JPH08219699A - Method of mounting metallic thin wire in demolishing apparatus - Google Patents

Abstract

PURPOSE: To enhance efficiency of operation of mounting a metallic thin wire by spanning a gap between exposed end portions of bundles of conductive wires by the metallic thin wire, respectively inserting the end portions in ring-shaped bodies and caulking the ring-shaped bodies. CONSTITUTION: In a demolishing apparatus 1, a metallic thin wire 4 is mounted by cutting-and-removing covering matter, which covers each of bundles 3 of conductive wires, at an end portion thereof so as to expose end portions of the bundles to form electrodes and spanning a gap between the exposed end portions by the metallic thin wire 4 and respectively inserting the exposed end portions and the end portions of the metallic thin wire into ring-shaped bodies 8 and caulking the ring-shaped bodies to secure. The metallic thin wire 4 is installed in a demolishing hole 5 of a matter (H) to be destroyed and the demolishing hole 5 is filled with water (W). By applying electric energy to the metallic thin wire 4 from a power source 2 in a short period of time, the metallic thin wire 4 is rapidly fused and vaporized to vaporize the water (W), and impact at this moment destroys the matter to be destroyed. Thus, operation of mounting the metallic thin wire 4 can be easily performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for attaching fine metal wires in a destruction apparatus for destroying an object to be destroyed by using impact energy generated by electric discharge.

[0002]

2. Description of the Related Art Conventionally, a pair of electrodes and a thin metal wire arranged between the electrodes are inserted into a breaking hole and a breaking liquid is filled in the breaking hole to supply electric energy to the thin metal wire in a short time. There is a device that destroys an object to be destroyed by the impact by rapidly melting and evaporating a thin metal wire and vaporizing a liquid for destruction.

[0003]

SUMMARY OF THE INVENTION In the above conventional breaking device, a metal fine wire portion is formed by cutting a metal rod to form a finer portion than other portions, and this is attached to an electrode. I am trying.

As described above, conventionally, since the metal rod is cut to be thinner than the other portion and is attached to the electrode, it takes a long time to attach the metal thin wire and the work efficiency is lowered. There is a problem such as doing.

Therefore, an object of the present invention is to provide a method of attaching a fine metal wire in a destruction apparatus capable of solving the above problems.

[0006]

Means for solving the problems in the present invention is to attach a thin metal wire to a power supply device through conductive wire bundles attached to both sides of the power supply device and use the thin metal wire for destruction of an object to be destroyed. By mounting the destruction material in the hole and filling the destruction hole with the destruction material, and supplying the metal thin wire with electric energy from the power supply device in a short time, the metal thin wire is rapidly melted and evaporated to vaporize the destruction material, A method of mounting a thin metal wire in a destruction apparatus configured to destroy an object to be destroyed by an impact force at that time, wherein an end portion of a conductive wire bundle is cut by cutting off a covering body that covers each conductive wire bundle at its end portion. Is exposed to form an exposed portion, a thin metal wire is passed between the exposed portions, each end of the thin metal wire and the exposed portion are externally fitted with an annular body, and then caulked and fixed.

[0007] Further, by cutting the covering body for covering one conductive wire bundle at its end, the end portion of the conductive wire bundle is exposed to be an exposed portion, and the covering body for covering the other conductive wire bundle is formed at the end portion. A metal thin wire is obtained by cutting off the other conductive wires while leaving only the necessary conductive wires, and passing this metal thin wire to the exposed part side and externally fitting the end and exposed part of the metal thin wire with an annular body. Later, it is caulked and fixed.

A metal body is connected to both ends of the power supply unit,
A thin metal wire is attached to the power supply through this metal body, the thin metal wire is mounted in the destruction hole of the object to be destroyed, and the destruction hole is filled with the destruction material. Is supplied in a short time, the thin metal wire is rapidly melted and evaporated to vaporize the destructive substance, and the impact force at that time destroys the object to be destroyed. Then, a thin metal wire is passed between the end portions of both metal bodies, and the thin metal wire and the end portions of the metal body are externally fitted to each other by an annular body and then caulked and fixed.

