JPH08203810A - Drawing device - Google Patents

Abstract

PURPOSE: To form a line pattern on a large area by measuring an error between the absolute position of a workpiece measured with an absolute position measuring means and a desired position, by adding to it a relative positional signal measured with a relative position measuring means, inputting the signal into a coarse movement means, and further inputting the error into a fine movement means. CONSTITUTION: A work 113, which comprises a fine movement means 114a and a coarse movement means 114b, is placed on a movement means 114 which is moveable in the X-Y direction. A control means 118 compares the absolute position of the workpiece 113 measured with an absolute position means 117 to a desired position and generates an error signal. Further, a relative positional signal measured with a relative positional measuring means 116 is added to it and imputed into the coarse movement means 114b. Also, the error signal is inputted into the fine movement means 114a. In this way, the fine movement means 114a and the coarse movement means 114b are subjected to cooperative positional control to form a line pattern on a large area.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a drawing device for irradiating a processing beam such as a laser beam or an electron beam onto a surface of a work to process an arbitrary line drawing pattern, and more particularly, a combination line drawing of straight lines and curved lines over a wide range Involved in processing equipment for drawing patterns with high precision and smoothness.

[0002]

2. Description of the Related Art Conventionally, semiconductor devices, electronic devices,
When manufacturing various devices such as optical devices, a processing process of projecting and exposing a line drawing pattern shape processed on a mask or a reticle onto an object surface by an exposure apparatus such as a stepper is adopted. It is generally processed by an electron beam drawing device.

[0003]

In recent years, in the manufacture of semiconductor devices and electronic devices, while the density and precision of line drawing patterns have been increasing, the area of wafer substrates has been increasing for the purpose of improving productivity. Therefore, there is a growing need for a processing device for processing a line drawing pattern with a large area and high accuracy. Also, in the manufacture of optical devices, light, which is a signal transmission medium, cannot be transmitted with a sharp curvature, and has the property of causing scattering due to slight misalignment of the line drawing pattern connection part and slight unevenness of the line drawing pattern edge. Therefore, there is a strong need for an apparatus for processing a line drawing pattern with a large area and high accuracy as in the case of manufacturing semiconductor devices and electronic devices.

Therefore, as the development of high-performance devices progresses in the future, it will become more important in the manufacture of masks or reticles that are indispensable for the manufacture of semiconductor devices and electronic devices, and in the manufacture of optical devices that are expected to be put to practical use in future. It is expected that there will be an increasing need for area and high precision processing equipment.

Conventionally, an electron beam drawing apparatus has been used to draw a line drawing pattern, but the electron beam drawing apparatus adopts a method of drawing a line drawing pattern by deflecting an electron beam. In the drawing method utilizing the deflection of the electron beam, the drawing field is at most about several mm square, so when drawing a wide range exceeding several mm square, the workpiece is mounted in each of the drawing fields. The moving means is moved to connect the drawing fields. Therefore, there is a problem that a connection failure is likely to occur in the connection between the drawing fields.

Further, in the electron beam drawing apparatus, when the drawing field becomes wider and the deflection angle of the electron beam becomes larger, the beam diameter of the electron beam irradiated on the surface of the work piece is deformed to a non-negligible range, so that it is wide. There is a problem that the line width of the line drawing pattern becomes thicker than a desired width as the range is drawn.

Further, since the electron beam drawing apparatus handles the electron beam, the atmosphere at the time of processing the line drawing pattern must be evacuated, and auxiliary equipment such as a vacuum apparatus is required. As a result, there is a problem that the device becomes large in size, maintenance costs are high, and the price of the device main body is high.

In view of the above conventional problems, it is an object of the present invention to eliminate the drawbacks of the electron beam drawing apparatus and to provide a drawing apparatus capable of forming a highly accurate line drawing pattern in a large area.

