JPH08221175A - Digitizer sensor plate and its manufacture, and digitizer sensor plate manufacturing device - Google Patents

Abstract

PURPOSE: To provide a digitizer sensor plate in easy-to-manufacture structure. CONSTITUTION: A conductor S is wired in an X direction from a starting point P0, adhered and fixed in a dotted shape at the end part of a transparent plate T on the non-staring-point side with an ultraviolet-ray setting resin spot B1, and changed in direction at a direction change point P1 and wired in a Y direction by a specific distance, and the conductor is further adhered and fixed in a dotted shape with an ultraviolet-ray setting resin spot B2, changed in direction at a direction change point P2 and wired in the X direction, and adhered and fixed in a dotted shape at the end part of the transparent plate T on the starting-point side with an ultraviolet-ray setting resin spot B3; and the conductor is further changed in direction at a direction change point P3 and wired in the Y direction by a specific distance, and the wiring is similarly repeated to wire the conductor zigzag. The need for a jig (pin P, etc.) for wiring is eliminated and the wiring is automated, so there is no trouble of wiring. Further, there is no trouble of the treatment of folded parts of the conductor. Therefore, the manufacturing cost is reducible and the precision of a sensor wire can be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a digitizer sensor plate, a method for manufacturing the same, and an apparatus for manufacturing a digitizer sensor plate. More specifically, the present invention relates to a digitizer sensor plate having a structure that is easy to manufacture, a method for manufacturing the digitizer sensor plate, and a method for manufacturing the same. The present invention relates to a digitizer sensor plate manufacturing apparatus for carrying out.

[0002]

2. Description of the Related Art As shown in FIG. 8, a conventional digitizer sensor plate 700 has a plurality of pins P implanted around a glass epoxy plate 701, and an insulating coating conductor 702 is hooked on the pins P to fold back and forth. In parallel with each other, a plurality of parallel sensor lines are laid in the X direction, and a plurality of parallel sensor lines are laid in the Y direction in the same manner. The glass epoxy plate 704 is adhered and integrated. As shown in FIG. 9, when the digitizer sensor plate 700 is removed from the pin P,
A lead wire turnback portion 702 'is projected from the glass epoxy plates 701 and 704. So, for example, the actual fairness 5-211
In the technique disclosed in Japanese Patent No. 45, the glass epoxy plate 7 is used.
The glass epoxy plate 704 is made slightly larger than 01, and an adhesive agent is raised in the enlarged portion to enclose the conductor wire folded portion 702 '. Further, for example, in the technique disclosed in Japanese Utility Model Publication No. 5-42507, the conductor wire folded portion 702 ′ is bent on the glass epoxy plate 704, and a protective insulating plate is attached and fixed to the bent portion.

[0003]

In the above-mentioned conventional digitizer sensor plate 700, the insulating coated conductor wire 70 is formed by using the pin P.
It is necessary to wire 2 and there is a problem that it is troublesome.
In addition to the wiring step, a step of treating the conductor wire folded-back portion 702 'is necessary, which also causes a problem in manufacturing. Therefore, an object of the present invention is to provide a digitizer sensor plate having a structure that is easy to manufacture, a manufacturing method thereof, and a digitizer sensor plate manufacturing apparatus.

[0004]

According to a first aspect of the present invention, in the digitizer sensor plate in which a plurality of sensor lines are laid in parallel in at least one direction on a substrate, the plurality of parallel sensor lines are One or a bundle of conductive wires are arranged in a meandering shape while being turned around at the conductive wire direction changing portion at the end of the substrate and folded back, and the conductive wires are dot-shaped on the substrate at the conductive wire direction changing portion. Provided is a digitizer sensor plate which is adhesively fixed.

According to a second aspect, the present invention is a method for manufacturing a digitizer sensor plate in which a plurality of sensor lines are laid in parallel in at least one direction on a substrate, and one or one bundle is formed on the substrate. Wire the conductors in the X direction, and
The UV curable resin is dripped at the direction changing part and the UV curable resin spot formed by the dropping is irradiated with UV rays to be cured so that the conductive wire is adhered and fixed to the substrate, and after the fixation, the direction is changed to move the conductive wire in the Y direction. Wiring is performed, and an ultraviolet curable resin is dropped at a second direction changing portion that is separated by a predetermined distance in the Y direction, and the ultraviolet curable resin spot formed by the dropping is irradiated with ultraviolet rays to be cured to bond the conductive wire to the substrate. A method for manufacturing a digitizer sensor plate is characterized in that the plurality of parallel sensor wires are fixed by fixing, adhering and fixing, and changing the direction, arranging the conducting wire in the X direction, and repeating this.