A thin metal wire is attached to the power supply device via conductive wire bundles attached to both sides of the power supply device. The thin metal wire is mounted in the breaking hole of the object to be destroyed, and the breaking hole is filled with the breaking substance. In a destructive device in which electric power is supplied from a power supply device to a thin wire in a short time to rapidly melt and evaporate a metal thin wire to vaporize a destructive substance and to destroy an object to be destroyed by an impact force at that time. A method of attaching a thin metal wire, wherein the end portion of the conductive wire bundle is exposed by exposing the end portions of the covering body that covers both conductive wire bundles, leaving only the necessary conductive wires and other conductive wires. The wires are cut into thin metal wires, and the thin metal wires are twisted together, and their ends are wound around the outer periphery of each exposed portion.

Further, by cutting off the coating body for covering one conductive wire bundle at its end, the end portion of the conductive wire bundle is exposed to be an exposed portion, and the covering body for covering the other conductive wire bundle is cut off and necessary. A thin metal wire is formed by cutting off the other conductive wire while leaving only the conductive wire, and the end of this thin metal wire is wound around the outer periphery of the exposed portion.

A thin metal wire is attached to the power supply device via conductive wire bundles attached to both sides of the power supply device. The thin metal wire is mounted in the breaking hole of the object to be destroyed, and the breaking hole is filled with the breaking substance. In a destructive device in which electric power is supplied from a power supply device to a thin wire in a short time to rapidly melt and evaporate a metal thin wire to vaporize a destructive substance and to destroy an object to be destroyed by an impact force at that time. A method of attaching a thin metal wire, in which the end portion of the conductive wire bundle is exposed by cutting off the covering body that covers both conductive wire bundles at its end, and each end of the thin metal wire is It is wound around the outer circumference.

A metal body is connected to both ends of the power supply unit,
Attach a thin metal wire to the power supply device via this metal body, install this thin metal wire in the hole for destruction of the object to be destroyed, fill the destruction hole with a substance for destruction, and supply electrical energy from the power supply device to the metal wire. A method for producing a metal thin wire in a destruction apparatus in which a thin metal wire is rapidly melted and vaporized to vaporize a destructive substance by supplying in a short time, and an impact force at that time destroys an object to be destroyed. An engaging recess for locking and winding a thin metal wire is formed at the tip of each metal body, and both ends of the thin metal wire are locked in the engaging recess for winding.

Conductive wire bundles are attached to both sides of the power supply unit, a metal body is attached to the tip of one conductive wire bundle, a metal thin wire is attached between the metal body and the other conductive wire bundle, and the metal fine wire is the object to be destroyed. The breaking wire is filled with the breaking substance and electric power is supplied to the thin metal wire from the power supply device in a short time to rapidly melt and evaporate the thin metal wire to break the breaking substance. A method of mounting a fine metal wire in a destruction apparatus that is vaporized and destroys an object to be destroyed by an impact force at that time, which is a recess for engagement for locking the fine metal wire at the tip of a metal body and winding it. A metal thin wire by cutting off the other conductive wire leaving only the necessary conductive wire while cutting off the coating that covers the other conductive wire bundle at the end. It is locked in the recess and wound up. Than it is.

A thin metal wire is attached to the power supply device through conductive wire bundles attached to both sides thereof, and the thin metal wire is mounted in the breaking hole of the object to be destroyed, and the breaking hole is filled with the breaking substance. In a destructive device in which electric power is supplied from a power supply device to a thin wire in a short time to rapidly melt and evaporate a metal thin wire to vaporize a destructive substance and to destroy an object to be destroyed by an impact force at that time. A method of attaching thin metal wires, wherein the end portion of the conductive wire bundle is exposed by exposing the end portions of the covering body that covers both conductive wire bundles to form exposed portions, and the thin metal wires are passed between the exposed portions and welded. It is a thing.

Further, by cutting off the covering body for covering both conductive wire bundles at the end portions, the end portions of the conductive wire bundles are exposed to be exposed portions, and the end portions of the thin metal wires are passed to the exposed portion side and welded. is there.

Further, by cutting off the coating body for covering one conductive wire bundle at the end, the end portion of the conductive wire bundle is exposed to be an exposed portion, and the covering body for covering the other conductive wire bundle is cut off at the end portion. In addition, the other conductive wires are cut off while leaving only the necessary conductive wires to form a thin metal wire, and the end of the thin metal wire is passed to the exposed portion side for welding.

