JPH08236580A - Connecting method of ic chip to wiring substrate and micro-ic connector - Google Patents

Abstract

PURPOSE: To weld-fix terminals and conductor wires firmly without fail by a method wherein at least exceeding one each of conductor wires of one end part of a micro connector is brought into contact with IC chip terminals in the alignment state as well as the conductor wires of the other end part are also brought into contact with the terminals of the wiring substrate in the alignment state for pressure-welding the contact part by welding electrodes. CONSTITUTION: An incidence solder 6 is fixed on a substrate terminal 5 connected respectively to a chip terminal 3 arranged on an IC chip 2 at a narrow pitch as well as another chip terminal 3 of a wiring substrate 4 whereon this chip 2 is fixed. Next, the substrate 4 fitted with a guide pin is fixed to the base plate 16 of a welding jig 15 and simultaneously guide pin 10 is inserted into the guide hole of a semiconductor 8 for making alignment. Furthermore, a welding electrode fitting body 19 lowered so that conductor wires 9 may be pressure-welded onto the solder 6 of the chip 3 and the terminal 5 respectively by welding electrodes 20 and 21. Through these procedures, many conductive wires can be firmly weld-fixed without fail a short time.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is to connect terminals of a multi-pin IC chip arranged at a narrow pitch to terminals of a wiring board.
The present invention relates to a method for connecting a C chip and a wiring board and a micro IC connector used for the connection.

[0002]

2. Description of the Related Art Conventionally, the connection between the terminals of an IC chip and the terminals of a wiring board is generally performed by a wire bonding method.

[0003]

In the conventional wire bonding method, since the position searching capacity of the general-purpose bonder has a distance between parallel pitches of 0.2 mm or more,
A stitch bond having a pitch of less than 0.2 mm cannot be searched by laser, and an expensive special auto bonder is required. Also, as the bonding medium, pure gold wire or pure aluminum wire is used because of its high corrosion resistance and high conductivity, but the bonding strength is weak due to the interface bonding, and the bonding interface is detached due to external vibration. There is a drawback that the wiring is time-consuming due to an increase in the number of terminals with a narrow pitch, and an efficient wiring cannot be performed.

In view of the above-mentioned conventional drawbacks, the present invention has been made.
Even if the number of terminals is increased with a narrow pitch, it is possible to efficiently connect the wires in a short time, to obtain a sufficient bonding strength of the wires, and to narrow the pitch of the wires. Connection method and micro I
It is intended to provide a C connector.

The above and other objects and novel characteristics of the present invention will become more fully apparent when the following description is read in view of the accompanying drawings. However, the drawings are for explanation only and do not limit the scope of the present invention.

[0006]

In order to achieve the above object, the present invention provides a large number of IC chip terminals arranged on a wiring board at a narrow pitch, and IC chips mounted on the wiring board.
At least one or more of the IC chip terminals and the board terminals are arranged in contact with each other in connection with a large number of board terminals formed at a predetermined narrow pitch on the wiring board, which are respectively connected to the chip terminals. A large number of conductive wires, a connecting portion integrally cuttable at both ends for fixing these conductive wires at predetermined positions, and a positioning guide hole formed in a connecting portion for connecting both end portions of this connecting portion, or A positioning step of using a micro IC connector in which a guide groove is formed, and a conductive wire of the micro IC connector is positioned in the IC chip terminal and the substrate terminal by a positioning guide hole or guide groove, and an IC chip terminal after this positioning step. Welding process in which the conductive wire is pressed and welded by the welding electrode and the conductive wire is pressed and welded to the board terminal by the welding electrode. It constitutes a cutting removing step of cutting and removing the connecting portion and connecting portion of the micro IC connector after welding process IC pitch and the connection of a wiring board.

Further, according to the present invention, a large number of conductive wires plated with gold brazing, solder plating, bright gold plating, etc., in which at least one or both ends are connected to the IC chip terminal and the board terminal, respectively, and these conductive wires A connecting portion integrally cuttable at both ends for fixing the wire at a predetermined position, a connecting portion for connecting both end portions of the connecting portion, and a positioning guide formed at substantially the center of the connecting portion. The hole or the guide groove constitutes a micro IC connector.

