JPH08201664A - Method for mounting optical array coupling structure - Google Patents

Abstract

PURPOSE: To provide simple optical array coupling structure mounting method capable of transmitting large capacity of information at high speed and with excellent reliability and simplifying, miniaturizing and lightening the optical array coupling structure. CONSTITUTION: In this method provided with a guide substrate 2 having a guide groove 3 on which plural optical fibers 10 are arranged and fixed at a fixed pitch to optically couple an end surface type semiconductor light emitting element array 5 with plural optical fibers 10, plural optical fibers 10 are arranged and fixed on an auxiliary guide substrate 8 at the same pitch as the guide groove 3, and the tips of plural optical fibers 10 are ground together with the auxiliary guide substrate 8, then the auxiliary guide substrate 8 integrated with plural optical fibers 10 is mounted on the guide substrate 2 on which the back of the end surface type semiconductor light emitting element array 5 is mounted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical array coupling structure for optical communication, an optical local area network, an optical interface, an optical transmission module, etc. used for large-capacity, high-speed, highly reliable image data transmission, optical interconnection, etc. It is about how to implement.

[0002]

2. Description of the Related Art An optical array coupling structure for optically coupling a light emitting element array or a light receiving element array and an optical fiber array has variations as much as possible in order to transmit a large amount of information at high speed and with high reliability. It is necessary to realize an optical array coupling structure with low loss and high optical coupling efficiency and a mounting method thereof. Furthermore, since the light-emitting element for optical transmission at the practical level used for the optical array coupling structure is an end-face type semiconductor light-emitting element, in order to make the optical signal emitted from this end-face type semiconductor light-emitting element enter the optical fiber efficiently. Needs to realize a highly accurate alignment and coupling method.

Conventionally, as an optical array coupling structure and a mounting method which realizes a highly accurate alignment and coupling method and can obtain a high optical coupling efficiency, there are disclosed in Japanese Patent Laid-Open No. 4-361210 and Technical Report Vol.91. , No. 197 (Technical Research Report of The Institute of Electronics, Information and Communication Engineers, 1991.8.26).

First, in the optical array coupling structure disclosed in Japanese Patent Application Laid-Open No. 4-361210, a submount portion having an inclined slide surface for holding an optical fiber array adjustable in its length direction, There is used a mount on which a heat sink having an engaging surface that is slidable with respect to the sliding surface of the submount portion and is inclined and on which a light emitting and receiving element array is mounted is fixed. Then, slide the slide surface of the submount on the engagement surface of the mount,
By adjusting each orthogonal axis, the alignment of the light emitting / receiving element array and the optical fiber array is made highly accurate.

Next, IEICE Technical Report Vol.91, No.197.
In the mounting method of the optical array coupling structure shown in Fig. 1, two sets of symmetrical chucks using low thermal expansion material are used, and the stereoscopic microscope and the micro positioner system are used for each orthogonal axis based on the component fixing method by soldering. And the rotation axis are adjusted to achieve highly accurate alignment.

[0006]

However, the optical array coupling structure realizes high accuracy of alignment, and
Compared to the current structure using copper wire cables, further simplification, size reduction and weight reduction are required.

However, in the above two optical array coupling structures, in parallel data transmission based on 1 byte (= 8 bits) used for a data bus or the like, a large amount of information is transmitted at high speed and with high reliability. At the same time, in order to achieve simplification of the optical array coupling structure and reduction in size and weight, the light receiving and emitting element array mounted on the heat sink for heat dissipation and the optical fibers are specified at an array pitch. In addition to the board, a metal stem for fixing, a mount, a block, and the like are required, so there is a limit to the miniaturization of the device, and the cost cannot be reduced too much from the viewpoint of component materials.

Also, in terms of manufacturing, since the two optical array coupling structures described above have a large number of parts, it is difficult to adjust each orthogonal axis and rotation axis, and it is difficult to assemble and mount each part of the module. is there.

On the other hand, some optical array coupling structures employ a spherical lens, a microlens or the like in order to allow the light emitted from the end face type semiconductor light emitting element to efficiently enter the optical fiber. However, in this optical array coupling structure, the number of parts is increased and the optical alignment accuracy between the end-face type semiconductor light emitting device and the optical fiber becomes strict, so that simplification in manufacturing becomes more difficult.

Further, in the optical array coupling structure, there is a structure in which a tip of an optical fiber is processed into a spherical tip to optically couple with a light emitting / receiving element instead of a lens. However, in this optical array coupling structure, in the case of parallel transmission using an optical fiber array, the tips of the optical fibers processed with a ball are aligned, and the tips of the optical fibers processed with a ball are arranged at a certain distance from the light emitting / receiving element. It is very difficult to manufacture because it is necessary to arrange them in an array while maintaining the above.

The present invention has been made in view of the above problems, and a large amount of information can be transmitted at high speed and with reliability, and the optical array coupling structure can be simplified and reduced in size and weight. It is an object to provide a simple optical array coupling structure mounting method to be achieved.

[0012]

According to the first aspect of the present invention,
Providing a guide substrate having a guide groove for fixing and fixing each light emitting element of the end face type semiconductor light emitting element array and a plurality of optical fibers, and facing each optical fiber and each light emitting element, In a mounting method of an optical array coupling structure for optically coupling the end face type semiconductor light emitting device array and the plurality of optical fibers, the end face type semiconductor light emitting device array is back mounted on the guide substrate, and the plurality of optical fibers are mounted. Are arranged and fixed on an auxiliary guide substrate at the same pitch as the guide groove, and after the tips of the plurality of optical fibers are polished together with the auxiliary guide substrate, the end face type semiconductor light emitting device array is mounted on the back side of the guide substrate. In addition, the auxiliary guide board in which the plurality of optical fibers are integrated is mounted.

