JPH08195268A - Method and device for soldering - Google Patents

Method and device for soldering

Info

Publication number
JPH08195268A
JPH08195268A JP497595A JP497595A JPH08195268A JP H08195268 A JPH08195268 A JP H08195268A JP 497595 A JP497595 A JP 497595A JP 497595 A JP497595 A JP 497595A JP H08195268 A JPH08195268 A JP H08195268A
Authority
JP
Japan
Prior art keywords
terminal
soldering
insulating film
solder bath
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP497595A
Other languages
Japanese (ja)
Inventor
Kunihiko Mori
邦彦 森
Shigeo Yamaguchi
繁男 山口
Isamu Kobayashi
勇 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP497595A priority Critical patent/JPH08195268A/en
Publication of JPH08195268A publication Critical patent/JPH08195268A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To provide a method and a device for soldering, which can excellently solder a terminal of an electric or electronic part and a wire. CONSTITUTION: In the soldering method for dipping a terminal 41, which is wound with a wire 42, in the solder bath 30 for soldering, during the time of the movement till the terminal 41 is dipped in the solder bath 30 or at the time of dipping, an insulating film of the wire 42 wound around the terminal 41 is damaged. Peeling auxiliary devices 21, 22, which contact with the wire 42 wound around the terminal 41 so as to damage the insulating film, can be provided near the dipping position, in which the terminal 41 is dipped in the solder bath 30. At the time of soldering, since the insulating film of the wire 41 is damaged, melting decomposition of the insulating film is accelerated so as to shorten the soldering time, and the melting decomposition of the insulating film of the wire 41 near the soldering part or the thermal deformation of a winding frame is prevented, and a coil 40 having the excellent characteristic can be easily obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電気・電子機器に使用
されるトランス、チョークコイル、インダクター等のコ
イル類を代表とする電気・電子部品の端子と電線との半
田付け方法及びその装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for soldering terminals and electric wires of electric / electronic parts such as transformers, choke coils, inductors and other coils used in electric / electronic equipment. .

【0002】[0002]

【従来の技術】従来、電線をコイルの端子に半田付けす
るには、図3に示すように、コイル40に巻かれた電線42
の端部の絶縁皮膜を剥離して導体41を露出し、この露出
した導体43を端子41に巻付け、この導体が巻かれた端子
部分45を半田槽31中の半田浴30に浸漬して行っていた。
しかし、近年、製造法の合理化を目的に、半田浴中で溶
融分解し消失する絶縁皮膜を被覆した自己ろう着絶縁電
線が開発された。この自己ろう着絶縁電線では、絶縁皮
膜を着けたまま端子に巻付けて半田浴に浸漬することに
より、半田浴の熱で絶縁皮膜が溶融分解し消失して電線
の導体と端子とが半田付けされる。
2. Description of the Related Art Conventionally, in order to solder an electric wire to a coil terminal, an electric wire 42 wound around a coil 40 is used as shown in FIG.
The conductor 41 is exposed by peeling off the insulating film at the end of the conductor 41, the exposed conductor 43 is wound around the terminal 41, and the terminal portion 45 wound with this conductor is immersed in the solder bath 30 in the solder bath 31. I was going.
However, in recent years, for the purpose of streamlining the manufacturing method, a self-brazing insulated wire coated with an insulating film that melts and decomposes in a solder bath and disappears has been developed. In this self-brazing insulated wire, the insulation film is wrapped around the terminal and immersed in a solder bath, so that the heat of the solder bath melts and decomposes the insulation film, and the wire conductor and the terminal are soldered together. To be done.

