JPH08191512A - Mounting structure of a plural apparatuses at inside of board - Google Patents

Abstract

PURPOSE: To provide a mounting structure in which the mounting size in the vertical direction of a plural apparatuses such as inverters or the like is shortened without spoiling a cooling effect. CONSTITUTION: Two apparatus rows 21, 22 in which a plural adjacent apparatuses composed of at least one inverter and of other apparatuses are arranged horizontally are arranged in such a way that horizontal positions of the respective apparatus rows are not overlapped with each other in a tier stand manner. As a result, the air which is discharged form the apparatus row 22 and whose temperature has been raised does not affect the cooling effect of the apparatus row 21. When a shielding plate which prevents the discharged air from flowing in the horizontal direction is installed, the air is discharged by the apparatus row 22 reduces the influence on the cooling effect of the apparatus row 21 further.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for equipment when a plurality of equipment are housed in a panel such as a switchboard or a control panel.

[0002]

2. Description of the Related Art For example, in a switchboard or control panel that stores a plurality of devices such as an inverter for controlling an electric motor and a transformer for an instrument, a row of the devices in which the plurality of devices are arranged in the horizontal direction is further arranged in the vertical direction. In some cases, a mounting structure is adopted. Since the semiconductor elements that make up the inverter generate a lot of heat, each inverter is equipped with a cooling fan that adopts a cooling method that sucks in air from the bottom and cools the semiconductor element and discharges the air whose temperature has risen to the top. To be done.

In order to prevent the upper inverter from sucking the air discharged from the lower inverter to reduce the cooling efficiency, the vertical distance of the equipment row should be set sufficiently large. Adopted.

[0004]

As described above, since the vertical distance of the inverter array is sufficiently large for cooling, the vertical mounting size of the inverter is large. There is. An object of the present invention is to solve such problems and to provide a plurality of equipment mounting structures in a panel in which the vertical mounting dimensions of the equipment are reduced without impairing the cooling effect.

[0005]

In order to solve the above-mentioned problems, according to the present invention, at least one device arranged in a line in the horizontal direction constitutes one device row, and at least two device rows in the vertical direction. In the mounting structure of the devices mounted side by side on the mounting frame, the horizontal position of the adjacent device row is
It shall be arranged so as not to overlap with each other. Further, the lower equipment rows are arranged closer to the front surface of the panel. In addition, it is assumed that a shield plate that prevents the horizontal flow of air is provided. In addition, it is assumed that the respective device rows are alternately arranged with their horizontal positions shifted.

[0006]

In the structure of the present invention, at least two adjacent device rows in which at least one adjacent device is horizontally arranged are provided.
In a mounting structure where two units are mounted, by arranging the horizontal position of each device row so that they do not overlap with each other, it is possible that the temperature-increased air after cooling each device will affect the cooling of the device immediately above. Absent.

If the lower device rows are arranged closer to the front surface of the panel like a so-called platform, all the equipment rows have different horizontal positions, so that the temperature generated by the equipment in each row is high. Air rarely affects the cooling of equipment in other equipment rows. The influence is further reduced by providing a shielding plate so that the discharged air does not flow in the horizontal direction.
When the number of device rows is large, if the horizontal positions of the respective rows are alternately staggered, even if the number of the equipment rows is three or more, the depth dimension for mounting the equipment is only two rows.

[0008]

EXAMPLES The present invention will be described below based on examples.
1 is a side view showing the inside of a switchboard showing an embodiment of the present invention, and FIG. 2 is an elevation view of the same. In the elevation view of FIG. 2, the door on the front side of the figure is omitted so that the inside can be seen. In the side view of FIG. 1, the side wall plate is omitted so that the inside can be seen. 1 is a side view seen from the right side of FIG. 2, and FIG. 2 is also a view seen from the left side of FIG. Therefore, there is a door (not shown) on the left side of the side view of FIG. 1, and this is the front of the switchboard.

In these figures, a total of 6 inverters, 5 inverters 2 and 1 other device 3, are housed in a box 1 of a switchboard, and each of them is arranged horizontally in a row. As a result, two device rows 21 and 22 are formed, and these device rows 21 and 22 are vertically arranged in two stages. The device rows 21 and 22 are attached to attachment plates 61 and 62 attached to the attachment frame 4. As shown in FIG. 1, the mounting frame 4 has a horizontal portion at the center, and the lower mounting plate 62 is located closer to the front surface than the upper mounting plate 61.

