JPH08216571A - Ic card - Google Patents

Ic card

Info

Publication number
JPH08216571A
JPH08216571A JP7021783A JP2178395A JPH08216571A JP H08216571 A JPH08216571 A JP H08216571A JP 7021783 A JP7021783 A JP 7021783A JP 2178395 A JP2178395 A JP 2178395A JP H08216571 A JPH08216571 A JP H08216571A
Authority
JP
Japan
Prior art keywords
conductor
card
antenna
ground conductor
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7021783A
Other languages
Japanese (ja)
Other versions
JP3238596B2 (en
Inventor
Hironobu Ishizaka
裕宣 石坂
Ryoji Ose
良治 小瀬
Seiji Kado
誠司 嘉戸
Kazuo Kaneko
一男 金子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP02178395A priority Critical patent/JP3238596B2/en
Publication of JPH08216571A publication Critical patent/JPH08216571A/en
Application granted granted Critical
Publication of JP3238596B2 publication Critical patent/JP3238596B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE: To obtain a small-size, thin, wide-band inexpensive non-contact type IC card by a method wherein an antenna is composed of a conductor formed on a thin plastic film and a U-shaped ground conductor surrounding the conductor. CONSTITUTION: On a surface of a plastic film, a conductor D1 and a ground conductor D2 are formed using conductive ink by screen printing. On the surface, a spacer is laminated, which is a plastic film provided with a relief hole on a position corresponding to an IC and coated with an adhesive on the back surface thereof. Lastly, plastic films each coated with an adhesive are laminated as upper and lower layers for forming a non-contact type IC card. In this manner, since the ground conductor is formed to be flush with the conductor, the band is hardly remarkably reduced in width even in a thin IC card.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、非接触式ICカードに
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC card.

【0002】[0002]

【従来の技術】非接触式ICカードは、伝送媒体により
電磁結合方式、電磁誘導方式、電波方式等に分類され
る。この内比較的長い通信距離を必要とするものには電
波方式が用いられており、内蔵されるアンテナには使用
周波数において1/2波長サイズのアンテナが用いられ
るのが一般的である。
2. Description of the Related Art Non-contact type IC cards are classified into an electromagnetic coupling type, an electromagnetic induction type, a radio wave type and the like depending on the transmission medium. Among them, the radio wave method is used for those requiring a relatively long communication distance, and the built-in antenna is generally an antenna having a half wavelength at the used frequency.

【0003】[0003]

【発明が解決しようとする課題】このような非接触式I
Cカードは、持ち歩きすることや将来の多機能化を考慮
し、CDカードと同じ大きさ、厚さ(ISO規格84.
5mm×54.0mm×0.8mm)ものが求められており、
使用周波数によっては、通常の1/2波長サイズのアン
テナでは寸法内での形成が不可能となってしまったり、
更にマイクロストリップアンテナ等の裏面に地導体を有
するものは薄くすることにより極めて狭帯域な特性とな
ってしまうなど、種々の問題点があった。本発明は、小
型、薄型化に優れ、広帯域で、かつ安価な構成が可能な
アンテナを有するICカードを提供することを目的とす
る。
Such a non-contact type I
The C card has the same size and thickness as those of the CD card (ISO standard 84.
5 mm x 54.0 mm x 0.8 mm) is required,
Depending on the frequency used, it may not be possible to form within the size of an ordinary 1/2 wavelength antenna,
Further, there are various problems such that a microstrip antenna or the like having a ground conductor on its back surface has an extremely narrow band characteristic when it is made thin. An object of the present invention is to provide an IC card having an antenna that is excellent in size and thickness, has a wide band, and can be inexpensively constructed.

【0004】[0004]

【課題を解決するための手段及び作用】本発明のICカ
ードは、図1に示すように薄いプラスチックスフィルム
上に形成された導体D1と、その導体D1を囲むように
形成したコ字状の地導体D2からアンテナを構成するこ
とを特徴とする。このコ字状のアンテナは、通常のスロ
ットアンテナの両端を電気的に解放状態とし、コ字状に
変形させたものであり、このことによりアンテナの長さ
L1は、使用周波数の1/4波長以下とすることが可能
であり、地導体が裏面でなく導体と同一平面に形成され
ていることによりICカード等の薄型形状においても極
端な狭帯化が生じにくい。
As shown in FIG. 1, an IC card of the present invention has a conductor D1 formed on a thin plastic film and a U-shape formed so as to surround the conductor D1. The antenna is composed of the ground conductor D2. This U-shaped antenna is an ordinary slot antenna in which both ends are electrically released and deformed into a U-shape, whereby the length L1 of the antenna is 1/4 wavelength of the used frequency. The following is possible, and since the ground conductor is formed not on the back surface but on the same plane as the conductor, an extremely narrow band is unlikely to occur even in a thin shape such as an IC card.

