JPH08228061A - One-surface joining structure of lead pin - Google Patents
One-surface joining structure of lead pinInfo
- Publication number
- JPH08228061A JPH08228061A JP7032216A JP3221695A JPH08228061A JP H08228061 A JPH08228061 A JP H08228061A JP 7032216 A JP7032216 A JP 7032216A JP 3221695 A JP3221695 A JP 3221695A JP H08228061 A JPH08228061 A JP H08228061A
- Authority
- JP
- Japan
- Prior art keywords
- lead pin
- spacer
- soldering
- hole
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、電子部品のリードピ
ンを電気回路基板の片面に半田付け接合する技術に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for soldering and joining a lead pin of an electronic component to one surface of an electric circuit board.
【０００２】[0002]
【従来の技術】図４に示すのは、この種の従来技術であ
り、電子部品のリードピン１を電気回路基板６のスルホ
ール２に挿通し、回路面側において半田４付け接合して
いる。2. Description of the Related Art FIG. 4 shows a conventional technique of this type, in which a lead pin 1 of an electronic component is inserted into a through hole 2 of an electric circuit board 6 and solder 4 is joined on the circuit surface side.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、このよ
うな構造では、リードピン１は、電気回路基板６の片面
の半田４付けのみで支持されているので、振動が加わっ
たり、熱応力が加わると半田４付け部に応力が集中し破
壊する。これを防止するために半田４の量を増やす試み
もなされているが、この場合も、変形するリードピン１
の非半田付け側がスルホール２の開口部に接触し、この
部分に応力が集中し、リードピン１が破損する等の虞が
あった。However, in such a structure, since the lead pin 1 is supported only by soldering 4 on one surface of the electric circuit board 6, when the vibration or the thermal stress is applied, the solder is applied. 4 Stress concentrates on the attachment and breaks. Attempts have been made to increase the amount of solder 4 in order to prevent this, but in this case as well, the deformed lead pin 1
There is a risk that the non-soldered side comes into contact with the opening of the through hole 2, stress concentrates on this portion, and the lead pin 1 is damaged.
【０００４】本発明は、上記事由に鑑みてなしたもの
で、リードピン１やリードピン１の半田４付け部が破損
しにくいリードピンの片面接合構造を提供することであ
る。The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a single-sided joint structure for a lead pin in which the lead pin 1 and a soldering portion of the lead pin 1 are not easily damaged.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決する請求
項１記載の発明は、リードピン１を電気回路基板６のス
ルホール２に挿通して片面半田４付け接合するリードピ
ンの片面接合構造において、非半田付け側５に、断面が
楔状で徐々に増加し、且つ、リードピン１を囲むスペー
サー３を、薄肉側を内側にしてリードピン１とスルホー
ル２の間に圧入介在させて成ることを特徴とするリード
ピンの片面接合構造である。According to a first aspect of the present invention for solving the above-mentioned problems, in a single-sided joint structure of a lead pin in which the lead pin 1 is inserted into a through hole 2 of an electric circuit board 6 and joined by one-sided soldering 4, A lead pin having a wedge-shaped cross section gradually increasing on the soldering side 5, and a spacer 3 surrounding the lead pin 1 is press-fitted between the lead pin 1 and the through hole 2 with the thin side inside. This is a single-sided bonded structure.
【０００６】請求項２記載の発明は、スペーサー３が筒
型であることを特徴とする請求項１記載のリードピンの
片面接合構造である。The invention according to claim 2 is the single-sided joint structure for a lead pin according to claim 1, characterized in that the spacer 3 is cylindrical.
【０００７】請求項３記載の発明は、請求項１記載の発
明において、スペーサー３が外周にローレット７を形成
した筒型であることを特徴とする請求項１記載のリード
ピンの片面接合構造である。A third aspect of the present invention is the single-sided joint structure for a lead pin according to the first aspect, characterized in that, in the first aspect of the invention, the spacer 3 is a cylindrical type in which a knurl 7 is formed on the outer periphery. .
【０００８】ここで、スペーサー３は、金属製、合成樹
脂製等の任意の材料で形成され、リードピン１を取り囲
むように配置されるものであれば、筒型のもの、複数の
割型からなるもの（例えば、筒型体を縦方向に複数分割
したようなもの）など所要に選択できる。Here, the spacer 3 is formed of any material such as metal or synthetic resin, and if it is arranged so as to surround the lead pin 1, it is of a cylindrical type or a plurality of split dies. A desired one (for example, a tubular body divided into a plurality of pieces in the vertical direction) can be selected as required.