[0009]

The structure of the present invention which achieves the above object comprises a coarse movement means having a large movement amount but poor positioning accuracy, and a fine movement means having a small movement amount but capable of highly accurate positioning. The work is mounted on the fine movement moving means of the moving means, and the position of the working beam is fixed while irradiating the working beam from above the surface of the work, and the moving means is aligned with the optical axis of the working beam. In a drawing device for processing a line drawing pattern on the surface of the workpiece by moving in a plane forming a line, absolute position measuring means for measuring an absolute position with respect to a fixed position of the workpiece, and the coarse movement. Relative position measuring means for measuring the relative displacement of the fine movement means with respect to the moving means, the error between the absolute position of the workpiece measured by the absolute position measuring means and the desired position The error and the relative position signal measured by the relative position measuring means are added, the signal is input to the coarse movement moving means, and the error is input to the fine movement moving means, whereby the moving means Control means for controlling the processing beam, autofocusing means for always maintaining the focus position of the processing beam on the surface position of the workpiece, and adjusting the intensity of the processing beam according to the moving speed of the moving means. Further, it is characterized by further comprising intensity modulating means for performing on / off control of the processing beam according to a processing start point and a processing end point.

Furthermore, a beam diameter changing device for processing the line drawing pattern on the surface of the workpiece with a desired line width by changing the processing beam to a predetermined beam diameter, and a laser as a processing light source are provided. Is used.

[0011]

[Action]

(1) In the drawing apparatus of the present invention, the line drawing pattern is processed on the surface of the workpiece by fixing the position of the processing beam and moving the moving means carrying the workpiece.

(2) In the drawing apparatus of the present invention, the error between the absolute position of the workpiece measured by the absolute position measuring means and the desired position is measured, and the error and the relative position signal measured by the relative position measuring means. Are added, the signal is input to the coarse movement moving means, and the error is input to the fine movement moving means, so that the moving means is controlled with a large movement amount and high precision.

(3) The drawing apparatus according to the present invention is provided with an autofocus means for maintaining the focal position of the processing beam with which the workpiece is irradiated at the surface position of the workpiece. And defocus due to the straightness of the moving means are corrected.

(4) The drawing apparatus according to the present invention is provided with the intensity modulating means and adjusts the intensity of the processing beam according to the moving speed of the moving means.

(5) In the drawing apparatus according to the present invention, a beam diameter varying device is provided and the line width of the line drawing pattern drawn on the surface of the workpiece can be controlled to a predetermined thickness.

(6) In the drawing apparatus of the present invention, a laser is used as a processing light source.

[0017]

Embodiments of the present invention will now be described in detail with reference to the drawings.

FIG. 1 is a block diagram showing a drawing apparatus according to an embodiment of the present invention. As shown in the figure, the processing light source 101 (He-Cd laser [λ = 441.6 nm])
The processing beam 1 emitted from the laser beam passes through an intensity modulator 102 such as an acousto-optic device and becomes a processing beam 2. The processing beam 2 is the beam sampler 10
At 3, the transmitted beam 3 and the reflected beam 4 are split into two beams, and the transmitted beam 3 is adjusted by the ½ wavelength plate 106 so that its polarization axis direction matches the transmission polarization axis direction of the polarization beam splitter 109. And the processing beam 7 is formed. The processing beam 7 is reflected by the mirror 108 in the figure
It is bent downward in the axis to become the processed beam 8, and then passes through the polarization beam splitter 109 and the quarter-wave plate 110 and
The quarter wave plate 110 is configured to convert linearly polarized light into circularly polarized light beam 9 by its action. The circularly polarized beam 9 is focused on the surface of the workpiece 113 by the objective lens 111 (focal length: 3.61 mm, aperture: 0.8, magnification: 50 times) to form a minute spot beam 10. I am doing it.

The workpiece 113 has, for example, a fine movement moving means 114a using a piezoelectric element as an actuator, a hinge spring as a guide element, and a DC motor as an actuator, and a coarse movement moving means 114 using a rolling element as a guide element.
a moving means 1 which is composed of b and is movable in the X-Y directions in the drawing.
14 mounted on. This moving means 114 is XY
By moving in the plane, a relative displacement is generated between the workpiece 113 and the minute spot beam 10, and the workpiece 11
3 is configured to draw a line drawing pattern on the surface.

The absolute position of the workpiece 113 is the workpiece 113.
Along with the reference mirror 115 mounted on the moving means 114 as a reference, the measuring beam 11 is passed through the X-axis by the absolute position measuring means 117 such as a laser length measuring machine.
It is configured to measure with high accuracy in each axial direction of the axis and the Y axis. At the same time, the relative displacement of the fine movement moving means 114a with respect to the coarse movement moving means 114b is measured by the relative position measuring means 116 such as a capacitance type displacement gauge.

