JPH08195572A - Electronic equipment - Google Patents

Abstract

PURPOSE: To obtain an electronic equipment which is excellent in effect of heat dissipation from an electronic circuit module by increasing a contact area between a heat sink and a guide plate. CONSTITUTION: A contact surface between a retainer of an electronic circuit module 1 and a guide groove 19 of a guide plate 18 provided to a chassis is formed to have wave-like undulations and the wave-like undulations of the retainer 5 and the guide groove 19 engage with each other when the electronic circuit module 1 is attached to a chassis. Thereby, a contact area between the heat sink 3 and the guide plate 18 can be increased and heat dissipation effect of the electronic circuit module 1 can be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device for indirectly cooling an electronic circuit component mounted on a printed circuit board housed in a chassis.

[0002]

2. Description of the Related Art The most common method for cooling electronic circuit components is a direct cooling system in which cooling air is blown directly onto electronic circuit components. However, in recent years, the heat generation density has significantly increased due to the improvement in the integration degree of electronic circuit parts and the improvement in the mounting density, and the direct cooling method has become unable to cope with it. On the other hand, as the functions in the field of electronic devices have become more decentralized, there is a growing desire to install the electronic devices themselves in places with relatively poor environmental conditions. That is, electronic devices are
It is not always installed in a room where humidity and dust are controlled. In such a case, the direct cooling method in which the cooling air is blown directly to the electronic circuit component is not preferable in terms of reliability of the electronic device. Because dust, dust, water, etc. floating in the cooling air adhere to the electronic circuit parts,
This is because the adhered portion may be corroded or dielectric breakdown may occur.

As described above, when the reliability required for electronic equipment is high, the heat generation density of electronic circuit parts is high, and the environmental conditions of the place where the electronic equipment is installed are severe, the above-mentioned dust and dust are generated. In order to prevent deterioration of reliability due to moisture, etc., and to cope with an increase in heat generation density, an indirect cooling type electronic circuit module that does not directly blow cooling air to electronic circuit components and has an excellent heat dissipation effect is mounted. Many electronic devices are used.

First, a conventional electronic device of this type will be described. FIG. 14 is an external view showing a conventional electronic device, and FIG.
14 is a view showing a cross section AA in FIG. 14, FIG. 16 is a detailed view around the guide groove in FIG. 15, and FIG. 17 is a view seen from B in FIG. 16, in which the screw portion is tightened and the retainer and the guide plate are in close contact with each other. Shows the state. 18 is shown in FIG.
6 is a view seen from B in FIG. 6, showing a state in which the screw portion is loosened and the retainer and the guide plate are separated from each other. FIG. 19 is a detailed view of the retainer in FIG. 1 in the figure
Is an electronic circuit module, and is intended to hold the plate wiring board 2, the electronic circuit component 4 attached to the plate wiring board 2 via the heat sink 3 and the electronic circuit module 1 with respect to the chassis 6. It is composed of a retainer 5.

Here, the heat dissipation plate 3 is made of a metal (for example, aluminum alloy) having good heat conductivity, and is punched out in a rectangular shape at a plurality of positions, and one surface of the heat dissipation plate 3 is in close contact with the plate wiring board 2. The other surface is arranged so as to be in contact with the electronic circuit component 4. The retainer 5 is a trapezoidal pillar-shaped retainer main body 7 whose both ends are sloped, and a square pillar whose sliding surface with the slope of the retainer main body 7 has the same slope as the slope of the retainer main body 7, and which penetrates in the longitudinal direction. A retainer upper portion 8 having a hole, a retainer lower portion 9 having a through-screw in the longitudinal direction, and a retainer lower portion 9 which is a rectangular column whose sliding surface with respect to the slope of the retainer main body 7 has the same slope as the slope of the retainer main body 7. And a retainer upper portion 8 and a retainer lower portion 9 are connected to each other, and a threaded portion 10 having a screw that meshes with a through screw of the retainer lower portion 9.