【０００９】また、スペーサー３をリードピン１とスル
ホール２の間に圧入介在させる場合に、筒型のスペーサ
ー３を予めリードピン１に嵌合しておき、嵌合した状態
でスルホール２に圧入してもよいし、また、予め、スル
ホール２にリードピン１を挿入しておき、その上で、両
者の隙間を埋めるように、楔型のスペーサー３を圧入し
てもよいなど、スルホール２とリードピン１との間にス
ペーサー３を介在させる手段は任意に選択しうる。Further, when the spacer 3 is press-fitted between the lead pin 1 and the through hole 2, the tubular spacer 3 is fitted into the lead pin 1 in advance, and the spacer 3 is press fitted into the through hole 2 in the fitted state. Alternatively, the lead pin 1 may be inserted into the through hole 2 in advance, and then the wedge-shaped spacer 3 may be press-fitted so as to fill the gap between the lead pin 1 and the through hole 2 and the lead pin 1. The means for interposing the spacer 3 therebetween can be arbitrarily selected.
【００１０】[0010]
【作用】請求項１記載の発明では、リードピン１は、半
田４付け部のみならず、非半田付け側５においてもスペ
ーサー３を介して支持されるので、熱応力等が、半田４
付け部または非半田付け側５の片側に集中することがな
い。According to the first aspect of the present invention, the lead pin 1 is supported not only on the solder 4 attachment portion but also on the non-soldered side 5 via the spacer 3.
It does not concentrate on one side of the attachment part or the non-soldered side 5.
【００１１】請求項２記載の発明では、スペーサー３が
筒型であるため、リードピン１が全周かつ、筒長さで規
定される広い面積で支持され、上記の効果が一層確実な
ものとなる。According to the second aspect of the present invention, since the spacer 3 has a cylindrical shape, the lead pin 1 is supported over the entire circumference and in a wide area defined by the cylinder length, and the above effect is further ensured. .
【００１２】請求項３記載の発明では、スペーサー３が
筒型であり、かつ、外周にローレット７を設けているの
で、リードピン１の支持及びスペーサー３のスルホール
２への固定が良好となり、上記の効果が一層確実なもの
となる。According to the third aspect of the present invention, since the spacer 3 has a cylindrical shape and the knurls 7 are provided on the outer periphery, the support of the lead pin 1 and the fixing of the spacer 3 to the through hole 2 are excellent, and The effect becomes more certain.
【００１３】[0013]
【実施例】本発明の実施例について以下に説明する。EXAMPLES Examples of the present invention will be described below.
【００１４】図１、図２は本発明に係わる一実施例を示
す。リードピン１は、電子部品８に設けられたもので、
このリードピン１が電気回路基板６のスルホール２に挿
通固定されている。このようにして、電子部品８は、電
気回路基板６の上にリードピン１によって実装されるの
である。1 and 2 show an embodiment according to the present invention. The lead pin 1 is provided on the electronic component 8,
The lead pin 1 is inserted and fixed in the through hole 2 of the electric circuit board 6. In this way, the electronic component 8 is mounted on the electric circuit board 6 by the lead pins 1.
【００１５】このリードピン１の非半田付け側５に、断
面が楔状で徐々に増加する金属製のスペーサー３を嵌合
し、このスペーサー３をリードピン１とスルホール２の
間に圧入介在させている。A metal spacer 3 having a wedge-shaped cross section and gradually increasing is fitted to the non-soldered side 5 of the lead pin 1, and the spacer 3 is press-fitted between the lead pin 1 and the through hole 2.
【００１６】この実施例では、スペーサー３が筒型であ
るため、リードピン１が全周かつ、筒長さで規定される
広い面積で支持されている。In this embodiment, since the spacer 3 is cylindrical, the lead pin 1 is supported on the entire circumference and in a wide area defined by the cylinder length.
【００１７】図３は本発明に係わる異なる実施例を示
す。即ち、本発明の異なる実施例に使用するスペーサー
３を示している。このスペーサー３は、外周にローレッ
ト７を形成した筒型である。従って、上記のように、こ
のスペーサー３をリードピン１とスルホール２の間に圧
入介在させるとき、リードピン１が全周かつ、筒長さで
規定される広い面積で支持されると共に、スペーサー３
のスルホール２への固定がローレット７の係合により、
一層確実になる。FIG. 3 shows a different embodiment according to the invention. That is, the spacer 3 used in the different embodiments of the present invention is shown. The spacer 3 has a cylindrical shape in which a knurl 7 is formed on the outer circumference. Therefore, when the spacer 3 is press-fitted between the lead pin 1 and the through hole 2 as described above, the lead pin 1 is supported over the entire circumference and in a wide area defined by the cylinder length, and the spacer 3
By fixing the knurl 7 to the through hole 2,
Become more certain.
