JPH08204330A - Connecting method for ceramic wiring board - Google Patents
Connecting method for ceramic wiring boardInfo
- Publication number
- JPH08204330A JPH08204330A JP7012381A JP1238195A JPH08204330A JP H08204330 A JPH08204330 A JP H08204330A JP 7012381 A JP7012381 A JP 7012381A JP 1238195 A JP1238195 A JP 1238195A JP H08204330 A JPH08204330 A JP H08204330A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic wiring
- wiring board
- dam
- cream solder
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えば電子部品として
利用されるセラミック基板を使用したプリント配線板の
製造の際等に使用されるセラミック配線板の接合方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of joining a ceramic wiring board used in the production of a printed wiring board using a ceramic substrate used as an electronic component, for example.
【０００２】[0002]
【従来の技術】近年、プリント配線板の高性能化が望ま
れる中、セラミック配線板においては、複数のセラミッ
ク配線板の導体層を何らかの方法で接続して、多層化す
ることにより、高性能化することが行われている。すな
わち、図３に示すように一対のセラミック配線板１ａ、
１ｂのグランド層１１ａ、１１ｂ（導体部）をクリーム
半田５で接合し、内層にグランド層１１ａ，１１ｂを有
し、両側の表層に回路層１０ａ、１０ｂを有する多層セ
ラミック配線板とすることにより、クロストーク等の問
題を解決することが行われている。このような、複数の
セラミック配線板の導体部を接続する接合方法の１つと
して、一方のセラミック配線板の導体部にクリーム半田
を印刷して配設し、次いで他方のセラミック配線板の導
体部をこのクリーム半田に当接させ、次いでリフロー処
理（加熱処理）をして接合する方法が知られている。し
かし、この方法の場合、リフロー処理でセラミック基板
間に広がって形成された半田の接続部分に、クリーム半
田中に含まれるフラックス等がボイドとして残ることが
あり、接続信頼性が低下するという問題があった。2. Description of the Related Art In recent years, as printed wiring boards have been desired to have higher performance, in ceramic wiring boards, the performance has been improved by connecting the conductor layers of a plurality of ceramic wiring boards by some method to form multiple layers. Is being done. That is, as shown in FIG. 3, a pair of ceramic wiring boards 1a,
By joining the ground layers 11a and 11b (conductor portions) of 1b with the cream solder 5, and having the ground layers 11a and 11b on the inner layers and the circuit layers 10a and 10b on the surface layers on both sides, a multilayer ceramic wiring board is obtained. Problems such as crosstalk are being solved. As one of the joining methods for connecting the conductors of a plurality of such ceramic wiring boards, cream solder is printed and arranged on the conductors of one ceramic wiring board, and then the conductors of the other ceramic wiring board are arranged. There is known a method of bringing the cream solder into contact with the cream solder, and then performing a reflow treatment (heating treatment) to join them. However, in the case of this method, flux and the like contained in the cream solder may remain as voids in the solder connection portion formed between the ceramic substrates by the reflow process, which causes a problem that the connection reliability decreases. there were.
【０００３】[0003]
【発明が解決しようとする課題】上記の事情に鑑み、本
発明は、クリーム半田中に含まれるフラックス等がボイ
ドとして残る問題を解決し、接続信頼性の高いセラミッ
ク配線板の接合方法を提供することを目的としている。In view of the above circumstances, the present invention solves the problem that the flux and the like contained in the cream solder remain as voids, and provides a method of joining a ceramic wiring board having high connection reliability. Is intended.
【０００４】[0004]
【課題を解決するための手段】請求項１に係る発明のセ
ラミック配線板の接合方法は、複数のセラミック配線板
の導体部間をクリーム半田を用いて接合するセラミック
配線板の接合方法において、接合する一方のセラミック
配線板の導体部上に、間隙を有する堰堤を形成し、この
堰堤内にクリーム半田を配設し、次いで接合する他方の
セラミック配線板の導体部を前記クリーム半田に当接さ
せ、次いで加熱処理することを特徴としている。According to a first aspect of the present invention, there is provided a method for joining a ceramic wiring board according to a first aspect of the present invention, wherein the conductor portions of the plurality of ceramic wiring boards are joined using cream solder. A dam having a gap is formed on the conductor of one ceramic wiring board, cream solder is arranged in the dam, and then the conductor of the other ceramic wiring board to be joined is brought into contact with the cream solder. The next step is heat treatment.
【０００５】請求項２に係る発明のセラミック配線板の
接合方法は、上記堰堤を硬化性の樹脂を用いて形成する
ことを特徴としている。The method for joining ceramic wiring boards according to a second aspect of the present invention is characterized in that the dam is formed using a curable resin.
