JPH08216160A - Mold for molding resin - Google Patents

Mold for molding resin

Info

Publication number
JPH08216160A
JPH08216160A JP4786195A JP4786195A JPH08216160A JP H08216160 A JPH08216160 A JP H08216160A JP 4786195 A JP4786195 A JP 4786195A JP 4786195 A JP4786195 A JP 4786195A JP H08216160 A JPH08216160 A JP H08216160A
Authority
JP
Japan
Prior art keywords
mold
resin
less
cemented carbide
corrosion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4786195A
Other languages
Japanese (ja)
Inventor
Manabu Tsuda
学 津田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Moldino Tool Engineering Ltd
Original Assignee
Hitachi Tool Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tool Engineering Ltd filed Critical Hitachi Tool Engineering Ltd
Priority to JP4786195A priority Critical patent/JPH08216160A/en
Publication of JPH08216160A publication Critical patent/JPH08216160A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To extend the life of a mold for molding an epoxy resin or the like by using a hard alloy enhanced in corrosion resistance against corrosion generated from the initial stage of use to enhance the hardness of the mold. CONSTITUTION: A WC base hard alloy of which the bonding phase is 3-10% of a Co-Cr type bonding phase is characterized by that the particle size of the sintered element thereof is 0.6μm or less and constituted by replacing a part of WC with a metal selected from Ta, Nb, V and Mo, carbide, nitride or carbonitride thereof within a range of 5wt.% or less.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、耐摩耗性・耐食性に優
れた樹脂成形用金型の超硬合金工具に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cemented carbide tool of a resin molding die having excellent wear resistance and corrosion resistance.

【0002】[0002]

【従来の技術】一般に、電子部品の封止には、製品形状
を彫り込んだ上下金型をしめておき、粉末を押し固めた
封止材(熱硬化性樹脂)を金型内に組み込まれたポット
に仕込み、それを加熱、可塑化し、プランジャーで押し
だし、移送して硬化成形するトランスファーモールドが
行なわれている。この前処理として脱気と予熱のため、
タブレット状に樹脂を成形する。その金型用には特公平
4−32536号のように特定の硬度、ヤング率、抗折
力を有する高速度鋼、超硬、ステライト等を適用する例
が有る。
2. Description of the Related Art Generally, for sealing electronic parts, a pot in which upper and lower molds engraved with the product shape are closed and a sealing material (thermosetting resin) obtained by compacting powder is incorporated in the mold. A transfer mold is used in which it is charged into a container, heated, plasticized, pushed out by a plunger, transferred, and cured for molding. For degassing and preheating as this pretreatment,
Mold the resin into tablets. There is an example in which high speed steel having specific hardness, Young's modulus and transverse rupture strength, cemented carbide, stellite, etc. are applied to the die as in Japanese Patent Publication No. 4-32536.

【0003】電子素子の高集積化に伴い、配線パターン
や素子チップの大型化が進み、封子樹脂の強度がより求
められるようになり、そのため、樹脂を予熱する過程で
腐食性の強いガスからの耐食性に起因する耐摩耗性が問
題となり、超硬合金製品、特にJIS V3〜V5相当
品が増加してきている。また、超硬合金、特に超微粒子
超硬合金に関しては、WC粒子を微細化し、粒抑制材と
して、TaC、Cr、V等を少量添加し、Coで結合し
た合金が用いられその強靭性を特長とし、優れた耐摩耗
性と強靭性を兼ね備えており、広く実用に供されてい
る。
With the high integration of electronic devices, the size of wiring patterns and device chips has increased, and the strength of the encapsulating resin has become more demanding. Therefore, in the process of preheating the resin, gas that is highly corrosive is used. The wear resistance resulting from the corrosion resistance of the above has become a problem, and the number of cemented carbide products, particularly JIS V3 to V5 equivalent products, has been increasing. Regarding cemented carbides, especially ultrafine grained cemented carbides, alloys made by refining WC particles and adding a small amount of TaC, Cr, V, etc. as a grain suppressor and bonding with Co are used. It has excellent wear resistance and toughness, and is widely used in practice.