By tightening the screw portion 10 of the retainer 5, the shortest distance between the retainer upper portion 8 and the retainer lower portion 9 is shortened, and the retainer upper portion 8 and the retainer lower portion 9 are slid along the slope of the retainer body 7 and the retainer upper portion 8 The lower retainer 9 is in contact with the guide groove 19 of the guide plate 18. On the first surface of the upper surface of the chassis 6, an opening portion 11 for inserting / accommodating or taking out the electronic circuit module 1 is provided. 12 is the opening 1
The cover 1 covers the chassis 1 and is fixed to the chassis 6 by screws or the like at the peripheral portion. The rectangular ventilation duct 14 having the cooling fins 13 is provided inside the chassis 6 as described above.
From the outside of the housing through the external duct 15 provided on the second surface, which is provided on the third and fourth surfaces facing each other among the second to fifth surfaces that are perpendicular to the surface. The supplied cooling air 16 is designed to flow. Cooling air 16
Is finally discharged to the outside of the electronic device from the exhaust port 17 provided on the fifth surface opposite to the second surface. further,
A guide plate 18 formed so as to form a right angle with the opening 11 is in close contact with the outer surface of the ventilation duct 14, and the electronic circuit module is attached by the mechanism of the retainer 5 attached to the end of the electronic circuit module 1. Holds 1 The chassis 6 is box-shaped and has first to fifth surfaces and a sixth surface facing the first surface.

Here, the heat generated from the electronic circuit component 4 is conducted to the end portion of the electronic circuit module 1 via the heat dissipation plate 3, and then is passed from the cooling fin 13 to the cooling air 16 via the guide plate 18. The heat is radiated to. Therefore,
The electronic circuit component 4 is devised so that the cooling air 16 is not blown directly onto it.

[0008]

However, the above-mentioned conventional electronic equipment has the following problems. That is, in the conventional heat radiation method, high integration of electronic components in recent years,
It is not possible to cope with a large increase in heat generation density due to high-density mounting, and the amount of heat radiation cannot be further increased. In the conventional heat radiation method, the heat generated from the electronic circuit component 4 is conducted to the end portion of the electronic circuit module 1 via the heat radiation plate 3, and then, from the cooling fin 13 to the cooling air 16 via the guide plate 18. It is said that heat is dissipated, and the heat dissipation method has not changed from the past. However, in recent years, electronic components have become highly integrated and densely mounted, and the amount of heat generated has been significantly increasing. Therefore, the MTBF (Me
Due to problems such as a decrease in an Time Between Failure) and sometimes seizure of electronic parts, it has become necessary to radiate heat more efficiently in order to maintain product reliability. However, the conventional heat radiation method cannot further increase the heat radiation amount.
The reason will be described below.

For example, when heat is transmitted through two closely contacting solids made of different materials, the amount of heat conduction can be calculated by the equation 1.

[0010]

[Equation 1]

From the above "Formula 1", it is understood that the contact area between two solids should be increased in order to increase the amount of heat conduction. By the way, in the conventional heat dissipation structure, the heat generated from the electronic circuit component 4 is transmitted through the heat dissipation plate 3 to the electronic circuit module 1
The heat is dissipated from the cooling fins 13 to the cooling air 16 via the guide plate 18 after being conducted to the end portions of. When attention is paid to heat conduction from the heat dissipation plate 3 to the guide plate 18 in this heat transfer path, the contact between the heat dissipation plate 3 and the guide plate 18 is caused by the mounting surface of the electronic circuit component 4 on the heat dissipation plate 3 as shown in FIG. The compressive force that causes the heat sink 3 and the guide plate 18 to be in close contact with each other due to the mechanism of the retainer 5 is limited to only a part of the back surface.
The retainer upper part 8 and the retainer lower part 9 which are components of the retainer 5 act only around the contact surface between the guide plate 18 and the heat dissipation plate 3, and the retainer upper part 8 and the retainer lower part among the contact surfaces. Except for the back surface of the mounting surface of the electronic circuit component 4 in the vicinity of the contact surface between the guide plate 18 and the guide plate 18, the heat dissipation plate 3 and the guide plate 18 are hardly in contact with each other, and are considered not to be involved in heat conduction. . This means that when a heatsink used for a long time is examined, seizure is confirmed only around the contact surface between the retainer upper part 8 and the retainer lower part 9 and the guide plate 18 on the rear surface of the mounting surface of the electronic circuit component 4 of the heatsink 3. It can be easily imagined from the phenomenon. In order to increase the amount of heat conduction, it suffices to increase this contact area. However, the printed wiring board 2 is adhered to the back surface of the mounting surface of the heat dissipation plate 3 for mounting the electronic circuit component 4. The contact area cannot be increased.