【0003】[0003]

【発明が解決しようとする課題】しかし、前述の自己ろ
う着絶縁電線を用いた半田付け法では、半田浴温度を高
く又半田浴浸漬時間を長くする必要があり、その為、図
4に示すように、半田浴の熱で半田付部近傍の電線41の
絶縁皮膜が溶融分解して絶縁性が低下するのを防ぐた
め、その部分に絶縁性補助チューブ50を被せる必要が生
じ、コスト高になった。又このチューブ50を被せない場
合は、半田付部分の絶縁皮膜がカス60として残り、これ
を除去するのに手間を要した。この他、半田付部近傍の
巻枠つば部70が熱変形して、電気・電子機器へのコイル
の装着具合が悪化して機器の特性が低下することがあっ
た。このように自己ろう着絶縁電線の半田付けには、生
産性及びコストの点で解決すべき問題が残されていた。
本発明の目的は、自己ろう着絶縁電線を用いて良好な半
田付けを行う方法及びその装置を提供することにある。
However, in the above-described soldering method using the self-brazing insulated wire, it is necessary to raise the solder bath temperature and prolong the solder bath dipping time. Therefore, as shown in FIG. As described above, in order to prevent the insulation film of the electric wire 41 near the soldering portion from being melted and decomposed by the heat of the solder bath and lowering the insulation property, it is necessary to cover the portion with the insulation auxiliary tube 50, resulting in high cost. became. Further, when the tube 50 was not covered, the insulating film on the soldered portion remained as the residue 60, and it took time and effort to remove it. In addition to this, the winding frame collar portion 70 near the soldering portion is thermally deformed, which may deteriorate the attachment condition of the coil to the electric / electronic device and deteriorate the characteristics of the device. As described above, the soldering of the self-brazing insulated wire has a problem to be solved in terms of productivity and cost.
An object of the present invention is to provide a method and an apparatus for performing good soldering using a self-brazing insulated wire.

【0004】[0004]

【課題を解決するための手段】請求項1の発明は、電線
の巻かれた端子を半田浴に浸漬して半田付けする半田付
け方法において、前記端子を半田浴に浸漬するまでの移
動の間又は浸漬時に、前記電線の端子に巻かれた部分の
絶縁皮膜に傷を付けることを特徴とする半田付け方法で
ある。
According to a first aspect of the present invention, in a soldering method in which a terminal on which an electric wire is wound is immersed in a solder bath for soldering, the terminal is moved until it is immersed in the solder bath. Alternatively, the soldering method is characterized in that the insulating film in the portion wound around the terminal of the electric wire is scratched during immersion.

【0005】この発明の半田付け方法によれば、端子に
巻かれた電線の絶縁皮膜に傷を付けて絶縁皮膜の溶融分
解を加速して、半田付けの所要時間を短縮できる。そし
てこの時間短縮により、半田浴の熱の影響を低減して、
半田付部近傍にある電線の絶縁皮膜の溶融分解や熱収
縮、或いは半田付部近傍の巻枠の熱変形等を防止するも
のである。絶縁皮膜に傷を付けるタイミングとしては、
端子に巻かれた電線が半田浴中にあるとき、前記電線が
半田浴間を移動するとき、半田浴に出入りするとき等を
挙げることができる。絶縁皮膜が溶融又は軟化している
ときに行うと容易に傷を付けることができる。傷は深く
付けるのが好ましい。傷が導体に達しても浅ければ問題
ない。
According to the soldering method of the present invention, the insulating film of the electric wire wound around the terminal is scratched to accelerate the melting and decomposition of the insulating film, and the time required for soldering can be shortened. And by shortening this time, the influence of the heat of the solder bath is reduced,
The purpose of the present invention is to prevent melting and decomposition of the insulating coating of the electric wire in the vicinity of the soldered portion, thermal contraction, or thermal deformation of the winding frame in the vicinity of the soldered portion. The timing of scratching the insulating film is
Examples include the case where the electric wire wound around the terminal is in the solder bath, the case where the electric wire moves between the solder baths, and the case where the electric wire goes in and out of the solder bath. If the insulating film is melted or softened, it can be easily scratched. It is preferable to make deep scratches. Even if the scratch reaches the conductor, there is no problem if it is shallow.

