JPH08236971A - Radiator and heat radiating structure for electronic equipment - Google Patents

Abstract

PURPOSE: To provide a radiator which is contrived to prevent the thermal deformation of a printed board and to not hinder the heat radiating effect of a convection of air by surely securing a gap between the printed board and radiator and a heat radiating structure constituted similarly to the radiator. CONSTITUTION: A radiator 1 which is held by a fitting 14 so that the radiator 1 can be positioned above a printed board is provided with a plurality of projecting sections 2 on its surface facing the printed board and the sections 2 are passed through a solder bath so that no ventilating gap can be formed between the surface of the radiator and printed board even when the printed board warps.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiator for electronic equipment such as audio equipment and a heat radiation structure using the radiator.

[0002]

2. Description of the Related Art FIGS. 4A and 4B show a conventional radiator of a vehicle-mounted audio equipment and its mounting structure. In the figure, reference numeral 11 denotes a radiator, which is disposed and held by a mounting bracket 14 so as to be positioned on the printed circuit board 12, and the heat generating electronic component 13 mounted on the printed circuit board 12 is mounted.

The radiator 11 is usually provided with a mounting bracket 14 so that a predetermined gap y is formed between the radiator 11 and the printed circuit board 12.
After the terminal 13a of the heat-generating electronic component 13 is inserted into the printed board 12, the heat-generating electronic component 13 is attached to the radiator 11 and soldered through the solder bath in this state.

[0004]

However, in the conventional radiator and its mounting structure, as described above, the radiator 1
Even if a gap y is formed between the printed circuit board 12 and the printed circuit board 12, the printed circuit board 12 is warped by the heat of the solder tank when it is passed through the solder tank as shown in FIGS. Therefore, the gap y is not uniform.

As the gap y becomes smaller, as shown in FIG. 6, the heat-generating electronic component 13 and the mounting bracket 1
4 and the air around the radiator 11 are alienated from convection, and the heat radiation effect is deteriorated.

An object of the present invention is to eliminate the above-mentioned drawbacks of the conventional radiator and heat dissipation structure, prevent deformation of the printed circuit board due to heat, and ensure the gap between the printed circuit board and the radiator. Another object of the present invention is to provide a radiator that ensures the heat dissipation effect by convection of air and such a heat dissipation structure.

[0007]

A radiator of an electronic device according to the present invention is a radiator arranged on a printed circuit board and held by a mounting bracket so that a plurality of radiators are provided on a surface facing the printed circuit board. It is provided with individual convex portions.

Further, the heat dissipation structure of the electronic device of the present invention is arranged by holding the printed circuit board and the heat-generating electronic components mounted on the printed circuit board by mounting metal fittings so as to be located on the printed circuit board. In a heat dissipation structure of an electronic device including a radiator, the radiator is provided with a plurality of convex portions on a surface facing the printed board, and the printed board surface is in contact with the convex portions. And a gap for ventilation is formed between them and the gap serves as a path for heat convection.

[0009]

The radiator is arranged so as to be held by the mounting metal fitting so that a predetermined gap is formed between the radiator and the printed board. And solder it through the solder bath. At this time, even if the printed circuit board warps due to the heat of the solder bath, the radiator has a plurality of convex portions on the surface facing the printed circuit board. A predetermined gap is secured between the printed circuit board and the printed circuit board.

In the heat dissipation structure having the gap as described above, the gap serves as a path for thermal convection, and the heat dissipation effect is not impeded, and the heat dissipation electronic component can be reliably cooled.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a radiator of an electronic device and a heat radiation structure thereof according to the present invention will be described with reference to FIGS. 1 to 3, but the same components as those of the conventional one described with reference to FIGS. Are denoted by the same reference numerals, and detailed description thereof will be omitted. FIG. 1 is a front view showing a radiator of the present invention, FIG. 2 is a front view showing a state where a radiator is attached, and FIG. 3 is an enlarged side view of a main part showing a state where the radiator is attached.

In the figure, reference numeral 1 is a radiator 1, and a plurality of convex portions 2 are provided at predetermined intervals on a surface (a lower surface in the illustrated example) facing the printed board 12. Reference numeral 3 is a mounting hole for mounting the heat-generating electronic component 13. The convex portions 2 are formed in a rib shape, L in the drawing is the pitch between the convex portions, m is the width of the convex portions, and n is the height (convex amount) of the convex portions.

In the embodiment, it is shown as a radiator for an on-vehicle audio equipment. From the outer diameter size of the on-vehicle audio equipment, it is sufficient that L is about 20 mm to 30 mm and m is about 5 mm to 10 mm.

FIG. 2 is a front view showing a state in which the radiator 1 is mounted on the printed circuit board 12 by a mounting bracket 14, and S in the figure is a clearance between the convex portion 2 and the printed circuit board 12. . Further, by appropriately setting the height n of the convex portion 2, it is possible to control the influence of thermal deformation of the printed circuit board 12 after passing through the solder bath. That is, as shown in FIG. 5, the gap У between the radiator 1 and the printed circuit board 12 is ≧≧ n + S (∴Уmin = n). Therefore, S should be set to the minimum value in consideration of the error and variation in the component dimensions, and n should be set to the minimum required gap Уmin.

[0015]

EFFECTS OF THE INVENTION According to the radiator and the heat dissipation structure of the electronic device of the present invention, (1) printing is performed even when the heat sink is placed on the printed board and the printed board is thermally affected. It is possible to secure a predetermined gap with the substrate and maintain the set heat dissipation effect. (2) The radiator is simple because it does not require separate parts, additional machining, repairs, etc. and can achieve a predetermined heat radiation effect. (3) Even after external pressure is applied to the radiator after the printed circuit board is incorporated into the main body to form a product after passing through the solder bath, the gap can be maintained because the structure is strong. (4) Deformation of the printed circuit board is prevented, which facilitates assembly. (5) If the heat sink and mounting bracket have good processing accuracy and dimensional accuracy, the amount of protrusion of the terminals of the heat-generating electronic components from the printed circuit board will be stable, improving the product quality such as electrical continuity and vibration resistance. To do.

[Brief description of drawings]

FIG. 1 is a front view of a radiator of the present invention.

FIG. 2 is a front view showing a mounting state of a radiator.

FIG. 3 is an enlarged side view of a main part showing a mounted state of a radiator.

4A and 4B show a mounting state of a conventional radiator, where FIG. 4A is a front view and FIG. 4B is a side view.

FIG. 5 shows a state where the printed circuit board is thermally deformed, (A)
Is a front view and (B) is a side view.

FIG. 6 is a side view showing heat convection.

[Explanation of symbols]

 1 Radiator 2 Convex part 3 Mounting hole 12 Printed circuit board 13 Heat generating electronic component 14 Mounting bracket

Claims (2)

[Claims] 1. An electronic device, comprising: a radiator disposed on a printed circuit board and held by a mounting bracket, wherein a plurality of protrusions are provided on a surface facing the printed circuit board. Radiator. 2. A heat dissipation structure for an electronic device, comprising: a printed circuit board; and a heat radiator arranged on the printed circuit board for mounting a heat generating electronic component mounted on the printed circuit board, the radiator being held by a mounting bracket. In the above, the radiator is provided with a plurality of convex portions on the surface facing the printed circuit board, and even when the printed circuit board surface is in contact with the convex portions, there is a ventilation gap between the radiator and the printed circuit board surface. A heat-dissipating structure for electronic equipment, wherein the gap serves as a path for thermal convection.