【0005】また、図2に示すように導体D1と地導体
D2とをコンデンサC1及びC2によって接続してもよ
い。このことにより、さらにアンテナの長さL2を短縮
し、小型化を図ることが可能となる。さらに、導体D1
及び地導体D2をいわゆる導電性インクを用いて形成し
てもよい。これにより、一般的なエッチング工法に比べ
コスト低減が可能となるばかりでなく、導体の抵抗が大
きくなることにより広帯域化が図れる。
Further, as shown in FIG. 2, the conductor D1 and the ground conductor D2 may be connected by capacitors C1 and C2. As a result, the length L2 of the antenna can be further shortened and the size can be reduced. Furthermore, the conductor D1
The ground conductor D2 may be formed using so-called conductive ink. Thereby, not only the cost can be reduced as compared with the general etching method, but also the resistance of the conductor is increased, so that the band can be widened.

【0006】[0006]

【実施例】図1に示すように、PETフィルムの面上に
導電性インクによるスクリーン印刷により導体D1及び
地導体D2を形成し、その面上に異方導電性フィルムを
用いてICを実装した。さらにその面上に、ICに相当
する部分に逃げ穴を設け、裏面に接着剤がコーティング
されたPETフィルムよりなるスペーサをラミネートし
た。最後に、これらの上層及び下層に接着剤がコーティ
ングされたPETフィルムをラミネートし、非接触式I
Cカードを形成した。
EXAMPLE As shown in FIG. 1, a conductor D1 and a ground conductor D2 were formed on the surface of a PET film by screen printing with conductive ink, and an IC was mounted on the surface by using an anisotropic conductive film. . Further, an escape hole was formed on the surface corresponding to the IC, and a spacer made of a PET film coated with an adhesive was laminated on the back surface. Finally, a PET film coated with an adhesive is laminated on these upper and lower layers, and the non-contact type I
A C card was formed.

【0007】[0007]

【発明の効果】以上に説明したように、本発明によって
小型、薄型に優れ、広帯域で、かつ安価な非接触式IC
カードの実現が可能となる。
As described above, according to the present invention, a non-contact type IC which is excellent in small size and thin shape, has a wide band and is inexpensive.
Realization of a card becomes possible.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示す斜視図。FIG. 1 is a perspective view showing an embodiment of the present invention.

【図2】本発明の他の実施例を示す斜視図。FIG. 2 is a perspective view showing another embodiment of the present invention.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 金子 一男 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館研究所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazuo Kaneko 1500 Ogawa, Shimodate City, Ibaraki Prefecture Hitachi Chemical Co., Ltd. Shimodate Research Center

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】アンテナと、IC、コンデンサ等の電子部
品と、これらを電気的に接続する接続部材と、プラスチ
ックスフィルム又はシート等からなる被覆部材等より構
成されるICカードにおいて、前記アンテナがプラスチ
ックスフィルム上に形成された導体D1と、その導体D
1を囲むように形成したコ字状の地導体D2から構成さ
れることを特徴とするICカード。
1. An IC card comprising an antenna, an electronic component such as an IC and a capacitor, a connecting member for electrically connecting them, and a covering member made of a plastics film, a sheet or the like. Conductor D1 formed on the plastic film and the conductor D1
An IC card comprising a U-shaped ground conductor D2 formed so as to surround 1.
【請求項2】前記アンテナのコ字状の先端部において、
導体D1と地導体D2とをコンデンサC1及びC2によ
って接続したことを特徴とする請求項1に記載のICカ
ード。
2. A U-shaped tip portion of the antenna,
The IC card according to claim 1, wherein the conductor D1 and the ground conductor D2 are connected by capacitors C1 and C2.
【請求項3】前記アンテナの導体D1及び地導体D2が
いわゆる導電性インクを用いて形成されることを特徴と
する請求項1及び2に記載のICカード。
3. The IC card according to claim 1, wherein the conductor D1 and the ground conductor D2 of the antenna are formed by using a so-called conductive ink.
JP02178395A 1995-02-09 1995-02-09 IC card Expired - Lifetime JP3238596B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP02178395A JP3238596B2 (en) 1995-02-09 1995-02-09 IC card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP02178395A JP3238596B2 (en) 1995-02-09 1995-02-09 IC card

Publications (2)

Publication Number Publication Date
JPH08216571A true JPH08216571A (en) 1996-08-27
JP3238596B2 JP3238596B2 (en) 2001-12-17

Family

ID=12064669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP02178395A Expired - Lifetime JP3238596B2 (en) 1995-02-09 1995-02-09 IC card

Country Status (1)

Country Link
JP (1) JP3238596B2 (en)

