JPH08213130A - Ic socket - Google Patents

Abstract

PURPOSE: To provide an IC socket, which can pinch a J-bent-lead IC package from both surfaces thereof and which can be inserted even from any direction of the surface and the back surface thereof. CONSTITUTION: The IC socket is formed of a square socket main body 1, a guide member 2, which is vertically planted in the socket main body 1, and a cover 3, which is regulated in the horizontal direction by the guide member 2 and can slide in the vertical direction. Contact pins 5, which are respectively formed of a pushing part 5a, a first contact part, a second contact part, a spring part and a connection part, are planted in the socket main body 1 with a constant space outside of an IC mounting table at a central part of the socket main body 1 so that the inserted IC package is pinched from both the upper and lower surfaces thereof. The cover 3 is provided with an inclined surface part 7 for moving the pushing part 5a of the contact pin 5 outward with the lowering itself.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to PLCC or SOJ.
Open top type IC socket

[0002]

2. Description of the Related Art As shown in FIG. 9, an example of a conventional open top type IC socket for PLCC has contact pins 12 which are planted at regular intervals facing four sides of a recess 11a in the center of a socket body 11. Bends inward at the upper end to form a contact portion 12a, and the contact portion 12a has an IC
This is an IC socket in which the leads 8a of the package 8 are slidably inserted.

As another example, as shown in FIG. 10, an IC package mounting base 13b is provided in the center of a recess 13a in the center of the socket body 13, and the four sides of the recess 13a have an upper side. Is the first contact portion 14a, and the contact pin 14 has the second contact portion 14b branched inward on the lower side.
Are facing each other and are planted at regular intervals.

The IC package 8 is attached to the first contact portion 14a.
Insert the lead 8a of the
The second contact portion 14b is pressed by b, and the lead shoulder portion 8c is engaged with the first contact portion 14a.

[0005]

However, in each of the above-mentioned examples, when the IC package 8 is attached or detached, the lead 8a slides with the contact pin 12 or 14 from the beginning, so the plating of the lead 8a is peeled off. 12 or 1
It may be transferred to 4. The transferred plating layer is electrolyzed and the contact pin 12 or 14 and the lead 8 are
This causes poor contact with a.

In the example of FIG. 10, the lead shoulder 8c is an IC.
The resin may squeeze into this portion when the package 8 is molded, and the first contact portion 14a may not contact the lead 8a.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above problems and provide an IC socket which is easy to attach and detach and does not cause poor contact.

[0008]

In order to solve the above-mentioned problems, a socket body 1 capable of accommodating a J-vent lead type IC package 8 and a vertical body having a tendency to upwardly oppose the socket body 1 are provided. In an IC socket composed of a frame-shaped cover 3 held slidably in a direction, an IC mounting table 4 is provided in the central portion of the socket body 1,
Contact pins 5 are arranged on the outside of the C mounting table 4 at regular intervals. The contact pins 5 are divided into a pressing portion 5a whose upper end is inclined outward, and an inside of the pressing portion 5a which branches below the pressing portion 5a. The first contact portion 5b, the spring portion 5d formed below the branch point of the first contact portion 5b, and the spring portion 5d.
A second contact portion 5c that branches in the same direction as the first contact portion 5b on the lower side, a base portion 5f disposed on the socket body 1, and extends downward from the base portion 5f to connect to an external circuit. The cover 3 is provided with an outwardly facing sloped portion 7 that comes into contact with the pressing portion 5a at the upper end of the contact pin 5 while being formed of the connecting portion 5e. By pressing the cover 3, the sloped portion 7 is formed. The IC package 8 accommodated in the first contact portion 5b by pressing the pressing portion 5a of the contact pin 5 to retract the first contact portion 5b to the outside and releasing the pressing.
The lead 8a or the main body of the IC package 8 can be pressed and contacted.

The cover 3 vertically has an elastic force of the contact pin 5, and the cover 3 or the socket body 1
Is formed integrally with or separately from these, and is configured to be restricted by the guide member 2 attached to the cover 3 or the socket body 1.

The contact pin 5 is formed by punching one elastic plate or is formed by bending a strip-shaped elastic plate, and its spring portion 5d is curved and protrudes outward. It is either a straight line or a straight line.