【００１８】[0018]
【発明の効果】請求項１記載の発明では、リードピン１
は、半田４付け部のみならず、非半田付け側５において
もスペーサー３を介して支持されるので、熱応力等が生
じても、半田４付け部のみならず、非半田付け側５にお
いても破損しにくい。According to the invention of claim 1, the lead pin 1
Is supported not only by the solder 4 attachment portion but also by the non-soldering side 5 through the spacer 3, so that even if thermal stress occurs, not only on the solder 4 attachment portion but also on the non-soldering side 5. Hard to break.
【００１９】請求項２記載の発明では、スペーサー３が
筒型であるため、リードピン１が全周かつ、筒長さで規
定される広い面積で支持され、上記の効果が一層確実な
ものとなる。According to the second aspect of the invention, since the spacer 3 is cylindrical, the lead pin 1 is supported over the entire circumference and in a wide area defined by the cylinder length, and the above effect is further ensured. .
【００２０】請求項３記載の発明では、スペーサー３が
筒型であり、かつ、外周にローレット７を設けているの
で、リードピン１の支持及びスペーサー３のスルホール
２への固定が良好となり、上記の効果が一層確実なもの
となる。According to the third aspect of the invention, since the spacer 3 is cylindrical and the knurling 7 is provided on the outer circumference, the support of the lead pin 1 and the fixing of the spacer 3 to the through hole 2 are excellent, and The effect becomes more certain.
【図１】本発明の一実施例を示す断面図。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】同上の要部を示す断面斜視図。FIG. 2 is a sectional perspective view showing a main part of the same.
【図３】本発明の異なる実施例に使用するスペーサー３
の斜視図。FIG. 3 is a spacer 3 used in a different embodiment of the present invention.
FIG.
【図４】従来例を示す断面図。FIG. 4 is a sectional view showing a conventional example.
１ リードピン ２ スルホール ３ スペーサー ４ 半田 ５ 非半田付け側 ６ 電気回路基板 ７ ローレット 1 Lead Pin 2 Through Hole 3 Spacer 4 Solder 5 Non-Solder Side 6 Electric Circuit Board 7 Knurled
Claims (3)
ール２に挿通して片面半田４付け接合するリードピンの
片面接合構造において、非半田付け側５に、断面が楔状
で徐々に増加し、且つ、リードピン１を囲むスペーサー
３を、薄肉側を内側にしてリードピン１とスルホール２
の間に圧入介在させて成ることを特徴とするリードピン
の片面接合構造。1. In a single-sided joint structure of a lead pin in which a lead pin 1 is inserted into a through hole 2 of an electric circuit board 6 and joined by single-sided solder 4, a cross section gradually increases in a wedge shape on a non-soldered side 5, and The spacer 3 surrounding the lead pin 1 has the thin side inside and the lead pin 1 and the through hole 2
A single-sided joint structure of lead pins, characterized by being press-fitted between them.
する請求項１記載のリードピンの片面接合構造。2. The single-sided joint structure for a lead pin according to claim 1, wherein the spacer 3 has a cylindrical shape.
成して成ることを特徴とする請求項１記載のリードピン
の片面接合構造。3. The single-sided joint structure for a lead pin according to claim 1, wherein the spacer 3 is formed by forming a knurl 7 on the outer periphery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7032216A JPH08228061A (en) | 1995-02-21 | 1995-02-21 | One-surface joining structure of lead pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7032216A JPH08228061A (en) | 1995-02-21 | 1995-02-21 | One-surface joining structure of lead pin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08228061A true JPH08228061A (en) | 1996-09-03 |
Family
ID=12352738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7032216A Withdrawn JPH08228061A (en) | 1995-02-21 | 1995-02-21 | One-surface joining structure of lead pin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08228061A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007522684A (en) * | 2004-02-11 | 2007-08-09 | コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツング | Electrical components with conductive contact pins for press-fit into printed circuit board openings |
| JP2015142669A (en) * | 2014-01-31 | 2015-08-06 | ジェイ アンド シー トレーディング カンパニー リミテッド | Shoulder hyperthermia pad using hot water |
-
1995
- 1995-02-21 JP JP7032216A patent/JPH08228061A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007522684A (en) * | 2004-02-11 | 2007-08-09 | コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツング | Electrical components with conductive contact pins for press-fit into printed circuit board openings |
| JP2015142669A (en) * | 2014-01-31 | 2015-08-06 | ジェイ アンド シー トレーディング カンパニー リミテッド | Shoulder hyperthermia pad using hot water |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20020507 |