According to a second aspect of the present invention, a guide substrate having a guide groove for fixing and fixing each light emitting element of the end face type semiconductor light emitting element array and a plurality of optical fibers at a constant pitch is provided, and each light is provided. In a mounting method of an optical array coupling structure in which a fiber and each of the light emitting elements are opposed to each other and the end face type semiconductor light emitting element array is optically coupled to the plurality of optical fibers, the end face type semiconductor light emitting element is mounted on the guide substrate. The array is mounted on the back surface, the plurality of optical fibers are arranged and fixed on an auxiliary guide substrate at the same pitch as the guide groove, and a polishing guide substrate made of the same material as the auxiliary guide substrate is provided on the auxiliary guide substrate and the auxiliary guide substrate. After being brought into contact with a plurality of optical fibers and temporarily fixed, and after polishing the tips of the plurality of optical fibers together with the auxiliary guide substrate and the polishing guide substrate Remove the abrasive guide substrate from the auxiliary guide substrate, the plurality of optical fibers to guide the substrate to the edge-type semiconductor light-emitting element array are back mounted was made to implement the auxiliary guide board integrally.

According to a third aspect of the present invention, there is provided an end face type semiconductor light emitting element array according to the first or second aspect, wherein the polishing end faces of the tips of the plurality of optical fibers and the auxiliary guide substrate are opposed to the auxiliary guide substrate. It was formed to be inclined with respect to the end face.

According to a fourth aspect of the present invention, grooves other than the guide grooves that are not related to optical transmission are formed on the guide substrate according to the first or second aspect of the invention, and the grooves are formed by contacting the end face type semiconductor light emitting element array. A spacer is arranged on the substrate, and an auxiliary guide substrate is brought into contact with the spacer for mounting.

According to a fifth aspect of the invention, a guide substrate having a guide groove for fixing and fixing each light emitting element of the end face type semiconductor light emitting element array and a plurality of optical fibers at a fixed pitch is provided, and each of the light beams is provided. In a mounting method of an optical array coupling structure in which a fiber and each of the light emitting elements are opposed to each other and the end face type semiconductor light emitting element array is optically coupled to the plurality of optical fibers, the end face type semiconductor light emitting element is mounted on the guide substrate. The array is mounted on the back surface, and the plurality of optical fibers are provided at positions apart from the end face of the auxiliary guide substrate facing the end face type semiconductor light emitting device array by a certain distance, the guide grooves having the guide grooves for arranging the plurality of optical fibers at the same pitch as the guide groove. The ends of the optical fibers are aligned and fixed, and the plurality of optical fibers are integrated with the guide substrate on which the end face type semiconductor light emitting element array is mounted on the back surface. And to implement the auxiliary guide substrate.

The invention according to claim 6 is the same as claim 1,
The common electrode side of the end face type semiconductor light emitting device array in the mounting method of the optical array coupling structure according to 3, 4, or 5 is mounted on a conductive submount, and each light emission of the submount and the end face type semiconductor light emitting device array. A bias voltage was applied to the device and each of the light emitting devices was independently driven from the outside to emit light, and the light emission power was measured and evaluated, and then mounted on the back surface of the guide substrate.

According to a seventh aspect of the invention, in the sixth aspect of the invention, a guide groove for alignment is formed in the submount on which the end face type semiconductor light emitting element array is mounted.

[0019]

According to the first aspect of the invention, after the tips of the plurality of optical fibers arranged and fixed on the auxiliary guide substrate at the same pitch as the guide grooves of the guide substrate are polished together with the auxiliary guide substrate, the plurality of optical fibers are By mounting the integrated auxiliary guide board on the guide board, the mounting and manufacturing can be simplified, and the tips of the plurality of optical fibers can be aligned with the surface with less optical loss, so that the optical array coupling can be achieved. The structure is simplified, the size and weight are reduced, variation and loss are reduced, and high optical coupling efficiency is obtained.

According to the second aspect of the present invention, since the material of the polishing guide substrate for polishing together with the plurality of optical fibers and the auxiliary guide substrate is the same as that of the auxiliary guide substrate, the polishing process is simplified and By polishing the tips of multiple optical fibers together with the auxiliary guide substrate and the polishing guide substrate used only during polishing, it is possible to align the tips of the multiple optical fibers with a surface that has less optical loss, and thus variations and loss And a high optical coupling efficiency can be obtained.

According to the third aspect of the invention, the auxiliary guide board having the plurality of optical fibers integrated therein is mounted on the guide board by forming an angle to the end surface of the auxiliary guide board that is polished together with the plurality of optical fibers. The distance between the end-face type semiconductor light emitting element and the incident end face of the optical fiber can be secured by this, and the influence of damage such as damage to each part during optical coupling can be avoided. High optical transmission.

According to a fourth aspect of the present invention, the spacer is disposed in a groove other than the guide groove that is not in contact with the end face type semiconductor light emitting element array and is not related to optical transmission, and an auxiliary guide substrate having a plurality of optical fibers integrated therein. By mounting it on the guide board, a fixed distance between the end face type semiconductor light emitting element and the incident end face of the optical fiber is secured, so that it is possible to avoid the influence of damage such as damage to each part during optical coupling. , A simple mounting method enables reliable optical transmission with less variation and loss.