Further, the electronic circuit module 1 is mounted on the chassis 6
Guide plate 1 inside chassis 6 when detaching from
The electronic circuit module 1 in the guide groove 19 provided in
Since it is necessary to slide the end of the guide groove 19 and a mechanical gap must be provided between the guide groove 19 and the end of the electronic circuit module 1, the guide groove 19 and the end of the electronic circuit module 1 are brought into contact with each other. It is not possible. For the above reasons, it can be said that the conventional heat dissipation structure cannot increase the amount of heat dissipation.

FIG. 13 shows an electronic device mounted on an aircraft in a direction (X-axis direction) perpendicular to the mounting surface of the electronic circuit component 4 whose strength is weak with respect to the electronic circuit module 1 having the heat sink 3 mounted on the conventional electronic device. It is the test data excited under the vibration condition.
From this result, the resonance frequency of the electronic circuit module 1 is 32.
At 0 Hz, the resonance magnification at that time is 21.8 times. In other words, 21.8 times as much vibration as the input vibration condition is applied to the electronic circuit module 1, so that the wiring in the electronic circuit component 4 or the lead wire from the connector is broken, which causes a short circuit accident. was there. Further, since it is necessary to select the electronic circuit component 4 that can withstand the vibration, the marketability becomes narrow and the price of the electronic circuit module 1 becomes very expensive, which is an economical problem.

Further, in the electronic circuit module 1, the heat dissipation plate 3 is brought into close contact with the guide plate 18 by the compressive force of the retainers 5 provided at both ends of the heat dissipation plate 3, but the heat dissipation plate 3, the guide plate 18 and the retainer 5 are connected to each other. Since the contact surface of the guide plate 18 is a flat surface, the compression force of the retainer 5 gradually decreases due to the above vibration, and the heat dissipation plate 3 cannot be brought into close contact with the guide plate 18. Therefore, the amount of heat conduction from the heat dissipation plate 3 to the guide plate 18 decreases,
MT due to rise in junction temperature of electronic circuit component 4
There is a problem in that the reliability of the electronic device cannot be maintained due to a problem such as a decrease in BF and sometimes seizure of the electronic circuit component 4.

The present invention has been made to solve the above problems, and an electronic device excellent in heat dissipation from the electronic circuit module 1 can be obtained by increasing the contact area between the heat dissipation plate 3 and the guide plate 18. With the goal.

[0016]