According to a third aspect of the present invention, in the method for manufacturing a digitizer sensor plate having the above-mentioned structure, the present invention is between the first direction changing part and the second direction changing part and not on a straight line connecting them. An intermediate turning portion is provided at a position, and a conductor is laid from the first turning portion to the second turning portion via the middle turning portion. A manufacturing method is provided.

According to a fourth aspect of the present invention, there is provided a conductive wire arranging means for arranging a conductive wire on a substrate, an ultraviolet curable resin dropping means for dropping an ultraviolet curable resin, and an ultraviolet curable resin spot formed by the ultraviolet ray. An ultraviolet ray irradiating means for irradiating the digitizer is provided.

According to a fifth aspect of the present invention, in the digitizer sensor plate manufacturing apparatus having the above structure, the conductor wire arranging means includes a wire arranging nozzle for leading the wire from the lower end opening.
The ultraviolet curable resin dropping means includes a dispenser for dropping the ultraviolet curable resin from the lower end opening, the ultraviolet irradiation means includes a light guide for irradiating the ultraviolet curable resin spot with the ultraviolet rays guided by the optical fiber, and the wiring nozzle. Provided is a digitizer sensor plate manufacturing apparatus, characterized in that the dispenser and the light guide are supported so as to rotate around a center.

[0009]

In the digitizer sensor plate according to the first aspect, the conductor wire is arranged in a meandering shape while being turned back at the conductor wire direction changing portion at the end of the substrate and folded back, and the conductor wire is arranged at the conductor wire direction changing portion. Adhesively fixed to the substrate in a dot shape. As described above, since the conductor wire has a structure in which the conductor wire is adhesively fixed to the substrate to change the direction, it is not necessary to arrange the conductor wire by changing the direction using the pin. Further, since the folded portion of the conductive wire does not go out of the substrate, there is no need for a step of treating it. Therefore, the manufacturing becomes easy and the manufacturing cost can be reduced.

In the method of manufacturing the digitizer sensor plate according to the second aspect, the conductive wire is laid in the X direction, the ultraviolet curable resin is dropped at the first direction changing portion, and the ultraviolet ray is irradiated to cure the conductive wire. Adhesively fixed to the substrate. After this fixing
The conductor wire is wired in the Y direction by changing the direction, and the ultraviolet curable resin is dropped at the second direction changing portion which is separated by a predetermined distance and is irradiated with ultraviolet rays to be cured, and the conductor wire is fixedly adhered to the substrate. After this fixing, the direction is changed and the conductor wire is laid in the X direction. Hereinafter, this is repeated to lay a plurality of parallel sensor wires. As described above, since the conductor wire has a structure in which the conductor wire is adhesively fixed to the substrate to change the direction, it is not necessary to arrange the conductor wire by changing the direction using the pin. Further, since the folded portion of the conductive wire does not go out of the substrate, there is no need for a step of treating it. Therefore, the manufacturing becomes easy and the manufacturing cost can be reduced. Further, since the ultraviolet curable resin is used, the bonding can be performed in a short time and the manufacturing time can be shortened.

In the method of manufacturing the digitizer sensor plate according to the third aspect, the intermediate direction changing portion is provided, and the conducting wire is provided from the first direction changing portion to the second direction changing portion via the intermediate direction changing portion. Wire. Since the intermediate direction changing part is provided at a position between the first direction changing part and the second direction changing part and not on a straight line connecting them, the direction in which the conducting wire enters the second direction changing part The angle formed by the protruding direction can be made small, and thus the influence of the size error of the ultraviolet curable resin spot on the accuracy of the sensor line interval can be made small.

