JPH08197434A - Pad for grinding - Google Patents

Pad for grinding

Info

Publication number
JPH08197434A
JPH08197434A JP784695A JP784695A JPH08197434A JP H08197434 A JPH08197434 A JP H08197434A JP 784695 A JP784695 A JP 784695A JP 784695 A JP784695 A JP 784695A JP H08197434 A JPH08197434 A JP H08197434A
Authority
JP
Japan
Prior art keywords
polishing
pad
layer
polishing pad
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP784695A
Other languages
Japanese (ja)
Inventor
Junzo Takano
純三 高野
Keiko Suzuki
恵子 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP784695A priority Critical patent/JPH08197434A/en
Publication of JPH08197434A publication Critical patent/JPH08197434A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To provide a durable pad for grinding by embossing recessed grooves formed on the surface of a grinding layer and thereby reducing dust produced from the ends of the grooves. CONSTITUTION: A pad for grinding comprises porous forming resin for grinding layer 15 containing the material to be ground and has a desired pattern on the surface of the grinding layer by embossing the recessed grooves 18 with hot press, etc.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は極めて小さい表面粗度が
要求されている被加工物の研磨装置に用いられる研磨用
パッドに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing pad used in a polishing apparatus for a work piece, which requires extremely small surface roughness.

【0002】[0002]

【従来の技術】従来CD(コンパクトディスク)やLD
(レーザディスク)の製造に用いられるガラス製の原盤
の表面を研磨する研磨装置用の研磨用パッドは、例えば
図6(a)、(b)、(c)に示す如き構造のものが存
在した。即ち(a)、(b)に示すものは、ウレタンフ
ォームのような多孔質樹脂の表面に機械研削により、比
較的浅い切削凹溝26を多数設けたものである。この切
削凹溝26は研磨加工の際に併用される液状の研磨剤を
パッドと被加工物の間に導き、それを被加工物の表面に
満遍なく行き渡らせるように作用するが、機械加工で削
った切削凹溝26は、その端面にバリ27が発生しがち
で、このバリ27は研磨中に脱落してゴミとなり被加工
物の表面に付着したり、研磨加工チャンバー内に付着し
たり、また研磨工程の前後に行うパッドの目立て工程に
用いられるブラシ上に付着して、研磨、洗浄効果を著し
く低下させる欠点があった。またこのゴミの発生量は使
用回数の増加に伴い増加していくが、ゴミの発生が著し
くなったときには、それが利用限界となる。また(c)
に示す如きパッドの表面に何ら凹溝を設けないものも存
在するが、研磨加工中に研磨剤がパッドと被加工物の間
に満遍なく行き渡らないので、均一な研磨加工が行えな
いという欠点がある。
2. Description of the Related Art Conventional CDs (compact discs) and LDs
As a polishing pad for a polishing apparatus for polishing the surface of a glass master used for manufacturing (laser disk), for example, there is a polishing pad having a structure as shown in FIGS. 6 (a), (b) and (c). . That is, in (a) and (b), a large number of relatively shallow cutting grooves 26 are provided by mechanical grinding on the surface of a porous resin such as urethane foam. The cutting groove 26 guides the liquid abrasive used together during polishing between the pad and the object to be processed and spreads it evenly over the surface of the object to be processed, but it is machined. The cutting grooves 26 tend to have burrs 27 on their end faces, and these burrs 27 fall off during polishing and become dust, which adheres to the surface of the workpiece or adheres to the inside of the polishing chamber. It has a drawback that it adheres to the brush used in the dressing process of the pad before and after the polishing process and significantly reduces the polishing and cleaning effects. The amount of dust generated increases as the number of times of use increases, but when the amount of dust becomes remarkable, it becomes the utilization limit. Also (c)
There are some pads that do not have any concave grooves on the surface, as shown in, but the disadvantage is that the polishing agent cannot be evenly distributed between the pad and the workpiece during polishing, so uniform polishing cannot be performed. .

【0003】[0003]

【発明が解決しようとする課題】そこで本発明の課題
は、パッド表面からのゴミの発生を極力少なくし、耐久
性の大きい研磨用パッドを提供する事である。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a polishing pad having a large durability by minimizing the generation of dust from the pad surface.

【0004】[0004]

【課題を解決するための手段】かかる課題を解決するた
めに本発明においては、研磨用パッドの表面に加熱プレ
ス等の手段によるエンボス加工による凹溝を形成する。
In order to solve such a problem, in the present invention, a groove is formed on the surface of a polishing pad by embossing by means such as a heating press.