In a first embodiment of an electronic apparatus according to the present invention, the retainer and the guide plate are molded into the following mechanism or shape, that is, the retainer has both ends. Is processed into a slope,
A retainer body of a trapezoidal column having a through hole in the longitudinal direction,
The surface of the retainer body that slides on the slope is the same as the slope of the retainer body, and the upper part of the square-shaped retainer that has through holes and trapezoidal protrusions in the longitudinal direction and the surface that slides on the slope of the retainer body are the retainers. It has the same slope as the slope of the main body, and has a rectangular prismatic retainer lower part with a through screw and a trapezoidal protrusion in the longitudinal direction, and a screw that connects the retainer upper part to the retainer body and lower part of the retainer and meshes with the through screw of the retainer lower part. The screw part is formed with a dovetail groove that engages with trapezoidal protrusions on the upper part of the retainer and the lower part of the retainer, and the contact surface of the guide plate with the guide groove is formed by a plate having corrugated undulations. By tightening, the shortest distance between the upper retainer and the lower retainer is shortened, and
The plate slides in the front-rear direction in conjunction with the slide of the retainer upper part and the retainer lower part along the slope of the retainer body, and the corrugated undulation of the plate engages with the guide groove provided in the guide plate. ing.
The guide groove of the guide plate is formed so that the contact surface with the retainer has the same undulations as the plate.

In a second embodiment of the electronic apparatus according to the present invention, the retainer and the guide plate are molded into the mechanism or shape shown below, that is, the retainer has both ends machined into slanted surfaces, A trapezoidal-shaped retainer body with a through-hole in its inside, and a retainer body that is a quadrangular prism whose surface that slides on the slope of the retainer body has the same slope as the slope of the retainer body, and that has a through-hole and a trapezoidal protrusion in the longitudinal direction. An upper part, a square pillar whose surface that slides on the slope of the retainer body has the same slope as the slope of the retainer body, and a retainer lower part that has a through screw and a trapezoidal protrusion in the longitudinal direction,
The retainer upper part, the retainer main body and the lower retainer are connected to each other, and a threaded portion having a screw that engages with the through screw of the lower retainer, and a dovetail groove that engages with the trapezoidal protrusions of the upper retainer and the lower retainer in the longitudinal direction are processed. It consists of a plate whose contact surface with the guide plate is processed into an inclined surface.By tightening the screw part, the shortest distance between the upper part of the retainer and the lower part of the retainer is shortened, and the upper part of the retainer and the lower part of the retainer slide along the inclined surface of the retainer body. In conjunction with this, the plate slides in the front-rear direction, and the inclined surface of the plate comes into contact with the guide groove provided in the guide plate. The guide groove of the guide plate is formed so that the contact surface with the retainer has the same slope as the plate.

In a third embodiment of the electronic device according to the present invention, the retainer of the electronic device provided with the means in the first embodiment has a corrugated undulation on the contact surface with the guide plate. A first plate having a U-shaped cross section; a second plate having a U-shaped cross section and having a size that fits in the first plate; and a first plate and a second plate The first stick with the right external thread and the second stick with the external left thread, and the first stick and the second stick, which are alternately connected to the inner side of the A first bevel gear, a third plate provided inside the second plate, and a second bevel gear that engages the third plate and meshes at a right angle with the first bevel gear, It is composed of a second bevel gear and a knob connected to it. Are those were, by turning the knob to the right and left, are those capable of adjusting the distance between the first and second plates.

In a fourth embodiment of the electronic device according to the present invention, the heat radiation forming the electronic circuit module of the electronic device, which is obtained by implementing the means in any one of the first to third embodiments. The plate is formed of a damping alloy material.

[0020]

In the first embodiment of the electronic device according to the present invention, the contact pressure between the heat dissipation plate and the guide plate can be easily increased by the shape or structure of the retainer, so that the heat dissipation plate and the guide plate are prevented from contacting each other. The contact area can be increased and the amount of heat radiation can be increased.

Further, in the second embodiment of the electronic apparatus according to the present invention, the contact pressure between the heat sink and the guide plate can be easily increased by the shape or structure of the retainer, so that the heat sink and the guide plate can be easily increased. The contact area of the plate can be increased and the amount of heat radiation can be increased.

In the third embodiment of the electronic device according to the present invention, the contact pressure between the heat dissipation plate and the guide plate can be easily increased by the shape or structure of the retainer, so that the heat dissipation plate and the guide plate are prevented from contacting each other. The contact area can be increased and the amount of heat radiation can be increased.