According to the invention of claim 5, by aligning the tips of the plurality of optical fibers, variation and loss are reduced, high optical coupling efficiency is obtained, and the tips of the plurality of optical fibers and the end face type semiconductor are obtained. By mounting an auxiliary guide board with a plurality of optical fibers integrated with the light emitting element array at a fixed distance on the guide board, it is possible to avoid the influence of damage such as damage to each part during optical coupling. , Reliable optical transmission is performed by a simple mounting method, and further, by arranging and fixing a plurality of optical fibers on the auxiliary guide board at the same pitch as the guide groove of the guide board, the plurality of optical fibers can be fixed on the auxiliary guide board. Since the structure around the optical fiber can be provided, the reliability against dust and the like can be improved.

According to the sixth aspect of the present invention, after mounting the common electrode side of the end face type semiconductor light emitting device array on the conductive submount, the end face type semiconductor light emitting device array is back mounted on the guide substrate. A bias voltage is applied to the submount before back-mounting on the guide substrate to externally drive each light emitting element of the end face type semiconductor light emitting element to emit light, and a chip-shaped end face type semiconductor light emitting element array is formed. Since they can be evaluated, they are sorted at the chip level in manufacturing, and the yield can be improved.

According to a seventh aspect of the present invention, a guide groove for alignment is formed in the submount on which the end face type semiconductor light emitting device array is mounted, and the common electrode side of the end face type semiconductor light emitting device array is formed in this guide groove. After mounting, by mounting the end-face type semiconductor light emitting element array on the back side of the guide substrate, it is possible to perform high-precision and stable chip mounting and back-side mounting on the guide substrate. Transmission takes place.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the invention described in claim 1 will be described with reference to FIGS. As shown in FIGS. 1A and 2, a first guide substrate 2, which is a guide substrate, is fixed on the base substrate 1. This first guide substrate 2
Two guide grooves 3 having a V-shaped cross section are formed on the surface of the. On the upper surface of the first guide substrate 2, a V-groove side wiring 4 is formed on the left side in FIG. 2 along the groove direction of the guide groove 3. An end face type LEDA (end face type light emitting diode array) 5, which is an end face type semiconductor light emitting element array, is mounted on the first guide substrate 2 by back flip chip mounting. At this time, each light emitting element 6 of the end face type LED A5 is arranged in each guide groove 3. Further, the wiring pad 7 connected to the light emitting element 6 is connected to the V-groove side wiring 4. The V-groove side wiring 4 and an external circuit (not shown) are connected to drive the light emitting elements 6 individually.

Next, as shown in FIG. 1B, a second guide groove 8 which is an auxiliary guide substrate is prepared. On the second guide substrate 8, two guide grooves 9 are formed at the same pitch as the guide grooves 3. The optical fibers 10 are arranged and fixed in each of these guide grooves 9. These optical fibers 10 are connected to the second guide substrate 8
Along with this, polishing is performed to form an optically favorable polished end surface 11 at the tips of the two optical fibers 10.

Then, as shown in FIGS. 1 (c) and 5, each optical fiber 10 on which the polished end face 11 is formed is inserted into each of the guide grooves 3 to face each of the light emitting elements 6, and A second guide board 8 having two optical fibers 10 integrated therein is mounted on the first guide board 2. As a result, the end face type LED A5 and the two optical fibers 10 are
Are optically coupled, and the two optical fibers 10 are sandwiched and fixed by the first guide substrate 2 and the second guide substrate 8.

By the way, a bump layer 12 made of a thermosetting conductive polymer adhesive is used in the method of electrically connecting the V-groove side wiring 4 and the wiring pad 7 described above. First,
The bump layer 12 is formed on the wiring pad 7 by a screen printing method. Then, the bump layer 12 is heated to 150 ° for 10 minutes after being aligned with the V-groove side wiring 4, and the V-groove side wiring 4 and the wiring pad 7 are cured and adhered to be electrically connected. A passivation layer 13 is formed in order to ensure the stability of adhesion and the insulation between adjacent channels.

Further, as shown in FIGS. 3 and 4, the end face type LEDs A5 have a laminated structure. This laminated structure has a p-type GaAs buffer layer 15 on the p-type GaAs substrate 14 by the MOVPE method, and a p with a large band gap.
-Type AlGaAs clad layer 16 and AlGa as a light emitting layer
As active layer 17, n-type AlGaAs cladding layer 18, n
This is a double hetero structure in which the type GaAs cap layer 19 and the n + type GaAs contact layer 20 are sequentially formed. From the surface of the contact layer 20 to the surface of the substrate 14, the substrate 1 is perpendicular to the surface of the substrate 14.
The separation groove 21 reaching the surface of No. 4 is formed by a dry etching method using chlorine gas. The separation groove 21
The light emitting elements 6 are electrically separated from each other and are formed on the substrate 14 with a pitch of 250 μm.
Then, the chips themselves are separated by performing mechanical cutting. Therefore, a cut portion 22 is formed near each end surface of the chip. In addition, the contact layer 20 of each of the light emitting devices 6 has Au-
An n-side electrode 23 made of Ge / Ni / Au is formed. The wiring pad 7 is connected to the n-side electrode 23. Further, on the back surface of the substrate 14, Au-Zn /
A p-side electrode 24 made of Au is formed. Since the end face type LED A5 configured in this manner is manufactured by the MOVPE method which is excellent in the uniformity of the film characteristics, the variation in the light output is ± 5% or less within one chip. Further, the material used for the end face type LED A5 is III-V group compound semiconductors such as GaAs and Al.
GaAs, AlGaInP, InP, InGaAsP,
InGaP, InAlP, GaAsP, GaN, InA
sP, InAsSb, etc., or ZnSe, ZeS, ZeSSe, CdSe, C which are II-VI group compound semiconductors
dSSe, CdTE, HgCdTe, etc., and IV-
Group VI compound semiconductors PgbSe, PbTe, PbS
It is nSe, PbSnTe, or the like, and it is possible to apply the laminated structure by utilizing the advantages of each material. For example, when an AlGaAs-based material is used for the active layer 17, GaAs or AlGaAs having a composition of Al larger than 0 and smaller than 0.45 is used to form the cladding layer 1
6 and 18 have a wider forbidden band than the active layer 17
Can be applied to a laminated structure.