【0005】[0005]

【作用】研磨用パッドに加熱プレス等によるエンボス加
工による凹溝を形成したので、凹溝端面からのバリの発
生が極めて少ない研磨用パッドが実現できた。
Since the concave groove is formed on the polishing pad by embossing with a hot press or the like, a polishing pad with extremely few burrs from the end surface of the concave groove can be realized.

【0006】[0006]

【実施例】以下、図1ないし図5を参照して本発明の研
磨用パッドについて、その構造と作用をまたこれをCD
等のディスクの製造に用いられるガラス原盤の研磨に適
用した例について説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure and function of the polishing pad of the present invention will be described below with reference to FIGS.
An example applied to the polishing of a glass master used for manufacturing disks such as the above will be described.

【0007】まず図1は本発明の研磨用パッドが用いら
れるCD等のディスクの原盤の表面を研磨する研磨装置
全体を示す側面図である。基台1の上部には、ターンテ
ーブル2が上部に固定された回転軸3が設けられてい
る。ターンテーブル2の表面には真空吸着用の開口と内
部にそれに連なった細孔が備えられている。また基台1
の下部には回転軸3を駆動するために、回転軸3にギヤ
ー等を介して電動機M1が連結された回転駆動機構が備
えられている。またアーム4は回動軸5に取り付けら
れ、ターンテーブル2上を回動自在となされており、ま
たその先端部にはパッドユニット取付軸6を備え、そこ
に後述するパッドユニット7が取り付けられている。さ
らにアーム4の先端部にはパッドユニット7の側面に先
端が伸びた研磨剤供給ノズル8と洗浄用の注水ノズル9
が取り付けられている。パッドユニット取付軸6はアー
ム4内に設けたタイミングベルト等を介して回動軸6の
上部に設けた電動機M2 により回転駆動がなされてい
る。また基台1の下部には回動軸5をギヤーを介して電
動機M3 により駆動するようになしており、また回動軸
5の下端にはそれを上下動させる為のエアーシリンダー
等の、上下動駆動機構B1が設けられている。
First, FIG. 1 is a side view showing an entire polishing apparatus for polishing the surface of a master of a disk such as a CD in which the polishing pad of the present invention is used. A rotary shaft 3 having a turntable 2 fixed thereto is provided on the upper portion of the base 1. The surface of the turntable 2 is provided with an opening for vacuum adsorption and a pore connected to it inside. Also the base 1
In order to drive the rotary shaft 3, a rotary drive mechanism in which the electric motor M1 is connected to the rotary shaft 3 via a gear or the like is provided in the lower part of the. The arm 4 is attached to a rotary shaft 5 so as to be freely rotatable on the turntable 2. Further, a pad unit mounting shaft 6 is provided at the tip of the arm 4, and a pad unit 7 to be described later is mounted thereto. There is. Further, at the tip of the arm 4, a polishing agent supply nozzle 8 having a tip extended to the side surface of the pad unit 7 and a water injection nozzle 9 for cleaning.
Is attached. The pad unit mounting shaft 6 is rotationally driven by an electric motor M2 provided above the rotary shaft 6 via a timing belt or the like provided in the arm 4. Further, a rotating shaft 5 is driven by an electric motor M3 via a gear at the lower part of the base 1, and a lower end of the rotating shaft 5 such as an air cylinder for moving it up and down. A dynamic drive mechanism B1 is provided.