Further, in the fourth embodiment of the electronic apparatus according to the present invention, the structure of any one of the first to third embodiments is further improved. That is, by forming the heat dissipation plate of the electronic circuit module with a damping alloy material having a large internal friction such as aluminum-zinc alloy, the response magnification at the resonance frequency of the electronic circuit module is reduced and the electronic circuit module is mounted. It is possible to reduce the vibration stress applied to the existing electronic circuit component.

[0024]

【Example】

Example 1. 1 to 6 show a first electronic device according to the present invention.
FIG. 1 is an external view and FIG. 2 is FIG.
3 is a view showing a cross section DD in FIG. 3, FIG. 3 is a detailed view of a part around the guide groove in FIG. 2, and FIG. 4 is a view showing a cross section EE in FIG. 5 and 5 are cross-sections E in FIG.
It is a figure which shows E, and is a figure which shows the state which the screw part was loosened and the retainer and the guide plate separated, FIG. 6 is a detailed view of the retainer in FIG. 3, 1-4, 6, 7, 10-18 are conventional. It is the same as the electronic device of.

The retainer 5a has a trapezoidal pillar-shaped retainer main body 7 having both ends machined into sloped surfaces and having through holes in the longitudinal direction.
The retainer body 7 has a sloping surface that slides on the slope of the retainer body 7, and has a rectangular prismatic retainer upper portion 8a having through holes and trapezoidal protrusions in the longitudinal direction, and a slope of the retainer body 7. The retainer body 7 has the same slope as the slope of the retainer body 7, and the retainer body 9 is connected to the retainer body 7 with the retainer body 8 and the retainer body 9a. Threaded portion 10 having a screw that engages the through screw of the lower portion 9a
Slides on the retainer upper part 8a and the retainer lower part 9a,
The plate 2 in which the contact surface with the guide groove 19 has a corrugated undulation
0, and by tightening the screw portion 10, the shortest distance between the retainer upper portion 8a and the retainer lower portion 9a is shortened, and the retainer upper portion 8a and the retainer lower portion 9a slide along the slope of the retainer body 7. The plate 20 slides in the front-back direction,
The corrugated undulations of 0 represent the guide groove 19 of the guide plate 18.
It has a mechanism to engage with each other.

The guide groove 19 is formed so that the contact surface with the retainer 5a is corrugated.
By using the retainer 5a having the above mechanism,
Compared with the conventional retainer 5, the heat sink 3 and the guide plate 1
8 can be evenly and evenly contacted, and the contact area can be increased by obtaining a larger contact pressure. Here, the relationship between the contact pressure and the contact area will be described. For example, consider the case where two substances, both of which have well-polished contact surfaces, are in contact with each other under a certain contact pressure. Strictly speaking, it is considered that the two substances that are in surface contact are in point contact with a plurality of joint points because the contact surface is not perfectly smooth in a strict sense. When a contact pressure higher than that of the contact surface is applied, the high point of the contact surface is deformed and the actual contact area increases. By increasing the contact area between the heat dissipation plate 3 and the guide plate 18 in this manner, the amount of heat dissipation can be increased.