The digitizer sensor plate manufacturing apparatus according to the fourth aspect comprises means for arranging a conductive wire on the substrate, means for dropping the ultraviolet curable resin, and means for irradiating the ultraviolet curable resin spot with ultraviolet rays. ing. Therefore, the digitizer sensor plate according to the first aspect can be preferably manufactured. Further, the method for manufacturing a digitizer sensor plate according to the second or third aspect can be suitably implemented.

In the digitizer sensor plate manufacturing apparatus according to the fifth aspect, a wire-discharging nozzle that guides the wire when the wire is laid, a dispenser that drops the ultraviolet curable resin,
A light guide for irradiating the ultraviolet curable resin spot with the ultraviolet light guided by the optical fiber was provided, and the dispenser and the light guide were supported so as to rotate around the wiring nozzle. For this reason, it is quick to position the dispenser on the conducting wire by controlling the rotation and drop the ultraviolet curable resin, and position the light guide on the ultraviolet curable resin spot formed by the dropping to control the rotation and irradiate the ultraviolet light. You can Therefore, the first
From this viewpoint, the digitizer sensor plate can be suitably manufactured.
Further, the method of manufacturing the digitizer sensor plate according to the second or third aspect can be suitably implemented.

[0014]

The present invention will be further described below with reference to the embodiments shown in the drawings. The present invention is not limited to this. FIG. 1 is a plan view of essential parts showing a first embodiment of the digitizer sensor plate of the present invention. In this digitizer sensor plate SP1, a transparent conductive film (for example, In-Sn oxide) is formed on the surface of a transparent plate (for example, glass epoxy plate) T. An insulating tape I is attached to one corner of the surface of the transparent plate T, an electrode A (for example, a copper foil) is attached on the insulating tape I, and an ultrafine conductive wire (for example, copper) is attached on the electrode A. One end of a tungsten wire S having a diameter of 10 μm to 20 μm) is bonded and fixed with an ultraviolet curable resin B0. The conducting wire S is laid in the X direction from the starting point P0, and the ultraviolet curable resin spot B1 is formed at the end of the transparent plate T on the side opposite to the starting point.
Is fixed in a dot shape by means of a change in direction at the turning point P1 and is laid out in the Y direction for a predetermined distance, and is fixed in a dot shape at the UV curable resin spot B2, and the direction is changed at a turning point P2. Wiring is performed in the X direction, and is adhered and fixed in a dot shape at the end of the transparent plate T on the side of the starting point by the ultraviolet curable resin spot B3, and is changed in direction at the turning point P3 and is wired in the Y direction for a predetermined distance. , And so on, the wire is laid in a meandering shape. The plurality of sides of the conductor wire S in the X direction are parallel to each other, and the pitch H thereof is, for example, 7.5 mm to 500 mm. The side length L is, for example, 45 mm to 3000 mm. These sides are electromagnetic induction type Y coordinate sensor lines. In addition, in practice, an X-coordinate sensor line and the like are laid in addition to the Y-coordinate sensor line, but they are omitted for simplification of description. The radius R of the ultraviolet curable resin spots B1, B2, B3, ... Is, for example, 1 mm to 2 mm.

FIG. 2 is a schematic block diagram showing an embodiment of the digitizer sensor plate manufacturing apparatus of the present invention. In the digitizer sensor plate manufacturing apparatus 100, the sensor wire laying unit 1 has a wire laying nozzle 21, a dispenser 32, and a light guide 42. In the wiring nozzle 21,
The conductor wire S is supplied from the conductor wire reel 2. In addition, the dispenser 32 includes a pipe 31 from the ultraviolet curable resin supply unit 3.
The ultraviolet curable resin in a fluid state is supplied via the. Further, ultraviolet light is guided to the light guide 42 from an ultraviolet light source 4 containing a mercury lamp or the like through an optical fiber 41.

The sensor wire laying portion 1 has a U-axis rotating portion 81.
The U-axis servomotor 811 controls the rotation and positioning around the Z-axis around the wire-disposing nozzle 21. In addition, the U-axis rotating unit 81 includes a Z-axis feeding unit 84.
And the positioning control is performed in the Z-axis direction by the Z-axis servo motor 841. In addition, the Z-axis feed unit 84
It is held by the axis feed unit 83, and positioning control is performed in the X axis direction by the X axis servo motor 831. The X-axis feed unit 83 is held by the Y-axis feed unit 82, and the Y-axis servomotor 821 controls the positioning in the Y-axis direction. U
Axis servo motor 811, Z-axis servo motor 841,
The X-axis servo motor 831 and the Y-axis servo motor 821 are controlled by the CPU 85.