【0008】また基台1上のアーム4が届く範囲の適当
な位置に固定洗浄ブラシ10と洗浄用の水を供給する注
水ノズル11を備えたパッド洗浄ユニット12が配置さ
れている。被加工物であるガラス原盤13を研磨する際
は、ターンテーブル2上にガラス原盤13を載置し、真
空吸着機構によって固定する。そしてターンテーブル2
を回転させると共に、研磨剤供給ノズル8から酸化セリ
ュウム等のスラリーを研磨材として混合した混合液から
成る研磨剤を吐出しつつ、パッドユニット7をガラス原
盤13に適当な圧力をもって押し付けつつ回転させ、か
つパッドがガラス原盤を横切る方向に適当な速度で回動
させる。研磨工程が終了すると、パッドユニット7は上
方に逃がされ、注水ノズル9から純粋が吐出されてガラ
ス原盤上の研磨剤は洗い流される。このようにして数十
枚の研磨加工が終了すると、研磨用パッドは磨耗し毛羽
立つので、パッド洗浄ユニット12のブラシ10にアー
ム4を回動させてパッドユニット7を当接させ、回転さ
せつつ、注水ノズル11から注水して洗浄を行う。
Further, a pad cleaning unit 12 having a fixed cleaning brush 10 and a water injection nozzle 11 for supplying water for cleaning is arranged at an appropriate position within a reach of the arm 4 on the base 1. When polishing the glass master disk 13 as a workpiece, the glass master disk 13 is placed on the turntable 2 and fixed by a vacuum suction mechanism. And turntable 2
While rotating the pad unit 7 while pressing the glass master 13 with an appropriate pressure while discharging the abrasive composed of a mixed liquid in which a slurry such as cerium oxide is mixed as an abrasive from the abrasive supply nozzle 8. And the pad is rotated at a suitable speed in the direction across the glass master. When the polishing process is completed, the pad unit 7 is released upward, pure water is discharged from the water injection nozzle 9, and the polishing agent on the glass master is washed away. When the polishing of several tens of sheets is completed in this way, the polishing pad is worn out and fluffed. Therefore, the arm 10 is rotated to bring the pad unit 7 into contact with the brush 10 of the pad cleaning unit 12, and while rotating, Water is injected from the water injection nozzle 11 for cleaning.

【0009】図2(a)は本発明の研磨用パッドの側断
面図、(b)は同平面図であるが、本発明の研磨用パッ
ド14は被加工物と直接接する研磨層15とその上にベ
ース層16、さらにその上に接着剤層17を積層して構
成されている。研磨層15の構成材料としては、ポリウ
レタン樹脂系の連続気泡型の発泡樹脂が適当である。典
型的なこの種材料としてウレタンフォームがよく知られ
ているが、吸水性がよく弾力性もあるので、液状の研磨
剤を併用して研磨を行う研磨用パッドの研磨層に最適で
ある。ベース層16の構成材料としては適度な弾性のあ
る不織布が良い。接着剤層17は両面接着テープを用い
ると取り付けが容易で適当である。
2 (a) is a side sectional view of the polishing pad of the present invention, and FIG. 2 (b) is a plan view of the same. The polishing pad 14 of the present invention has a polishing layer 15 in direct contact with a workpiece and its polishing layer 15. The base layer 16 is formed thereon, and the adhesive layer 17 is further laminated thereon. As a constituent material of the polishing layer 15, a polyurethane resin-based open-cell type foamed resin is suitable. Although urethane foam is well known as a typical material of this kind, it is most suitable for the polishing layer of a polishing pad for polishing by using a liquid abrasive in combination because it has good water absorption and elasticity. As a constituent material of the base layer 16, a non-woven fabric having appropriate elasticity is preferable. The adhesive layer 17 is suitable because it can be easily attached by using a double-sided adhesive tape.

【0010】研磨層15の表面に設ける凹溝18は例え
ば図4に示す金型19を用いて製造することができる。
金型19は上型20、下型21からなり、上型20には
凹溝を形成する為の凸条22aが所望の模様となるよう
設けられている。また下型21には上型20の凸条22
aと合致する凹条22bが設けられ、また下型21を案
内する為のガイド孔23a、23bがその外周近傍に設
けられている。凸条22はその頂部の幅W1 を0.10
〜0.25mm、高さH1 を2.0〜2.5mm程度と
した。また下型21の外周近傍には上型20のガイド孔
23a、23bに嵌合するガイドピン24a、24bを
備える。そしてこの金型を圧縮プレス(図示省略)に取
り付け、上下の金型の間にパッドの研磨層面を凸条23
側に向けて置き、金型を温度95〜110℃位に加熱
し、加圧する。加圧の条件は面圧力で290〜300k
g/cm2 、保持時間を2〜5秒とした。このような条
件でプレス加工した凹溝18は従来の切削による場合に
比し、溝の端面は組織が圧縮されているだけなので、バ
リの発生はなく物理的に安定であり、ゴミの発生を著し
く少なくできる。また研磨加工中において、液状の研磨
剤に浸されても形状を安定して維持できる。
The concave groove 18 provided on the surface of the polishing layer 15 can be manufactured by using, for example, a mold 19 shown in FIG.
The mold 19 is composed of an upper mold 20 and a lower mold 21. The upper mold 20 is provided with a ridge 22a for forming a concave groove in a desired pattern. In addition, the lower die 21 has a ridge 22 of the upper die 20.
A concave line 22b that matches a is provided, and guide holes 23a and 23b for guiding the lower mold 21 are provided near the outer periphery thereof. The ridge 22 has a top width W1 of 0.10.
.About.0.25 mm and height H1 of about 2.0 to 2.5 mm. Further, guide pins 24a and 24b fitted in the guide holes 23a and 23b of the upper mold 20 are provided near the outer periphery of the lower mold 21. Then, this mold is attached to a compression press (not shown), and the polishing layer surface of the pad is projected between the upper and lower molds by a ridge 23.
The mold is heated to a temperature of about 95 to 110 ° C. and pressed. The pressurization condition is a surface pressure of 290 to 300k.
The holding time was g / cm 2 and the holding time was 2 to 5 seconds. Compared with the case of conventional cutting, the concave groove 18 pressed under such conditions has only the texture of the end surface of the groove, so that it has no burr and is physically stable, so that dust is not generated. It can be significantly reduced. Further, during polishing, the shape can be stably maintained even when immersed in a liquid polishing agent.