Further, as the optical fiber 10, a GI type multimode fiber is used. The size of the core diameter is 50 μm, and the size of the diameter including the clad is 125 μm. And the two optical fibers 10
The pitch between them is 250 μm.

The first guide substrate 2 and the second guide substrate 8 have a V-shaped cross-section guide groove 3 formed by anisotropically etching single crystal silicon.
And a silicon guide substrate (Si-V groove substrate) having the guide groove 9 (Si-V groove). The guide groove 3 and the guide groove 9 are of a size such that half of the optical fiber 10 can be accommodated in a cross-sectional view. However, the first guide substrate 2 and the second guide substrate 8 are
The material is not limited to the one made of silicon, but may be made of glass by cutting or plastic molding.

According to such a mounting method, a fixing metal stem, mount, block or the like is unnecessary,
Moreover, since the height of the light emitting element 6 is as low as several μm, light is emitted by a mechanical mounting process of inserting the optical fiber 10 into the guide groove 3 and mounting the second guide substrate 8 integrated with the optical fiber 10. The light emitting direction of the element 6 and the center of the core of the optical fiber 10 substantially coincide with each other, and good optical coupling can be obtained. Therefore, simplification in mounting and manufacturing is achieved. Further, the tips of the two optical fibers 10 are connected to the second guide substrate 8
By polishing together with them, the tips of the optical fibers 10 can be aligned with the optically good polished end face 11, so that the optical coupling efficiency can be improved.

An embodiment of the invention described in claim 2 will be described with reference to FIGS. 6 and 7. The same parts as those described in the above embodiment are represented by the same reference numerals,
The description thereof is omitted (the same applies to other embodiments below). As shown in FIG. 6A, the third guide substrate 26 fixed to the third guide substrate holding jig 25 is prepared as a polishing guide substrate. Further, the two optical fibers 10 are fixed to the second guide substrate 8. The optical fiber fixing member 27 is fixed so that these optical fibers 10 are sandwiched together with the second guide substrate 8.

Then, as shown in FIG.
The second guide substrate 8 integrated with the one optical fiber 10 is temporarily fixed to the third guide substrate 26 so as to sandwich the two optical fibers 10. At this time, the reason why the second guide substrate 8 and the third guide substrate 26 are temporarily fixed without being completely adhered and fixed is that they can be separated later. Two optical fibers 1 fixed in this way
0 is polished together with the second guide substrate 8 and the third guide substrate 26. Then, the third guide substrate 26 is separated from the second guide substrate 8.

In this way, as shown in FIG. 6C, the two optical fibers 10 aligned with the polishing end face 11 with less optical loss form the second guide substrate 8 integrated with each other.

Then, as shown in FIG. 7A, after inserting each of the optical fibers 10 along each of the guide grooves 3, as shown in FIG. The second guide board 8 integrated with the two optical fibers 10 is mounted on the first guide board 2 so as to match the distance in the optical axis direction with the end surface type LED A5. As a result, the optical fibers 10 and the light emitting elements are optically coupled.

However, when the second guide substrate 8 is temporarily fixed to the third guide substrate 26, since the constituent members thereof are Si, quartz glass, etc., it is damaged as an adhesive for temporary fixing. I used the one that can be easily washed off with a solvent without worrying about. Therefore, it is possible to easily separate the third guide substrate 26 from the second guide substrate 8 by using a solvent.

Further, the third guide substrate 26 has a V-shaped cross section formed by anisotropically etching single crystal silicon similarly to the first guide substrate 2 and the second guide substrate 8. -V with a grooved Si-V groove
It is a grooved substrate. In addition, the Si-V of the third guide substrate 26
The width and depth of the groove shape were also formed in the same manner as the second guide substrate 8. The third guide substrate 26 is not limited to the one made of silicon, and if it is the same as the second guide substrate 8, one made of glass by cutting or made of plastic is used. It may be something.

According to such a mounting method, the polishing characteristics can be improved by polishing the two optical fibers 10 together with the second guide substrate 8 and the third guide substrate 26. Since the tips of the two optical fibers 10 can be aligned with the optically good polished end surface 11, the optical coupling efficiency can be improved. Further, the distance L between the polished end faces 11 of the two optical fibers 10 and the optical fiber fixing member 27 is set to be the distance from the cut end face 28 of the end face type LED A5 to the end face 29 of the first guide substrate 2 on the optical fiber 10 side. The optical coupling distance can be set without adjustment by adjusting to, and uniform optical coupling can be obtained especially in the case of an array. Therefore, while simplifying the polishing process, highly efficient optical coupling with less variation in optical coupling efficiency and loss of each channel can be realized. Further, by a mechanical mounting process in which the optical fiber 10 is inserted into the guide groove 3 and the second guide substrate 8 is mounted on the first guide substrate 2, the light emitting direction of the light emitting element 6 and the core center of the optical fiber 10 are reduced. And almost match, and good optical coupling can be obtained. Therefore, simplification in mounting and manufacturing is achieved.

