JPH08203940A - Resin feeding device - Google Patents

Abstract

PURPOSE: To obtain a resin feeding device, which does never make the viscosity of a resin rise even in the case where a work is interrupted for a long time and the like, can continue the quantitative feed of the resin after the work is reopened and can improve the quality of bonding and the quality of sealing, by a method wherein the device is provided with a cooling means, which holds the resin in a container in the state of a low temperature, and a normal-temperature return means, which returns the cooled resin to normal temperatures, and the like. CONSTITUTION: A thermosetting liquid resin 10 housed in a container is made a quantitative feed by a resin feed rate control means 12 via a nozzle 8. In such a resin feeding device, the container housed with the resin 10 is split into a first container 6 communicating with the nozzle 8 and a second container 9 communicating with the container 6. Moreover, a cooling means 13, which holds the resin 10 in the container 9 in the state of a low temperature, and a normal-temperature return means 14, which is arranged at the communicating part between the containers 6 and 9 and returns the resin 10 cooled in the container 9 to normal temperatures, are provided. For example, an amount-of-resin control means 12 for controlling the amount of the resin, which is fed in the container 6, is arranged at the communicating part between the containers 6 and 9.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin supply device for supplying a predetermined amount of thermosetting liquid resin.

[0002]

2. Description of the Related Art Generally, an electronic component such as a semiconductor device is formed by fixing an electronic component body such as a semiconductor pellet to a supporting member such as a lead frame and electrically connecting an electrode of the electronic component body and a lead. The main part including is subjected to an exterior treatment, and unnecessary portions of the support member led out from the exterior portion are cut to obtain individual electronic components. Here, in electronic components for low power consumption, a resin adhesive such as a viscous epoxy resin is used as an adhesive for fixing the electronic component body to the support member, and the electronic component body is subjected to external force, external moisture, corrosion A resin-based encapsulant such as an epoxy resin is used as an exterior member that protects against volatile gas. In addition to the transfer molding of a tablet-shaped resin using a molding die, a method of coating a viscous liquid resin by dropping it on the main part including the electronic component body is also used for the exterior treatment. ing. An example of a device for quantitatively supplying the resin adhesive or the resin encapsulant will be described with reference to FIG.

In the figure, reference numeral 1 is a container for containing a liquid resin 2, and has a structure in which a funnel-shaped portion 1b is connected to a lower end of a cylindrical portion 1a having a shaft vertically arranged. As the resin 2, a solventless type liquid resin is used in order to avoid the progress of curing during storage. 3 is a supply pipe communicating with the funnel-shaped portion 1b of the container 1, 4 is a nozzle connected to the lower end of the supply pipe 3, 5 is a cover for closing the upper end of the container 1, and an air supply hole 5
a is open and is connected to a means for adjusting the air pressure in the container 1 through an open / close valve (not shown). Although not shown, this device is arranged above the support member moving path in the manufacturing process of the electronic component, and in conjunction with the movement of the support member, the air pressure adjusting means is operated to cause a predetermined amount of resin to flow from the nozzle 4 onto the support member. It is supplied to a predetermined region or a predetermined region including the electronic component body fixed on the support member. In this way, the nozzle 4
Although the liquid resin discharged from the resin spontaneously cures with the passage of time, it is accelerated by heating and is completely cured in a relatively short time.Therefore, in the manufacture of electronic parts, after supplying the resin, store the support member at high temperature. It promotes the curing of the resin and ensures adhesion and sealing.

[0004]

By the way, the resin 2 in the container 1 is shielded from the outside air and kept at the ambient temperature of the manufacturing process. However, the polymerization reaction of the resin proceeds after a long time even at room temperature, There is a problem that the viscosity becomes high and the fluidity in the supply pipe 3 and the nozzle 4 is lowered. In this way, when the fluidity of the resin decreases, the amount of resin supplied on the support member varies, and when the amount of adhesive or sealing material is small, the adhesive strength decreases or the predetermined area is completely covered. If the supply control is inappropriate and the supply amount is too large, the problem that the adhesive or the sealing material will stick out to the undesired part occurs,
There is a problem that the control of the supply amount is complicated.