【0011】このようにして完成したパッド14を円盤
状のパッドヘッド25に取り付け、パッドユニット7と
し、これを研磨装置のパッドユニット取付軸6にとりつ
けた状態を図2に示す。
FIG. 2 shows a state in which the pad 14 thus completed is attached to a disk-shaped pad head 25 to form a pad unit 7, which is attached to the pad unit attachment shaft 6 of the polishing apparatus.

【0012】パッドの研磨層15の表面に形成する凹溝
の間隔は5mm〜10mm程度とし、また凹溝が形成す
る模様は、第2図(b)の格子縞、第5図(a)、
(b)の格子縞に斜線を追加した模様、(c)蜂の巣、
(d)小円、(e)同心円等規則性のあるものが望まし
い。
The interval between the grooves formed on the surface of the polishing layer 15 of the pad is about 5 mm to 10 mm, and the patterns formed by the grooves are the lattice stripes in FIG. 2 (b), FIG. 5 (a),
(B) a pattern with diagonal lines added to the checkered pattern, (c) a honeycomb,
It is desirable to have regularity such as (d) small circles and (e) concentric circles.

【0013】本発明の実施例では研磨用パッドの形状を
円盤状のものについて、説明したが円盤状に限らず他の
形状の研磨用パッドにも適用できることは当然である。
In the embodiments of the present invention, the shape of the polishing pad has been described as a disc shape, but it is needless to say that the present invention is not limited to the disc shape and can be applied to polishing pads having other shapes.

【0014】[0014]

【発明の効果】以上の説明から明らかなように、本発明
によれば研磨用パッドの研磨層の表面に加熱プレス等に
よりエンボス加工した凹溝を規則性のある模様で形成し
たので、ゴミの発生が少なく、研磨加工時に併用される
研磨剤の導入の良い、また従来より耐久性の良い研磨用
パッドが得られ、このパッドを用いて研磨加工した場合
被加工物の研磨面のゴミ、ゴミによるキズを減少させる
ことができ、その結果ドロップアウトの少ないCD、L
D等の記録ディスクが提供できる。
As is apparent from the above description, according to the present invention, the embossed concave grooves are formed on the surface of the polishing layer of the polishing pad by a hot press or the like in a regular pattern. It is possible to obtain a polishing pad that is less likely to occur and has a better introduction of abrasives used during polishing, and is more durable than before. When polishing is performed using this pad, dust on the polishing surface of the work piece It is possible to reduce the scratches caused by, and as a result, CD, L with less dropout
A recording disk such as D can be provided.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の研磨用パッドを用いる研磨装置の側面
図。
FIG. 1 is a side view of a polishing apparatus using a polishing pad of the present invention.

【図2】(a)は本発明の研磨用パッドの側断面図、
(b)は同平面図。
FIG. 2A is a side sectional view of the polishing pad of the present invention,
(B) is the same top view.

【図3】本発明の研磨用パッドを研磨装置に取り付ける
際の状態を示す側面図。
FIG. 3 is a side view showing a state in which the polishing pad of the present invention is attached to a polishing apparatus.

【図4】本発明の研磨用パッドを製造するための、プレ
スの金型側面図。
FIG. 4 is a die side view of a press for manufacturing the polishing pad of the present invention.

【図5】(a)〜(e)は本発明の研磨用パッドの研磨
層表面に設ける凹溝の模様の例。
5 (a) to 5 (e) are examples of patterns of grooves provided on the surface of the polishing layer of the polishing pad of the present invention.

【図6】(a)は従来の研磨用パッドの側断面図、
(b)は同平面図。
FIG. 6A is a side sectional view of a conventional polishing pad,
(B) is the same top view.