An embodiment of the invention described in claim 3 will be described with reference to FIG. The tip end of the optical fiber 10 fixed in the guide groove 9 of the second guide substrate 8 is polished together with the second guide substrate 8, and the two optical fibers 10 are cut with respect to the cut end face 28 of the end face type LEDA 5. Polished end face 30
And the polishing end face 31 of the second guide substrate 8 are inclined toward the cutting end face 28 side by an angle θ. Then, the optical fibers 10 are opposed to the light emitting elements 6 and the guide grooves 3 are formed.
Insert the polishing end face 31 into contact with the cutting end face 28,
The second guide board 8 in which the two optical fibers 10 are integrated is mounted on the first guide board 2 on which the end face type LEDs A5 are mounted.

According to such a mounting method, by polishing the two optical fibers 10 to form the polished end faces 30, the tips of the two optical fibers 10 are aligned with the optically good polished end faces 30. be able to. Therefore, highly efficient optical coupling with less variation in optical coupling efficiency and loss of each channel can be obtained. Moreover, the polishing end face 31 can be brought close to the cutting end face 28 by the angle θ between the polishing end faces 30 and 31, and the distance from the light emitting element 6 to the polishing end face 30 can be easily set. Therefore, the variation in the optical coupling efficiency of each channel can be minimized.
Further, since the wafer thickness of the end surface type LEDA5 is several hundreds of μm, by forming the polishing end surfaces 30 and 31 at an angle, the polishing end surface 30 does not hit even if the end surface type LEDA5 is abutted with the polishing end surface 31. The reliability of the optical fiber 10 can be ensured, and the influence of damage such as damage to each part can be avoided when optical coupling is performed. Therefore, a simple and highly reliable mounting can be obtained. In addition, the light emitting direction of the light emitting element 6 and the optical fiber 1 are reduced by a mechanical mounting process in which the optical fiber 10 is inserted into the guide groove 3 and the second guide substrate 8 is mounted on the first guide substrate 2.
Since the core center of 0 substantially coincides with each other, good optical coupling can be obtained. Therefore, simplification in mounting and manufacturing is achieved.

An embodiment of the invention described in claim 4 will be described with reference to FIG. Two guide grooves 3 are formed in the center of the first guide substrate 32, and grooves 33 not related to optical transmission are formed on both outer sides of the guide substrates 3. An end face type LEDA 34 having a size corresponding to the groove 33 is mounted on the first guide substrate 32. A guide groove 9 corresponding to the guide groove 3 and the groove 33 is formed on the second guide substrate 35 having the same length as the end surface type LEDA 34 in the array direction. An optical fiber 10 is fixed to each of the center two of these guide grooves 9. After polishing these optical fibers 10 together with the second guide substrate 35, the cut end face 28 of the end face type LEDA 34 is cut.
And the spacer 36 is fixed to the groove 33.
Then, each of the optical fibers 10 is inserted along each of the guide grooves 3, the second guide substrate 35 is brought into contact with the spacer 36, and the optical fiber 10 is integrated with the first guide substrate 32. The second guide board 35 is mounted.

The first guide substrate 32 and the second guide substrate 35 are Si-V groove substrates. Also,
The groove 33 is the same Si-V groove as the guide groove 3, and is formed by changing the mask for the semiconductor process. Thus, if the groove 33 has basically the same shape as the guide groove 3, it can be easily realized by adding the number of transmission channels when the first guide substrate 32 is formed.

The spacer 36 is a spherical polymer resin. This spherical polymer resin can be easily made uniform in size by selection. However, the shape of the spacer 36 is not limited to a spherical shape as long as it is suitable for the groove 33.

According to such a mounting method, the end face type LE is used.
The spacer 3 is provided between the DA 34 and the second guide substrate 35.
By mounting No. 4, the distance between the light emitting element 6 and the polished end surface 11 can be kept constant, and the influence of damage such as damage to each part when optically coupling can be avoided. Therefore, it is possible to obtain a simple and highly reliable mounting in which the variation in the optical coupling efficiency of each channel can be minimized. Further, by the mechanical mounting process of inserting the optical fiber 10 into the guide groove 3 and mounting the second guide substrate 35 on the first guide substrate 32, the light emitting direction of the light emitting element 6 and the core center of the optical fiber 10 can be reduced. And almost match, and good optical coupling can be obtained. Therefore, simplification in mounting and manufacturing is achieved. Further, by polishing the tips of the two optical fibers 10 together with the second guide substrate 35,
Since the tips of the optical fibers 10 can be aligned with the optically polished end face 11, the optical coupling efficiency can be improved.

Although the optical fiber 10 is not mounted in the groove 33 in this embodiment, the optical fiber 10 may be mounted in the groove 33. However, when the optical fiber 10 is not mounted in the groove 33, the spacer 36 can be pressed down and can be stably fixed.

An embodiment of the invention described in claim 5 will be described with reference to FIG. First, the two optical fibers 10 are
It is sandwiched between the guide substrate 8 and the optical fiber fixing member 27, temporarily fixed, and polished together with the second guide substrate 8. After that, the polished end faces 1 of the two optical fibers 10 are
1 is fixed at a distance d from the end surface 37 of the second guide substrate 8. Then, the optical fiber 10 is inserted along the guide groove 3, and the end face 37 is abutted against the end face type LEDA 5, so that the second guide substrate 8 in which the optical fiber 10 is integrated with the first guide substrate 2. Implemented.