Even if the supply amount of the resin is appropriate, when the polymerization reaction of the resin proceeds, the adhesiveness and sealing property of the resin discharged from the nozzle 4 deteriorate, and the adhesiveness and sealing become insufficient. There was a problem. This kind of problem occurs when the product is left in a resting state for a long time, for example, when changing the product type during the manufacture of electronic parts, or when the environmental temperature changes to the high temperature side. Liquid resin exceeding the value needs to be taken out of the container 1, the entire apparatus must be washed with a solvent and replaced with a new liquid resin, and improvement has been desired.

[0006]

SUMMARY OF THE INVENTION The present invention has been proposed for the purpose of solving the above-mentioned problems, in which a thermosetting liquid resin contained in a container is quantitatively supplied through a nozzle by a resin supply adjusting means. In the resin supply device, the container containing the resin is divided into a first container communicating with the nozzle and a second container communicating with the first container, and the resin in the second container is cooled to a low temperature state. A resin supply device comprising: a cooling means for keeping the temperature; and a room temperature returning means arranged in a communicating portion of the first container and the second container for returning the resin cooled in the second container to room temperature. provide. A resin amount adjusting means for adjusting the amount of resin supplied to the first container is arranged in the communicating portion of the first and second containers to properly control the amount of liquid resin supplied to the first container and normal temperature return control. can do.

[0007]

According to the present invention, by the means for solving the above problems, the second container is cooled to such an extent that the polymerization reaction of the liquid resin can be suppressed for a long period of time, and the liquid resin in the first container is returned to the normal temperature at which the supply operation is not hindered. Therefore, it is possible to supply a resin having a stable supply amount, adhesiveness and sealing property.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIG.
In the figure, 6 is a tubular portion 6a arranged with its axis facing up and down.
The first container has a funnel-shaped portion 6b connected to the lower end thereof, and the funnel-shaped portion 6b communicates with a nozzle 8 via a supply pipe 7. 9 is a second container having the same structure as the first container 6,
Is disposed above the container 6, and the funnel-shaped portion 9b is inserted into the first container 6 and the tubular portion 9a is the tubular portion 6a of the first container 6.
It is connected to the. The upper end of the cylindrical portion 9a of the second container 9 is closed by the lid 11 except when the liquid resin 10 is being supplied. 1
Reference numeral 2 is a valve serving as a liquid amount adjusting means for controlling the amount of resin supplied to the first container 6 by opening and closing the lower end opening of the funnel-shaped portion 9b in the second container 9, although not shown in the drawing. Liquid resin 1 in the second container 9 that moves up and down under the control of the outside of the container 9
Supplying 0 to the first container 6 is controlled. 13 is the second container 9
A cooling means for cooling the liquid resin 10 in the container 9
Reference numeral 14 denotes a normal temperature returning means that is attached to the lower end of the funnel-shaped portion 9b of the second container 9 and returns the liquid resin 10 cooled in the second container 9 to the normal temperature state and supplies it to the first container 6. Show.

Reference numeral 15 denotes a pipe which communicates with the resin supply amount control means from the tubular portion 6a of the first container 6, and supplies pressure-controlled air into the container 6 to control the amount of resin discharged from the nozzle 8. This device to be controlled is obtained by adding the second container 9, the valve 12, the cooling means 13 and the room temperature returning means 14 to the device shown in FIG. The operation of this device will be described below. First, the lid 11 is opened to supply the solventless liquid resin 10 into the second container 9, and the valve 12 is opened to supply a sufficient amount of the liquid resin 10 to the first container 6. When a sufficient amount of the liquid resin 10 is supplied to the first container 6, the resin supply work from the nozzle 8 becomes possible by controlling the pressure from the pipe 15 as in the conventional device. In this apparatus, the liquid resin 10 in the second container 9 is cooled by the cooling means 13 in a state where the lid 11 and the valve 12 are closed and the liquid resin 10 is confined in the second container 9.
To cool. Therefore, the polymerization reaction of the resin 10 in the second container 9 is suppressed, and low viscosity can be maintained for a long time.