[0008]

In the method of connecting the IC chip and the wiring board configured as described above, at least one or more conductive wires at one end of the micro IC connector are brought into contact with the terminals of the IC chip in a positioned state, and at the other end The conductive wire is brought into contact with the terminal of the wiring board in a positioned state, and the contact portion is pressed and welded by the welding electrode, whereby the terminal and the conductive wire are firmly and reliably welded and fixed.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below with reference to the embodiments shown in the drawings.

In the first embodiment of the present invention shown in FIGS. 1 to 10, reference numeral 1 denotes a bumping process, which is arranged on the IC chip 2 at a narrow pitch as shown in FIGS. And a large number of IC chip terminals 3
Gold solder, solder, etc. are applied to the plurality of IC chip terminals 3 of the wiring board 4 such as a printed circuit board or a ceramics board to which the C chip 2 is fixed and the board terminals 5 arranged at a narrow pitch. 6 are fixed respectively.

As shown in FIG. 4, a row 6 of a large number of IC chip terminals 3 of the IC chip 2 and a row 6 of the board terminals 5 of the wiring board 4 are electrically conductive wires 9 of a micro IC connector 8. In the positioning step of positioning so that they can be connected to each other, the micro IC connector 8 used in this positioning step 7 has a thickness of, for example, 25 as shown in FIG.
The wiring board 4 is formed in a substantially central portion of both ends by electron beam, excimer laser, machining, etching, precision press or the like using a rectangular metal frame material such as micron Kovar, 42 alloy, phosphor bronze, nickel silver and the like. The guide holes 11 and 11 engaging with the guide pins 10 and 10 provided in the guide holes 11a and 11a and the guide holes 11 and 11 or the guide grooves 11a and 11a.
The metal frame material 12 between the connecting portions 13, 13 on both sides
The same pitch as or a fraction of the pitch of the IC chip terminals 3 and the substrate terminals 5
Formed on the outer peripheral portion of the metal frame member 12 and a large number of conductive wires 9 which are formed to have the same pitch or a fraction of a pitch, for example, the minimum dimension is 30 to 40 μm pitch. The connection parts 13, 1
3 and 4 for removing the guide holes 11 and 11 forming parts
It consists of a pair of notches 14, 14, 14, 14 and is plated with nickel as a base and then soldered.
Alternatively, nickel plating is used as a base, and then gold plating and tin plating are applied.

In the positioning step 7, FIG. 6 and FIG.
The wiring board 4 having the guide pins 10 and 10 attached thereto is fixed to the base plate 16 of the welding jig 15, and the guide holes 11 and 11 of the micro IC connector 8 are inserted into the guide pins 10 and 10 as shown in FIG. .

In this state, one of the many conductive wires 9 of the micro IC connector 8 is connected to the IC chip terminal 3 of the IC chip 2.
Of the conductive wire 9 and the solder 6 of the other substrate terminal 5 of the conductive wire 9 respectively. in this case,
When the conductive wires 9 are formed at the same pitch as the IC chip terminals 3, one conductive wire 9 contacts one IC chip terminal 3 and is a fraction of the pitch of the IC chip terminals 3. When the conductive lines 9 are formed at the pitch of 1, the plurality of conductive lines 9 are in contact with one IC chip terminal 3.

Reference numeral 17 denotes a welding step performed after the positioning step 7. This welding step 17 is a welding electrode attachment body 19 which is vertically movably attached to a column 18 standing on the base plate 16 as shown in FIG. And the conductive wires 9 are pressed to the solder 6 of the IC chip terminal 3 by the welding electrodes 20 respectively, and the conductive wires 9 are pressed to the solder 6 of the substrate terminals 5 by the welding electrodes 21, respectively, and the voltage is set to 0.002 seconds. The temperature is increased to 250 ° C. to 300 ° C. and welding is performed.

Reference numeral 22 designates the connecting portions 13, 13 of the micro IC connector 8 welded and fixed after the welding step 17, as shown in FIG.
In the cutting and removing step of bending or cutting at the conductive wire 9 portion with scissors, a cutter knife or the like as shown in FIG.
By removing 3 and 13, the conductive lines 9 are connected to the IC chip terminal 3 and the substrate terminal 5, respectively, as shown in FIG.

