit 14, each IC 1A is stored in the loading loader 22.
They are classified and stored in ~ 24. In the control unit 3, an operation is instructed by a CPU (not shown). For example, although the internal operation of the auto handler 1 is instructed by the control unit 3,
Descriptions of operations not related to the present invention will be omitted.

[0011]

In FIG. 4, an IC classified as a defective product may be re-sorted among the classified ICs. For example, when the yield in one lot is different from the expected yield, the tray 20 is pulled out from the accommodating loader set to accommodate defective ICs,
The tray 20 is mounted on the supply loader 21.

It is an object of the present invention to provide a method of re-sorting inside the auto handler without reloading the tray from the storage loader to the supply loader in the auto handler in which the IC carrier is internally circulated.

[0013]

In order to achieve this object, according to the present invention, an IC is mounted on an IC carrier 10 in a supply section 11.
1A is sequentially supplied, and the IC carrier 10 is supplied to the measuring unit 13
IC1A is tested by moving to
The carrier 10 moves to the classification unit 14, and the classification unit 14 uses the IC 1A in the IC carrier 10 based on the test result.
IC1A is sorted and transferred to a plurality of trays 20,
The IC carrier 10 is an auto handler in which the IC carrier moving to the supply unit 11 circulates.
Control section 3 has at least sorting means 3A and re-sorting determination means 3C, sorting means 3A is set with sorting condition 3B for sorting IC 1A after measurement, and re-sorting determination means 3C re-sorts IC after measurement. The re-sorting condition 3D is set, and the individual ICs 1A of the IC carrier 10 after the measurement are set in the sorting means 3A.
Measurement data 2C is sent, the sorting means 3A compares the sorting condition 3B with the measurement data 2C, and the sorting means 3A sends the measurement data 2C of the IC 1A judged as defective to the re-sorting determination means 3C for re-sorting determination. Means 3C is re-sorting condition 3D
And the measurement data 2C are compared with each other, and the re-sorting determination means 3C transfers a first instruction to hold the defect determination IC in the IC carrier 10 and the defect determination IC to the tray 20 designated to accommodate the defective product IC. One of the second commands to be executed.

[0014]

According to the present invention, the control unit for operating the autohandler is provided with the selecting means, the re-selecting judging means, the selecting condition for selecting the IC after measurement, and the re-selecting condition for re-selecting the IC after measurement. ing. The ICs that have been re-sorted by the re-sorting determination means are held in the IC carrier in the sorting unit,
Since the carrier moves to the supply unit and is retested, the re-sorting process can be shortened.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the structure according to the present invention will be described with reference to the embodiment of FIG. Reference numeral 3C in FIG. 1 is a re-sorting determination means, 3D is a re-sorting condition, and the others are the same as those in FIG. That is, in FIG. 1, the re-sorting determination means 3C and the re-sorting condition 3D are added to the control unit 3 of FIG.

In FIG. 1, the sorting means 3A compares the sorting condition 3B with the measurement data 2C, and the measurement data 2C of the IC 1A determined by the sorting means 3A to be a defective product is sent to the re-sorting determination means 3C. The re-sorting determination unit 3C compares the re-sorting condition 3D with the measurement data 2C, and the re-sorting determination unit 3C stores the defect determination IC in the IC carrier 10 as a first command and the defect determination IC as a defective product. Any one of the second commands for transferring the IC to the tray 20 designated to be accommodated is commanded.
It should be noted that the re-sorting condition mentioned here includes not only the setting data to be compared with the measurement data 2C but also the setting condition to regard as a defective IC when the defective product is judged for the second time.

The operation of the embodiment of the present invention will be described below with reference to the flow chart of FIG. In step 101 of FIG. 2, the supply hand 31 transfers N ICs 1A from the tray 20 of the supply loader 21 to the IC carrier 10 located in the supply unit 11. In this case, when the defective IC 1A to be re-sorted remains in the IC carrier 10, the supply hand 31
Moves the IC1A while avoiding the accommodation place of the IC1A.