The absolute position signal 12 measured by the absolute position measuring means 117 and the relative position measuring means 11
The relative position signal 13 measured by 6 is the control means 11
8 is configured to be input.

FIG. 2 is a block diagram showing the control means 118 and its related parts of the drawing apparatus shown in FIG.

As shown in FIG.
First, the command signal 25 from the command signal output means 118a is compared with the absolute position signal 12 to generate an error signal 26. On the other hand, the relative position signal 13 is input to a control calculation unit 118d such as an integrator, where a control calculation output signal 27 is generated. The error signal 26 and the control calculation output signal 27 are added in an adder to become a coarse movement command signal 28, which is, for example, proportional, integral,
After being input to the coarse motion control means 118c composed of a differential element, the coarse motion control means 118b outputs as the coarse motion control signal 15.
Is output to Further, the error signal 26 is input to the fine movement control means 118b including, for example, proportional, integral, and differential elements, and then the fine movement moving means 114 is used as the fine movement control signal 14.
is output to a.

The fine movement moving means 1 has the above-mentioned structure.
By controlling the positions of 14a and the coarse movement moving means 114b, the fine movement moving means 114a and the coarse movement moving means 11 are controlled.
4b enables coordinated position control, and the moving means 114
Can be moved with a large amount of movement and with high accuracy.

Thus, since the relative movement between the minute spot beam 10 and the workpiece 113 can be realized in a wide range and with high precision, the surface of the workpiece 113 can be precisely moved without connecting the drawing fields. Draw a line drawing pattern.

<Autofocus Means> FIG. 3 is a block diagram showing the autofocus means of the drawing apparatus shown in FIG. 1 and its related parts.

As shown in the figure, a minute spot beam 1
After 0 is irradiated on the surface of the work piece 113, a part of it is reflected by the surface of the work piece 113 to generate a surface reflected beam 16, which is directed upward in the Z-axis in the figure and the objective lens 111. , 1/4 wavelength plate 110, 1/4
By the action of the wave plate 110, the circularly polarized state is changed to a linearly polarized beam 17 whose polarization axis direction is orthogonal to that of the processed beam 8. The linearly polarized beam 17 is incident on the polarizing beam splitter 109, and the polarization axis direction of the linearly polarized beam 17 coincides with the reflection polarization axis direction of the polarizing beam splitter 109. As a result, the linearly polarized beam 17 is totally reflected by the polarizing beam splitter 109 and becomes a reflected beam 18.

The reflected beam 18 is generated by passing through, for example, a convex lens 119a and a cylindrical lens 119b which form an astigmatic optical system, and the beam 19 is formed so as to subsequently enter a four-division photodetector 120. is there. As a result, the four-division photo detector 12
0 from each photocathode to photocurrent signals 20a, 20b, 20c,
20d is output.

FIG. 4 is an explanatory view conceptually showing the sectional shape of the beam 19 in the section AA of the four-division photodetector 120 of FIG.

As shown in FIG. 3, the beam 19 has four
On the photocathode of the split photodetector 120, the cross-sectional shape changes due to the relative displacement L between the objective lens 111 and the surface of the workpiece 113. That is, as shown in FIG. 4, when the relative displacement L is equal to the focal length 1 of the objective lens 111, a circular cross section is formed, and when the relative displacement L is larger than the focal length l, a horizontal axis having a long axis in the Y-axis direction is formed. It has an elliptical cross section, and the relative displacement L is the focal length 1
When it is smaller than the above, the shape becomes a vertical elliptical cross section having a major axis in the Z-axis direction.

In order to utilize this characteristic, the photocurrent signal 2
The intensity signals Ia, Ib, Ic, and Id are obtained by current-voltage converting 0a, 20b, 20c, and 20d, and the intensity signals Ia, Ib, Ic, and Id are calculated. The focus signal F becomes an S-shaped curve with respect to the relative displacement L as shown in FIG.

[0032]

[Equation 1]

It can be seen from FIG. 5 that the autofocus signal F has a characteristic that it becomes 0 when the relative displacement L and the focal length 1 become equal.