【０００６】[0006]
【作用】本発明においては、接合する一方のセラミック
配線板の導体部上に、間隙を有する堰堤を形成している
ので、この堰堤内にクリーム半田を配設し、他方のセラ
ミック配線板の導体部と加熱処理により接合させた場合
に、前記堰堤の間隙からフラックス等の成分が逃げるた
め、接合する導体部と半田との間に泡状のボイドが残留
しなくなる。従って、本発明の接合方法によれば接続信
頼性が向上する。In the present invention, since a dam having a gap is formed on the conductor portion of one ceramic wiring board to be joined, cream solder is arranged in the dam and the conductor of the other ceramic wiring board is formed. In the case of joining by heat treatment with a portion, components such as flux escape from the gap of the dam, so that bubble-like voids do not remain between the joined conductor portion and solder. Therefore, the joining method of the present invention improves the connection reliability.
【０００７】[0007]
【実施例】以下、本発明の実施例を図面を参照して説明
する。Embodiments of the present invention will be described below with reference to the drawings.
【０００８】本実施例では３層構造のセラミック多層配
線板を本発明の接合方法を用いて作製する。まず、図１
に示すように、一方の面に回路層１０ａ、他の面にグラ
ンド層１１ａが形成されたセラミック配線板１ａと一方
の面に回路層１０ｂ、他の面にグランド層１１ｂが形成
されたセラミック配線板１ｂの２枚のセラミック配線板
１ａ、１ｂを準備する。なお、回路層１０ａ、１０ｂ及
びグランド層１１ａ、１１ｂの形成は、例えばセラミッ
ク基板の表面を３３０℃程度の熱リン酸で粗面化処理し
た後、Ｐｄ等の核付け処理をし、次いで無電解めっき法
によって銅層を形成し、さらにフォトリソ法等の方法で
回路パターンを形成する等の方法で形成できる。そし
て、図１に示すように接合する一方のセラミック配線板
１ｂのグランド層１１ｂ（導体部）の上であって、クリ
ーム半田５を印刷しようとする位置を包囲する位置に、
間隙４を有する堰堤３を形成する。この点について、図
２に示すセラミック配線板１ｂの平面図に基づいて説明
すると、セラミック配線板１ｂの表面に形成されている
グランド層１１ｂ上の、点線６で区切られている円周内
がクリーム半田を印刷しようとする位置であり、この点
線６で区切られている位置を包囲して、間隙４を有する
堰堤３を形成する。この堰堤３の形成法については、例
えば、硬化性樹脂であるエポキシ樹脂等をスクリーン印
刷法で所望の形状に印刷し、乾燥して形成することがで
きる。なお、堰堤３を形成する材料は硬化性樹脂に限る
必要はなく、金属、ガラス等の無機物で形成してもよい
が、硬化性樹脂であれば堰堤３の形成が容易にできる利
点がある。In this embodiment, a ceramic multilayer wiring board having a three-layer structure is manufactured by using the bonding method of the present invention. First, FIG.
As shown in FIG. 1, a ceramic wiring board 1a having a circuit layer 10a formed on one surface and a ground layer 11a formed on the other surface and a ceramic wiring board 10a formed on one surface and a ground layer 11b formed on the other surface Two ceramic wiring boards 1a and 1b of the board 1b are prepared. The formation of the circuit layers 10a, 10b and the ground layers 11a, 11b is performed, for example, by roughening the surface of the ceramic substrate with hot phosphoric acid at about 330 ° C., then performing nucleation treatment with Pd or the like, and then performing electroless plating. It can be formed by a method such as forming a copper layer by a plating method and further forming a circuit pattern by a method such as a photolithography method. Then, as shown in FIG. 1, on the ground layer 11b (conductor portion) of the one ceramic wiring board 1b to be joined, at a position surrounding the position where the cream solder 5 is to be printed,
A dam 3 having a gap 4 is formed. This point will be described with reference to the plan view of the ceramic wiring board 1b shown in FIG. 2. On the ground layer 11b formed on the surface of the ceramic wiring board 1b, the inside of the circle delimited by the dotted line 6 is the cream. A dam 3 having a gap 4 is formed by surrounding a position where solder is to be printed and which is divided by the dotted line 6. The dam 3 can be formed by printing a curable resin such as epoxy resin in a desired shape by screen printing and drying it. The material for forming the dam 3 is not limited to the curable resin, and may be an inorganic material such as metal or glass. However, the curable resin has an advantage that the dam 3 can be easily formed.
【０００９】次いで、図１に示すように、セラミック配
線板１ｂのグランド層１１ｂ上の、堰堤３で囲まれてい
る位置にクリーム半田５を印刷して配設し、次いで、接
合する他方のセラミック配線板１ａのグランド層１１ａ
（導体部）が前記クリーム半田５に当接するように、２
枚のセラミック配線板１ａ、１ｂを重ねる。Next, as shown in FIG. 1, cream solder 5 is printed and arranged on the ground layer 11b of the ceramic wiring board 1b at a position surrounded by the dam 3, and then the other ceramic to be joined. Ground layer 11a of wiring board 1a
2 so that the (conductor) may come into contact with the cream solder 5.