【0004】[0004]

【発明が解決しようとする課題】しかし、樹脂成形用金
型に超硬合金を使用した場合、樹脂が加工時に発生する
ガスにより超硬合金が腐食され、そのまま使用を継続し
て行くと、腐食部分に樹脂が付着、特に樹脂中に含まれ
るシリカ粒子が食い込み、タブレット状の外周部の凹凸
が激しくなり、また甚だしい場合には、特にパンチ部に
樹脂の一部が金型に付着したまま離型されたりし、脱気
が不十分となるなどの問題点があった。
However, when cemented carbide is used for the resin molding die, the gas generated during processing of the resin corrodes the cemented carbide, and if it is used as it is, corrosion will occur. The resin adheres to the part, especially the silica particles contained in the resin bite into it, and the unevenness of the tablet-shaped outer peripheral part becomes severe. There were problems such as being modeled and insufficient degassing.

【0005】[0005]

【本発明の目的】本発明の目的は、使用初期から発生す
る腐食に対して、耐腐食性を向上させた超硬合金を使用
するとともに高硬度化を計り、金型の長寿命化を計るこ
とである。
It is an object of the present invention to use a cemented carbide having improved corrosion resistance against corrosion that occurs from the beginning of use, to increase the hardness, and to extend the life of the mold. That is.

【0006】[0006]

【課題を解決するための手段】本発明は上記観点に基ず
いて成されたものであり、樹脂成形用金型を結合相を3
〜10%のCo−Cr系合金からなるWC基超硬合金に
おいて、その焼結体の平均粒度が0.6ミクロン以下よ
り成ることを特長とするものである。また、結合金属が
Co−Cr系で少量であるため、WCの1部を重量比で
5%以下の範囲でTa、Nb、V、Moの金属、炭化
物、窒化物、炭窒化物の1種又は2種以上で置き換え
て、粒抑制効果をもたせたものである。
The present invention has been made based on the above-mentioned point of view, and a resin molding die is provided with three binder phases.
In a WC-based cemented carbide consisting of 10% to 10% Co-Cr alloy, the average grain size of the sintered body is 0.6 micron or less. Also, since the binding metal is a small amount in the Co-Cr system, one part of Ta, Nb, V, Mo metal, carbide, nitride, carbonitride is used in the range of 5% or less by weight of 1 part of WC. Alternatively, it may be replaced by two or more kinds to have a grain suppressing effect.

【0007】[0007]

【作用】粒度を細かくし、結合金属の総量を減ずること
は、結合相のmean free pathを薄くし、
耐腐食性を向上させると共に、腐食により初期に生ずる
斑点状の傷を著しく少なくし、その後に生ずる超硬中の
WC粒子の脱落等を減少させ、長寿命化を計ることがで
きる。Co−Cr結合相は、樹脂を予熱する段階で発生
するガスによる腐食に対し、結合相の耐食性を高め、初
期損傷を著しく減少させる。
[Function] To reduce the particle size and the total amount of the binder metal, the mean free path of the binder phase is thinned,
In addition to improving the corrosion resistance, it is possible to significantly reduce the number of speckled scratches initially generated by corrosion and reduce the subsequent drop of WC particles in the cemented carbide to prolong the life. The Co-Cr binder phase enhances the corrosion resistance of the binder phase against the corrosion caused by the gas generated in the step of preheating the resin, and significantly reduces the initial damage.

【0008】本発明による超硬合金の組成及び平均粒度
は以下の理由により限定される。最初に、結合相のCo
−Cr系合金の含有量が3%未満では結合金属の量が十
分でなく、靱性を十分に与えられず、また10%を越え
ると相対的にWC含有量が減少し著しく、耐摩耗性を阻
害するために、3〜10%とした。またCrの添加量は
Co中に固溶する量以下であれば良く、Crが単相に生
じるような添加量では靱性を阻害するため、好ましくな
い。次に、焼結体における平均粒度はイメージアナライ
ザーによる粒度測定で、その平均粒度が0.6ミクロン
以下であれば、結合金属のmean free pat
h が十分に薄くなり結合金属のプールが生じにくく、
問題点の項に述べた斑点状の腐食が生じ難くなるためで
ある。
The composition and average grain size of the cemented carbide according to the invention are limited for the following reasons. First, the binder phase Co
If the content of the -Cr alloy is less than 3%, the amount of the binding metal is not sufficient and the toughness is not sufficiently given. If it exceeds 10%, the WC content is relatively decreased and the wear resistance is improved. In order to inhibit, it was set to 3 to 10%. Further, the amount of addition of Cr is not more than the amount of solid solution in Co, and the amount of addition of Cr in a single phase hinders the toughness, which is not preferable. Next, the average particle size of the sintered body is measured by an image analyzer. If the average particle size is 0.6 micron or less, the mean free particle of the bonding metal is measured.
h is thin enough that a pool of bonded metal is less likely to occur,
This is because the spot-like corrosion described in the section of the problem is less likely to occur.