A metal body is connected to both ends of the power supply unit,
Attach a thin metal wire to the power supply device via this metal body, install this thin metal wire in the hole for destruction of the object to be destroyed, fill the destruction hole with a substance for destruction, and supply electrical energy from the power supply device to the metal wire. A method for producing a metal thin wire in a destruction apparatus in which a thin metal wire is rapidly melted and vaporized to vaporize a destructive substance by supplying in a short time, and an impact force at that time destroys an object to be destroyed. A thin metal wire is passed between the ends of each metal body and welded.

Conductive wire bundles are attached to both sides of the power supply unit, a metal body is attached to the tip of one of the conductive wire bundles, a thin metal wire is attached between the metal body and the other conductive wire bundle, and the thin metal wire is the object to be destroyed. The breaking wire is filled with the breaking substance and electric power is supplied to the thin metal wire from the power supply device in a short time to rapidly melt and evaporate the thin metal wire to break the breaking substance. A method of attaching fine metal wires in a destruction apparatus that vaporizes and destroys the object to be destroyed by the impact force at that time. A thin metal wire is obtained by cutting off the other conductive wire while leaving only the wire, and the end of this thin metal wire is passed over the end of the metal body and welded.

[0019]

In the above means for solving the problems, the thin metal wire is attached to the exposed portion where the coating wire end portion of the conductive wire bundle connected to the power supply device is cut off to expose the conductive wire bundle, or to the metal body connected to the end portion of the conductive wire bundle. Install by crimping, winding, engaging, or welding the metal fine wire into the destruction hole of the object to be destroyed and filling the destruction hole with the destruction material, and then the metal thin wire from the power supply device. By supplying electric energy in a short time, the fine metal wires are rapidly melted and vaporized to vaporize the destruction material, and the object to be destroyed is destroyed by the impact force at that time.

[0020]

Embodiments of the present invention will now be described with reference to the drawings, in which electric energy is supplied in a destruction apparatus for destroying an object to be destroyed (for example, a reinforced concrete structure) by using impact energy by electric discharge. This is a method of attaching a thin metal wire that melts and evaporates.

First, a first embodiment of the present invention will be described with reference to FIGS. 1 and 2. A destruction device 1 for destroying an object to be destroyed H includes a power supply device 2 and conductive wire bundles attached to both sides thereof. And a metal thin wire (made of, for example, Cu) 4 attached via 3, and the metal thin wire 4 is mounted in the breaking hole 5 of the object to be destroyed H and water ( An example of a substance for destruction) W is filled, and electric energy is supplied to the thin metal wire 4 from the power supply device 2 in a short time, whereby the thin metal wire 4 is rapidly melted and vaporized to vaporize the water W, and the impact at that time is generated. It is used so that the object to be destroyed H is destroyed by force.

In the breaking device 1 as described above, the method for attaching the thin metal wires 4 is as follows, as shown in FIG.
By cutting the covering body 6 covering the
An exposed part (becomes an electrode) by exposing the end of the conductive wire bundle 3
After passing the thin metal wire 4 between the exposed portions 7 and fitting the ends of the thin metal wire 4 and the exposed portion 7 with the annular body 8,
It is to be caulked and fixed.

As described above, according to the first embodiment of the present invention, the end portion of the conductive wire bundle 3 is exposed as the exposed portion 7 by cutting off the covering body 6 of the conductive wire bundle 3 at its end portion. 7
Since the metal thin wire 4 is passed between and fitted by the annular body 8 and then fixed by caulking, there is no need to perform work for making the metal rod thinner than other portions by cutting.
The mounting work can be easily performed, and the efficiency for manufacturing the entire device can be improved.

Next, a second embodiment of the present invention will be described with reference to FIG. In the method of attaching the thin metal wire 4 according to the second embodiment of the present invention, the end portion of the conductive wire bundle 3 is exposed by exposing the end portion of the cover 6 that covers one conductive wire bundle 3 to expose the exposed portion. 7, the coating 6 that covers the other conductive wire bundle 3 is cut off at its end and only the necessary conductive wire 9 is cut, for example, the other conductive wire 9 is cut off to form the metal thin wire 4. The metal thin wire 4 is passed to the exposed portion 7 side, and the end portion of the metal thin wire 4 and the exposed portion 7 are externally fitted with the annular body 8 and then caulked and fixed. The other structure is the same as that of the above-mentioned embodiment, and therefore its explanation is omitted.