【符号の説明】[Explanation of symbols]

1 基台 2 ターンテーブル 3 回転軸 4 アーム 5 回動軸 6 パッドユニット取付軸 7 パッドユニット 8 研磨材供給ノズル 9 注水ノズル 10 ブラシ 11 注水ノズル 12 パッド洗浄ユニット 13 ガラス原盤 14 パッド 15 研磨層 16 ベース層 17 接着剤層 18 凹溝 19 金型 20 上型 21 下型 22a 凸条 22b 凹条 23a、23b ガイド孔 24a、24b ガイドピン 25 パッドヘッド 26 切削凹溝 27 バリ 1 Base 2 Turntable 3 Rotating Shaft 4 Arm 5 Rotating Shaft 6 Pad Unit Mounting Shaft 7 Pad Unit 8 Abrasive Material Supply Nozzle 9 Water Injection Nozzle 10 Brush 11 Water Injection Nozzle 12 Pad Cleaning Unit 13 Glass Master 14 Pad 15 Polishing Layer 16 Base Layer 17 Adhesive layer 18 Recessed groove 19 Mold 20 Upper die 21 Lower die 22a Convex strip 22b Recessed strip 23a, 23b Guide hole 24a, 24b Guide pin 25 Pad head 26 Cutting recessed groove 27 Burr

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成7年4月17日[Submission date] April 17, 1995

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】図面の簡単な説明[Name of item to be corrected] Brief description of the drawing

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【図1】本発明の研磨用パッドを用いる研磨装置の側面
図。
FIG. 1 is a side view of a polishing apparatus using a polishing pad of the present invention.

【図2】(a)は本発明の研磨用パッドの側断面図、
(b)は同平面図。
FIG. 2A is a side sectional view of the polishing pad of the present invention,
(B) is the same top view.

【図3】本発明の研磨用パッドを研磨装置に取り付ける
際の状態を示す側面図。
FIG. 3 is a side view showing a state in which the polishing pad of the present invention is attached to a polishing apparatus.

【図4】本発明の研磨用パッドを製造するための、プレ
スの金型側面図。
FIG. 4 is a die side view of a press for manufacturing the polishing pad of the present invention.

【図5】(a)〜(e)は本発明の研磨用パッドの研磨
層表面に設ける凹溝の模様の例。
5 (a) to 5 (e) are examples of patterns of grooves provided on the surface of the polishing layer of the polishing pad of the present invention.

【図6】(a)は従来の研磨用パッドの側断面図、
(b)は同平面図、(c)は従来の他の研磨用パッドの
平面図。
FIG. 6A is a side sectional view of a conventional polishing pad,
(B) is the same plan view, (c) is a plan view of another conventional polishing pad.

【符号の説明】 1 基台 2 ターンテーブル 3 回転軸 4 アーム 5 回動軸 6 パッドユニット取付軸 7 パッドユニット 8 研磨材供給ノズル 9 注水ノズル 10 ブラシ 11 注水ノズル 12 パッド洗浄ユニット 13 ガラス原盤 14 パッド 15 研磨層 16 ベース層 17 接着剤層 18 凹溝 19 金型 20 上型 21 下型 22a 凸条 22b 凹条 23a、23b ガイド孔 24a、24b ガイドピン 25 パッドヘッド 26 切削凹溝 27 バリ[Explanation of symbols] 1 base 2 turntable 3 rotating shaft 4 arm 5 rotating shaft 6 pad unit mounting shaft 7 pad unit 8 abrasive material supply nozzle 9 water injection nozzle 10 brush 11 water injection nozzle 12 pad cleaning unit 13 glass master disk 14 pad 15 polishing layer 16 base layer 17 adhesive layer 18 concave groove 19 mold 20 upper mold 21 lower mold 22a convex stripe 22b concave stripe 23a, 23b guide hole 24a, 24b guide pin 25 pad head 26 cutting concave groove 27 burr