According to such a mounting method, by adjusting the distance d, it is possible to adjust in the optical axis direction, and it is possible to suppress variations in the coupling efficiency of each channel. Further, the polished end face 11 of the optical fiber 10 is sealed together with the light emitting element 6. Therefore, deterioration of the optical coupling efficiency due to dust or the like is prevented, and the reliability of the optical array coupling structure is ensured. Furthermore, by polishing the tips of the two optical fibers 10 together with the second guide substrate 8, the tips of the optical fibers 10 can be aligned with the optically good polished end faces 11, thus increasing the optical coupling efficiency. To be

In this embodiment, two optical fibers 10 are polished together with the second guide substrate 8 as a method for fixing a plurality of optical fibers at a position separated from an end surface of the second guide substrate by a predetermined distance. A method of aligning the tips of the two optical fibers 10 with the optically good polishing end faces 11 and then fixing the polishing end faces 11 by displacing the distance d from the end face 37 was used, but the method is not limited to this. It is not meant to be done. For example, a method may be used in which the ends of the two optical fibers 10 are aligned by cutting and then the ends of the optical fibers 10 are fixed by shifting the distance d from the end face 37 of the second guide substrate 8.

Here, FIG. 11 shows the optical coupling characteristics in the optical axis direction in the optical array coupling structure mounted by the mounting method of the optical array coupling structure of the above-mentioned embodiment. This is because the second guide substrates 8 and 35 to which the optical fiber 10 is fixed are first
The measurement is performed by moving in the optical axis direction on the guide substrates 2 and 32.

By the way, in the above-mentioned embodiment, the optical array coupling structure using the two light emitting elements 6 and the two optical fibers 10 is shown, but the number of the light emitting elements 6 and the number of the optical fibers 10 are the same. The number of light emitting elements 6 and the number of optical fibers 10 are not limited, and are determined by what the optical array coupling structure is used for. For example, when considering one-channel signal transmission that can perform highly reliable transmission, it is necessary to prepare one compensation channel in addition to the data transmission channel, so that at least two light-emitting elements 6 are required. It is necessary to prepare at least two optical fibers 10. Considering parallel data transmission in units of 1 byte (= 8 bits) that enables highly reliable transmission, it is necessary to prepare 8 channels for data transmission and several channels for control lines, etc. It is necessary to prepare one light emitting element 6 and at least nine optical fibers. Moreover, the end face type LEDA
Although 5 has an array shape, it can be used even if the number of the light emitting elements 6 is one.

Further, in the above-described embodiment, the Si-V groove is used as a groove for arranging and fixing the two optical fibers 10 at the same pitch as the guide groove 3 and the second guide substrates 8 and 3.
However, the cross-sectional shape of the guide groove of the second guide substrate 8 is not limited to the V shape, and a plurality of optical fibers 10 may be arranged and fixed at the same pitch as the guide groove 3. I wish I could. For example, as shown in FIG. 12, the cross-sectional shape of the guide groove 38 may be rectangular.

An embodiment of the invention described in claim 6 will be described with reference to FIGS. 13 and 14. First, as shown in FIG. 13A, the end surface type L is attached to the conductive submount 39.
The p-side electrode 24 side which is the common electrode of the EDA 5 is die-bonded. After that, the end face type LED A5 is electrically contacted from the outside. At that time, a power meter is placed in the optical axis direction to measure the true light emission power of the end surface type LED A5 in the optical axis direction to evaluate the variation in the light emission power of the end surface type LED A5. Next, as shown in FIG. 13B, a metallic lead 40 for external extraction is mounted on the submount 39. Then, as shown in FIG. 13C, the end face type LEDs A5 are mounted on the first guide substrate 2 by rear flip chip mounting. Optical fiber 10 after this
Is implemented according to the above-described embodiment.

As for the electrical contact from the outside to the end face type LED A5, as shown in FIG. 14, a microprober 41, a metal lead or the like is brought into contact with the submount 39 on the p-side electrode 24 side. Then, the microprober 41 or the like is brought into contact with the n-side electrode 23 of each light emitting element 6.

As described above, by die-bonding the end-face type LED A5 to the conductive submount 39, it is possible to evaluate the variation in the light emission power of the end-face type LED A5 in the chip alone in the optical axis direction. Therefore, the chips are sorted at the chip level in manufacturing the module, and the yield can be improved. Furthermore, the metallic lead 4
By mounting 0 on the submount 39 in advance,
The bias is easily applied at the time of evaluation and mounting. Further, by mounting the end face type LED A5 die-bonded to the submount 39 on the backside by flip chip mounting, the handling of the light emitting element at the time of mounting is safe and easy.

An embodiment of the invention described in claim 7 will be described with reference to FIG. In the conductive submount 39, a cutout portion 42 having a bottom surface of the same size as the p-side electrode 24 of the end surface type LED A5 is formed as a guide groove for alignment. The cutout portion 42 is formed on the submount 3
9 shows the position of the end surface type LED A5 on the surface 9. By forming such a notched portion 42, the end surface type LE
Die bonding of the DA5 onto the submount 39 is facilitated, and stable fixing is obtained when the flip-chip mounting is performed on the first guide substrate 2 or after the mounting, and the reliability of the optical coupling structure is obtained. Is secured. In addition, an end face type LED A5 that is die-bonded to the submount 39
The position of can be determined. Therefore, when the back flip chip mounting is performed, the external shape of the submount 39 and the first
Positioning can be performed by aligning with the guide substrate 2 of.