According to the second embodiment of the present invention, the coating 6 for coating the other conductive wire bundle 3 is cut off at its end and the other conductive wire 9 is cut off while leaving only the necessary conductive wire 9. As a result, the thin metal wire 4 is not required to be provided, and similarly to the first embodiment, the work of thinning the metal rod by cutting is not necessary. The mounting work of No. 4 can be easily performed, and the efficiency for manufacturing the entire device can be improved.

Next, a third embodiment of the present invention will be described with reference to FIG. 4, in which a rod-shaped metal body 10 is connected to both ends of the power supply device 2 and the end portions of both metal bodies 10 are connected. The thin metal wire 4 is passed over to, and the thin metal wire 4 and the end of the metal body 10 are externally fitted with the annular body 8 and then caulked and fixed.

According to the third embodiment of the present invention, the thin metal wire 4 is simply passed over the metal body 10, and the end of the metal body 10 is externally fitted with the annular body 8 and fixed by caulking. Therefore, the work of attaching the thin metal wires 4 can be easily performed, and the efficiency of manufacturing the entire device can be improved.

Next, a fourth embodiment of the present invention will be described with reference to FIGS. 5 to 7, in which conductive wire bundles 3 are attached to both sides of a power supply device 2 and, as shown in FIG. By cutting off the covering body 6 for covering the end portion of the conductive wire bundle 3 to expose the end portion of the conductive wire bundle 3 to form an exposed portion 7, the other conductive wire 9 is cut off while leaving only the necessary conductive wire 9. As the thin wire 4, as shown in FIG. 6 and FIG.
Twist each other and attach each end to each exposed part 7
It is adapted to be wound around the outer circumference of.

According to the fourth embodiment of the present invention, the end portion of the conductive wire bundle 3 is exposed by forming the exposed portion 7 by cutting off the covering body 6 for covering the conductive wire bundle 3 at its end portion. Since the metal thin wires 4 are formed by cutting off the other conductive wires 9 while leaving only the conductive wires 9, it is not necessary to provide the metal thin wires 4 in particular, and the metal thin wires 4 are twisted together and each end thereof is The thin metal wire 4 can be easily attached by winding it around the exposed portion 7, and therefore,
The efficiency for manufacturing the entire device can be improved.

Furthermore, in both conductive wire bundles 3, the thin metal wires 4 are used.
Therefore, it is possible to easily select the cross-sectional area of the thin metal wire 4 according to the breaking conditions by the number of the conductive wires 9 to be cut (the number of the remaining conductive wires 9), and improve the applicability to the breaking conditions. be able to.

Next, a fifth embodiment of the present invention will be described with reference to FIGS. 8 and 9. In this embodiment, conductive wire bundles 3 are attached to both sides of the power supply device 2 and, as shown in FIG. The end of the conductive wire bundle 3 is exposed by cutting off the cover 6 that covers the wire bundle 3 to form an exposed portion 7, and the cover 6 that covers the other conductive wire bundle 3 is cut off and the necessary conductivity is obtained. The metal thin wire 4 is obtained by cutting off the other conductive wire 9 while leaving only the wire 9, and as shown in FIG. 9, the end portion of the metal thin wire 4 is wound around the outer periphery of the exposed portion 7.

Further, according to the fifth embodiment of the present invention, the end portion of the conductive wire bundle 3 is exposed as the exposed portion 7 by cutting the covering body 6 at the end portion thereof, and the necessary conductive wire is provided in the other conductive wire bundle 3. Since the metal thin wires 4 are formed by cutting off the other conductive wires 9 while leaving only 9, the metal thin wires 4 do not need to be specially provided, and the work of attaching the metal thin wires 4 can be easily performed. The efficiency of can be improved.

Next, a sixth embodiment of the present invention will be described with reference to FIGS. 10 and 11. This is, as shown in FIG. 10, a covering body 6 for covering both conductive wire bundles 3 at its ends. By cutting off, the end portions of the conductive wire bundle 3 are exposed to form exposed portions 7, and each end portion of the thin metal wire 4 is wound around the exposed portion 7 as shown in FIG. By doing so, the attachment of the thin metal wire 4 becomes easy.

Next, a seventh embodiment of the present invention will be described with reference to FIGS. 12 and 13. This is that a rod-shaped metal body 11 is connected to both end portions of the power supply device 2 and each metal body 11 is connected. A spiral groove portion (an example of a recess for engagement) 12 for locking and winding the thin metal wire 4 is formed at the tip portion.
The both ends of the thin metal wire 4 are locked and wound.