【0006】請求項2の発明は、請求項1記載の半田付
け方法を行う為の装置で、その構成は、電線の巻かれた
端子が移動する軌跡近傍、又はこの端子が半田に浸漬さ
れる位置の近傍に、前記電線の端子に巻かれた部分に接
して、その絶縁皮膜に傷を付ける剥離補助装置を設けた
ことを特徴とするものである。
A second aspect of the present invention is an apparatus for performing the soldering method according to the first aspect, which has a structure in the vicinity of the locus of movement of a terminal on which an electric wire is wound or in which the terminal is immersed in solder. In the vicinity of the position, a peeling auxiliary device for contacting the portion of the electric wire wound around the terminal and for scratching the insulating film is provided.

【0007】この発明では、端子に巻かれた電線が半田
浴の熱で加熱される位置で、これに剥離補助装置が接し
て前記電線の絶縁皮膜に傷を付ける態様が最も好まし
い。前記剥離補助装置には、電線に接する部分がブラシ
状、ヤスリ状、螺旋状、スリット状等のものが適用され
る。前記剥離補助装置の材料には、半田に対し良好な耐
候性、耐熱性を有する、チタン、チタン合金、鋳鉄、ス
テンレス鋼、セラミックス等の材料が用いられる。前記
剥離補助装置は、半田浴中か、又は半田浴に複数回浸漬
する場合の半田浴上や半田浴間の電線の巻かれた端子が
移動する軌跡近傍に配置される。剥離補助装置を半田浴
外に配置すると、剥離補助装置は半田による劣化が抑制
されて寿命が延びる。又剥離補助装置の材料に、半田に
対する耐候性や耐熱性が比較的低い材料を使用できる。
剥離補助装置を、端子に巻かれた電線に接するには、電
線巻付部と剥離補助装置のいずれか、又は両方を移動さ
せて行う。剥離補助装置を回転又は振動させておくと、
傷口の広い傷が多数付いて、その効果がより高まる。
In the present invention, it is most preferable that the wire wound around the terminal is heated by the heat of the solder bath and the peeling auxiliary device comes into contact with the wire to damage the insulating film of the wire. A brush-shaped, file-shaped, spiral-shaped, slit-shaped, or the like is applied to the peeling assisting device in a portion in contact with the electric wire. As the material of the peeling assisting device, a material such as titanium, titanium alloy, cast iron, stainless steel, or ceramics having good weather resistance and heat resistance against solder is used. The peeling assisting device is arranged in the solder bath, or on the solder bath when immersed in the solder bath a plurality of times, or in the vicinity of the locus of movement of the terminal on which the electric wire is wound between the solder baths. When the peeling auxiliary device is arranged outside the solder bath, deterioration of the peeling auxiliary device due to solder is suppressed and the life is extended. Further, as the material of the peeling auxiliary device, a material having relatively low weather resistance and heat resistance to solder can be used.
In order to contact the peeling auxiliary device to the electric wire wound around the terminal, either or both of the wire winding portion and the peeling auxiliary device are moved. If the peeling auxiliary device is rotated or vibrated,
A large number of wide open wounds are attached, and the effect is enhanced.

【0008】以下に、本発明装置を図を参照して具体的
に説明する。図1イ、ロは、本発明の半田付装置の態様
を示すそれぞれ説明図である。図1イに示す半田付装置
10は、剥離補助装置20が半田槽31に保持された半田浴30
中に配置されたものである。図1ロに示す半田付装置11
は、剥離補助装置20が半田浴30の半田液面直上に配置さ
れたものである。
The device of the present invention will be described below in detail with reference to the drawings. FIGS. 1A and 1B are explanatory views showing aspects of the soldering apparatus of the present invention. Soldering device shown in FIG.
10 is a solder bath 30 in which the peeling auxiliary device 20 is held in a solder bath 31.
It was placed inside. Soldering device 11 shown in FIG.
Is a device in which the peeling assisting device 20 is arranged directly above the solder liquid surface of the solder bath 30.