Example 2. FIG. 7 is a partial detailed view of the vicinity of the guide groove of the second embodiment, and FIG. 8 is a sectional view F in FIG.
FIG. 9 is a diagram showing F, showing a state in which the retainer and the guide plate are in close contact with each other by tightening the screw portion, and FIG. 9 is a diagram showing a cross section FF in FIG. 7, in which the retainer and the guide plate are loosened by loosening the screw portion. FIG. 10 is a detailed view of the retainer in FIG.
Reference numerals 10 and 18 are the same as those of the conventional electronic device. Retainer 5
b is a trapezoidal-shaped retainer main body 7 having both ends machined into slopes and having through-holes in the longitudinal direction, and a square prism whose surface that slides on the slope of the retainer main body 7 has the same slope as the slope of the retainer main body 7. And a retainer upper part 8a having a through hole and a trapezoidal protrusion in the longitudinal direction, and a square column whose sliding surface with the slope of the retainer body 7 has the same slope as the slope of the retainer body 7, and a through screw in the longitudinal direction. And a lower retainer 9a having a trapezoidal protrusion, a retainer body 7, and an upper retainer 8a.
And the retainer lower portion 9a are connected to each other, and the screw portion 10 having a screw that engages with the through screw of the retainer lower portion 9a and the retainer upper portion 8a and the retainer lower portion 9a slide in the longitudinal direction, and the contact surface with the guide groove 19 is processed into a sloped surface. Plate 20a
By tightening the screw portion 10, the shortest distance between the retainer upper portion 8a and the retainer lower portion 9a is shortened, and the retainer upper portion 8a and the retainer lower portion 9a slide along the slope of the retainer body 7, The plate 20a slides in the front-rear direction, and the slope of the plate 20a engages with the guide groove 19.

The guide groove 19 is formed such that the contact surface with the retainer 5b has the same slope as the slope of the plate 20a. By using the retainer 5b having the above-mentioned mechanism, the heat sink 3 can be compared with the conventional retainer 5.
The guide plate 18 and the guide plate 18 can be evenly and uniformly contacted with each other, and the contact area can be increased by obtaining a larger contact pressure.

Example 3. FIG. 11 is a partial detailed view around the guide groove of the third embodiment, FIG. 12 is a view showing a cross section GG in FIG. 11, and 2, 3, 6, and 18 are the same as the conventional electronic device. . The retainer 5c is the guide groove 1 described above.
9 has a corrugated undulation on the contact surface with the first plate 21 having a U-shaped cross section, and a first plate 21 having a U-shaped cross section with a size that can be accommodated in the first plate 21. Plate 2
2, the inside of the first plate 21 and the second plate 22, the first stick 23 with a right external thread and the second stick with a left external thread, which are alternately connected in opposite positions. A stick 24, a first bevel gear 25 engaged with the first stick 23 and the second stick 24, and alternately connected, and a third bevel gear 25 provided inside the second plate 22. A plate 26, a second bevel gear 27 engaged with the third plate 26 and meshing at a right angle with the first bevel gear 25, and a knob 28 connected to the second bevel gear 27. It

The guide groove 19 is formed such that the contact surface with the retainer 5c has a corrugated undulation. By using the retainer 5c having the above-described mechanism, the heat dissipation plate 3 and the guide plate 18 are different from those of the conventional retainer 5.
Can be evenly and evenly contacted, and the contact area can be increased by obtaining a larger contact pressure.

Example 4. This embodiment is the same as the first embodiment described above.
Fourth Modification of any of the Third Embodiments
In this embodiment, the heat dissipation plate 3 of the electronic circuit module 1 is formed of a damping alloy material such as aluminum-zinc alloy having a large internal friction. Therefore, the logarithmic decrement δ increases and the resonance magnification A can be reduced as shown in Equation 2, so that the input vibration to the electronic circuit module 1 is absorbed and the resonance magnification of the electronic circuit module 1 shown in FIG. 13 is suppressed low. Vibration stress applied to the electronic circuit component 4 is reduced, and the electronic circuit component 4 can be used even under severe vibration conditions of the electronic equipment mounted on the aircraft. Furthermore, in selecting the electronic circuit component 4, it becomes less necessary to consider the vibration.

[0032]

[Equation 2]

The above expression 2 shows the resonance magnification A at the resonance frequency of the electronic circuit module 1. Therefore, it is shown that the resonance magnification A at the resonance frequency can be reduced by increasing the internal friction Q ⁻¹ of the electronic circuit module 1. Therefore, according to the embodiment shown in this embodiment, the heat dissipation plate 3 of the electronic circuit module 1 has a large internal friction (a general aluminum alloy has an internal friction of 0.5 to 2 × 10 ⁻³ ), for example, aluminum. -Zinc alloy (5 x 10
^-3 ) etc., the vibration level transmitted from the electronic circuit module 1 to the electronic circuit component 4 is attenuated inside the electronic circuit module 1 by the molding with the damping alloy material, and the resonance at the resonance frequency of the electronic circuit module 1 occurs. The magnification A is reduced, and the vibration stress applied to the electronic circuit component 4 can be reduced.