Therefore, the defocus calculation circuit 121 calculates the autofocus signal F and compares the autofocus signal F with the reference signal 21 from the reference signal generator 123 to obtain the defocus amount 29, By inputting the defocus amount 29 to the objective lens driving means 112 via the amplifier 122, the objective lens 111 is moved to Z in FIG.
By moving in the axial direction, the relative displacement L is controlled so that it is always equal to the focal length l.

FIG. 6 is a circuit diagram showing details of the defocus calculation circuit 121. As shown in the figure, the defocus calculation circuit 121 includes current-voltage conversion circuits 121a to 121.
d, inverting and adding circuits 121e and 121f, and comparators 121g and 121h.

The autofocus signal F is obtained by converting the photocurrent signals 20a, 20b, 20c and 20d in the current-voltage conversion circuits 121a to 121d into the intensity signal-.
Convert to Ia, -Ib, -Ic, -Id. The respective intensity signals are input to the inverting addition circuits 121e and 121f, where the addition signals Ia + Ib and Ic + Id are calculated. Further, the addition signals Ia + Ib and Ic + Id are input to the comparator 121g, where the autofocus signal F is calculated. After that, the autofocus signal F is input to the comparator 121h, where it is compared with the reference signal 21 from the reference command output means 123 to output the defocus amount 29.

From the structure of the autofocus means described above, the surface undulation from the workpiece 113 and the moving means 114
Since the fluctuation of the relative displacement L due to the straightness error and the like is eliminated and the focal position of the minute spot beam 10 is always maintained on the surface position of the workpiece 113, the line width of the line drawing pattern is always constant. Kept in.

<Intensity Modulating Means> FIG. 7 is a block diagram showing the intensity modulating means of the drawing apparatus shown in FIG. 1 and its related parts.

As shown in the figure, the processing beam 1 emitted from the processing light source 101 is input to an intensity modulator 102 such as an acousto-optic device to obtain a processing beam 2. The processed beam 2 is split into a transmitted beam 3 and a reflected beam 4 in a beam sampler 103, and the reflected beam 4 is incident on a photodetector 104 to generate a photocurrent signal 5 according to the intensity of the reflected beam 4. , The photocurrent signal 5 is sent to the comparator 105
It is configured to be taken into a and compared with the command signal 24 from the strength command output means 124. The signal obtained as a result is amplified by the amplifier 105b into the amplified signal 6, and then input to the intensity modulator 102.

As a result, the intensity modulator 102 feedback-controls the intensity of the processing beam 1 so that the photocurrent signal 5 and the command signal 24 are always equal, and outputs the processing beam 2 having a stable intensity.

The command signal 24 is calculated by the strength command output means 124 based on the speed signal calculated from the absolute position signal 12.

Therefore, even when the moving means 114 has a speed fluctuation, the command signal 24 changes according to the speed fluctuation, so that the energy applied to the surface of the workpiece 113 is always kept constant. It becomes possible to process a line drawing pattern with a constant line width.

Further, in the above intensity modulating means, the processing beam is turned ON at the start point or the end point of the line drawing pattern.
/ OFF can also be controlled.

FIG. 8 is a block diagram showing a drawing apparatus according to another embodiment of the present invention. In this embodiment, the beam diameter changing means is incorporated into the embodiment shown in FIG. Therefore, the same parts as those in FIG.

In this embodiment, a beam diameter varying device 107 and a beam diameter varying control means 125 are added to the drawing device shown in FIG. 1, and the processing beam 7a passes through the beam diameter varying device 107. , The beam diameter is controlled to W and outputted from the beam diameter varying device 107, and thereafter, the processing beam 7b is bent downward by the mirror 108 in the Z axis direction into the processing beam 8, and further the polarization beam splitters 109 and ¼. The circularly polarized beam 9 is configured to pass through the wave plate 110. When the circularly polarized beam 9 is incident on the objective lens 111, a minute spot beam 10 is generated and irradiated on the surface of the workpiece 113, and the beam diameter of the minute spot beam 10 on the surface of the workpiece 113 is w _0. Then, the beam diameter w ₀ and the processing beam 7
The relationship shown in the following equation (2) holds with the beam diameter W of b.

[0046]

[Equation 2]

Therefore, the beam diameter changing device 107
By changing the beam diameter W of the processing beam 7b, the beam diameter w ₀ of the minute spot beam 10 can be changed.