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2753305A1 (en) * 1996-09-12 1998-03-13 Schlumberger Ind Sa METHOD FOR MANUFACTURING AN ASSEMBLY OF ELECTRONIC MODULES FOR NON-CONTACT MEMORY CARDS
WO2000033249A1 (en) * 1998-11-30 2000-06-08 Hitachi, Ltd. Method for mounting electronic circuit chip
WO2000039883A1 (en) * 1998-12-23 2000-07-06 Nokia Mobile Phones Limited An antenna and method of production
KR100503048B1 (en) * 1998-09-09 2005-09-26 삼성테크윈 주식회사 How to make contactless IC card
US7012531B2 (en) 1999-12-07 2006-03-14 Infineon Technologies Ag Product label, method of producing product labels and method for identifying products in a contactless and forgery-proof manner
US8847833B2 (en) 2009-12-29 2014-09-30 Pulse Finland Oy Loop resonator apparatus and methods for enhanced field control
US8866689B2 (en) 2011-07-07 2014-10-21 Pulse Finland Oy Multi-band antenna and methods for long term evolution wireless system
US8988296B2 (en) 2012-04-04 2015-03-24 Pulse Finland Oy Compact polarized antenna and methods
US9123990B2 (en) 2011-10-07 2015-09-01 Pulse Finland Oy Multi-feed antenna apparatus and methods
US9203154B2 (en) 2011-01-25 2015-12-01 Pulse Finland Oy Multi-resonance antenna, antenna module, radio device and methods
US9246210B2 (en) 2010-02-18 2016-01-26 Pulse Finland Oy Antenna with cover radiator and methods
US9350081B2 (en) 2014-01-14 2016-05-24 Pulse Finland Oy Switchable multi-radiator high band antenna apparatus
US9406998B2 (en) 2010-04-21 2016-08-02 Pulse Finland Oy Distributed multiband antenna and methods
US9450291B2 (en) 2011-07-25 2016-09-20 Pulse Finland Oy Multiband slot loop antenna apparatus and methods
US9461371B2 (en) 2009-11-27 2016-10-04 Pulse Finland Oy MIMO antenna and methods
US9484619B2 (en) 2011-12-21 2016-11-01 Pulse Finland Oy Switchable diversity antenna apparatus and methods
US9531058B2 (en) 2011-12-20 2016-12-27 Pulse Finland Oy Loosely-coupled radio antenna apparatus and methods
US9590308B2 (en) 2013-12-03 2017-03-07 Pulse Electronics, Inc. Reduced surface area antenna apparatus and mobile communications devices incorporating the same
US9634383B2 (en) 2013-06-26 2017-04-25 Pulse Finland Oy Galvanically separated non-interacting antenna sector apparatus and methods
US9647338B2 (en) 2013-03-11 2017-05-09 Pulse Finland Oy Coupled antenna structure and methods
US9673507B2 (en) 2011-02-11 2017-06-06 Pulse Finland Oy Chassis-excited antenna apparatus and methods
US9680212B2 (en) 2013-11-20 2017-06-13 Pulse Finland Oy Capacitive grounding methods and apparatus for mobile devices
US9722308B2 (en) 2014-08-28 2017-08-01 Pulse Finland Oy Low passive intermodulation distributed antenna system for multiple-input multiple-output systems and methods of use
US9761951B2 (en) 2009-11-03 2017-09-12 Pulse Finland Oy Adjustable antenna apparatus and methods
US9906260B2 (en) 2015-07-30 2018-02-27 Pulse Finland Oy Sensor-based closed loop antenna swapping apparatus and methods
CN107766920A (en) * 2017-10-24 2018-03-06 苏州海博智能系统有限公司 A kind of processing method of visual intelligent card
US9917346B2 (en) 2011-02-11 2018-03-13 Pulse Finland Oy Chassis-excited antenna apparatus and methods
US9948002B2 (en) 2014-08-26 2018-04-17 Pulse Finland Oy Antenna apparatus with an integrated proximity sensor and methods
US9973228B2 (en) 2014-08-26 2018-05-15 Pulse Finland Oy Antenna apparatus with an integrated proximity sensor and methods
US9979078B2 (en) 2012-10-25 2018-05-22 Pulse Finland Oy Modular cell antenna apparatus and methods
US10069209B2 (en) 2012-11-06 2018-09-04 Pulse Finland Oy Capacitively coupled antenna apparatus and methods
US10079428B2 (en) 2013-03-11 2018-09-18 Pulse Finland Oy Coupled antenna structure and methods