The Z-axis feed section 84 is provided with a dropping driver 5 for controlling the amount of ultraviolet curable resin dropped from the dispenser 32, and a dispenser vertical driver 6 for vertically moving the dispenser 32.

The CPU 85 sequence-controls the ultraviolet light source 4, the dropping driver 5, and the dispenser vertical driver 6 via the sequencer section 7.

FIG. 3 is a schematic view of the essential parts of the sensor wire laying section 1. The wiring nozzle 21 includes a pair of supply rollers 22, 22.
The conductive wire S sent by is discharged from the lower end opening 21a. The dispenser 32 descends and the ultraviolet curable resin 33
Is dripped from the lower end opening 32a, rises and returns to the original position. The light guide 42 irradiates the ultraviolet rays guided by the optical fiber 41 to the ultraviolet curable resin spots (B0, B1, ... In FIG. 1) from the lower end opening 42a. The dispenser 32 and the light guide 42 are located at opposite positions with respect to the wiring nozzle 21. This separates the dispenser 32 and the light guide 42 as much as possible,
Ultraviolet rays from the lower end opening 3 reach the dispenser 32.
This is to prevent the ultraviolet curable resin 33 of 2a from being cured. Distance D from the wiring nozzle 21 to both
Is slightly larger than the radius R of the ultraviolet curable resin spot.

If the ultraviolet rays from the light guide 42 are prevented from reaching the dispenser 32 by, for example, an ultraviolet shield, the dispenser 32 and the light guide 4 will be described.
2 and 2 may be positioned in a relation of, for example, 90 ° about the wiring nozzle 21.

FIG. 4 shows an apparatus 10 for manufacturing a digitizer sensor plate.
It is explanatory drawing which shows the operation | movement of 0. First, as shown in FIG. 4A, the light guide 42, the wiring nozzle 21, and the dispenser 32 are arranged in a line in this order, and the sensor wire laying portion 1 is moved from the starting point P0 in the X direction, so that the conductor S is transparent. Line on T in X direction. Then, the wiring nozzle 21 changes the turning point P.
Stop 1 at a position past "DR". Next, FIG.
As shown in (b) of FIG.
The ultraviolet curable resin 33 is dropped on the conducting wire S and the transparent plate T. At this time, the dropping amount is controlled so that the radius of the ultraviolet curable resin 33 becomes “R”. Next, as shown in FIG. 4C, the dispenser 32 is raised. Next, as shown in FIG. 4 (d), the dispenser 32 and the light guide 42 are rotated 180 ° about the wiring nozzle 21,
The light guide 42 is positioned above the ultraviolet curable resin spot B1. Then, the ultraviolet light source 4 is turned on, and the ultraviolet light guide 42 irradiates the ultraviolet curable resin 33 with ultraviolet light. As a result, the ultraviolet curable resin 33 is cured to form the ultraviolet curable resin spot B1 and the conductive wire S is attached to the transparent plate T.
It is fixed by adhesion. Next, as shown in (e) of FIG.
The dispenser 32 and the light guide 42 are rotated 90 ° around the wiring nozzle 21, and the light guide 42, the wiring nozzle 21, and the dispenser 32 are arranged in a line in this order, and the sensor wire laying portion 1 is moved from the direction change point P1 to the Y direction. The conductor S is moved and laid on the transparent plate T in the Y direction. Similarly, the sensor wire is laid.