The IC chip terminals arranged on the other side of the IC chip 2 are also connected by the same method as described above. Further, the micro IC connector 8 may be formed by an electroforming method.

[0017]

Different Embodiments of the Present Invention Next, different embodiments of the present invention shown in FIGS. 11 to 22 will be described. In the description of these different embodiments of the present invention, the same components as those of the first embodiment of the present invention will be designated by the same reference numerals and redundant description will be omitted.

The second embodiment of the present invention shown in FIGS. 11 to 13 is mainly different from the first embodiment of the present invention in the micro IC connector 8A used in the positioning step 7A. The connector 8A has a conductive wire 9 formed on the surface of the insulating film 23 and having the same pitch as the pitch of the IC chip terminals 3 and the pitch of the board terminals 5.
Are formed. Micro IC formed in this way
By using the connector 8A, the cutting / removing step is unnecessary, or the wiring work can be performed only by a simple cutting / removing work of cutting and removing only the end portion of the film 23 in which the guide holes 11, 11 are formed. .

The third embodiment of the present invention shown in FIGS. 14 to 16 is mainly different from the first embodiment of the present invention in the micro IC connector 8B used in the positioning step 7B. The connector 8B has a connecting portion 13,
Both ends of the conductive wire 9 and the connecting portions 13, 13 are formed with cut portions 24, 24 having a size smaller than the size of the conductive wire 9 so that the conductive wire 9 can be easily cut and removed. By using the micro IC connector 8B thus formed, the cutting / removing step 22 can be performed easily, and the connection work can be performed more easily.

The fourth embodiment of the present invention shown in FIGS. 17 to 19 is mainly different from the first embodiment of the present invention in the micro IC connector 8C used in the positioning step 7C. The connector 8C is formed such that one of the conductive wires 9 has the same pitch as the pitch of the IC chip terminals 3 and the other of the conductive wires 9 is a substrate terminal so that the connector 8C can be connected even when the pitch of the IC chip terminals 3 and the pitch of the board terminals 5 are different. The conductive wires 9 are formed on the metal frame material 12 so as to have the same pitch as the pitch of 5. By using the micro IC connector 8C thus formed, I
Even if the pitch of the C chip terminals 3 and the pitch of the substrate terminals 5 are different, the wiring operation can be performed by the same operation.

The fifth embodiment of the present invention shown in FIGS. 20 to 22 is mainly different from the first embodiment of the present invention in that the IC chip terminal 3 of the IC chip 2 is gold-plated, solder-plated or soldered. The plating process 1A for forming the substrate is performed, and the substrate terminal 5 of the wiring substrate 4 is plated with gold, solder, or solder is used to form a micro I
When the positioning step 7D is performed using the C connector 8 and N ² + H ² is used when solder is formed on the terminals,
Since the welding step 17A is performed in a gas, even if the connection is performed in this manner, the same operational effect as that of the first embodiment of the present invention can be obtained.

[0022]

As is apparent from the above description, the following effects can be obtained in the present invention.

(1) A large number of IC chip terminals mounted on the wiring board at a narrow pitch and a plurality of IC chip terminals formed on the wiring board connected to the IC chip terminals at a predetermined narrow pitch. In the connection with a large number of board terminals, a large number of conductive wires arranged so as to contact at least one or more of the IC chip terminal and the board terminal, and at both ends for fixing these conductive wires at predetermined positions. A micro IC connector having a connecting portion integrally formed so that it can be cut and a positioning guide hole or guide groove formed in the connecting portion connecting both ends of the connecting portion is used, and a conductive wire of the micro IC connector is used. Positioning step for positioning the IC chip terminal and the board terminal in the positioning guide hole or guide groove, and after the positioning step, A welding step of pressing and welding an electric wire with a welding electrode and a conductive wire to a substrate terminal by a welding electrode, and a cutting and removing step of cutting and removing a connecting portion and a connecting portion of a micro IC connector after this welding step. Therefore, a connecting portion is provided at both ends of the conductive wire connected to the IC chip side terminal and the board side terminal arranged at a narrow pitch, and a large number of conductive wires are accurately connected to the IC chip side terminal and the board side terminal. , And the whole can be welded and fixed at the same time. Therefore, a large number of conductive wires can be connected in a short time.

