JPH08213124A - Socket for stack mounting chip parts - Google Patents

Abstract

PURPOSE: To provide a socket for stack mounting chip parts, which can make electric continuity terminals of two chip parts, which are stack mounted, and which can easily operate the temporary positioning of the relative position of these two chip parts and which can improve the utilizing efficiency of a printed board at the stack mounting merit and which can easily realize the reduction of the harmful parasitic component. CONSTITUTION: This socket is formed of conductive flat plates 1a, 2a and socket parts 1b, 1c, 2b, 2c, and four pieces having the cross sectional shape having the spring performance. One pair of them is bent upward in relation to the conductive flat plates 1a, 2a, and the other pair is bent downward, and each pair respectively has the structure for holding objective chip parts 3, 4, 5 before mounting.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for electrically connecting two chip parts, and more particularly to a socket for electrically connecting two chip parts mounted three-dimensionally.

[0002]

2. Description of the Related Art FIG. 2 is a perspective view showing a chip component mounted on a plane by a conventional conductor pattern.

Conventionally, when chip type electronic parts such as capacitors, resistors and coils having no lead wire, that is, chip parts are mounted on a printed wiring board, as shown in FIG. 2, a chip land 16 on the printed wiring board is used. The terminal portions 13a and 15a of the chip components 13 and 15 are soldered to the. Further, the other chip component 14 electrically connected to the above-mentioned chip components 13 and 15 is electrically connected by the conductor patterns 11 and 12 on the printed wiring board.

[0004]

In the above-described conventional chip component mounting method, since each chip component that needs to be electrically connected is generally connected by the conductor pattern on the printed wiring board, the parasitic inductance is inevitable. Components and parasitic capacitance components are added. As a result, there is a problem in that the electrical characteristics (simulation result) at the time of design and the actual electrical characteristics of the printed wiring board differ. Moreover, since the chip components are soldered almost directly to the printed wiring board, the space on the printed wiring cannot be effectively used, which hinders the improvement of the mounting density.

Therefore, an object of the present invention is to have a function of electrically connecting between the terminal portions of two chip components mounted three-dimensionally, and to easily determine the relative positions of the two chip components to be mounted. It is an object of the present invention to provide a socket for three-dimensional mounting of chip components, which has a structure that can be provisionally determined and solves the above problems.

[0006]

A three-dimensional mounting socket for chip parts according to the present invention has a three-dimensional mounting structure in which two chip parts are parallel to a substrate and orthogonal to each other, and at least a part of each one terminal portion overlaps with each other. Is a socket that conducts electricity between the respective one terminal portions of the two chip components arranged in the above, and is a substantially rectangular conduction flat plate portion, and a substantially rectangular connection with a part of each of the four side end portions of the conduction flat plate portion. A pair of opposed rectangular pieces and a socket portion in which the remaining one pair is bent toward the opposite sides with respect to the surface of the conductive flat plate portion are formed from a single metal plate. The conductive flat plate part has an area and solderability for soldering the terminal part of the chip component, and the socket part has a position, a width and a height on a predetermined side edge for each of the facing groups. And having a cross-sectional shape with springiness A part of the shape is bent to the inside of a right angle with respect to the conductive flat plate portion, and by these, the terminal portion of a predetermined chip component can be gripped and the relative position of the two chip components can be determined. It has a feature.

It is desirable that the conductive lithographic portion of the chip component three-dimensional mounting socket has a vertical and horizontal length slightly larger than the width of the terminal portion of each chip component to be connected. It is also preferable that the socket portion of the three-dimensional component mounting socket has an S-shaped cross-section with springiness.

[0008]

The three-dimensional mounting socket for chip parts of the present invention has a structure in which the socket portion has a spring-like elastic surface shape, and one set is bent to the upper side of the conductive flat plate portion and the other set is bent to the lower side. Therefore, this part has a feature that each target chip component can be gripped before mounting.

First, solder paste is applied to the chip land and the upper and lower surfaces of the conductive flat plate portion of the socket of the present invention. Next, the terminal portion of the chip component arranged on the substrate surface is press-fitted into the socket portion of the set of the present socket, then this chip component is mounted on the chip land, and another set of sockets attached to this chip component. The terminal portions at both ends of the chip component to be three-dimensionally mounted are press-fitted into the portion. From these, the target chip component is grasped, and the relative positions of both chip components are determined, that is, they can be temporarily fixed. After that, the whole is electrically and mechanically connected using a reflow device. By using this socket in this way, the operation in the pre-reflow process for three-dimensional mounting is extremely simple.

[0010]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a perspective view showing the relationship between an embodiment of a chip component three-dimensional mounting socket of the present invention and chip components connected by the socket.

In FIG. 1, a chip component three-dimensional mounting socket 1 is parallel to a substrate and orthogonal to each other, and has a terminal portion 4.
It is a socket for electrically connecting the above-mentioned terminal portions 4a, 3a of the two chip parts 4, 3 which are three-dimensionally arranged so that parts of a, 3a overlap each other.