【0009】更に、該超硬合金において、粒抑制を目的
とした、V、TaC等の添加は有効であり、平均粒度を
より細かくする効果があるが、耐食性の改善には無関係
であり、Crとの複合添加により効果を発揮するもので
ある。以下、本発明を実施例に基づき詳細に説明する。
Further, in the cemented carbide, the addition of V, TaC, etc. for the purpose of grain suppression is effective and has the effect of making the average grain size finer, but it is irrelevant to the improvement of corrosion resistance, and Cr The effect is exhibited by the combined addition of and. Hereinafter, the present invention will be described in detail based on examples.

【0010】[0010]

【実施例】市販のWC粉末(平均粒度0.6μm及び
2.5μm)、Cr粉末(同2.0μm)、TaC粉末
(同1.0μm)及び、Co粉末を使用し、表1に示す
組成で作成した。
EXAMPLES Commercially available WC powder (average particle size 0.6 μm and 2.5 μm), Cr powder (2.0 μm), TaC powder (1.0 μm) and Co powder were used, and the composition shown in Table 1 was used. Created in.

【0011】[0011]

【表1】 [Table 1]

【0012】また、比較のため92%WC−8.0%C
oの組成になるようWC2.5ミクロンの粉末を使用し
て、JISK30相当の合金も製作した。これらの粉末
を混合後、乾燥し、1400℃・1時間焼結したのち、
所定の形状に加工した。また、物性、ミクロ組織上の変
化を確認するため、上記チップを研磨、ラップした後、
硬さ、破壊靱性値を測定した。その結果も併せ表1に示
す。また、粒度は電子顕微鏡による組織観察を行ない、
その写真よりイメージアナライザーで測定した。
For comparison, 92% WC-8.0% C
An alloy equivalent to JIS K30 was also manufactured by using WC 2.5 micron powder so as to have a composition of o. After mixing these powders, drying and sintering at 1400 ° C for 1 hour,
It was processed into a predetermined shape. In addition, in order to confirm changes in physical properties and microstructure, after polishing and lapping the above chips,
Hardness and fracture toughness values were measured. The results are also shown in Table 1. In addition, the grain size is microscopically observed with an electron microscope,
The image was measured with an image analyzer.

【0013】本発明例と比較例の測定結果は、本発明は
WC相の平均粒度が0.45〜0.58μmであり、比
較例は2.3μmとなっていた。さらに、樹脂成形用金
型において実際のタブレット成形を行い、その性能を確
認した。その概略を図1に示し、耐用日数で比較した。
According to the measurement results of the example of the present invention and the comparative example, the average particle size of the WC phase in the present invention was 0.45 to 0.58 μm, and the average particle size of the comparative example was 2.3 μm. Furthermore, actual tablet molding was performed in a resin molding die and the performance was confirmed. The outline is shown in FIG. 1 and compared by the number of service days.

【0014】[0014]

【図1】[Figure 1]

【0015】レジンタブレットとしては、エポキシ系樹
脂を用い、粉末状の樹脂を一定量秤量し、金型に充填
後、加圧・成形したタブレットを予熱した金型に導き
(予熱温度は150度)硬化させ、成形した。その結
果、硬さを同レベルに調整した合金はは10日程度で腐
食から金型表面が荒れたのに対し、本発明合金4は2ケ
月程度耐用した。この試験においては、粒度の影響が顕
著に現れ、比較例は使用初期〜中期に腐食からの肌荒れ
により寿命に達したのに対し、本発明例は、初期の腐食
による傷が防止されたため正常摩耗により長寿命化が達
成されている。また、樹脂の種類、充填材の種類により
変化する予熱温度による加工性と、耐食性に関し、Co
−Cr量を調整して、最適な成分を選択することが可能
である。また、表面にダイヤモンド等の硬質物質やCr
N等の軟質物質を被覆し、耐腐食性、耐摩耗性等を改善
できる。
As the resin tablet, an epoxy resin is used, and a certain amount of powdery resin is weighed and filled in a mold, and then the pressed / molded tablet is guided to a preheated mold (preheating temperature is 150 ° C.). It was cured and molded. As a result, the alloy whose hardness was adjusted to the same level had its mold surface roughened due to corrosion in about 10 days, whereas the alloy 4 of the present invention withstood for about 2 months. In this test, the effect of the particle size was significantly exhibited, whereas the comparative example reached the end of its life due to rough skin from corrosion in the early to middle stages of use, whereas the inventive example was normally worn because scratches due to initial corrosion were prevented. Has achieved longer life. In addition, regarding workability by preheating temperature that changes depending on the type of resin and the type of filler, and corrosion resistance, Co
It is possible to select the optimum component by adjusting the amount of -Cr. In addition, hard materials such as diamond or Cr on the surface
A soft substance such as N can be coated to improve corrosion resistance, wear resistance and the like.