[0034]

Since the electronic device according to the present invention is configured as described above, it has the following effects.

In the first embodiment, since the contact pressure between the heat sink and the guide plate can be easily increased by the shape or structure of the retainer, the contact area between the heat sink and the guide plate can be increased. Therefore, the amount of heat radiation can be increased. Therefore, it is possible to obtain an electronic device having an excellent heat dissipation effect of the electronic circuit component. Also, by engaging the contact surfaces of the retainer and the guide plate with corrugated undulations, it is possible to suppress the movement of the electronic circuit module due to vibration, so it is possible to prevent the compressive force of the retainer from decreasing and to make the heat sink adhere to the guide plate. Because you can
An electronic device with excellent reliability can be obtained.

In the second embodiment, since the contact pressure between the heat sink and the guide plate can be easily increased by the shape or structure of the retainer, the contact area between the heat sink and the guide plate can be increased. Therefore, the amount of heat radiation can be increased. Therefore, it is possible to obtain an electronic device having an excellent heat dissipation effect of the electronic circuit component. Also, by engaging the contact surface of the retainer with the guide plate on the slope, it is possible to suppress the movement of the electronic circuit module due to vibration, so it is possible to prevent the compressive force of the retainer from decreasing and to make the heat sink adhere to the guide plate. An electronic device with excellent reliability can be obtained.

In the third embodiment, since the contact pressure between the heat sink and the guide plate can be easily increased by the shape or structure of the retainer, the contact area between the heat sink and the guide plate can be increased. Therefore, the amount of heat radiation can be increased. Therefore, it is possible to obtain an electronic device having an excellent heat dissipation effect of the electronic circuit component. Also, by engaging the contact surfaces of the retainer and the guide plate with corrugated undulations, it is possible to suppress the movement of the electronic circuit module due to vibration, so it is possible to prevent the compressive force of the retainer from decreasing and to make the heat sink adhere to the guide plate. Because you can
An electronic device with excellent reliability can be obtained.

In the fourth embodiment, not only the same effect as described above is obtained, but also the heat dissipation plate of the electronic circuit module is formed of a damping alloy material such as aluminum-zinc alloy having a large internal friction. As a result, the response magnification at the resonance frequency of the electronic circuit module is reduced, and the vibration stress applied to the electronic circuit component mounted on the electronic circuit module can be reduced, so that the marketability of the electronic circuit component is expanded and the low cost is achieved. Thus, it is possible to obtain an electronic device having excellent vibration resistance.

[Brief description of drawings]

FIG. 1 is an external view showing an electronic device according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a cross-section DD in FIG.

FIG. 3 is a partial detailed view around the guide groove in FIG. 2 at a normal time.

FIG. 4 is a view showing a cross section EE in FIG. 3, showing a state in which the screw portion is tightened and the retainer and the guide plate are in close contact with each other.

FIG. 5 is a view showing a cross section EE in FIG. 3, showing a state where the screw portion is loosened and the retainer and the guide plate are separated from each other.

FIG. 6 is a detailed view of the retainer in FIG.

FIG. 7 is a partial detailed view around a guide groove according to a second embodiment of the present invention.

8 is a view showing a cross section FF in FIG. 7, showing a state in which the screw portion is tightened and the retainer and the guide plate are in close contact with each other.

9 is a view showing a cross section FF in FIG. 7, showing a state in which the screw portion is loosened and the retainer and the guide plate are separated from each other.

FIG. 10 is a detailed view of the retainer in FIG.