The guide groove for alignment is not limited to the cutout portion 42 as shown in FIG.
As shown in FIG. 16, a groove 43 formed along the optical axis direction of the light emitting element 6 and having the same width as the array direction width of the end surface type LED A5, or, as shown in FIG. 17, an end surface type LE.
The end face type LE having the same width as the optical axis direction of DA5
It is sufficient that the end surface type LED A5 can be positioned and die-bonded, such as the cutout portion 44 formed along the array direction of the DA5.

[0059]

According to the first aspect of the present invention, the tips of the plurality of optical fibers arranged and fixed on the auxiliary guide substrate at the same pitch as the guide grooves of the guide substrate are polished together with the auxiliary guide substrate, and then the plurality of optical fibers are polished. By mounting the integrated auxiliary guide substrate on the guide substrate on which the end face type semiconductor light emitting element array is mounted on the back surface, simplification in mounting and manufacturing can be achieved, and the tips of the plurality of optical fibers can be optically mounted. Since it is possible to align the surfaces with less loss, the optical array coupling structure can be simplified, reduced in size and weight, variation and loss can be reduced, and high optical coupling efficiency can be obtained.

According to the second aspect of the present invention, since the material of the polishing guide substrate for polishing together with the plurality of optical fibers and the auxiliary guide substrate is the same as that of the auxiliary guide substrate, the polishing process can be simplified. By polishing the tips of the plurality of optical fibers together with the auxiliary guide substrate and the polishing guide substrate used only at the time of polishing, it is possible to align the tips of the plurality of optical fibers with the surface with less optical loss, and thus the variations and Can reduce losses,
High optical coupling efficiency can be obtained.

According to a third aspect of the present invention, the auxiliary guide board, which is polished together with the plurality of optical fibers, is mounted on the guide board at a certain angle, and the auxiliary guide board having the plurality of optical fibers is mounted on the guide board. Since the distance between the end face type semiconductor light emitting element and the incident end face of the optical fiber can be ensured and the influence of damage such as damage to each part at the time of optical coupling can be avoided, reliability can be improved by a simple mounting method. A high optical array coupling structure can be obtained.

According to a fourth aspect of the present invention, a spacer is disposed in a groove other than the guide substrate that is not in contact with the end face type semiconductor light emitting element array and is not related to optical transmission, and a plurality of optical fibers guide the auxiliary guide substrate. By mounting on the substrate, since a fixed distance between the end face type semiconductor light emitting element and the incident end face of the optical fiber is secured, it is possible to avoid the influence of damage such as damage to each part during optical coupling, With a simple mounting method, it is possible to obtain a highly reliable optical array coupling structure with less variation and loss.

According to the fifth aspect of the present invention, by aligning the tips of the plurality of optical fibers, variations and losses are reduced, high optical coupling efficiency can be obtained, and the tips of the plurality of optical fibers and the end face type semiconductor light emission are obtained. By mounting the auxiliary guide substrate on which a plurality of optical fibers are integrated on the guide substrate at a constant distance from the element array, it is possible to avoid the influence of damage such as damage at each part during optical coupling, A highly reliable optical array coupling structure can be obtained by a simple mounting method. Furthermore, by arranging and fixing a plurality of optical fibers on the auxiliary guide board at the same pitch as the guide groove of the guide board, the auxiliary guide board is fixed. Since it is possible to make a structure that surrounds multiple optical fibers with,
The reliability of dust and the like can be improved.

According to a sixth aspect of the present invention, after the common electrode side of the end face type semiconductor light emitting device array is mounted on the conductive submount, the end face type semiconductor light emitting device array is back mounted on the guide substrate, whereby the guide is formed. Bias voltage is applied to the submount before back mounting on the substrate, and each light emitting element of the edge type semiconductor light emitting element can be independently driven from the outside to emit light, and the chip type edge surface type semiconductor light emitting element array is evaluated. Therefore, the chips can be sorted at the chip level in manufacturing, and the yield can be improved.

According to a seventh aspect of the present invention, a guide groove for alignment is formed in the submount on which the end face type semiconductor light emitting device array is mounted, and the common electrode side of the end face type semiconductor light emitting device array is mounted in this guide groove. After that, by mounting the end surface type semiconductor light emitting element array on the back surface of the guide substrate, the chip mounting can be performed with high accuracy and stability, and the back surface mounting on the guide substrate can be performed. A bond structure can be obtained.

[Brief description of drawings]

FIG. 1 is a perspective view sequentially showing a mounting process of an embodiment of the invention described in claim 1.

2A and 2B show a guide substrate on which an end face type semiconductor light emitting element array is mounted on the back surface, FIG. 2A is a plan view, FIG.
(C) is a front view.

FIG. 3 is a partial vertical side view showing the end face type semiconductor light emitting device array.

FIG. 4 is a perspective view showing the end face type semiconductor light emitting device array.

FIG. 5 shows an optical array coupling structure mounted by the mounting method, (a) is a plan view, (b) is a side view, and (c) is a front view.

FIG. 6 is a perspective view sequentially showing a polishing process according to an embodiment of the invention as set forth in claim 2.

FIG. 7 is a side view showing the mounting process in order.

FIG. 8 is a side view of an optical array coupling structure showing an embodiment of the invention according to claim 3;

9A and 9B show an optical array coupling structure mounted by a mounting method according to an embodiment of the invention described in claim 4, wherein FIG. 9A is a plan view and FIG. 9B is a side view.