The normal temperature returning means 14 is operated in accordance with the progress of the resin supply work from the nozzle 8 or when the resin supply work in the first container 6 reaches a predetermined amount of remaining amount. Then, the valve 12 is controlled to be opened and closed, and the liquid resin 10 is replenished in the first container 6. The resin 10 cooled and stored in the second container 9 is supplied to the first container 6 at a normal temperature by the normal temperature returning means 14 in a state where the fluidity before the polymerization reaction is good. When the amount of the resin 10 in the second container 9 reaches a predetermined amount due to the progress of the work, the lid 11 is opened to open the liquid resin 10
Can be replenished and work can be continued. Further, when the supply operation of the resin 10 is interrupted, the operation of the room temperature returning means 14 is stopped to prevent local hardening of the resin, and when the operation interruption is prolonged, the cooling air of the cooling means 13 is reduced. The first container 6 can also be cooled by, for example, applying a part to the first container 6. The second container 9 may be cooled directly using a Peltier effect element, or may be indirectly cooled by circulating cold air through a circulation pipe wound around the second container 9.

Further, as the room temperature returning means 14, it is possible to use a ceramic heater having a heating wire pattern formed on the outer periphery of the ceramic pipe or a spiral pipe for guiding a resin in a spiral shape, which is dipped in heated water or oil. Also, the second
The valve 12 as means for adjusting the amount of resin 10 from the container 9 to the first container 9 can also use a screw feeder for supplying a high viscous material. In this case, the cooling temperature by the cooling means 13 can be used. Can be stored in a high-viscosity state where it is set to a lower temperature and hardly flows, and the polymerization reaction can be reliably suppressed, and the resin can be supplied in a fixed amount. When a screw feeder is used instead of the valve 12, the first and second containers 6 and 9 do not need to be coaxially arranged in the vertical direction, but may be horizontally arranged. Furthermore, by sufficiently increasing the capacity of the second container as compared with the first container, continuous operation can be performed for a long time and the frequency of resin supply can be reduced. As described above, according to the present invention, since the resin that is not immediately supplied and treated in the storage state is kept at a low temperature, the polymerization reaction of the resin is suppressed, and the resin returned to the ordinary temperature has good fluidity. Further, it is possible to stably supply a predetermined amount of resin without variation. Therefore, the adhesiveness and sealing property are good, and high-quality adhesion and sealing can be performed. In addition, inspection and maintenance including cleaning of the device becomes easy. The device of the present invention is not limited to the production of electronic components, but can be applied to the general supply of liquid resin.

[0012]

As described above, according to the present invention, when the liquid resin is quantitatively supplied, the viscosity of the resin does not increase even if the operation is interrupted for a long time, and the quantitative supply is continued after the operation is resumed. The adhesive quality and sealing quality can be improved.

[Brief description of drawings]

FIG. 1 is a side sectional view of a resin supply device showing an embodiment of the present invention.

FIG. 2 is a side sectional view of a resin supply device which is a premise of the present invention.

[Explanation of symbols]

 6 1st container 9 2nd container 10 Resin 12 Liquid amount adjusting means 13 Cooling means 14 Normal temperature returning means

Claims (2)

[Claims] 1. A resin supply device for quantitatively supplying a thermosetting liquid resin contained in a container through a nozzle by a resin supply amount adjusting means, wherein a container containing the resin is connected to a nozzle. And a second container that communicates with the first container, and a cooling means that keeps the resin in the second container in a low temperature state and a communication part that connects the first container and the second container. Done second
And a room temperature returning means for returning the resin cooled in the container to room temperature. 2. The resin supply device according to claim 1, wherein a resin amount adjusting means for adjusting the amount of resin supplied to the first container is arranged in the communicating portion of the first and second containers.