JPH08172299A - Apparatus and method for mounting of electronic component - Google Patents

Abstract

PURPOSE: To provide the mounting method and the mounting apparatus, of electronic components, in which the electronic components such as air-core coils can be mounted onto a board with high density. CONSTITUTION: A plurality of holding members 10, 12 hold an electronic component C so as to sandwich its side parts. Then, when the plurality of holding members 10, 12 insert a part of the electronic component C into a hole H in a board P in a position away from the board used to mount the electronic component C, the holding members are situated away from the board, and a cutout part 100 is formed. As a result, the holding members avoid a situation that the electronic component C hits other electronic components C mounted on the board. Thereby, an electronic component can be mounted newly in a part immediately near an electronic component which has been already mounted, and electronic components can be mounted with high density.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and method for mounting an electronic component such as an air core coil used as a circuit component on a mounting substrate.

[0002]

2. Description of the Related Art FIG. 19 shows various air core coils C which are examples of electronic parts used as circuit parts.

This air-core coil C has a winding portion C1 wound in a spiral shape, and linearly protrudes from both ends of the winding portion C1 to the same side, and is inserted into a mounting board for mounting. It is composed of a lead portion C2 that is electrically connected to a circuit in the substrate.

The winding portion C1 is closely wound as shown in FIG. 19 (a), space wound as shown in FIG. 19 (b), or FIG. Some are partially space-wound, as shown in c).

As shown in FIG. 19 (d), a pair of lead portions C2 protrudes in the same direction on the side of the winding portion C1, or as shown in FIG. 19 (e). To
Some of them project in parallel in a state of being displaced diagonally.

FIG. 16 shows an example of a chuck device used for mounting the air-core coil C as described above on a mounting board P such as a printed board or a flexible board.

The lead portion C2 of the air-core coil C is sandwiched and supported by a pair of grip claws 1 and 1 which advance and retreat in the direction of the arrow from both sides, and on the side of the winding portion C1 of the air-core coil C. The hook portion 2 is pressed against, and the air-core coil C is positioned and held in the lower part of the chuck device.

Then, with this chuck device, the air-core coil C
In order to mount on the mounting substrate P, the chuck device is lowered to the vicinity of the mounting substrate P, and the lead portion C of the air-core coil C is attached.
2 is inserted into a predetermined hole P1 of the mounting board P.

Next, while the upper part of the winding portion C1 of the air-core coil C is pressed downward by the pressing block 3, the grip claws 1 and 1 and the hook portion 2 are opened outward, and the chuck device is moved to the air-core coil C. Away from. Then, the mounting board P and the lead portion C2 of the air-core coil C are electrically connected via solder or the like, and the mounting of the air-core coil C on the mounting board P is completed.

[0010]

However, in the conventional chuck device, when attaching an electronic component such as the air-core coil C to the mounting substrate P, it is necessary to open the gripping claws 1, 1 and the hook portion 2. Around the air-core coil C on the mounting substrate P, a mounting space S as shown by the diagonal lines in FIG. 17 is required.

That is, as shown in FIG. 17A, opening areas M1 and M1 of the grip claws 1 and 1 are required on both sides of the end portion of the air-core coil C, and the longitudinal side of the air-core coil C is required. Since the opening area M2 of the hook portion 2 is required on one side,
On the mounting substrate P, as shown in FIGS. 17B and 17C, it is necessary to secure a large mounting space S around the air-core coil C.

Therefore, in the method of attaching the air-core coil C to the mounting board P using the above-mentioned conventional chuck device, a large attaching space S is required around the attaching portion of the air-core coil C of the mounting board P, and the mounting board is required. Air core coil C for P
However, there was an inconvenience that it could not be mounted at high density.

Moreover, tuners and the like in which the air-core coil C is used have been miniaturized, and the mounting board P thereof has also been miniaturized.
This inconvenience has become an increasing problem in recent years due to the tendency toward higher densities.

In mounting the electronic components such as the air-core coil C on the mounting substrate P by the conventional chuck device,
Since the lead portion C2 of the air-core coil C is sandwiched between the grip claws 1 and 1, the lower portion of the lead portion C2 is bent outward by an angle of θ, as shown in FIG. There is also an inconvenience that it is difficult to insert the coil C into the hole P1 of the mounting substrate P.

Further, in the conventional chuck device described above, when the lead portion C2 of the air-core coil C, which is an electronic component, is inserted into the hole P1 of the mounting substrate P, the upper portion of the air-core coil C is strongly pressed downward by the pressing block 3. Since it was pressed, as shown in FIG. 18, the central portion of the winding portion C1 of the air-core coil C is deformed downward, and in the air-core coil C having a small wire diameter, permanent deformation remains in this. There was a drawback that the electrical characteristics changed.