Further, in the eighth embodiment of the present invention, as shown in FIG. 14, an insertion hole (an example of a recess for engagement) for locking and winding the metal thin wire 4 at the tip of each metal body 11. 13 is formed, and both ends of the thin metal wire 4 are inserted into and locked in the insertion hole 13 for winding.

Further, in the ninth embodiment of the present invention, as shown in FIGS. 15 and 16, a slit (engagement concave portion of the engaging concave portion) for locking and winding the thin metal wire 4 at the tip of each metal body 11. (Example) 14a, 14b are formed, and the slits 14a, 14b
Both ends of the thin metal wire 4 are locked on 14b to be wound up.

The tenth embodiment of the present invention is shown in FIGS.
As shown in FIG. 0, the conductive wire bundles 3 are attached to both sides of the power supply device 2, and the metal body 11 is attached to the tip of one conductive wire bundle 3.
Engagement recesses (shown in the seventh to ninth embodiments) for locking and winding the thin metal wires 4 on the tip of the metal body 11.
5, the coating 6 for covering the other conductive wire bundle 3 is cut off at its end, and the other conductive wires 9 are cut off while leaving only the necessary conductive wires 9 to form the metal thin wires 4. The end of No. 4 is locked in the engaging recess 15 and is wound.

According to the seventh to tenth embodiments described above, since the end portion of the thin metal wire 4 is engaged with the engaging recess formed at the tip of the metal body 11 to be attached, the thin metal wire 4 is firmly attached. It can be performed, and the electrical bondability can be improved.

An eleventh embodiment of the present invention will now be described with reference to FIG. 21. This is done by cutting off the coating 6 for covering the conductive wire bundles 3 mounted on both sides of the power supply device 2 at the ends. The ends of the conductive wire bundle 3 are exposed to form exposed parts 7, and both ends of the thin metal wires 4 are passed to both exposed parts 7 and welded.

In the twelfth embodiment of the present invention, as shown in FIG. 22, the conductive wire bundles 3 attached to both sides of the power supply device 2 are
The end portion of the conductive wire bundle 3 is exposed by forming the exposed portion 7 by cutting off the end portion of the cover member 6 that covers the one conductive wire bundle 3, and the cover member 6 that covers the other conductive wire bundle 3 is cut at the end portion. The metal thin wires 4 are cut off by cutting the other conductive wires 9 while leaving only the necessary conductive wires 9, and the ends of the metal thin wires 4 are passed to the exposed portion 7 side and welded.

In the thirteenth embodiment of the present invention, as shown in FIG. 23, rod-shaped metal bodies 16 are connected to the tip portions of both sides of the power supply device 2, and the metal thin wires 4 are provided between the end portions of each metal body 16. Is to pass and weld.

In the fourteenth embodiment of the present invention, as shown in FIG. 24, a plate-shaped metal body 17 is connected to the front end portions of both sides of the power supply device 2, and a thin metal wire is connected between the end portions of each metal body 17. 4 is welded.

Further, in the fifteenth embodiment of the present invention, the conductive wire bundles 3 are attached to both sides of the power supply device 2, the rod-shaped or plate-shaped metal body 18 is attached to the tip of one conductive wire bundle 3, and the one conductive A metal thin wire 4 is formed by cutting off the coating 6 that covers the wire bundle 3 at its end and cutting off the other conductive wire 9 while leaving only the necessary conductive wire 9 and the end of this metal thin wire 4 is a metal body 18. Is welded to the end of the.

According to the eleventh to fifteenth embodiments of the present invention, the electrical contact is secured by attaching the end of the thin metal wire 4 by welding.

[0045]

As is apparent from the above description, according to the present invention, the coating wire end portion of the conductive wire bundle connected to the power supply is cut off to expose the conductive wire bundle, or the end portion of the conductive wire bundle is exposed. Caulking, winding, engaging with the connected metal body,
Alternatively, because the thin metal wire is attached by welding,
Compared to the case of cutting a metal rod and then attaching this metal rod to the electrode as in the past, it is possible to reduce the time and effort required for attaching the fine metal wire, and therefore the work for creating the destruction device. The efficiency can be greatly improved.

[Brief description of drawings]

FIG. 1 is an overall configuration diagram of a breaking device according to a first embodiment of the present invention.