The details of the beam diameter varying device 107 will be described with reference to FIG. As shown in the figure, the beam diameter changing device 107 is, for example, a DC servo motor,
A drive means 107d such as a stepping motor, a rotation amount detection means 107i such as an encoder, a drive transmission means 107c such as a toothed belt transmission element, and a rotation shaft 107b incorporating lenses 107f and 107g.
And a fixed shaft 107a in which a lens 107e is incorporated.

Beam diameter varying device 107 having such a configuration
Then, the rotational movement generated by the driving means 107d is transmitted to the rotating shaft 107b via the drive transmitting means 107c. The rotational force transmitted to the rotating shaft 107b is applied to the lens 107
It is converted into a linear motion by a rotation-linear conversion means 107h such as a cam element attached to f and 107g, whereby the lenses 107f and 107g are independently linearly moved. As a result, the lens 107
The relative positional relationship between e, 107f, and 107g can be changed.

Further, in the beam diameter changing device 107, the beam diameter W of the processing beam 7b emitted is changed so as to change in inverse proportion to the rotation angle θ of the driving means 107d.
The linear motion conversion means 107h is designed. Therefore, since w ₀ is inversely proportional to W from the relationship shown in Expression (2), the rotation angle θ and the beam diameter w ₀ are in a proportional relationship, and the beam diameter w ₀ can be easily calculated using the rotation angle θ. It becomes possible to control.

In the rotation amount detecting means 107i, the rotation angle θ
Of the rotation angle signal 3 to the beam diameter variable control means 125.
Outputs 1. The beam diameter variable control means 125 estimates the beam diameter w ₀ based on the rotation angle signal 31 from the above-described proportional relationship between the rotation angle θ and the beam diameter w ₀ . Further, the beam diameter variable control means 125 is based on the assumption that the cross-sectional intensity distribution of the micro spot beam 10 forms a Gaussian distribution, and based on the estimated beam diameter w ₀ , the central intensity I _{0 of the} micro spot beam 10 is calculated. Is calculated from the following equation (3).

[0052]

(Equation 3)

Further, in the beam diameter variable control means 125,
An intensity correction signal 32 is output to the intensity command output means 124 so that the center intensity I _{0 of the} beam does not change and remains constant even if the beam diameter w ₀ changes.

In the intensity command output means 124, based on the input intensity correction signal 32, the minute spot beam 1
Adjust the total intensity of 0. Therefore, even if the beam diameter w ₀ changes, the central intensity I ₀ can be maintained at a constant value.

Thus, if the rotation angle θ of the driving means 107d in the beam diameter varying device 107 is changed, the beam diameter w _{0 on} the surface of the workpiece 113 changes in proportion to the rotation angle θ. It is possible to change the processing width of the line drawing pattern processed on the surface of the object 113.

[0056]

As described above with reference to the embodiments, by using the drawing apparatus according to the present invention, the following effects can be obtained.

(1) Since the drawing apparatus of the present invention is configured to fix the position of the processing beam and move the moving means on which the workpiece is mounted, the line drawing pattern is processed on the surface of the workpiece. There is no influence of the change of the line width with the increase of the deflection angle, which is a problem in the electron beam drawing apparatus.

(2) In the drawing apparatus of the present invention, the error between the absolute position of the workpiece measured by the absolute position measuring means and the desired position is measured, and the error and the relative position signal measured by the relative position measuring means. By adding the signal to the coarse movement moving means and further inputting the error to the fine movement moving means, a control means for controlling the moving means with a large movement amount and high accuracy is provided. Unlike the electron beam drawing apparatus, it is possible to draw a line drawing pattern with a large area and high accuracy without the need to connect drawing fields.

(3) The drawing apparatus according to the present invention is provided with an autofocus means for maintaining the focal position of the processing beam with which the workpiece is irradiated at the surface position of the workpiece, and the undulation of the surface of the workpiece. It is possible to correct defocus due to the straightness of the moving means and the moving means, and to draw a line drawing pattern having a certain width.

(4) Since the drawing apparatus according to the present invention adjusts the intensity of the processing beam according to the moving speed of the moving means provided with the intensity modulating means, a highly accurate line drawing pattern with no line width change can be obtained. It can be processed.