【0009】図2イ、ロは、本発明装置の剥離補助装置
により、端子に巻かれた電線の絶縁皮膜に傷を付ける様
子を示すそれぞれ斜視図である。図2イに示す剥離補助
装置は、2個の固定ブラシ21が所定間隔を開けて対向配
置されたものである。この2個の固定ブラシ21の間をコ
イル40が移動し、移動の際に、コイル40の端子41に巻か
れた電線42に固定ブラシ21が接してその絶縁皮膜に傷が
付く。2個の固定ブラシ21の配置間隔は、コイル40の両
側の端子41に巻かれた電線42の絶縁皮膜に十分深い傷が
付き、且つ電線内部の導体に深い傷が付いたりしない間
隔にする。図2ロに示す剥離補助装置は、2個の回転ブ
ラシ22が所定間隔を開けて対向配置されたものである。
この剥離補助装置では、ブラシが回転するので、絶縁皮
膜に多数の傷が付き、しかも傷口も広がるので、絶縁皮
膜の溶融分解がより加速される。コイルが上下に移動す
る場合は、対をなす2個の剥離補助装置の間隔をコイル
の上下動に合わせて可変とし、剥離補助装置が端子に巻
かれた電線にのみ接し、巻枠部分には接しないようにす
る。
2A and 2B are perspective views showing a state in which the peeling auxiliary device of the device of the present invention scratches the insulating film of the wire wound around the terminal. In the peeling assisting device shown in FIG. 2A, two fixed brushes 21 are arranged to face each other with a predetermined gap. The coil 40 moves between these two fixed brushes 21. When the coil 40 moves, the fixed brush 21 comes into contact with the electric wire 42 wound around the terminal 41 of the coil 40, and the insulating film is damaged. The two fixed brushes 21 are arranged at intervals such that the insulation film of the electric wire 42 wound around the terminals 41 on both sides of the coil 40 is not deeply scratched and the conductor inside the wire is not deeply scratched. In the peeling assisting device shown in FIG. 2B, two rotating brushes 22 are arranged to face each other with a predetermined gap.
In this peeling auxiliary device, since the brush rotates, many scratches are formed on the insulating film and the scratches also spread, so that the melting and decomposition of the insulating film is accelerated. When the coil moves up and down, the distance between the pair of peeling auxiliary devices is variable according to the vertical movement of the coil, and the peeling auxiliary device contacts only the electric wire wound around the terminal, and Avoid contact.

【0010】[0010]

【作用】請求項1の発明では、電線の巻かれた端子を半
田浴に浸漬して半田付けする半田付け方法において、前
記端子を半田浴に浸漬するまでの移動の間又は浸漬時
に、電線の端子に巻かれた部分の絶縁皮膜に傷を付ける
ので、絶縁皮膜の溶融分解が加速され、その結果半田付
けに要する時間が短縮されて、半田付部近傍にある電線
の絶縁皮膜の溶融分解や巻枠の熱変形が防止される。請
求項2の発明では、電線の巻かれた端子が移動する軌跡
近傍、又はこの端子が半田浴に浸漬される位置の近傍
に、電線の端子に巻かれた部分に接して、その絶縁皮膜
に傷を付ける剥離補助装置を設けた半田付装置なので、
コイルの半田付部が半田浴中で、又はそこに出入りする
際に、半田浴の高温に加熱された電線の絶縁皮膜が剥離
補助装置と接して、前記絶縁皮膜に傷が付き絶縁皮膜の
溶融分解が加速され、前述と同様の効果が得られる。
According to the invention of claim 1, in a soldering method of immersing a terminal on which an electric wire is wound in a solder bath for soldering, the terminal of the electric wire is moved during or during the movement until the terminal is immersed in the solder bath. Since the insulating film on the part wound around the terminal is damaged, the melting and decomposition of the insulating film is accelerated, and as a result, the time required for soldering is shortened and the melting and decomposition of the insulating film of the wire near the soldered part Thermal deformation of the reel is prevented. In the invention of claim 2, in the vicinity of the locus of movement of the wound terminal of the electric wire, or in the vicinity of the position where this terminal is immersed in the solder bath, the portion wound on the terminal of the electric wire is brought into contact with the insulating film. Since it is a soldering device with a peeling auxiliary device that scratches,
When the soldering part of the coil is in or out of the solder bath, the insulation coating of the wire heated to a high temperature in the solder bath comes into contact with the peeling auxiliary device, and the insulation coating is scratched and melts. Decomposition is accelerated and the same effect as described above is obtained.