A plurality of sides of the conductor wire S in the X direction are parallel,
The pitch H is, for example, 7.5 mm to 500 mm.
The side length L is, for example, 45 mm to 3000 mm. These sides are electromagnetic induction type Y coordinate sensor lines. FIG. 5 is an explanatory diagram showing the relationship between the error in the radius of the ultraviolet curable resin spot and the sensor line interval. When the angle formed by the direction of the conducting wire S3 exiting the ultraviolet curing resin spot B2 with respect to the direction of the conducting wire S2 entering the ultraviolet curing resin spot B2 is θ and the radius error of the ultraviolet curing resin spot B2 is Δ, the sensor line spacing is Is represented by “H + Δ · sin {θ}”. Therefore, if the conducting wire S2 is at a right angle (θ = 90 °) with respect to the conducting wire S3, the ultraviolet curable resin spot B2
The error Δ of the radius of becomes the error of the sensor line interval as it is.
That is, when the radius of the ultraviolet curable resin spot B2 'is smaller by the error Δ, the sensor line interval becomes "H-Δ". On the other hand, when the radius becomes the ultraviolet curable resin spot B2 ″, which is larger by the error Δ, the sensor line interval becomes “H + Δ”, but the wiring length can be minimized, while the conductor S2 is oblique (θ ≠) with respect to the conductor S3. If the angle is 90 °, the wiring length becomes slightly longer, but the influence of the error in the radius of the ultraviolet curable resin spot B2 on the sensor line spacing can be reduced.

FIG. 6 is a plan view of essential parts showing a second embodiment of the digitizer sensor plate of the present invention. This digitizer sensor plate SP2 has basically the same configuration as the digitizer sensor plate SP1 of the first embodiment, but the influence of the radius error of the ultraviolet curing resin spots B2, B4, ... On the sensor line spacing is small. In order to do so, the intermediate turning point Q1,
Q2, ... Are provided so that the θ is 45 ° or less. That is, the conducting wire S is laid in the X direction from the starting point P0, and the ultraviolet curable resin spot B is formed at the end of the transparent plate T on the side opposite to the starting point.
1 is adhered and fixed in a dot shape, and the direction is changed by about 70 ° at the direction change point P1 and is diagonally laid out by a predetermined distance, and is adhered and fixed in a dot shape at the ultraviolet curable resin spot C1 and is changed at the direction change point Q1. The direction is changed by about 80 °, and the wires are laid in a diagonal direction by a predetermined distance, and are fixed in a dot shape at the ultraviolet curable resin spot B2. At the direction change point P2, the direction is changed by about 30 ° and the wires are laid in the X direction. At the end of the transparent plate T on the side of the starting point, it is adhered and fixed in a dot shape at the ultraviolet curable resin spot B3, and the direction is changed by about 70 ° at the turning point P3, and it is wired diagonally by a predetermined distance, and so on. Repeatedly, the wires are arranged in a meandering shape.

FIG. 7 is an explanatory diagram showing the relationship between the error in the radius of the ultraviolet curable resin spot and the sensor line interval. When the angle formed by the direction of the conducting wire S3 exiting from the ultraviolet curing resin spot B2 with respect to the direction of the conducting wire S2b entering the ultraviolet curing resin spot B2 is θ and the radius error of the ultraviolet curing resin spot B2 is Δ, the sensor line spacing is Is "H + Δ ・ sin
It is represented by {θ} ″. If θ = 30 °, 1/2 of the radius error Δ of the ultraviolet curable resin spot B2 has an influence on the sensor line interval.

[0025]

According to the digitizer sensor plate, the manufacturing method thereof and the digitizer sensor plate manufacturing apparatus of the present invention, the following effects can be obtained. (1) Wiring jigs (pins P, etc.) are not required, and wiring work is not required. Therefore, the manufacturing cost can be reduced. In particular, the elimination of jigs is advantageous in small-quantity production. (2) It does not take time and labor for the folded-back portion of the conducting wire. Therefore, the manufacturing cost can be reduced. In particular, the manufacturing time can be shortened. (3) The resin material can be saved because the folded-back portion of the conducting wire is not sealed in the resin. Therefore, the cost can be reduced and the weight can be reduced. (4) Since the wiring can be automated, the accuracy of the sensor wire can be improved.

[Brief description of drawings]

FIG. 1 is a plan view of an essential part showing a first embodiment of a digitizer sensor plate of the present invention.

FIG. 2 is a schematic configuration diagram of an embodiment of a digitizer sensor plate manufacturing apparatus of the present invention.

FIG. 3 is a main part configuration diagram of a sensor wire installation portion.