Further, when the air-core coil C is mounted on the mounting substrate P by using such a conventional chuck device, the air-core coil C already mounted on the mounting substrate P hits the chuck device. There is a problem that a dense air-core coil cannot be mounted.

Therefore, the present invention has been made in order to solve the above problems, and provides an electronic component mounting method and a mounting device capable of mounting electronic components such as air-core coils on a substrate at high density. It is intended to be provided.

[0018]

The above object is, in the invention described in claim 1, a plurality of holding members for sandwiching and holding side portions of an electronic component for mounting the electronic component. A notch for avoiding hitting an electronic component mounted on another substrate adjacent to the electronic component when inserting a part of the electronic component into a hole of the substrate at a position separated from the substrate This is achieved by an electronic component mounting apparatus including: the holding member having a section; and a pressing unit for inserting the electronic component held by the plurality of holding members into the hole of the substrate. It Claim 2
In the invention described in (1), preferably, the holding member is provided in one of the plurality of holding members, and the plurality of holding members have a substantially L-shaped cross section. In the invention according to claim 3, preferably, the electronic component is a coil. In the invention according to claim 4, the above object is to hold the electronic component by sandwiching a side portion of the electronic component with the holding member, and to hold the holding member at a position apart from a substrate for mounting the electronic component. A part of the holding member is inserted into the hole of the substrate, and the cutout portion of the holding member is prevented from hitting another electronic component adjacent to the electronic component, and is held by the plurality of holding members by the pressing means. It is achieved by a method of mounting an electronic component, wherein the electronic component is further inserted into the hole of the substrate. According to a fifth aspect of the present invention, preferably, the electronic component held by the plurality of holding members is further pressed by the pressurizing means in a state where the pressure that gives the holding force of the holding member is released. Insert into the hole.

[0019]

According to the above structure, in the invention according to claim 1, the plurality of holding members hold the side parts of the electronic component while sandwiching the side parts. Then, when the plurality of holding members insert a part of the electronic component into the hole of the substrate at a position away from the substrate for mounting the electronic component, the holding member is at a position away from the substrate and the cutout portion is present. Therefore, the holding member can be prevented from hitting another electronic component mounted on the substrate. Thereby, an electronic component can be newly mounted in the immediate vicinity of the already mounted electronic component, and high-density mounting of electronic components can be performed. After the plurality of holding members insert a part of the electronic component into the hole of the substrate, the pressurizing means further inserts a part of the electronic component into the hole of the substrate to complete the mounting of the electronic component. In the invention according to claim 4, a side portion of the electronic component is sandwiched and held by the holding member, and a part of the electronic component is formed in the hole of the substrate at a position where the holding member is separated from the substrate for mounting the electronic component. To insert. At this time, since the holding member is located away from the substrate and the holding member has a cutout portion, it is possible to prevent the holding member from hitting another adjacent electronic component. This is achieved by a mounting method of an electronic component in which the electronic component held by the plurality of holding members is further inserted into the hole of the substrate by the pressing unit. In the invention according to claim 5, preferably, the electronic component held by the plurality of holding members is further inserted into the hole of the substrate by the pressing means in a state in which the pressure giving the holding force of the holding member is released. Therefore, the holding member only moves slightly, and the moving range of the holding member can be reduced.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

Since the examples described below are preferred specific examples of the present invention, various technically preferable limitations are attached, but the scope of the present invention is particularly limited in the following description. The present invention is not limited to these modes unless there is a statement to limit the above.

1 and 2 show a preferred embodiment of the mounting apparatus of the present invention. 1 and 2, the electronic component mounting apparatus of the present invention is for inserting and mounting an air-core coil C as an electronic component, which is a holding object, into a mounting substrate P.

The electronic component mounting apparatus is provided with sandwiching plates 10 and 12 as holding members and a pressing block 11 also called a pusher as a pressing means.

The sandwiching plates 10 and 12 sandwich the winding portion C1 of the air-core coil C from two directions, that is, both end faces on the end side and both end faces on the longitudinal side (axial direction). It is a pair of sandwiching plates for positioning and holding or holding C. As shown in FIGS. 3 and 4, the sandwiching plates 10 and 12 are substantially L-shaped plate-shaped when viewed in a horizontal cross section.
Are arranged point-symmetrically with respect to the winding portion C1 of the air-core coil C.

