JPH10256716A - Manufacture of semiconductor device and its manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily form columnar bumps by CGA at a low cost and greatly improve the connection reliability. SOLUTION: A pressure adjuster 4 feeds a nitrogen gas at a specified pressure to an injection pressure vessel 5 to lower a syringe 7 by this pressure to inject molten solder D of fixed amt. from injection nozzles 8a of an injection plate 8, thereby forming columnar bumps at the electrodes of a semiconductor device. A stage 17 has a cooling mechanism for cooling semiconductor device during forming of the bumps, thereby reliably forming the columnar bumps without deforming them.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a semiconductor device, and more particularly to a technique which is effective when applied to formation of connection bumps in a semiconductor device.

[0002]

2. Description of the Related Art According to studies made by the present inventor, B
2. Description of the Related Art In semiconductor devices such as a ball grid array (GA) and a flip chip, electrical connection is performed by using a metal bump formed by a spherical solder instead of a lead.

The metal bumps are formed by a vapor deposition method of forming a bump by vapor deposition of a solder, a solder ball attaching method of providing a pre-formed solder ball on a semiconductor chip, a plating method of forming a bump by plating with gold (Au), or the like. Is formed.

[0004] As an example describing this type of semiconductor device in detail, see Nikkei B on May 31, 1993.
Published by Company P, Susumu Kayama, Kunihiko Naruse (supervised), "Practical Course V
LSI Packaging Technology (Bottom) "P173, P174
This document describes the configuration of a BGA and the like.

[0005]

However, the present inventors have found that there are the following problems in the electrical connection of the semiconductor device by the metal bumps as described above.

That is, in the vapor deposition method, there is a problem that the processing time is lengthened, and when the thermal expansion coefficients of the semiconductor chip and the wiring board cannot be matched, the connection reliability is reduced.

[0007] In addition, the solder ball attaching method has a problem that the yield decreases as the ball pitch becomes finer.

[0008] Furthermore, the plating method has a problem that the cost is high because the equipment and the members used are expensive.

An object of the present invention is to provide a CGA (Column Grid Array) provided with columnar bumps.
An object of the present invention is to provide a method and an apparatus for manufacturing a semiconductor device which can be easily manufactured at low cost and can greatly improve connection reliability.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0011]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, in the method of manufacturing a semiconductor device according to the present invention, a certain amount of solder is injected into an electrode portion of the semiconductor device from an injection nozzle for injecting molten solder to form connection bumps.

Further, a method of manufacturing a semiconductor device according to the present invention
The bumps are formed while cooling the semiconductor device by a cooling mechanism provided on a mounting means for mounting the semiconductor device.

Further, according to the present invention, there is provided a semiconductor manufacturing apparatus comprising: a mounting means for mounting a semiconductor device; a solder tank for storing molten solder; and a soldering device for an electrode portion of the semiconductor device mounted on the mounting means. It comprises a bump forming means for forming a columnar bump by discharging a fixed amount of solder in a bath under a predetermined pressure.

Further, in the semiconductor manufacturing apparatus according to the present invention, the bump forming means may supply gas for injection from a supply port provided at an upper part of the solder bath, and apply a predetermined pressure to the inside of the solder bath. A partition plate installed in the solder bath to separate the solder in the solder bath from the injection gas, apply a uniform pressure to the solder in the solder bath, and discharge a certain amount of solder, and a bottom portion of the solder bath. And a plurality of injection nozzles for injecting the solder discharged from the partition plate are formed at intervals corresponding to the electrodes of the semiconductor device.

Further, in the semiconductor manufacturing apparatus according to the present invention, the injection plate has a detachable structure in which the injection plate can be replaced according to the electrode position of the semiconductor device.

Further, in the semiconductor manufacturing apparatus of the present invention, the mounting means is provided with a cooling mechanism for cooling the semiconductor device.

As described above, the columnar bumps can be easily and reliably formed at low cost on the semiconductor device, so that the connection reliability in the semiconductor device such as CGA can be greatly improved.

[0019]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is an explanatory view of a bump forming apparatus according to one embodiment of the present invention, and FIGS. 2 and 3 are explanatory views of a bump forming process by the bump forming apparatus according to one embodiment of the present invention.

In the present embodiment, a bump forming apparatus (semiconductor manufacturing apparatus) 1 for forming a columnar bump of CGA
Is provided with a pressure vessel 2 filled with an inert gas (injection gas) such as nitrogen (N ₂ ) gas.