FIG. 11 is a partial detailed view around the guide groove according to the third embodiment of the present invention.

12 is a diagram showing a cross section GG in FIG.

FIG. 13 is a diagram showing a vibration state of an electronic circuit module and a vibration axis for the electronic circuit module when a conventional aircraft-mounted electronic device is vibrated about an X axis.

FIG. 14 is an external view showing a conventional electronic device.

15 is a diagram showing a cross section AA in FIG.

16 is a partial detailed view around the guide groove in FIG.

FIG. 17 is a view as seen from B in FIG. 16, showing a state where the screw portion is tightened and the retainer and the guide plate are in close contact with each other.

FIG. 18 is a view seen from B in FIG. 16, showing a state in which the screw portion is loosened and the retainer and the guide plate are separated from each other.

19 is a detailed view of the retainer in FIG.

[Explanation of symbols]

1 electronic circuit module, 2 plate wiring board, 3 heat sink, 4 electronic circuit parts, 5 retainer, 6 chassis, 7 retainer body, 8 retainer upper part, 9 retainer lower part, 10 screw part, 11 opening part, 12 cover, 1
3 cooling fins, 14 ventilation ducts, 15 external ducts, 16 cooling air, 17 exhaust ports, 18 guide plates, 19 guide grooves, 20 plates, 21 first plates, 22 second plates, 23 first sticks, 24 Second stick, 25 first bevel gear, 26 second bevel gear, 27 third plate,
28 knobs.

Claims (4)

[Claims] 1. A first surface having an opening, a second surface having an external duct for supplying cooling air on one of four surfaces forming a right angle with the first surface, and a cooling fin. A fourth surface having a ventilation duct, a third surface perpendicular to the first surface and the second surface, a ventilation duct having cooling fins, and a fourth surface facing the third surface; A fifth surface having an outlet for cooling air and facing the second surface, the first surface
And a sixth surface opposite to the first surface, and the housing is inserted and housed in the chassis through the opening, and the electronic circuit component is mounted on the printed wiring board by sandwiching the heat dissipation plate. The electronic circuit module is provided in close contact with the third surface and the fourth surface of the chassis, and is molded in the same direction as the insertion direction of the electronic circuit module so as to form a right angle with the opening. And one of the surfaces of the electronic circuit module that comes into contact with the heat dissipation plate is provided at both ends of the heat dissipation plate of the electronic circuit module, the guide plate having a guide groove having a corrugated undulation, A trapezoidal pillar retainer body having through-holes in the longitudinal direction, both ends of which are processed into slopes, a retainer upper part having a through-hole and trapezoidal protrusions that slide in the slope of the retainer body, A screw that slides on the slope of the retainer body and connects the lower part of the retainer having a through screw and a trapezoidal protrusion in the longitudinal direction, the retainer upper part to the retainer body and the lower part of the retainer, and engages with the through screw of the lower retainer. A retainer configured by a screw portion, a retainer upper portion, and a retainer lower portion, which are slidably engaged with the corrugated undulations of the guide plate, and arranged so as to cover the opening from the outside with respect to the chassis. An electronic device comprising a cover. 2. The electronic device according to claim 1, wherein the contact surfaces of the plate and the guide groove are formed to have the same slope. 3. The retainer, wherein the contact surface with the guide plate has a corrugated undulation, and a section having a U-shaped cross section, and a size that fits in the first plate, A second plate having a U-shaped cross section;
The first stick with the right external thread and the second stick with the external left thread, which are alternately connected to the inner side of the plate and the second plate at positions opposite to each other;
First bevel gear engaged with the second stick and the second stick, and alternately connected, a third plate provided inside the second plate, and the third plate 2. The electronic device according to claim 1, wherein the electronic device comprises a second bevel gear that meshes at a right angle with the first bevel gear and a knob that is connected to the second bevel gear. 4. The electronic device according to claim 1, wherein the heat dissipation plate of the electronic circuit module is formed of a damping alloy material.