【0011】[0011]

【実施例】以下に、本発明を実施例により詳細に説明す
る。 (実施例1)図1イに示した半田付装置を用いて電線の
巻かれたコイル端子を半田付けした。剥離補助装置には
図2イに示した固定ブラシ(ステンレス鋼製)を用いた。コイ
ルの巻枠に巻かれた自己ろう着型ポリエステル電線(絶
縁皮膜厚さが 100μm、導体径0.8mm)の端部を所定長さ
引出し、これを端子に3ターン巻付けた。次にこの電線
の巻かれた端子部分を 420℃に加熱された半田浴に浸漬
して半田付けした。半田浴に浸漬中に、前記端子部分の
電線に固定ブラシを接して、前記電線の絶縁皮膜に傷を
付けた。その傷の深さは導体に浅い傷が付く程度とし
た。
EXAMPLES The present invention will be described in detail below with reference to examples. (Example 1) A coil terminal on which an electric wire was wound was soldered by using the soldering apparatus shown in FIG. The fixed brush (made of stainless steel) shown in FIG. 2A was used as the peeling auxiliary device. A self-brazing type polyester electric wire (insulating film thickness: 100 μm, conductor diameter: 0.8 mm) wound around a coil winding frame was pulled out for a predetermined length, and this was wound around a terminal for 3 turns. Next, the wound terminal portion of the electric wire was dipped in a solder bath heated to 420 ° C for soldering. While being immersed in the solder bath, a fixing brush was brought into contact with the electric wire of the terminal portion to scratch the insulating film of the electric wire. The depth of the scratch was such that the conductor had a shallow scratch.

【0012】(実施例2)実施例1において、剥離補助
装置に図2ロに示した回転ブラシ(ステンレス鋼製)を用いた
他は、実施例1と同じ方法によりコイルの端子部分を半
田付けした。
(Embodiment 2) The terminal portion of the coil is soldered by the same method as in Embodiment 1 except that the rotating brush (made of stainless steel) shown in FIG. did.

【0013】(実施例3)実施例1において、図1ロに
示した半田付装置を用い、半田浴に2回浸漬した他は、
実施例1と同じ方法により、コイルの端子部分を半田付
けした。前記端子部分は、半田浴に1回浸漬して絶縁皮
膜を軟化させた後に固定ブラシを接して傷を付け、その
あと再び半田浴に浸漬した。固定ブラシは、半田浴の表
面から0〜10mmの位置に配置した。
(Embodiment 3) In Embodiment 1, except that the soldering apparatus shown in FIG.
The terminal portion of the coil was soldered by the same method as in Example 1. The terminal portion was dipped once in a solder bath to soften the insulating film, and then contacted with a fixing brush to scratch it, and then dipped again in the solder bath. The fixed brush was arranged at a position of 0 to 10 mm from the surface of the solder bath.

【0014】(実施例4)実施例3において、剥離補助
装置に図2ロに示した回転ブラシ(ステンレス鋼製)を用いた
他は、実施例3と同じ方法によりコイルの端子部分を半
田付けした。
(Embodiment 4) The terminal portion of the coil is soldered by the same method as in Embodiment 3 except that the rotary brush (made of stainless steel) shown in FIG. did.