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 被加工物と接する研磨層の表面に、エン
ボス加工による凹溝を多数設けて成る、研磨用パッド。
1. A polishing pad having a large number of recessed grooves formed by embossing on the surface of a polishing layer that is in contact with a workpiece.
【請求項2】 前記凹溝により前記研磨層表面に規則性
のある模様を形成して成る、請求項1項記載の研磨用パ
ッド。
2. The polishing pad according to claim 1, wherein the concave groove forms a regular pattern on the surface of the polishing layer.
【請求項3】 前記模様が格子縞または蜂の巣模様また
は小円の繰り返しまたは同心円であることを特徴とす
る、請求項1記載の研磨用パッド。
3. The polishing pad according to claim 1, wherein the pattern is a checkered pattern, a honeycomb pattern, or repeating small circles or concentric circles.
【請求項4】 前記研磨層が連続気泡型発泡樹脂より成
る、請求項1記載の研磨用パッド。
4. The polishing pad according to claim 1, wherein the polishing layer comprises an open-cell foam resin.
【請求項5】 前記研磨層の裏側に弾力性のある合成樹
脂から成るベース層と、該ベース層の裏側に接着剤層を
設けて成る、請求項1記載の研磨用パッド。
5. The polishing pad according to claim 1, wherein a base layer made of a synthetic resin having elasticity is provided on the back side of the polishing layer, and an adhesive layer is provided on the back side of the base layer.
JP784695A 1995-01-23 1995-01-23 Pad for grinding Pending JPH08197434A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP784695A JPH08197434A (en) 1995-01-23 1995-01-23 Pad for grinding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP784695A JPH08197434A (en) 1995-01-23 1995-01-23 Pad for grinding

Publications (1)

Publication Number Publication Date
JPH08197434A true JPH08197434A (en) 1996-08-06

Family

ID=11676991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP784695A Pending JPH08197434A (en) 1995-01-23 1995-01-23 Pad for grinding

Country Status (1)

Country Link
JP (1) JPH08197434A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1170463A (en) * 1997-05-15 1999-03-16 Applied Materials Inc Polishing pad with grooved pattern for use in chemical and mechanical polishing device
JP2001232554A (en) * 2000-02-22 2001-08-28 Toyobo Co Ltd Polishing pad and method for manufacturing thereof
JP2007081322A (en) * 2005-09-16 2007-03-29 Jsr Corp Method for manufacturing chemical-mechanical polishing pad
KR100723820B1 (en) * 2005-12-05 2007-05-31 엠.씨.케이 (주) Process for molding abrasion Tape having concavo-convex surface
JP2008302454A (en) * 2007-06-06 2008-12-18 Sharp Corp Polishing pad and its manufacturing method
JP2009512566A (en) * 2005-10-20 2009-03-26 スリーエム イノベイティブ プロパティズ カンパニー Abrasive article and method of correcting surface of workpiece
JP2012216276A (en) * 2011-03-31 2012-11-08 Hoya Corp Method for manufacturing glass substrate for magnetic disk
JP2013193181A (en) * 2012-03-21 2013-09-30 Fujibo Holdings Inc Sheet for polishing pad, method for manufacturing the same, polishing pad, method for manufacturing the same, and polishing method
TWI461255B (en) * 2010-04-16 2014-11-21 Applied Materials Inc Method for making molding windows in thin pads

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1170463A (en) * 1997-05-15 1999-03-16 Applied Materials Inc Polishing pad with grooved pattern for use in chemical and mechanical polishing device
JP2001232554A (en) * 2000-02-22 2001-08-28 Toyobo Co Ltd Polishing pad and method for manufacturing thereof
JP4591980B2 (en) * 2000-02-22 2010-12-01 東洋ゴム工業株式会社 Polishing pad and manufacturing method thereof
JP2007081322A (en) * 2005-09-16 2007-03-29 Jsr Corp Method for manufacturing chemical-mechanical polishing pad
KR101248641B1 (en) * 2005-09-16 2013-03-28 제이에스알 가부시끼가이샤 Method of manufacturing chemical mechanical polishing pad
JP2009512566A (en) * 2005-10-20 2009-03-26 スリーエム イノベイティブ プロパティズ カンパニー Abrasive article and method of correcting surface of workpiece
KR100723820B1 (en) * 2005-12-05 2007-05-31 엠.씨.케이 (주) Process for molding abrasion Tape having concavo-convex surface
JP2008302454A (en) * 2007-06-06 2008-12-18 Sharp Corp Polishing pad and its manufacturing method
JP4499136B2 (en) * 2007-06-06 2010-07-07 シャープ株式会社 Polishing pad manufacturing method
TWI461255B (en) * 2010-04-16 2014-11-21 Applied Materials Inc Method for making molding windows in thin pads
JP2012216276A (en) * 2011-03-31 2012-11-08 Hoya Corp Method for manufacturing glass substrate for magnetic disk
JP2013193181A (en) * 2012-03-21 2013-09-30 Fujibo Holdings Inc Sheet for polishing pad, method for manufacturing the same, polishing pad, method for manufacturing the same, and polishing method

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