FIG. 2 is likewise an enlarged view of a main part.

FIG. 3 is an enlarged view of a main part of a destruction device showing a second embodiment of the present invention.

FIG. 4 is an enlarged cross-sectional view of a main part of a breaking device showing a third embodiment of the present invention.

FIG. 5 is an enlarged view of an essential part of a breaking device according to a fourth embodiment of the present invention before being created.

FIG. 6 is an enlarged view of a main part of the same, which is being created.

FIG. 7 is an enlarged view of a main part after the same is created.

FIG. 8 is an enlarged view of an essential part of a destruction device before it is prepared according to a fifth embodiment of the present invention.

FIG. 9 is an enlarged view of an essential part after the same is created.

FIG. 10 is an enlarged view of an essential part of a destruction device according to a sixth embodiment of the present invention before being created.

FIG. 11 is an enlarged view of a main part after the same is created.

FIG. 12 is an enlarged view of an essential part of a destruction device before creation according to a seventh embodiment of the present invention.

FIG. 13 is an enlarged view of the principal part after the same is created.

FIG. 14 is an enlarged view of an essential part of a destruction device before it is formed according to an eighth embodiment of the present invention.

FIG. 15 is an enlarged view of a main part of the destruction apparatus according to the ninth embodiment of the present invention in the process of being formed.

FIG. 16 is an enlarged view of a main part of the destruction device in the process of being formed.

FIG. 17 is an enlarged view of the main part of the destruction apparatus in the middle of the preparation showing the tenth embodiment of the present invention.

FIG. 18 is a cross-sectional view showing a use state of the same.

FIG. 19 is an enlarged view of a main part of the destruction device in the process of being created.

FIG. 20 is an enlarged view of a main part of the destruction device, which is being formed.

FIG. 21 is an enlarged view of a main part of a destruction device showing an eleventh embodiment of the present invention.

FIG. 22 is an enlarged view of a main part of a breaking device showing a twelfth embodiment of the present invention.

FIG. 23 is an enlarged view of a main part of a destruction device showing a thirteenth embodiment of the present invention.

FIG. 24 is an enlarged view of a main part of a destruction device showing a fourteenth embodiment of the present invention.

FIG. 25 is a perspective view showing a usage state of the same.

FIG. 26 is an enlarged view of a main part of a breaking device showing a fifteenth embodiment of the present invention.

FIG. 27 is an enlarged view of an essential part of the destruction device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Destruction device 2 Power supply device 3 Conductive wire bundle 4 Metal thin wire 5 Hole for destruction 7 Exposed part 8 Annular body H Object to be destroyed W Water

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location F42D 3/02 F42D 3/02 (72) Inventor Masanori Tsukahara Nishikujo 5 chome, Konohana-ku, Osaka City, Osaka Prefecture 3-28 Hitachi Shipbuilding Co., Ltd. (72) Inventor Tetsuya Inoue 5-3-28 Nishikujo, Konohana-ku, Osaka City, Osaka Prefecture Hitachi Shipbuilding Co., Ltd.

Claims (13)