【0015】(実施例5)実施例1又は実施例4におい
て、電線に自己ろう着型1種ポリウレタン線(1.0mmφ)
を用いた他は、実施例1と同じ方法によりコイルの端子
部分を半田付けした。
(Embodiment 5) In Embodiment 1 or 4, the self-brazing type 1-type polyurethane wire (1.0 mmφ) is used as the electric wire.
The terminal portion of the coil was soldered by the same method as in Example 1 except that

【0016】(従来例1)実施例1又は実施例3におい
て、剥離補助装置を用いなかった他は、実施例1又は実
施例3と同じ方法によりコイル端子の電線巻付部を半田
付けした。
(Prior Art 1) The wire winding part of the coil terminal was soldered by the same method as in Example 1 or Example 3 except that the peeling auxiliary device was not used.

【0017】前記の実施例又は従来例において、良好な
半田付けが得られる半田浴浸漬時間又は半田浴浸漬回数
を調べた。又半田付け後のコイルについて、皮膜カスの
発生状況、半田付部近傍の電線の品質、巻枠つば部の熱
変形状況を調べた。結果を表1に示す。
In the above-mentioned examples or conventional examples, the solder bath dipping time or the number of times of solder bath dipping for obtaining good soldering was examined. Further, with respect to the coil after soldering, the generation state of film residue, the quality of the electric wire in the vicinity of the soldered portion, and the thermal deformation state of the winding frame collar portion were examined. The results are shown in Table 1.

【0018】[0018]

【表1】 [Table 1]

【0019】表1より明らかなように、本発明例品(N
o.1〜6)は、半田付け時間が短かった為、半田付部近傍
の絶縁皮膜の溶融分解や熱収縮、巻枠の熱変形が全く認
められなかった。又半田付け後の絶縁皮膜カスはブラシ
に付着し、コイル側には殆ど存在しなかった。又ブラシ
はステンレス製の為半田浴中に浸漬しても腐食したりせ
ず長期間使用できた。特に半田浴上に配置したものは寿
命が長く、半田浴中に配置したものの約3倍の寿命があ
った。半田付けを2回に分けて行ったもの(No.3,4,6)
は、1回目の半田浴浸漬後にブラシが端子に巻かれた電
線に接して、電線の絶縁皮膜に傷が付き、2回目の半田
浴浸漬で絶縁皮膜が消失すると同時に良好な半田付けが
なされた。ブラシを回転させたもの(No.2,4,6)は、ブラ
シを固定したもの(No.1,3,5) より、短時間で良好な半
田付けがなされた。これは傷口の広い傷が多数付いて絶
縁皮膜がより完全に消失した為である。ポリウレタン
(一種)電線(No.5,6)は、絶縁皮膜のポリウレタンが溶
融分解し易い為、ポリエステル電線(No.1,3)より半田付
け時間が短かった。これに対し、比較例品は剥離補助装
置を用いなかった為、No.7では半田付けに12秒を要し、
No.8では3秒の半田浴浸漬を4回繰り返した。その結
果、両者とも半田浴の熱の影響を受けて、半田付部近傍
の電線の絶縁皮膜が溶融分解したり、熱収縮したりし
て、その部分の絶縁性を維持するのに補助チューブが必
要であった。又巻枠つば部が著しく変形して不良品とな
るものがあった。又絶縁皮膜のカスが多量に残存して除
去に手間が掛かった。
As is clear from Table 1, the product of the present invention (N
In o.1 to 6), since the soldering time was short, no melt decomposition or heat shrinkage of the insulating film near the soldered part or thermal deformation of the winding frame was observed. Further, the insulating film dust after soldering adhered to the brush and was hardly present on the coil side. Since the brush is made of stainless steel, it can be used for a long time without being corroded even when immersed in a solder bath. In particular, the one arranged on the solder bath has a long life, and the life is about three times that of the one arranged in the solder bath. Soldering is divided into two parts (No.3,4,6)
Shows that the brush was in contact with the wire wound around the terminal after the first immersion in the solder bath, and the insulation film of the wire was damaged, and the second immersion in the solder bath caused the insulation film to disappear and at the same time good soldering was performed. . The one with the brush rotated (No.2,4,6) had better soldering in a shorter time than the one with the brush fixed (No.1,3,5). This is because a large number of scratches with wide wounds were attached and the insulating film disappeared more completely. Polyurethane (one kind) electric wire (No.5,6) had shorter soldering time than polyester electric wire (No.1,3) because the polyurethane of the insulation film was easily melted and decomposed. On the other hand, since the comparative example product did not use the peeling auxiliary device, it took 12 seconds for soldering in No. 7,
In No. 8, immersion in the solder bath for 3 seconds was repeated 4 times. As a result, both of them are affected by the heat of the solder bath, and the insulation coating of the wire near the soldering part melts and decomposes, or heat shrinks, and an auxiliary tube is used to maintain the insulation of that part. Was needed. In addition, the collar portion of the bobbin was significantly deformed, resulting in a defective product. In addition, a large amount of dust remained on the insulating film, which took time to remove.