(5) In the drawing apparatus according to the present invention, since the line width of the line drawing pattern drawn on the surface of the workpiece is controlled to a predetermined thickness by including the beam diameter varying device, a straight line whose line width gradually changes It is possible to easily process a line drawing pattern, and it is also possible to reduce the drawing time by drawing with a thick processing beam even for a large area fill pattern, and efficient drawing is possible. realizable.

(6) In the drawing apparatus according to the present invention, by using the laser as the processing light source, it is possible to avoid the processing in a vacuum, which has been a problem in the electron beam drawing apparatus, and the vacuum apparatus is unnecessary. Therefore, it is possible to provide an inexpensive drawing device.

[Brief description of drawings]

FIG. 1 is a block diagram showing a drawing apparatus according to an embodiment of the present invention.

FIG. 2 is a block diagram showing a control unit and related parts thereof extracted from the drawing apparatus shown in FIG.

FIG. 3 is a block diagram showing an autofocus unit and related parts thereof extracted from the drawing apparatus shown in FIG.

4 is an explanatory view conceptually showing the cross-sectional shape of the processing beam on the photocathode (cross section AA) of the four-division photodetector of the autofocus means shown in FIG.

5 is a characteristic diagram showing characteristics of an autofocus signal in the autofocus means shown in FIG.

6 is a circuit diagram showing in detail a defocus calculation circuit for calculating a defocus amount in the autofocus means shown in FIG.

FIG. 7 is a block diagram showing an intensity modulation unit and its related portion extracted from the drawing apparatus shown in FIG.

FIG. 8 is a block diagram showing a drawing device according to another embodiment of the present invention.

9 is a detailed configuration diagram of the beam diameter varying device in FIG.

[Description of Reference Signs] 101 Processing Light Source 102 Intensity Modulator 103 Beam Sampler 104 Photo Detector 105 Comparator 106 1/2 Wave Plate 107 Beam Diameter Changing Device 107a Fixed Axis 107b Rotation Axis 107c Drive Transmission Means 107d Driving Means 107e Lens 107f Lens 107g Lens 107h Rotation-linear conversion means 107i Rotation amount detection means 108 Mirror 109 Polarization beam splitter 110 1/4 wavelength plate 111 Objective lens 112 Objective lens drive device 113 Workpiece 114a Fine movement movement means 114b Coarse movement movement means 115 Reference mirror 116 Relative position Measuring means 117 Absolute position measuring means 118 Control means 119a Convex lens 119b Cylindrical lens 120 Four-division photodetector 121 Defocus calculation circuit 122 Amplification 123 reference signal generator 124 intensity command output means 125 beam diameter variable control means

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Reference number within the agency FI Technical display location G03F 9/02 H H01L 21/30 541 Q (72) Inventor Takeshi Tsuno Takeshi Tsuno, Yukiura, Kanazawa-ku, Kanagawa-shi 1-8-1 Mitsubishi Heavy Industries Ltd. Basic Technology Research Institute

Claims (3)

[Claims] 1. A workpiece is mounted on a fine movement moving means of a movement means having a large movement amount but poor positioning accuracy and a fine movement moving means having a small movement amount but capable of highly accurate positioning. While irradiating the processing beam from above the surface of the workpiece, the position of the processing beam is fixed, and the moving means is moved within a plane that is normal to the optical axis of the processing beam, In a drawing apparatus for processing a line drawing pattern on the surface of a workpiece, an absolute position measuring unit for measuring an absolute position of the workpiece relative to a fixed position, and a relative displacement of the fine moving unit with respect to the coarse moving unit are measured. Relative position measuring means for, measuring the error between the absolute position of the workpiece and the desired position measured by the absolute position measuring means, by the error and the relative position measuring means A control means for controlling the moving means by adding the measured relative position signals, inputting the signal to the coarse movement moving means, and further inputting the error to the fine movement moving means, and the processing beam. The autofocus means for always maintaining the focus position of the surface position of the workpiece, the intensity of the processing beam is adjusted according to the moving speed of the moving means, and further according to the processing start point and the processing end point. A drawing apparatus comprising: an intensity modulation unit that controls on / off of the processing beam. 2. A beam diameter varying device for processing a line drawing pattern on a surface of the workpiece with a desired line width by changing the processing beam to have a predetermined beam diameter. The drawing device according to claim 1. 3. The drawing apparatus according to claim 1 or 2, wherein a laser is used as a processing light source.