(2) According to the above (1), the conductive wire and the terminal are welded and fixed, so that the wire is securely fixed, and even if a micro super vibration due to a super high frequency of the GHZ band is received, a disconnection accident in which the joint is dislodged is efficient. This can be well prevented, and the reliability of the product can be improved.

(3) According to the above (1), the positioning can be achieved by inserting the guide hole or the guide groove of the micro IC connector into the guide pin.
The conductive wire can be accurately positioned in the terminal portion in a short time, and the wiring work can be performed efficiently.

(4) Due to the above (1), it is possible to extremely easily increase the number of wirings with a narrow pitch.

(5) Claims 2 to 6 are also the above (1) to (4).
The same effect can be obtained.

[Brief description of drawings]

FIG. 1 is a process drawing showing a first embodiment of the present invention.

FIG. 2 is an enlarged side view of an essential part with a wax fixed.

FIG. 3 is an enlarged plan view of an essential part with a wax fixed.

FIG. 4 is an explanatory diagram of a positioning process.

FIG. 5 is a plan view of a micro IC connector.

FIG. 6 is a front view showing a state where the welding jig is attached.

FIG. 7 is a side view showing a state of being attached to a welding jig.

FIG. 8 is an explanatory view of a welding process.

FIG. 9 is an explanatory diagram of a cutting and removing step.

FIG. 10 is a front view showing a connected state.

FIG. 11 is a process drawing showing the second embodiment of the present invention.

FIG. 12 is an explanatory diagram of a micro IC connector according to a second embodiment of the present invention.

FIG. 13 is an explanatory diagram of a welding process according to the second embodiment of the present invention.

FIG. 14 is a process drawing showing the third embodiment of the present invention.

FIG. 15 is an explanatory diagram of a micro IC connector according to a third embodiment of the present invention.

FIG. 16 is an explanatory diagram of a cutting and removing step according to the third embodiment of the present invention.

FIG. 17 is a process drawing showing the fourth embodiment of the present invention.

FIG. 18 is an explanatory diagram of a micro IC connector according to a fourth embodiment of the present invention.

FIG. 19 is a front view showing a connection state of a fourth embodiment of the present invention.

FIG. 20 is a process drawing showing the fifth embodiment of the present invention.

FIG. 21 is an enlarged side view of a connecting portion according to the fifth embodiment of the present invention.

FIG. 22 is an explanatory diagram of a welding process according to the fifth embodiment of the present invention.

[Explanation of symbols]

 1: Bumping process, 1A: Plating process, 2: IC chip, 3: IC chip terminal, 4: Wiring board, 5: Board terminal, 6: Row, 7, 7A, 7B, 7C, 7D: Positioning process, 8, 8A, 8B, 8C: Micro IC connector, 9: Conductive wire, 10: Guide pin, 11: Guide hole, 12: Metal frame material, 13: Connection part, 14: Notch part, 15: Welding jig, 16 : Base plate, 17, 17A: Welding process, 18: Struts, 19: Welding electrode attachment body, 20: Welding electrode, 21: Welding electrode, 22: Cutting removal process, 23: Film, 24: Cutting part.

Claims (6)