The ceramic wiring boards 1a and 1b are stacked.
【００１０】次いで、リフロー処理（加熱処理）をし
て、クリーム半田５中の半田を溶融し、冷却することに
より、２枚のセラミック配線板１ａ、１ｂが接合され
た、３層構造のセラミック多層配線板が作製できる。こ
のリフロー処理の際にクリーム半田５中のフラックス成
分等は堰堤３の間隙４を通って逃げるため、冷却後の半
田部分にボイドが発生することが防止される。Next, a reflow process (heating process) is performed to melt the solder in the cream solder 5 and cool it to join the two ceramic wiring boards 1a and 1b to each other, thereby forming a three-layer ceramic multilayer structure. A wiring board can be manufactured. During this reflow process, flux components and the like in the cream solder 5 escape through the gaps 4 of the dam 3, so that voids are prevented from occurring in the solder portion after cooling.
【００１１】[0011]
【発明の効果】請求項１及び請求項２に係る発明によれ
ば、クリーム半田中に含まれるフラックス等の成分が堰
堤の間隙から逃げるため、接合する導体部と半田との間
に泡状のボイドが残留しなくなる。従って、本発明の接
合方法によれば接続信頼性が向上する。According to the first and second aspects of the invention, the components such as the flux contained in the cream solder escape from the gap of the dam, so that a foam-like component is formed between the conductor portion to be joined and the solder. The void does not remain. Therefore, the joining method of the present invention improves the connection reliability.
【００１２】請求項２に係る発明によれば、上記の効果
に加えて、堰堤の形成を硬化性樹脂で行うため、堰堤の
形成が容易にできる。According to the second aspect of the present invention, in addition to the above effects, since the dam is formed by the curable resin, the dam can be easily formed.
【図１】本発明の接合方法を説明する断面図である。FIG. 1 is a cross-sectional view illustrating a joining method of the present invention.
【図２】実施例における、一方のセラミック配線板に堰
堤を形成した状態を示す平面図である。FIG. 2 is a plan view showing a state in which a dam is formed on one ceramic wiring board in the example.
【図３】従来技術における、接合方法を説明する断面図
である。FIG. 3 is a cross-sectional view illustrating a joining method in a conventional technique.
１ａ セラミック配線板 １ｂ セラミック配線板 ３ 堰堤 ４ 間隙 ５ クリーム半田 １０ａ 回路層 １０ｂ 回路層 １１ａ グランド層 １１ｂ グランド層 1a ceramic wiring board 1b ceramic wiring board 3 dam 4 gap 5 cream solder 10a circuit layer 10b circuit layer 11a ground layer 11b ground layer
Claims (2)
リーム半田を用いて接合するセラミック配線板の接合方
法において、接合する一方のセラミック配線板の導体部
上に、間隙を有する堰堤を形成し、この堰堤内にクリー
ム半田を配設し、次いで接合する他方のセラミック配線
板の導体部を前記クリーム半田に当接させ、次いで加熱
処理することを特徴とするセラミック配線板の接合方
法。1. A method for joining ceramic wiring boards, wherein conductor portions of a plurality of ceramic wiring boards are joined together using cream solder, wherein a dam having a gap is formed on the conductor portion of one ceramic wiring board to be joined. A method for joining ceramic wiring boards, characterized in that cream solder is disposed in this dam, the conductor portion of the other ceramic wiring board to be joined next is brought into contact with the cream solder, and then heat treatment is performed.
ることを特徴とする請求項１記載のセラミック配線板の
接合方法。2. The method for joining a ceramic wiring board according to claim 1, wherein the dam is formed by using a curable resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7012381A JPH08204330A (en) | 1995-01-30 | 1995-01-30 | Connecting method for ceramic wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7012381A JPH08204330A (en) | 1995-01-30 | 1995-01-30 | Connecting method for ceramic wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08204330A true JPH08204330A (en) | 1996-08-09 |
Family
ID=11803701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7012381A Withdrawn JPH08204330A (en) | 1995-01-30 | 1995-01-30 | Connecting method for ceramic wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08204330A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060353A (en) * | 2001-08-09 | 2003-02-28 | Murata Mfg Co Ltd | Electronic component unit and manufacturing method therefor |
| JP2006319313A (en) * | 2005-04-13 | 2006-11-24 | Kyocera Corp | Circuit board and electronic parts module |
-
1995
- 1995-01-30 JP JP7012381A patent/JPH08204330A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060353A (en) * | 2001-08-09 | 2003-02-28 | Murata Mfg Co Ltd | Electronic component unit and manufacturing method therefor |
| JP2006319313A (en) * | 2005-04-13 | 2006-11-24 | Kyocera Corp | Circuit board and electronic parts module |
| JP4721929B2 (en) * | 2005-04-13 | 2011-07-13 | 京セラ株式会社 | Multilayer circuit board and electronic component module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20020402 |