The bump forming apparatus 1 is provided with a rectifying valve 3 for preventing backflow of nitrogen gas and a pressure adjusting mechanism 4 for varying the pressure of nitrogen gas output from the pressure vessel 2. The pressure vessel 2, the rectifying valve 3, and the pressure adjusting mechanism 4 constitute a gas supply unit GK.

Further, the bump forming apparatus 1 includes, for example,
An injection pressure vessel (solder tank) 5 made of stainless steel is provided, and a heater for heating and melting the solder is also provided on the outer peripheral portion of the injection pressure vessel 5, and the injection pressure vessel 5 is filled with the molten solder D.

The pressure vessel 2, the rectifying valve 3, and the pressure adjusting mechanism 4 are connected to a supply port 5a provided at an upper portion of the injection pressure vessel 5 by a pipe 6, and nitrogen gas of a predetermined pressure is supplied to the injection pressure vessel 5 Will be supplied inside.

Further, inside the injection pressure vessel 5, a stainless steel for separating the nitrogen gas supplied from the supply port 5a and the molten solder D and applying a constant pressure to the molten solder D uniformly is used. Syringe (partition plate) 7
Is provided. Then, the syringe 7 is pushed down by the pressure of the supplied nitrogen gas, and the solder D in the injection pressure vessel 5 is discharged from an injection nozzle described later.

Further, an injection plate (injection plate) 8 made of stainless steel is provided at the bottom of the injection pressure vessel 5, and the injection plate 8 has an injection nozzle 8a formed of a circular hole at a predetermined pitch. Have been. Further, the injection plate 8 has a detachable structure, and an arbitrary injection plate suitable for the pitch of the type of semiconductor device to be manufactured can be selected.

The above-mentioned gas supply means GK, the injection plate 8 on which the syringe 7 and the injection nozzle 8a are formed constitute the bump formation means BK.

Next, in the bump forming apparatus 1, a replenishing tank 9 made of stainless steel or the like for replenishing the molten solder D into the injection pressure vessel 5 is provided.
Is provided.

The replenishing tank 9 is connected to the injection pressure vessel 5 via a pipe 10, and the pipe 10 is provided with a valve 11 for stopping supply of the replenished solder D. Further, the valve 11 is provided with a motor 12 that automatically opens and closes the valve 11 when the supply of the solder D in the replenishing tank 9 is stopped.

Further, the bump forming apparatus 1 includes a pressure vessel 13 also filled with an inert gas such as nitrogen gas, a rectifying valve 14 for preventing backflow of nitrogen gas, and a pressure vessel 13.
A pressure adjusting mechanism 15 for varying the pressure of the nitrogen gas output from the controller is provided.

The pressure vessel 13, the rectifying valve 14, and the pressure adjusting mechanism 15 are connected to a supply port 9 a provided at an upper portion of the replenishing tank 9 by a pipe 16. To supply the molten solder D to the injection pressure vessel 5.

The bump forming apparatus 1 is provided with a stage (mounting means) 17 on which a semiconductor device described later is mounted at the time of bump formation, and a cooling mechanism for cooling the mounted semiconductor device is provided on the stage 17. In addition, a drive mechanism for moving the stage 17 in the vertical direction is provided.

Next, the operation of the present embodiment will be described.

First, as shown in FIG. 2, the semiconductor device HS having the flux F applied on the electrodes on which the bumps are formed is transported by a transport mechanism or the like, and is mounted at a predetermined position on the stage 17.

Here, the semiconductor device HS is a kind of bare chip mounting technology, in which the above-mentioned electrodes are formed on a semiconductor chip, and the bumps formed on the electrodes are pressed against the electrodes of the printed wiring board to be mounted, and the electrical connection is made. It is a bare chip that is connected to the other.

At this time, the solder D in the injection pressure vessel 5 (FIG. 1) is heated and melted by the above-described heater.

Then, as shown in FIG. 3, the stage 17 is moved upward by the above-described drive mechanism until a predetermined clearance is formed between the stage 17 and the injection plate 8.

Next, the pressure adjusting mechanism 4 supplies a nitrogen gas at a predetermined pressure into the injection pressure vessel 5, presses down the syringe 7 by the pressure, and applies a certain amount of solder D to each injection nozzle of the injection plate 8. Emitting from 8a, a bump B is formed on the electrode portion of the semiconductor device HS.

At this time, the semiconductor device HS is formed with the bumps B while being cooled by the cooling mechanism of the stage 17, so that the bumps B can be reliably formed without breaking the columnar shape.

By forming the bumps B in a columnar shape, the printed circuit board or the like to be connected is connected to the semiconductor device HS.
Even if the thermal expansion coefficients cannot be matched, the connection reliability can be improved because the bumps B absorb the stress.