[Claims] 1. A large number of IC chip terminals arranged on a wiring board at a narrow pitch, and I
At least one or more of the IC chip terminals and the board terminals are arranged in contact with each other in connection with a large number of board terminals formed at a predetermined narrow pitch on the wiring board, which are respectively connected to the C chip terminals. A large number of conductive wires,
A connecting portion integrally formed to be cuttable at both ends for fixing these conductive wires at predetermined positions and a positioning guide hole or guide groove formed at the connecting portion for connecting both end portions of the connecting portion are formed. Using a micro IC connector,
A positioning step in which the conductive wire of the micro IC connector is positioned in the IC chip terminal and the board terminal by a positioning guide hole or guide groove, and an IC after this positioning step.
Welding process in which the conductive wire is pressed and welded to the chip terminal with the welding electrode, and the conductive wire is pressed and welded to the substrate terminal with the welding electrode, and the connecting portion and the connecting portion of the micro IC connector are cut and removed after this welding step. A method of connecting an IC chip and a wiring board, comprising: 2. A plurality of IC chip terminals arranged at a narrow pitch of IC chips mounted on a wiring board, and the IC chip terminals.
At least one or more of the IC chip terminals and the board terminals are arranged in contact with each other in connection with a large number of board terminals formed at a predetermined narrow pitch on the wiring board, which are respectively connected to the C chip terminals. Using a large number of conductive wires and a micro IC connector formed of an insulating material sheet having positioning guide holes or guide grooves formed at both ends for fixing these conductive wires at predetermined positions,
A positioning step in which the conductive wire of the micro IC connector is positioned in the IC chip terminal and the board terminal by a positioning guide hole or guide groove, and an IC after this positioning step.
A method for connecting an IC chip and a wiring board, which comprises a welding step of welding a conductive wire to a chip-side terminal by pressing it with a welding electrode and welding a conductive wire to a board terminal by pressing it with a welding electrode. 3. A plurality of IC chip terminals arranged at a narrow pitch of IC chips mounted on a wiring board, and the IC chip terminals.
In connection with a large number of board terminals formed at a predetermined narrow pitch on the wiring board, which are respectively connected to C chip terminals, gold solder is connected to the IC chip terminals and the board terminals,
A bumping step of subjecting solder or the like to a bumping step of a solder, and a gold brazing plating, a solder plating, arranged so as to contact at least one or more of the IC chip terminal and the board terminal subjected to the bumping step, A large number of conductive wires that have been plated with bright gold, connecting parts that are integrally molded so that they can be cut at both ends that fix these conductive wires in place, and positioning that is formed on the connecting parts that connect these connecting parts Micro I with guide holes or guide grooves
A positioning step of using the C connector to position the conductive wire of the micro IC connector in the bump of the IC chip terminal and the bump of the board terminal by the positioning guide hole or guide groove, and after the positioning step, the bump of the IC chip terminal While pressing the conductive wire with the welding electrode to weld it,
An IC chip comprising: a welding step of welding a conductive wire to a bump of a substrate terminal by pressing it with a welding electrode; and a cutting and removing step of cutting and removing a connecting portion and a connecting portion of a micro IC connector after the welding step. And wiring board connection method. 4. A large number of IC chip terminals arranged at a narrow pitch of IC chips mounted on a wiring board and I
In connection with a large number of board terminals formed at a predetermined narrow pitch on the wiring board, which are respectively connected to C chip terminals, gold solder is connected to the IC chip terminals and the board terminals,
A bumping step of subjecting solder or the like to a bumping step of a solder, and a large number of conductive wires arranged so as to contact at least one or more of the IC chip terminal and the board terminal subjected to the bumping step; A micro IC connector formed of a sheet made of an insulating material in which positioning guide holes or guide grooves are formed at both ends for fixing these conductive wires at predetermined positions is used, and the conductive wires of the micro IC connector are IC chips. A positioning step of positioning the terminal and the board terminal with a positioning guide hole or guide groove, and after this positioning step, the conductive wire is pressed and welded to the IC chip side terminal by a welding electrode, and the conductive wire is welded to the board terminal. A method of connecting an IC chip and a wiring board, which comprises a welding step of welding by pressing with an electrode. 5. Gold brazing, wherein both ends are connected to at least one IC chip terminal and at least one board terminal, respectively.
A large number of conductive wires that have been plated with solder, bright gold, etc., a connecting portion that is integrally cuttable at both ends that fix these conductive wires in place, and both ends of this connecting portion are connected. A micro IC connector comprising a connecting portion and a positioning guide hole or a guide groove formed in substantially the center of the connecting portion. 6. An IC chip terminal is provided between an insulating sheet having positioning guide holes or guide grooves formed at both ends and a positioning guide hole or guide groove of the insulating sheet. A micro IC connector comprising a board terminal and a large number of conductive wires arranged so that at least one or both ends thereof are connected to each other.