The arrow in FIG. 1 indicates the flow of air that cools the inverter 2. The cooling fan 23, 23 provided in the inverter 2 sucks air from the bottom to power the inverter 2. The power semiconductor element such as a transistor is cooled to take heat, and as a result, the air whose temperature has risen is discharged from above. Upper row inverter 2
It goes without saying that the air discharged by 1 flows upward regardless of the inverter 22 in the lower row, but the air discharged by the inverter 22 also rises in the space on the front side thereof regardless of the inverter 21. Does not affect the cooling effect of the inverter 2 above.

In the shield plate 5, the high temperature air discharged from the inverter row 22 flows toward the equipment row 21 and the equipment row 2
1 is provided in order to prevent the cooling effect from decreasing due to the temperature of the air sucked by the device 1, and the device row 21,
Although it is possible to reduce the influence of the cooling effect on each other just by shifting the horizontal positions of 22 so as not to overlap with each other, the effect of further reducing the influence is further provided by providing the shield plate 5. .

Although the number of equipment rows is two in these figures, for example, when the number of equipment rows is three, the third equipment row is arranged further below the equipment row 22, and three equipment rows are provided. There is a structure such as a platform in which the eye device row is arranged in front of the equipment row 22 and a structure in which the third equipment row is arranged in the same horizontal position as the equipment row 21. In the former case, the mutual equipment rows do not affect each other in terms of cooling, but the mounting dimension in the horizontal direction in FIG. 1, that is, the depth dimension is as large as three equipment rows. On the other hand, in the latter case, the air discharged from the third equipment row rises and affects the cooling effect of the equipment row 21, but the distance between them is sufficiently large that at least the cooling is performed as compared with the conventional mounting structure. The effect does not decrease. The depth dimension is only for two device rows.
The same is true even if the number of device rows is four or more. Therefore, it can be said that the latter arrangement structure is suitable when the number of device rows is large.

[0013]

As described above, according to the present invention, when two or more device rows are vertically overlapped with each other, the horizontal positions of the device rows are offset from each other so that they do not overlap each other. The heated air discharged from a device does not affect the cooling effect of other devices. Therefore, since the vertical distance between the device rows can be reduced, the vertical mounting dimension can be shortened without reducing the cooling effect. As a method to shift the horizontal position of multiple device rows,
The lower equipment rows may be closer to the front of the panel like a daiseki. If there are many equipment rows, the horizontal position of each equipment row may be changed alternately to the front and back so that they are at the same horizontal position. Since the vertical distance of a certain equipment row can be secured for at least one equipment row, the air discharged from the lower equipment row has a small effect on the cooling effect of the upper equipment row, and the depth dimension of the mounting structure is set to the equipment row 2 You can limit it to one.
When arranging like a poultry platform, the influence on the cooling effect can be further reduced by providing a shielding plate that prevents discharged air from flowing in the horizontal direction.

[Brief description of drawings]

FIG. 1 is a side view showing the inside of a switchboard showing an embodiment of the present invention.

FIG. 2 is an elevation view showing the inside of the switchboard of FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Box body, 2 ... Inverter, 21, 22 ... Inverter row, 23, 24 ... Cooling fan, 3 ... Other equipment, 4 ... Mounting frame,
5 ... Shield plate, 61, 62 ... Mounting plate

Claims (4)

[Claims] 1. At least one horizontally arranged side by side
In a multiple device mounting structure in a panel in which at least two device rows are vertically arranged and mounted on a mounting frame with each device row as one device row, the horizontal positions of adjacent device rows do not overlap each other. A structure for mounting a plurality of devices in a panel, which is characterized in that 2. A plurality of device mounting structures in a panel according to claim 1, wherein the lower device rows are arranged closer to the front surface of the panel. 3. A structure for mounting a plurality of devices in a panel according to claim 2, further comprising a shield plate for preventing a horizontal flow of air. 4. A plurality of equipment mounting structures in a panel according to claim 1, wherein the respective equipment rows are alternately arranged with their horizontal positions being shifted.