JPH08256976A - Solid-state image pickup device for electronic endoscope - Google Patents

Abstract

PURPOSE: To provide a solid-state image pickup device for an electronic endoscope which prevents the yellowing of picked up images and the degradation of picked up image quality even when the device is placed under a high-temp. environment by a high-pressure steam sterilizer, etc. CONSTITUTION: The parts exclusive of an image pickup surface 3 from the peripheral part of the image pickup surface 3 disposed on the front surface of an image pickup chip 2 toward the side faces of the image pickup chip 2 are coated and molded with a synthetic resin. Cover glass 6 is joined to the front side aperture of the synthetic resin part 5 by opening a spacing 7 from the image pickup surface 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device for an electronic endoscope.

[0002]

2. Description of the Related Art FIG. 3 shows a conventional solid-state image pickup device for an electronic endoscope, in which a cover glass 13 is arranged in front of an image pickup surface 12 provided on the front surface of an image pickup chip 11. There is.

The cover glass 13 is provided with an image pickup chip 11 by a transparent adhesive 14 of epoxy resin type, for example.
Is joined to the front of. Reference numeral 15 is a header, and 16 is a lead for transmitting a signal to the outside.

[0004]

The endoscope needs to be washed and disinfected after use, but in order to perform more complete sterilization, it is placed in a high temperature environment by a high pressure steam sterilization (autoclave) device or the like. You may get burned.

Then, since the epoxy resin adhesive turns yellow due to high temperature, the observation light incident on the image pickup surface 12 becomes yellowish, which causes a serious inconvenience that the quality of the observed image is deteriorated.

Therefore, the present invention has an object to provide a solid-state imaging device for an electronic endoscope in which a picked-up image does not yellow even when placed in a high temperature environment by a high-pressure steam sterilizer or the like, and the picked-up image quality does not deteriorate. And

[0007]

In order to achieve the above object, a solid-state image pickup device for an electronic endoscope according to the present invention is provided from a peripheral portion of an image pickup surface provided on a front surface of an image pickup chip to a side surface of the image pickup chip. It is characterized in that a portion other than the image pickup surface is covered with a synthetic resin, and a cover glass is joined to the front opening of the synthetic resin portion with a space provided between the cover glass and the image pickup surface.

The synthetic resin may be black, and the joint surface between the synthetic resin portion and the cover glass may be tapered so as to gradually expand forward.

[0009]

Embodiments will be described with reference to the drawings. Figure 1
1 shows a solid-state imaging device according to an embodiment of the present invention, in which an imaging chip 2 is arranged on the surface of a ceramic header 1 and the surface of the imaging chip 2 is an imaging surface 3. Input / output of signals to / from the outside is performed via the leads 4.

In this way, from the peripheral portion of the image pickup surface 3 provided on the front surface of the image pickup chip 2 to the side surface of the image pickup chip 2, the portion other than the image pickup surface 3 is covered and molded with synthetic resin. 5 is the synthetic resin part.

If, for example, an epoxy resin is used as the material of the synthetic resin portion 5, an inexpensive mold is used and the temperature is from room temperature to 80.
Molding can be performed at a temperature of about 0 ° C., and the imaging chip 2 is not adversely affected during molding.

In the synthetic resin portion 5, after the image pickup chip 2 is set at a predetermined position of the header 1 and the leads 4 are wired,
It is molded so as to cover the header 1, the imaging chip 2, and the leads 4. As a result, the image pickup chip 2 and the leads 4 are fixed and protected, and electrical insulation is secured.

FIG. 2 is a front view of the solid-state image pickup device in which the synthetic resin portion 5 is coated and molded in this manner, and the hatched portion is the synthetic resin portion 5. As shown in this FIG.
The front surface of the imaging surface 3 is not covered with the synthetic resin part 5.

After the synthetic resin portion 5 is hardened, a cover glass 6 formed in the same shape as the front opening portion of the synthetic resin portion 5 is adhered to the front opening portion of the synthetic resin portion 5. that time,
It is preferable to use the same epoxy adhesive as the synthetic resin part 5. Further, if both the synthetic resin portion 5 and the adhesive are black, it is effective to prevent the generation of ghosts due to the reflection of ambient light.

The cover glass 6 and the imaging surface 3 of the imaging chip 2
A small space 7 is formed between and
Is an air layer. In this way, by providing the space 7 composed of the air layer in front of the imaging surface 3, the light condensing effect is enhanced. The thickness e of the space 7 is, for example, 0.05 to
Although it is about 0.2 mm, it may be more or less than that.

Further, since the joint surface between the synthetic resin portion 5 and the cover glass 6 is formed in a taper shape which gradually expands forward, eclipse of an effective ray and incidence of an unnecessary ray due to reflection are suppressed. .

The solid-state image pickup device constructed as described above is arranged in the image forming part of the objective optical system of the electronic endoscope, and after the endoscope is used, the whole endoscope is placed in the high-pressure steam sterilizer or the like. It may be housed and placed in a hot environment.

However, since there is no adhesive between the front surface of the image pickup surface 3 and the cover glass 6 and there is only the space 7, the image pickup light does not become yellowish due to the temperature rise by the high-pressure steam sterilizer. It should be noted that the parts made of metal, ceramics, glass, etc., which constitute the solid-state imaging device, are not damaged at such a temperature.

[0019]

According to the present invention, a portion other than the image pickup surface is covered and molded with a synthetic resin from the peripheral portion of the image pickup surface to the side surface of the image pickup chip, and the front opening of the synthetic resin portion is provided between the image pickup surface. Since the cover glass is joined with a space between the two, a picked-up image does not yellow even when placed in a high-temperature environment by a high-pressure steam sterilizer or the like, and a good picked-up image quality can always be obtained.

If the synthetic resin is made black and the joint surface between the synthetic resin portion and the cover glass is formed in a tapered shape that gradually expands forward, reflection of unnecessary light in the peripheral portion of the optical path is suppressed, and the ghost is suppressed. Is effective in preventing the occurrence of

[Brief description of drawings]

FIG. 1 is a side sectional view of an embodiment.

FIG. 2 is a front view of the embodiment in the process of being manufactured.

FIG. 3 is a side sectional view of a conventional example.

[Explanation of symbols]

 2 Image pickup chip 3 Image pickup surface 4 Lead 5 Synthetic resin part 6 Cover glass 7 Space

Claims (3)

[Claims] 1. A synthetic resin is coated and molded on a portion other than the image pickup surface from a peripheral portion of an image pickup surface provided on a front surface of the image pickup chip to a side surface of the image pickup chip, and the front opening portion of the synthetic resin portion is formed by the above-mentioned method. A solid-state imaging device for an electronic endoscope, characterized in that a cover glass is bonded to the imaging surface with a space provided therebetween. 2. The solid-state image pickup device for an electronic endoscope according to claim 1, wherein the synthetic resin is black. 3. The solid-state imaging device for an electronic endoscope according to claim 1, wherein a joint surface between the synthetic resin portion and the cover glass has a tapered shape that gradually expands forward.