The three-dimensional mounting socket 1 for chip parts is
A conductive metal plate member is bent to form a substantially flat conductive flat plate portion 1a, and a rectangular socket portion 1b that is bent and connected to the conductive flat plate portion 1b.
It consists of 1c.

The conductive flat plate portion 1 has an area and solderability for soldering the terminal portions 4a, 3a of the chip parts 4, 3.

The socket portions 1b and 1c are the conductive flat plate portion 1a.
The four rectangular pieces forming two sets are connected to the opposing portions of the four side edges of the socket, one set of the socket portions 1b is directed upward from the conductive flat plate portion 1a, and the remaining one set of sockets is formed. The portions 1c are bent substantially at right angles from the conductive flat plate portion 1a toward the lower side. The socket portions 1b and 1c have a spring-like S-shape, and are designed so that the terminal portions 3a and 4a of the chip components 3 and 4 to be connected can be held. The positions, widths and heights on the side edges of the conductive flat plate portion 1a of the rectangular socket portions 1b and 1c are the two chip components 3 and 4 to be connected and the symmetrically arranged ones shown in this figure. It is set to be optimum depending on the factors of the dimension and the arrangement position of the chip component 5 to be connected through the chip component three-dimensional mounting socket 2.

Next, the operation of this embodiment will be described.

Two chip parts 3 and 5 on the same plane,
On the other hand, the case where the sockets 1 and 2 of the present embodiment are used between the three chip components 4 arranged three-dimensionally will be described.

First, an appropriate amount of solder paste is applied to the upper and lower surfaces of the conductive lands 1a and 2a of the chip lands 6 and the sockets 1 and 2 for three-dimensional mounting of chip components, respectively. Next, the terminal portions 3a and 5a of the chip components 3 and 5 are press-fitted into the socket portions 1c and 2c of the chip component three-dimensional mounting sockets 1 and 2. Next, the chip parts 3 and 5 are mounted on the chip land 6, and the terminal parts 4a at both ends of the chip part 4 are press-fitted into the socket parts 1b and 2b of the chip part mounting sockets 1 and 2 attached to the chip parts 3 and 5, respectively. , The target chip parts 3,
4, 5 are grasped, the relative positions of the parts 3, 4, 5 of each chip are determined, that is, they are temporarily fixed.

After that, the whole chip is heated and soldered by using a reflow device, so that three chip parts 3, 4, 5 are formed.
Electrical and mechanical connections of.

As described above, this embodiment is extremely easy to operate, enhances the utilization efficiency of the printed circuit board, and eliminates the need for a conductor pattern between chip components, so that a parasitic inductance component and a parasitic capacitance component are added. This has advantages such as reduction.

In the above example, the sectional shape of the socket is S-shaped, but it may be Z-shaped or the like.

[0022]

As described above, according to the present invention, the terminal parts of the chip parts are overlapped, the chip parts are three-dimensionally arranged, and the conductor pattern between the chip parts can be eliminated. Further, there is an effect that it is possible to provide a socket for three-dimensional mounting of chip components, which is extremely easy to operate, improves the mounting density on the printed circuit board, and can reduce the parasitic inductance component and parasitic capacitance component added between the chip components.

[Brief description of drawings]

FIG. 1 is a perspective view showing a relationship between an embodiment of a chip component three-dimensional mounting socket of the present invention and a chip component connected by the socket.

FIG. 2 is a perspective view showing a chip component planarly mounted by a conventional conductor pattern.

[Explanation of symbols]

 1, 2 Chip component three-dimensional mounting sockets 1a, 2a Conductive flat plate portions 1b, 1c, 2b, 2c Socket portions 3, 4, 5, 13, 14, 15 Chip components 3a, 4a, 5a, 13a, 14a, 15a Terminal portion 6,16 Chip land 11,12 Conductor pattern

Claims (3)

[Claims] 1. The one terminal of each of the two chip components, which is three-dimensionally arranged such that the two chip components are parallel to the substrate and orthogonal to each other, and at least a part of each one terminal portion overlaps each other. A socket for conducting between parts, which is a substantially rectangular conducting flat plate portion and a substantially rectangular piece connected to a part of each of the four side end portions of the conducting flat plate portion, the rectangular pieces facing each other. A socket part in which one set and the other set are bent on opposite sides with respect to the surface of the conductive flat plate part are molded from a single metal plate, and the conductive flat plate part is the chip. It has an area and solderability for soldering the terminal portion of the component, and the socket portion has a position, a width and a height on a predetermined side end for each of the facing pairs, and has a spring property. A part of the shape having a cross-sectional shape with the conductive flat plate The chip is characterized in that it is bent to the inside of a right angle with respect to the part, and by these, the terminal parts of predetermined chip parts can be gripped and the relative positions of the two chip parts can be determined. Socket for three-dimensional mounting of parts. 2. The socket for three-dimensional mounting of chip components according to claim 1, wherein the conductive flat plate portion has a vertical length and a horizontal length that are slightly larger than the widths of the terminal portions of the respective chip components to be connected. 3. The socket for three-dimensional mounting of chip components according to claim 1, wherein the socket portion has an S-shaped cross section having the spring property.