【0016】[0016]

【発明の効果】WC基超硬合金において、結合相をCo
−Cr合金とし、焼結体に於けるWC相の平均粒度を
0.6ミクロン以下と微細化を計ることにより結合相の
mean free pathを薄くし、耐腐食性、耐
摩耗性に優れた樹脂成形用金型用の超硬合金を開発し
た。
In the WC-based cemented carbide, the binder phase is Co
-Cr alloy, the average grain size of the WC phase in the sintered body
We have developed a cemented carbide for resin molding dies, which has a small mean free path of the binder phase and is excellent in corrosion resistance and wear resistance by making it finer than 0.6 microns.

【図面の簡単な説明】[Brief description of drawings]

【図1】図1は、本発明に係る樹脂成形用金型の実施例
を示す断面図を示す。
FIG. 1 is a sectional view showing an embodiment of a resin molding die according to the present invention.

【符号の説明】[Explanation of symbols]

1 上パンチ 2 ダイ 3 樹脂 4 下パンチ 1 Upper punch 2 Die 3 Resin 4 Lower punch

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 結合相が3〜10%のCo−Cr系合金
からなるWC基超硬合金において、その焼結体の平均粒
度が0.6ミクロン以下より成ることを特長とする樹脂
成形用金型。
1. A resin molding, characterized in that in a WC-based cemented carbide composed of a Co--Cr based alloy having a binder phase of 3 to 10%, the average grain size of the sintered body is 0.6 μm or less. Mold.
【請求項2】 請求項1において、WCの1部を重量比
で5%以下の範囲でTa、Nb、V、Moの金属、炭化
物、窒化物、炭窒化物の1種又は2種以上で置き換えた
ことを特徴とする樹脂成形用金型。
2. The WC according to claim 1, wherein one part of WC is made of one or more of Ta, Nb, V and Mo metals, carbides, nitrides and carbonitrides within a range of 5% by weight or less. A resin molding die characterized by being replaced.
JP4786195A 1995-02-13 1995-02-13 Mold for molding resin Pending JPH08216160A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4786195A JPH08216160A (en) 1995-02-13 1995-02-13 Mold for molding resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4786195A JPH08216160A (en) 1995-02-13 1995-02-13 Mold for molding resin

Publications (1)

Publication Number Publication Date
JPH08216160A true JPH08216160A (en) 1996-08-27

Family

ID=12787161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4786195A Pending JPH08216160A (en) 1995-02-13 1995-02-13 Mold for molding resin

Country Status (1)

Country Link
JP (1) JPH08216160A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6259864A (en) * 1985-09-06 1987-03-16 ゼロツクス コ−ポレ−シヨン Device and method for measuring speed of belt
NL1032865C2 (en) * 2006-10-03 2008-04-04 Czl Tilburg B V Injection molding tool for producing e.g. lenses or CD's, includes wear resistant hard metal layer applied by shockwave cladding
JP2013206968A (en) * 2012-03-27 2013-10-07 Kaneka Corp Tablet molding die for optical semiconductor package, and manufacturing method of tablet using the die
WO2018097286A1 (en) * 2016-11-28 2018-05-31 日立金属株式会社 Mold and production method therefor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6259864A (en) * 1985-09-06 1987-03-16 ゼロツクス コ−ポレ−シヨン Device and method for measuring speed of belt
NL1032865C2 (en) * 2006-10-03 2008-04-04 Czl Tilburg B V Injection molding tool for producing e.g. lenses or CD's, includes wear resistant hard metal layer applied by shockwave cladding
JP2013206968A (en) * 2012-03-27 2013-10-07 Kaneka Corp Tablet molding die for optical semiconductor package, and manufacturing method of tablet using the die
WO2018097286A1 (en) * 2016-11-28 2018-05-31 日立金属株式会社 Mold and production method therefor
JPWO2018097286A1 (en) * 2016-11-28 2019-10-17 日立金属株式会社 Mold and manufacturing method thereof
US11820048B2 (en) 2016-11-28 2023-11-21 Proterial, Ltd. Mold and production method therefor

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