【0020】以上、剥離補助装置に、固定ブラシ又は回
転ブラシを用いる場合について説明したが、本発明によ
れば、絶縁皮膜と接する部分がやすり状、板状、螺旋状
等の剥離補助装置を、固定、回転、又は振動させて用い
ても同様の効果が得られる。
Although the case where a fixed brush or a rotating brush is used as the peeling assisting device has been described above, according to the present invention, a peeling assisting device in which the portion in contact with the insulating film is a file, a plate, a spiral, etc. The same effect can be obtained by using it in a fixed, rotating, or vibrating manner.

【0021】[0021]

【発明の効果】以上に述べたように、請求項1の発明に
よれば、半田付けに際して、端子に巻かれた電線の絶縁
皮膜に傷を付けるので、絶縁皮膜の溶融分解が加速され
て半田付け時間が短縮され、半田付部近傍の電線の絶縁
皮膜の溶融分解や巻枠の熱変形が防止され、特性に優れ
たコイルが容易に得られる。又請求項2の発明によれ
ば、前記半田付け方法を実施する装置で、コイル端子が
移動する軌跡近傍、又はこの端子が半田浴に浸漬される
位置の近傍に、端子に巻かれた電線に接して、その絶縁
皮膜に傷を付ける剥離補助装置を設けた半田付装置なの
で、コイルの半田付部が半田浴中で、又はそこに出入り
する際に、半田付部の電線の高温に加熱された絶縁皮膜
が剥離補助装置と接して、前記絶縁皮膜に傷が付き絶縁
皮膜の溶融分解が加速され、良好な半田付けが容易にな
される。
As described above, according to the first aspect of the present invention, since the insulating film of the wire wound around the terminal is damaged during soldering, the melting and decomposition of the insulating film is accelerated and the solder is soldered. The soldering time is shortened, melting and decomposition of the insulating coating of the electric wire in the vicinity of the soldered portion and thermal deformation of the winding frame are prevented, and a coil having excellent characteristics can be easily obtained. According to the invention of claim 2, in the device for carrying out the soldering method, the wire wound around the terminal is provided in the vicinity of the locus of movement of the coil terminal or in the vicinity of the position where the terminal is immersed in the solder bath. Since it is a soldering device that is equipped with a peeling auxiliary device that contacts and scratches the insulation film, when the soldering part of the coil is in or out of the solder bath, it is heated to the high temperature of the wire of the soldering part. The insulating film comes into contact with the peeling auxiliary device, the insulating film is scratched, and the melting and decomposition of the insulating film is accelerated, and good soldering is facilitated.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の半田付装置の態様を示す説明図であ
る。
FIG. 1 is an explanatory view showing an aspect of a soldering device of the present invention.