FIG. 10 is a side view sequentially showing a mounting process of an embodiment of the invention as set forth in claim 5;

FIG. 11 is a graph showing the optical coupling characteristics in the optical axis direction of the optical array coupling structure mounted by the mounting method of the embodiments of the invention described in claims 1 to 5.

FIG. 12 is a front view of an optical array coupling structure showing a modified example.

FIG. 13 is a perspective view sequentially showing a mounting step of an embodiment of the invention described in claim 6;

FIG. 14 is a perspective view showing an electrical contact method using a microprober for an end face type semiconductor light emitting element array die-bonded to a submount.

FIG. 15 is a perspective view showing an embodiment of the invention described in claim 7 before die bonding.

FIG. 16 is a perspective view of a submount showing a modified example thereof.

FIG. 17 is a perspective view of a submount showing a different modified example.

[Explanation of symbols]

 2, 32 guide substrate 3 guide groove of guide substrate 5,34 end face type semiconductor light emitting element array 6 light emitting element 8, 35 auxiliary guide substrate 9, 38 guide groove of auxiliary guide substrate 10 optical fiber 24 common electrode side 26 polishing guide substrate 30 Polished end face of optical fiber 31 Polished end face of auxiliary guide substrate 33 Groove of guide substrate 36 Spacer 39 Submount 42, 43, 44 Guide groove for alignment

Claims (7)

[Claims] 1. A guide substrate having guide grooves for fixing and fixing each light emitting element of an end face type semiconductor light emitting element array and a plurality of optical fibers at a fixed pitch is provided, and each optical fiber and each light emitting element are provided. In the mounting method of the optical array coupling structure in which the end face type semiconductor light emitting element array and the plurality of optical fibers are optically coupled to each other,
The end surface type semiconductor light emitting device array is mounted on the back surface of the guide substrate, the plurality of optical fibers are arranged and fixed on an auxiliary guide substrate at the same pitch as the guide groove, and the tips of the plurality of optical fibers are attached to the auxiliary substrate. A method for mounting an optical array coupling structure, comprising: polishing the guide substrate together with the guide substrate, and then mounting the auxiliary guide substrate having the plurality of optical fibers integrated on the guide substrate on which the end face type semiconductor light emitting device array is mounted on the back surface. 2. A guide substrate having guide grooves for fixing and fixing each light emitting element of an end face type semiconductor light emitting element array and a plurality of optical fibers at a fixed pitch is provided, and each optical fiber and each light emitting element are provided. In the mounting method of the optical array coupling structure in which the end face type semiconductor light emitting element array and the plurality of optical fibers are optically coupled to each other,
The end face type semiconductor light emitting device array is mounted on the back surface of the guide substrate, the plurality of optical fibers are arranged and fixed on the auxiliary guide substrate at the same pitch as the guide groove, and the same material as the auxiliary guide substrate is polished. The guide substrate for contact with the auxiliary guide substrate and the plurality of optical fibers to temporarily fix them, and after polishing the tips of the plurality of optical fibers together with the auxiliary guide substrate and the polishing guide substrate, An optical array coupling structure characterized in that the guide board is removed from the auxiliary guide board, and the auxiliary guide board having the plurality of optical fibers integrated is mounted on the guide board on which the end face type semiconductor light emitting device array is mounted on the back surface. How to implement. 3. The polishing end faces of the tips of the plurality of optical fibers and the auxiliary guide substrate are formed so as to be inclined with respect to the end face of the end face type semiconductor light emitting device array facing the auxiliary guide substrate. Alternatively, the method of mounting the optical array coupling structure according to the above item 2. 4. A groove other than the guide groove, which is not related to optical transmission, is formed in the guide substrate, a spacer is disposed in the groove so as to abut against the end face type semiconductor light emitting device array, and an auxiliary guide substrate is brought into contact with the spacer. The optical array coupling structure mounting method according to claim 1 or 2, wherein the mounting method is performed by mounting the optical array coupling structure. 5. A guide substrate having guide grooves for fixing and fixing each light emitting element of an end face type semiconductor light emitting element array and a plurality of optical fibers at a fixed pitch is provided, and each optical fiber and each light emitting element are provided. In the mounting method of the optical array coupling structure in which the end face type semiconductor light emitting element array and the plurality of optical fibers are optically coupled to each other,
The end face type semiconductor light emitting device array is mounted on the back face of the guide substrate so as to face the end face type semiconductor light emitting device array of the auxiliary guide substrate having a guide groove for arranging the plurality of optical fibers at the same pitch as the guide groove. The tip ends of the plurality of optical fibers are aligned and fixed at a position apart from the end face, and the auxiliary guide substrate having the plurality of optical fibers integrated on a guide substrate on which the end face type semiconductor light emitting device array is mounted on the back surface is mounted. A method for mounting an optical array coupling structure characterized by the above. 6. The end face type semiconductor light emitting element array common electrode side is mounted on a conductive submount, and a bias voltage is applied to this submount and each light emitting element of the end face type semiconductor light emitting element array, The optical array according to claim 1, 2, 3, 4 or 5, wherein each light emitting element is independently driven from the outside to emit light, the light emission power is measured and evaluated, and then the light emitting element is mounted on the back surface of the guide substrate. How to implement the combined structure. 7. The method of mounting an optical array coupling structure according to claim 6, wherein a guide groove for alignment is formed in a submount on which the edge-face type semiconductor light emitting device array is mounted.