[0011]

1 is a sectional view of an IC socket showing an embodiment of the present invention. The right half is a state diagram immediately after inserting the IC package 8 by pushing down the cover 3 (immediately before taking out), and the left half is the left half. Figure 2 shows the state that the IC package is completely inserted.
Is a plan view.

This IC socket has a frame shape in which a rectangular socket body 1 and guide members 2 vertically implanted at four corners of the socket body 1 regulate the horizontal direction and slidably retain the vertical direction. And a coil spring 9 that elastically presses the cover 3 to the upper end of the guide member 2 along the guide member 2.

The socket body 1 is an upward box-shaped body having a wall 1a on its periphery, and has a rectangular IC mounting table 4 provided on the upper surface of the central portion of the bottom surface and each side of the IC mounting table 4. A plurality of contact pins 5 are provided on the outer side in parallel with each side and planted at regular intervals.

Coil springs 9 are inserted into the guide members 2 along the respective guide members 2, and the cover 3 is elastically pressed onto the upper end of the guide member 2.

Holes 6 through which the guide member 2 penetrates are formed at four corners of the cover 3. As shown in FIG. 3, the hole 6 has a diameter on the lower side that allows the guide member 2 to be loosely fitted,
The upper side has a diameter at which the head portion 2a of the guide member 2 is loosely fitted, and is configured to regulate the upper limit even when the cover 3 is elastically pressed to the upper end by the coil spring 9.

Further, a slanted surface portion 7 is provided from the inside to the outside on the lower surface of each side of the frame shape so as to contact the pressing portion 5a at the upper end of the contact pin 5.

An example of the contact pin 5 is shown in FIG.
As shown in FIG. 3, the pressing portion 5a has an upper end inclined outward, and the first contact portion 5 that branches inward under the pressing portion 5a.
b and the lower side of the branch point of the first contact portion 5b form an outwardly curved spring portion 5d, and the lower side of the spring portion 5d branches in the same direction as the first contact portion 5b. Two contact parts 5
c, a base portion 5f disposed in the socket body 1, and a connecting portion 5 extending downward from the base portion 5f and connected to an external circuit.
e.

The one shown in FIG. 4B is the same as that shown in FIG.
Instead of the curved spring portion 5d shown, a linear spring portion 5d
It has become.

The contact pin 5 shown in FIGS. 4 (a) and 4 (b) is formed by punching one elastic plate into a predetermined shape, but the one shown in FIG. 4 (c) is a band-shaped elastic member. The plate is bent to form the first contact portion 5b, the spring portion 5d, the second contact portion 5c, and the connection portion 5e, and the pressing portion 5a is joined by spot welding or the like with the same strip-shaped elastic plate. is there.

Next, the operation of the above IC socket will be described. As shown in the right half of FIG. 1, when the cover 3 is pushed down against the elastic force of the coil spring 9, the contact pin 5
The pressing portion 5a of the cover 3 is bent by the slope portion 7 of the cover 3 so that the spring portion 5d moves outward. In this state, the first contact portion 5b
Shifts to the diagonally outer side and is in a state of being retracted from the insertion range of the IC package 8.

In this state, the lead 8a is placed on the second contact portion 5c of the contact pin 5 along a positioning member (not shown) and the cover 3 is released from the depressed state. The elastic force of the coil spring 9 raises the upper end of the guide member 2, and the contact pin 5
The pressing portion 5a moves inward along the inclined surface portion 7, and along with this, the first contact portion 5b moves obliquely inward and presses the upper surface of the IC package 8. This state is shown in the left half of FIG.

When the IC package is to be removed, the cover 3 should be pushed down in the same manner as when the IC package is inserted so that the right half of FIG.

When the IC package 8 is inserted into this IC socket, the IC package 8 is constructed so as to make regular contact with the IC package 8 face up or face down.
It is inserted in a direction determined by the internal connection of the IC package 8 and the external connection of the IC socket.

An explanatory view of this state is shown in FIG. 5, in which (a) is an example in which the spring portion 5d of the contact pin 5 is curved, and the IC package 8 is inserted in the reverse direction, and (b) is the spring portion 5d.
Is a linear type, and the IC package 8 is an example in which it is inserted face up. However, the IC package 8 can be inserted in the opposite direction to the above by the internal connection of the IC package 8 and the external connection of the IC socket.