[Claims] 1. A power supply device is provided with thin metal wires via conductive wire bundles mounted on both sides of the power supply device. The thin metal wires are mounted in a hole for breaking an object to be destroyed and a material for breaking is filled in the hole for breaking. By supplying electric energy to the thin metal wire from the power supply device in a short time, the thin metal wire is rapidly melted and evaporated to vaporize the destructive substance, and the impact force at that time destroys the object to be destroyed. A method of mounting a thin metal wire in an apparatus, wherein the end portion of the conductive wire bundle is exposed by exposing the end portion of the covering body that covers each conductive wire bundle to form an exposed portion, and a thin metal wire is provided between the exposed portions. A method for attaching a thin metal wire in a breaking device, characterized in that each end of the thin metal wire and the exposed portion are externally fitted with an annular body and then fixed by caulking. 2. A power supply device is provided with thin metal wires via conductive wire bundles mounted on both sides of the power supply device, the thin metal wires are mounted in the breaking holes of the object to be destroyed, and the breaking holes are filled with a breaking substance. By supplying electric energy to the thin metal wire from the power supply device in a short time, the thin metal wire is rapidly melted and evaporated to vaporize the destructive substance, and the impact force at that time destroys the object to be destroyed. A method of mounting a thin metal wire in an apparatus, wherein a cover body for covering one conductive wire bundle is cut off at an end thereof to expose the end portion of the conductive wire bundle as an exposed portion and cover the other conductive wire bundle. A thin metal wire is formed by cutting off the coating at its end and cutting off the other conductive wires while leaving only the necessary conductive wires, and passing this thin metal wire to the exposed side to separate the end and exposed part of the thin metal wire. After being fitted with an annular body, A method for attaching a fine metal wire in a breaking device, characterized by crimping and fixing. 3. A metal body is connected to both end portions of a power supply device, a metal thin wire is attached to the power supply device through the space between the metal bodies, and the metal thin wire is mounted in a hole for breaking an object to be destroyed and destroyed. By filling the hole for use with the destructive substance and supplying electric energy to the thin metal wire from the power supply device in a short time, the thin metal wire is rapidly melted and vaporized to vaporize the destructive substance. A method for producing a thin metal wire in a destruction device for destroying a destructive object, wherein a thin metal wire is passed between the end portions of both metal bodies, and the thin metal wire and the end portion of the metal body are fitted by an annular body. A method for attaching a fine metal wire in a destruction device, characterized by fixing after caulking. 4. A thin metal wire is attached to a power supply device through conductive wire bundles attached to both sides thereof, the thin metal wire is mounted in a hole for breaking an object to be destroyed, and the breaking hole is filled with a breaking substance. By supplying electric energy to the thin metal wire from the power supply device in a short time, the thin metal wire is rapidly melted and evaporated to vaporize the destructive substance, and the impact force at that time destroys the object to be destroyed. A method for attaching a thin metal wire in an apparatus, wherein the end portion of the conductive wire bundle is exposed by cutting off the covering body that covers both conductive wire bundles, leaving only the necessary conductive wires 2. A method for attaching a thin metal wire in a breaking device, characterized in that the conductive wire is cut to form a thin metal wire, the thin metal wires are twisted together, and each end thereof is wound around the outer periphery of each exposed portion. 5. A power supply device is provided with a thin metal wire via conductive wire bundles mounted on both sides of the power supply device, the thin metal wire is mounted in a hole for breaking an object to be destroyed, and the breaking hole is filled with a breaking substance. By supplying electric energy to the thin metal wire from the power supply device in a short time, the thin metal wire is rapidly melted and evaporated to vaporize the destructive substance, and the impact force at that time destroys the object to be destroyed. A method of mounting a thin metal wire in a device, wherein a coating body for covering one conductive wire bundle is cut off at its end to expose the end portion of the conductive wire bundle to be an exposed portion and to cover the other conductive wire bundle. A thin metal wire is attached to a breaking device, which is characterized by cutting the body and cutting other conductive wires while leaving only the necessary conductive wires, and winding the end of this thin metal wire around the outer periphery of the exposed portion. Method . 6. A power supply device is provided with a thin metal wire via conductive wire bundles attached to both sides thereof, the thin metal wire is mounted in a breaking hole of an object to be destroyed, and the breaking hole is filled with a breaking substance. By supplying electric energy to the thin metal wire from the power supply device in a short time, the thin metal wire is rapidly melted and evaporated to vaporize the destructive substance, and the impact force at that time destroys the object to be destroyed. A method for mounting metal thin wires in a device, wherein the end portions of the conductive wire bundles are exposed by exposing the end portions of the conductive wire bundles by exposing the end portions of the conductive wire bundles by cutting off the covering body that covers both conductive wire bundles. A method for attaching a fine metal wire in a destruction device, characterized in that the wire is wound around the outer periphery of the portion. 7. A metal body is connected to both end portions of the power supply device, and a thin metal wire is attached to the power supply device through the metal body,