【図2】本発明装置の剥離補助装置により、端子に巻か
れた電線の絶縁皮膜に傷を付ける様子を示す斜視図であ
る。
FIG. 2 is a perspective view showing a state in which an insulating film of an electric wire wound around a terminal is scratched by a peeling auxiliary device of the device of the present invention.

【図3】従来の、端子に巻かれた電線を半田付けする様
子を示す斜視図である。
FIG. 3 is a perspective view showing a conventional manner of soldering an electric wire wound around a terminal.

【図4】従来のコイルの半田付部の斜視図である。FIG. 4 is a perspective view of a soldering portion of a conventional coil.

【符号の説明】[Explanation of symbols]

10,11,12──半田付装置 20─────剥離補助装置 21─────固定ブラシ 22─────回転ブラシ 30─────半田浴 31─────半田浴槽 40─────コイル 41─────端子 42─────電線 43─────導体 44─────電線が巻かれた端子部分 45─────導体が巻かれた端子部分 50─────補助チューブ 60─────絶縁皮膜カス 70─────巻枠つば部 10,11,12── Soldering device 20───── Peeling auxiliary device 21───── Fixed brush 22───── Rotating brush 30───── Solder bath 31───── Solder Bath 40 ───── Coil 41 ───── Terminal 42 ───── Electric wire 43 ───── Conductor 44 ───── Terminal part where the electric wire is wound 45 ───── Winded terminal part 50 ───── Auxiliary tube 60 ───── Insulation film scrap 70 ─────

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 電線の巻かれた端子を半田浴に浸漬して
半田付けする半田付け方法において、前記端子を半田浴
に浸漬するまでの移動の間又は浸漬時に、前記電線の端
子に巻かれた部分の絶縁皮膜に傷を付けることを特徴と
する半田付け方法。
1. In a soldering method of immersing a terminal on which an electric wire is wound in a solder bath for soldering, the terminal of the electric wire is wound during movement or during immersion until the terminal is immersed in the solder bath. A soldering method characterized by scratching the insulating film on the exposed portion.
【請求項2】 電線の巻かれた端子が移動する軌跡近
傍、又はこの端子が半田に浸漬される位置の近傍に、前
記電線の端子に巻かれた部分に接して、その絶縁皮膜に
傷を付ける剥離補助装置を設けたことを特徴とする半田
付け装置。
2. A portion of the electric wire wound around the terminal is in contact with the wound portion of the electric wire in the vicinity of the locus of movement of the wound terminal of the electric wire, or near the position where the terminal is immersed in solder, and the insulating film is scratched. A soldering device comprising a peeling auxiliary device for attaching.
JP497595A 1995-01-17 1995-01-17 Method and device for soldering Pending JPH08195268A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP497595A JPH08195268A (en) 1995-01-17 1995-01-17 Method and device for soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP497595A JPH08195268A (en) 1995-01-17 1995-01-17 Method and device for soldering

Publications (1)

Publication Number Publication Date
JPH08195268A true JPH08195268A (en) 1996-07-30

Family

ID=11598607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP497595A Pending JPH08195268A (en) 1995-01-17 1995-01-17 Method and device for soldering

Country Status (1)

Country Link
JP (1) JPH08195268A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2003020468A1 (en) * 2001-08-30 2004-12-16 スミダコーポレーション株式会社 Lead-free solder alloy and electronic component using the same
JP2009071315A (en) * 2008-10-20 2009-04-02 Sumida Corporation Coil part

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2003020468A1 (en) * 2001-08-30 2004-12-16 スミダコーポレーション株式会社 Lead-free solder alloy and electronic component using the same
JP2009071315A (en) * 2008-10-20 2009-04-02 Sumida Corporation Coil part

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