As shown in FIGS. 6, 7 and 8, the guide member 2 may be formed integrally with the cover 3 so as to engage with the socket body 1, or conversely, it may be formed integrally with the socket body 1. It may be engaged with the cover 3.

Further, the coil spring 9 need not be provided in particular, and the elastic force of the contact pin 5 pushes the inclined surface portion 7 in the direction of arrow F through the pressing portion 5a as shown in FIG. , The cover 3 is pressed upward,
It is also possible to perform the operation of the socket described above.

[0027]

As described above, since the IC package 8 is not fixed only by the lead 8a, the load on the lead 8a is reduced, and problems such as deformation of the lead 8a do not occur.

Since the IC package 8 is clamped and fixed in the vertical direction, the IC package 8 does not come off from the IC socket due to vibration or shock.

Further, since the same IC socket can be used for mounting the front surface and the back surface of the IC package, it is possible to cope with the IC package 8 in which the internal connection is reversed.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of an IC socket showing an embodiment of the present invention, in which the right half pushes down a cover 3 to IC package 8;
Is a state diagram immediately after insertion (immediately before removal), and the left half is a state diagram when insertion of the IC package is completed.

FIG. 2 is a plan view of the same.

FIG. 3 is an explanatory view of an engagement state between an upper end portion of a guide member and a cover.

FIG. 4 is a shape diagram of a contact pin, in which (a) a punched shape has a curved spring portion, (b) a shape drawing having a linear spring portion, and (c) a bending step. It is a shape diagram having a linear spring portion.

FIG. 5 is an explanatory diagram of the insertion state of the IC package.
FIG. 4 is an explanatory diagram of the face-down insertion, and (B) is an explanatory diagram of the front-side insertion.

FIG. 6 is a partially enlarged perspective view of another embodiment of the guide member of the present invention.

7 is a partially enlarged cross-sectional view showing engagement between the guide member and the socket body shown in FIG.

8 is a partial cross-sectional view of an IC socket having the guide member shown in FIG.

FIG. 9 is a sectional view of an example of a conventional IC socket.

FIG. 10 is a sectional view of another example of a conventional IC socket.

[Explanation of symbols]

 1 Socket Main Body 2 Guide Member 3 Cover 4 IC Placement Table 5 Contact Pin 5a Pressing Part 5b First Contact Part 5c Second Contact Part 5d Spring Part 5e Connection Part 5f Base Part 6 Hole 7 Slope Area 8 IC Package 8a Lead 9 Coil Spring

Claims (7)

[Claims] 1. A socket main body capable of accommodating a J-vent lead type IC package, and a frame-shaped cover which is held so as to be vertically slidable while having an upward elastic tendency to the socket main body. In the IC socket, an IC mounting table is provided in the center of the socket body, and contact pins are arranged at regular intervals on the outer side of the IC mounting table. The contact pins are pressed with their upper ends inclined outward. Portion, a first contact portion that branches inward under the pressing portion, a spring portion formed below the branch point of the first contact portion, and the first portion below the spring portion. The cover includes a second contact portion branched in the same direction as the contact portion, a base portion provided in the socket body, and a connection portion extending downward from the base portion and connected to an external circuit. Pressing the upper end of the contact pin A sloped portion facing outward is provided, and by pressing the cover, the sloped portion presses the pressing portion of the contact pin to retract the first contact portion to the outside, and by releasing the pressing, An IC socket characterized in that one contact portion can be pressed into contact with a lead of an IC package housed therein or an IC package body. 2. The IC socket according to claim 1, wherein the cover is restricted in a vertical direction by an elastic force of the contact pin and a guide member integrally formed with the cover or the socket body. 3. The guide member is formed separately from the cover and the socket body, and is attached to the cover or the socket body.
IC socket. 4. The IC socket according to claim 1, wherein the spring portion of the contact pin is curved and protrudes outward. 5. The IC socket according to claim 1, wherein the spring portion of the contact pin has a linear shape. 6. The contact pin is formed by punching an elastic plate.
2, 3, 4 or 5 IC sockets. 7. The contact pin is formed by bending a band-shaped elastic plate.
Or 5 IC socket.