In step 102, N pieces of I have been supplied.
The C carrier 10 moves to the preheating unit 12. Step 103
Then, the IC carrier 10 moves to the measuring unit 13. In step 104, the IC tester 2 is requested to start the IC test.

At step 105, the IC tester 2 sends a test end signal to the auto handler 1. Step 10
In 6, the IC tester 2 selects the measurement data 2C from the selection means 3A.
Send to.

In step 107, the sorting means 3A compares the measurement data 2C with the sorting conditions 3B and gives an instruction for the storage loader to be sorted. If there is no IC that is determined to be defective in step 108, the process proceeds to step 109, and if there is an IC that is determined to be defective, the process proceeds to step 110.
In step 109, the storage hand 32 moves to step 107.
The IC is transferred to a predetermined accommodating loader in accordance with the command.

At step 110, the sorting means 3A sends the measurement data 2C to the re-sorting determination means 3C. In step 111, the re-sorting determination means 3C compares the measurement data 2C with the re-sorting condition 3D. In step 112, if re-sorting is necessary, the process proceeds to step 113, and if it is determined that re-sorting is not necessary, the process returns to the previous stage of step 109.

At step 113, the re-sorting judging means 3C
Instructs the IC carrier 10 to hold the IC. In step 114, the IC carrier on which the holding IC is mounted is moved by the supply unit 11, and the process returns to the initial step. When all classification work is completed, a series of work is completed.

[0023]

According to the present invention, the control section for operating the auto-handler includes a sorting means, a re-sorting determination means, and an IC after measurement.
In advance, there are provided a selection condition for selecting and a re-selection condition for re-selecting the IC after measurement. The ICs that have been re-sorted by the re-sorting determination means are retained in the IC carrier in the sorting unit, and the IC carrier is moved to the supply unit and retested, so that the re-sorting process can be shortened.

[Brief description of drawings]

FIG. 1 is a configuration diagram of functional blocks according to an embodiment of the present invention.

FIG. 2 is a flowchart showing the operation of the present invention.

FIG. 3 is a configuration diagram of an auto handler according to the present invention.

FIG. 4 is a configuration diagram of functional blocks according to a conventional technique.

[Explanation of symbols]

 1 Auto Handler 1A IC 2 IC Tester 2A Test Start Request Signal 2B Test End Signal 2C Measurement Data 3 Controller 3A Sorting Means 3B Sorting Conditions 3C Resorting Judgment Means 3D Resorting Conditions 10 IC Conveyor 11 Supply Unit 12 Preheating Unit 13 Measurement Part 14 Sorting part 15 Storage part 20 Tray 21 Supply loader 22 Storage loader 23 Storage loader 24 Storage loader 25 Standby part

Claims (1)

[Claims] 1. An IC is sequentially supplied to an IC carrier in a supply unit, the IC carrier is moved to a measuring unit to test the IC, and after the test is completed, the IC carrier is moved to a sorting unit, The sorting unit sorts the ICs in the IC carrier based on the test result, sorts and transfers the ICs to a plurality of trays, and the IC carrier is an auto handler in which the IC carrier moving to the supply unit circulates. The control unit of the auto handler has at least a sorting means and a re-sorting determination means, the sorting means sets sorting conditions for sorting the IC after measurement, and the re-sorting determination means re-sorts the IC after measurement. Re-sorting conditions for sorting are set, measurement data of individual ICs of the IC carrier after measurement are sent to the sorting means, the sorting means compares the sorting conditions with the measurement data, and the sorting means Defective product The measured data of the determined IC is sent to the re-sorting determination means, the re-sorting determination means compares the re-sorting condition with the measurement data, and the re-sorting determination means transfers the defect determination IC to the IC carrier. The IC carrier is circulated, and a first command to be stored in the IC storage device and a second command to transfer the defect determination IC to a tray designated to accommodate the defective product IC are automatically circulated. Handler re-screening method.