FIG. 4 is an explanatory diagram showing an operation of the digitizer sensor plate manufacturing apparatus.

FIG. 5 is an explanatory diagram showing a relationship between a radius error of an ultraviolet curable resin spot and a sensor line interval.

FIG. 6 is a plan view of an essential part showing a second embodiment of the digitizer sensor plate of the present invention.

FIG. 7 is an explanatory diagram showing a relationship between a radius error of an ultraviolet curable resin spot and a sensor line interval.

FIG. 8 is a cutaway perspective view showing a method for manufacturing a conventional digitizer sensor plate.

FIG. 9 is a perspective view showing a folded portion of a conductive wire.

[Explanation of symbols]

 SP1, SP2 Digitizer sensor plate S Conductive wire B1, B2, ... UV curable resin spot P1, P2, ... Direction change point C1, C2, ... UV curable resin spot Q1, Q2, ... Direction change point 1 Wiring part 2 Sensor wire reel 3 UV curable resin supply section 4 UV light source 5 Drop driver 6 Dispenser vertical driver 7 Sequencer section 21 Wiring nozzle 22 Supply roller 31 Tube 32 Dispenser 33 UV curable resin 41 Optical fiber 42 Light guide 81 U axis rotating section 82 X axis feeding section 83 Y-axis feed section 84 Z-axis feed section 85 CPU 100 Digitizer sensor plate manufacturing device 811 U-axis servo motor 821 X-axis servo motor 831 Y-axis servo motor 841 Z-axis servo motor

Claims (5)

[Claims] 1. A digitizer sensor plate in which a plurality of sensor lines are laid in parallel in at least one direction on a substrate, wherein the plurality of parallel sensor lines are one or a bundle of conducting wires at the end of the substrate. A digitizer sensor plate, characterized in that it is wired in a meandering shape while changing the direction at the direction changing portion and being folded back, and that the conducting wire is adhesively fixed to the substrate in a dot shape at the direction changing portion. 2. A method of manufacturing a digitizer sensor plate, which comprises arranging a plurality of sensor lines in parallel in at least one direction on a substrate, wherein one or a bundle of conducting wires is laid in the X direction on the substrate. , Dropping the ultraviolet curable resin at the first direction changing portion at the end of the substrate, and irradiating the ultraviolet curable resin spot formed by the dropping with ultraviolet rays to cure the conductive wire, and fixing the conductive wire to the substrate by adhesion; And wire the conductor in the Y direction.
The ultraviolet curable resin is dropped at the second direction changing portion which is separated by a predetermined distance in the Y direction, and the ultraviolet curable resin spot formed by the dropping is irradiated with ultraviolet rays to be cured so that the conductive wire is adhesively fixed to the substrate. A method for manufacturing a digitizer sensor plate, characterized in that the conductor wire is wired in the X direction by changing the direction after adhesion and fixing, and this is repeated to lay the plurality of parallel sensor wires. 3. The method for manufacturing a digitizer sensor plate according to claim 2, wherein an intermediate direction is present between the first direction changing portion and the second direction changing portion and not on a straight line connecting them. A method of manufacturing a digitizer sensor plate, comprising: providing a turning portion, and arranging a conductor from the first turning portion to the second turning portion via an intermediate turning portion. 4. A conductive wire arranging means for arranging a conductive wire on a substrate, an ultraviolet curable resin dripping means for dripping an ultraviolet curable resin, and an ultraviolet irradiating means for irradiating an ultraviolet ray to an ultraviolet curable resin spot formed by the dropping. An apparatus for manufacturing a digitizer sensor plate, which is characterized by being provided. 5. The digitizer sensor plate manufacturing apparatus according to claim 4, wherein the conductor wire arranging means includes a wire arranging nozzle for leading out the conductor wire from the lower end opening portion, and the ultraviolet curable resin dropping means comprises an ultraviolet curable resin lower end. The dispenser includes a dispenser that drips from an opening, and the ultraviolet irradiation unit includes a light guide that irradiates the ultraviolet curable resin spot with the ultraviolet light guided by an optical fiber, and the dispenser and the A digitizer sensor plate manufacturing apparatus characterized by supporting a light guide.