By repeating the above operation, a columnar bump, ie, a column bump, of the semiconductor device HS is formed. For example, a test solder is discharged about once per batch, The clogging of the injection nozzle 8a is prevented.

After that, when the bumps B are formed on the semiconductor device HS, the stage 17 is driven downward by the drive mechanism, and then is transported to a predetermined position by the transport mechanism. Further, when the amount of the solder D in the injection pressure container 5 decreases, the valve 11 is opened, and a predetermined pressure is applied to the replenishing tank 9 by adjusting the pressure adjusting mechanism 15.
The injection pressure vessel 5 is refilled with the solder D.

Thus, in the present embodiment, the columnar bumps B can be easily and reliably formed at low cost on the semiconductor device HS, and the connection reliability can be greatly improved.

Further, since the bump B is formed for each semiconductor device HS, the bump B can be formed only on an arbitrary semiconductor device HS, and the production efficiency of the semiconductor device HS of a large variety of small production can be improved. .

As described above, the invention made by the inventor has been specifically described based on the embodiments of the invention. However, the invention is not limited to the above embodiments, and various modifications may be made without departing from the gist of the invention. Needless to say, it can be changed.

For example, in the above-described embodiment, a CGA flip-chip semiconductor device is described.
Semiconductor devices and PGA using spherical bumps such as
(Pin Grid Array) can be used as a substitute for a pin to greatly improve connection reliability.

[0047]

Advantageous effects obtained by typical ones of the inventions disclosed by the present application will be briefly described as follows.
It is as follows.

(1) According to the present invention, a columnar bump can be easily and reliably formed at low cost on a semiconductor device.

(2) In the present invention, according to the above (1), connection reliability in a semiconductor device such as a CGA can be greatly improved, and bumps can be selectively formed in the semiconductor device. Therefore, it is possible to improve the production efficiency of a semiconductor device of high-mix low-volume production.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a bump forming apparatus according to an embodiment of the present invention.

FIG. 2 is an explanatory view of a process of forming a bump by a bump forming apparatus according to an embodiment of the present invention.

FIG. 3 is an explanatory view of a process of forming a bump by a bump forming apparatus according to an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Bump forming apparatus (semiconductor manufacturing apparatus) 2 Pressure vessel 3 Rectifier valve 4 Pressure adjustment mechanism 5 Injection pressure vessel (solder tank) 5a Supply port 6 Piping 7 Syringe (partition plate) 8 Injection plate (injection plate) 8a Injection nozzle 9 Refill tank 9a Supply port 10 Pipe 11 Valve 12 Motor 13 Pressure vessel 14 Rectifier valve 15 Pressure adjustment mechanism 16 Pipe 17 Stage (mounting means) BK bump forming means GK Gas supply means HS Semiconductor device D Solder B Bump F Flux

Claims (6)

[Claims] 1. A method of manufacturing a semiconductor device, comprising: injecting a fixed amount of solder from an injection nozzle for injecting molten solder into an electrode portion of the semiconductor device to form a connection bump. 2. The method of manufacturing a semiconductor device according to claim 1, wherein said bump is formed while cooling said semiconductor device by a cooling mechanism provided on a mounting means for mounting said semiconductor device. 3. A mounting means for mounting a semiconductor device, a solder bath for storing molten solder, and a solder in the solder bath being applied to an electrode portion of the semiconductor device mounted on the mounting means in a predetermined manner. A semiconductor manufacturing apparatus comprising: a bump forming means for discharging a predetermined amount by pressure to form a columnar bump. 4. The semiconductor manufacturing apparatus according to claim 3, wherein said bump forming means supplies an injection gas from a supply port provided at an upper portion of said solder bath, and applies a predetermined pressure to said solder bath. Gas supply means, a partition provided in the solder bath, separating the solder in the solder bath and the injection gas, and applying a uniform pressure to the solder in the solder bath to discharge a fixed amount of solder; A plurality of injection nozzles provided at the bottom of the solder bath and for injecting the solder discharged by the partition plate are formed at intervals corresponding to the electrodes of the semiconductor device. Characteristic semiconductor manufacturing equipment. 5. The semiconductor manufacturing apparatus according to claim 3, wherein said injection plate has a detachable structure capable of replacing said injection plate in accordance with an electrode position of said semiconductor device. apparatus. 6. The semiconductor manufacturing apparatus according to claim 3, wherein said mounting means is provided with a cooling mechanism for cooling said semiconductor device.