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998011507A1 (en) * 1996-09-12 1998-03-19 Schlumberger Systemes Method for making an assembly of electronic modules for contactless memory cards
FR2753305A1 (en) * 1996-09-12 1998-03-13 Schlumberger Ind Sa METHOD FOR MANUFACTURING AN ASSEMBLY OF ELECTRONIC MODULES FOR NON-CONTACT MEMORY CARDS
KR100503048B1 (en) * 1998-09-09 2005-09-26 삼성테크윈 주식회사 How to make contactless IC card
US7549208B2 (en) 1998-11-30 2009-06-23 Hitachi, Ltd. Method of mounting electronic circuit chip
WO2000033249A1 (en) * 1998-11-30 2000-06-08 Hitachi, Ltd. Method for mounting electronic circuit chip
US6731509B1 (en) 1998-11-30 2004-05-04 Hitachi, Ltd. Method for mounting electronic circuit chip
WO2000039883A1 (en) * 1998-12-23 2000-07-06 Nokia Mobile Phones Limited An antenna and method of production
US6396444B1 (en) 1998-12-23 2002-05-28 Nokia Mobile Phones Limited Antenna and method of production
GB2345196B (en) * 1998-12-23 2003-11-26 Nokia Mobile Phones Ltd An antenna and method of production
US7012531B2 (en) 1999-12-07 2006-03-14 Infineon Technologies Ag Product label, method of producing product labels and method for identifying products in a contactless and forgery-proof manner
US9761951B2 (en) 2009-11-03 2017-09-12 Pulse Finland Oy Adjustable antenna apparatus and methods
US9461371B2 (en) 2009-11-27 2016-10-04 Pulse Finland Oy MIMO antenna and methods
US8847833B2 (en) 2009-12-29 2014-09-30 Pulse Finland Oy Loop resonator apparatus and methods for enhanced field control
US9246210B2 (en) 2010-02-18 2016-01-26 Pulse Finland Oy Antenna with cover radiator and methods
US9406998B2 (en) 2010-04-21 2016-08-02 Pulse Finland Oy Distributed multiband antenna and methods
US9203154B2 (en) 2011-01-25 2015-12-01 Pulse Finland Oy Multi-resonance antenna, antenna module, radio device and methods
US9917346B2 (en) 2011-02-11 2018-03-13 Pulse Finland Oy Chassis-excited antenna apparatus and methods
US9673507B2 (en) 2011-02-11 2017-06-06 Pulse Finland Oy Chassis-excited antenna apparatus and methods
US8866689B2 (en) 2011-07-07 2014-10-21 Pulse Finland Oy Multi-band antenna and methods for long term evolution wireless system
US9450291B2 (en) 2011-07-25 2016-09-20 Pulse Finland Oy Multiband slot loop antenna apparatus and methods
US9123990B2 (en) 2011-10-07 2015-09-01 Pulse Finland Oy Multi-feed antenna apparatus and methods
US9531058B2 (en) 2011-12-20 2016-12-27 Pulse Finland Oy Loosely-coupled radio antenna apparatus and methods
US9484619B2 (en) 2011-12-21 2016-11-01 Pulse Finland Oy Switchable diversity antenna apparatus and methods
US9509054B2 (en) 2012-04-04 2016-11-29 Pulse Finland Oy Compact polarized antenna and methods
US8988296B2 (en) 2012-04-04 2015-03-24 Pulse Finland Oy Compact polarized antenna and methods
US9979078B2 (en) 2012-10-25 2018-05-22 Pulse Finland Oy Modular cell antenna apparatus and methods
US10069209B2 (en) 2012-11-06 2018-09-04 Pulse Finland Oy Capacitively coupled antenna apparatus and methods
US10079428B2 (en) 2013-03-11 2018-09-18 Pulse Finland Oy Coupled antenna structure and methods
US9647338B2 (en) 2013-03-11 2017-05-09 Pulse Finland Oy Coupled antenna structure and methods
US9634383B2 (en) 2013-06-26 2017-04-25 Pulse Finland Oy Galvanically separated non-interacting antenna sector apparatus and methods
US9680212B2 (en) 2013-11-20 2017-06-13 Pulse Finland Oy Capacitive grounding methods and apparatus for mobile devices
US9590308B2 (en) 2013-12-03 2017-03-07 Pulse Electronics, Inc. Reduced surface area antenna apparatus and mobile communications devices incorporating the same
US9350081B2 (en) 2014-01-14 2016-05-24 Pulse Finland Oy Switchable multi-radiator high band antenna apparatus
US9948002B2 (en) 2014-08-26 2018-04-17 Pulse Finland Oy Antenna apparatus with an integrated proximity sensor and methods
US9973228B2 (en) 2014-08-26 2018-05-15 Pulse Finland Oy Antenna apparatus with an integrated proximity sensor and methods
US9722308B2 (en) 2014-08-28 2017-08-01 Pulse Finland Oy Low passive intermodulation distributed antenna system for multiple-input multiple-output systems and methods of use
US9906260B2 (en) 2015-07-30 2018-02-27 Pulse Finland Oy Sensor-based closed loop antenna swapping apparatus and methods
CN107766920A (en) * 2017-10-24 2018-03-06 苏州海博智能系统有限公司 A kind of processing method of visual intelligent card

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