By mounting this thin metal wire in the destruction hole of the object to be destroyed, filling the destruction hole with the destruction material, and supplying the metal thin wire with electric energy from the power supply device in a short time, the metal thin wire is rapidly melted. Evaporate to vaporize the destructive material,
A method for producing a fine metal wire in a destruction apparatus configured to destroy an object to be destroyed by an impact force at that time, wherein an engaging recess for locking and winding the fine metal wire is provided at a tip of each metal body. A method for attaching a thin metal wire in a breaking device, characterized in that both ends of the thin metal wire are formed in the engaging recesses and are wound. 8. A conductive wire bundle is attached to both sides of a power supply device, a metal body is attached to the tip of one conductive wire bundle, a metal thin wire is attached between the metal body and the other conductive wire bundle, and the metal thin wire is covered. The destruction wire is installed in the destruction hole, the destruction hole is filled with the destruction material, and electric energy is supplied to the metal wire from the power supply device in a short time to rapidly melt and evaporate the metal wire for destruction. A method for mounting a thin metal wire in a destruction apparatus, wherein a substance is vaporized and an object to be destroyed is destroyed by an impact force at that time. A metal thin wire is formed by forming a combination recess and cutting the covering body that covers the other conductive wire bundle at its end and cutting the other conductive wire while leaving only the necessary conductive wire. Winding by locking in the engaging recess A method for attaching a fine metal wire in a destruction apparatus, which is characterized by the above. 9. A power supply device is provided with a thin metal wire via conductive wire bundles mounted on both sides of the power supply device, the thin metal wire is mounted in a hole for breaking an object to be destroyed, and the breaking hole is filled with a breaking substance. By supplying electric energy to the thin metal wire from the power supply device in a short time, the thin metal wire is rapidly melted and evaporated to vaporize the destructive substance, and the impact force at that time destroys the object to be destroyed. A method of attaching a thin metal wire in a device, wherein the end portion of the conductive wire bundle is exposed by cutting off the coating that covers both conductive wire bundles at the end, and the thin metal wire is passed between the exposed portions. A method for attaching a fine metal wire in a destruction device characterized by welding. 10. A power supply device is provided with metal thin wires via conductive wire bundles mounted on both sides of the power supply device. The metal thin wires are mounted in the destruction holes of the object to be destroyed and the destruction holes are filled with a destruction material. By supplying electric energy to the thin metal wire from the power supply device in a short time, the thin metal wire is rapidly melted and evaporated to vaporize the destructive substance, and the impact force at that time destroys the object to be destroyed. A method of attaching a metal thin wire in an apparatus, wherein the end portion of the conductive wire bundle is exposed by exposing the end portion of the conductive wire bundle by cutting off the covering body that covers both conductive wire bundles at the end portion. A method for attaching a thin metal wire in a destruction device, which is characterized by passing and welding. 11. A power supply device is provided with a thin metal wire via conductive wire bundles mounted on both sides thereof, the thin metal wire is mounted in a breaking hole of an object to be destroyed, and the breaking hole is filled with a breaking substance. By supplying electric energy to the thin metal wire from the power supply device in a short time, the thin metal wire is rapidly melted and evaporated to vaporize the destructive substance, and the impact force at that time destroys the object to be destroyed. A method of mounting a thin metal wire in a device, wherein a coating body that covers one conductive wire bundle is cut off at an end to expose the end portion of the conductive wire bundle to be an exposed portion, and a coating body that covers the other conductive wire bundle. A metal thin wire by cutting off the end of the metal wire and cutting off the other conductive wires while leaving only the necessary conductive wire, and passing the end of this metal thin wire to the exposed side for welding. Metal in Fine wire mounting method. 12. A metal body is connected to both end portions of the power supply device, and a thin metal wire is attached to the power supply device through the metal body,
By mounting this thin metal wire in the destruction hole of the object to be destroyed, filling the destruction hole with the destruction material, and supplying the metal thin wire with electric energy from the power supply device in a short time, the metal thin wire is rapidly melted. Evaporate to vaporize the destructive material,
A method for producing a thin metal wire in a destroyer that destroys an object to be destroyed by an impact force at that time, characterized in that the thin metal wire is passed between the end portions of each metal body and welded. How to install thin metal wires in. 13. A conductive wire bundle is attached to both sides of the power supply,
A metal body is attached to the tip of one conductive wire bundle, a thin metal wire is attached between this metal body and the other conductive wire bundle, and this thin metal wire is installed in the destruction hole of the object to be destroyed and By filling the destructible substance and supplying electric energy to the metal thin wire from the power supply in a short time, the metal thin wire is rapidly melted and vaporized to vaporize the destructive substance, and the impact force at that time destroys the object to be destroyed. A method of attaching a fine metal wire in a destruction device that is designed to be destroyed, by cutting off a coating body that covers one conductive wire bundle at its end and cutting off the other conductive wire while leaving only the necessary conductive wire. A method of attaching a thin metal wire in a breaking device, which comprises forming a thin metal wire and passing an end of the thin metal wire to an end of a metal body for welding.