As shown in FIGS. 3 and 4, the sandwich plate 10 is
It has a side surface portion 10a, an end surface portion 10b, and a guide portion 10c. On the other hand, the other sandwiching plate 12 has a side surface portion 12a, an end surface portion 12b, and a guide portion 12c.

Side surface portions 10a, 12a of the sandwiching plates 10, 12
Is a portion that moves toward the longitudinal side surface of the winding portion C1 and holds the winding portion C1 of the air-core coil C therebetween.

On the other hand, the end faces 10b and 12b of the sandwiching plates 10 and 12 can sandwich both end faces of the winding part C1. The pair of lead portions C2 and C2 of the winding portion C1 can be held by being guided in the vertical direction by the corner portions 10d and 12d of the sandwiching plates 10 and 12, respectively.

The guide portions 10c and 12c are connected to the end face portion 10b,
The tip of 12b is a portion that is curved outward. Sandwich plate 10,
One of the sandwiching plates 10 out of 12 is characterized in that a cutout portion 100 is formed as shown in FIGS. 1 and 2. This notch 100 is shown in FIG.
As shown in FIG. 2, the air-core coil C is formed so as to be cut out in a shape along the bent portion (R portion) of the winding portion C1. That is, the end face portion 10 of the sandwich plate 10
The lower end portion of b and its peripheral portion are cut out in correspondence with the outer peripheral shape of the winding portion C1.

By doing so, as shown in FIGS. 1 and 2, immediately after the lead portion C2 of a certain air-core coil C is already inserted and mounted in the hole H of the mounting substrate P, When the lead portion C2 of another air core coil C is to be inserted into the hole H, the notch 100 should be prevented from hitting the winding portion C1 of the adjacent air core coil C, that is, avoided. Thus, the sandwiching portions 10 and 12 can be lowered in the direction of arrow D.

If the cutout portion 100 is not formed, the air-core coil C already attached to the mounting board P with the air-core coil C sandwiched between the sandwiching plates 10 and 12. When it is attempted to mount the air-core coil C on the mounting substrate P, the sandwiching plate 10 will hit the winding portion C1 of the air-core coil C adjacent thereto, and the air-core coil C can be mounted on the mounting board P with high density. Disappear.

However, as described above, in the embodiment of the present invention, the part of the one sandwiching plate 10, in particular, the part corresponding to the winding part C1 of the air core coil C which has been already mounted is cut away to form the cutout part 100. Therefore, the air-core coil can be easily and densely mounted regardless of whether or not the air-core coil C is already mounted next to the air-core coil C.

The holding block 11 shown in FIG. 2 has a cut portion 11a whose lower end surface is cut into a mountain-shaped concave shape. The cut portion 11a is inserted into the mounting board P to be wound and mounted on the winding portion C1 of the air-core coil C.
Is a pusher for pressing along the downward arrow D.

This pressing block 11 can be lowered in the direction of arrow D and raised in the opposite direction. On the other hand, the sandwiching plates 10 and 12 can be lowered in the arrow D direction and raised in the opposite direction separately from the pressing block 11.

Next, a method of attaching the air-core coil C to the mounting substrate P will be sequentially described with reference to FIGS.

5 to 9 show the mounting method in steps 1 to 5. Step 1 of FIG.
Then, preferably, a large number of air-core coils C are mounted on the pallet R. The lead portion C2 of the air-core coil C is placed on the pallet R.

As shown in FIG. 3, the side surface portion 1 of the sandwich plate 10
0a and the side surface portion 12a of the sandwiching plate 12 are sufficiently separated from the air core coil C, the sandwiching plates 10 and 12 are positioned above a predetermined air core coil C of the pallet R.

Next, as shown in step 1 of FIG. 5, the sandwiching plates 10 and 12 and the pressing block 11 are lowered to the vicinity of the air core coil C. Then, by moving the sandwiching plates 10 and 12 in the directions opposite to each other in the direction of arrow S, the side surface portions 10a and 12a sandwich and hold both longitudinal side surfaces of the winding portion C1, and the end surface portions 10b and 12b.
Then, a part of both side surfaces of the winding portion C1 on the end side is sandwiched and held.

In this state, the corners 1 of the sandwich plates 10 and 12 are
The pair of lead portions C2 and C2 of the air-core coil C are guided by the inner surfaces of 0d and 12d.

Next, as shown in step 2 of FIG. 6, the sandwiching plates 10 and 12 and the pressing block 11 are raised in the direction of the arrow D1 to set the air-core coil C on the mounting board P shown in FIG. Move to position. The predetermined position is a position where the lead portions C2, C2 of the air-core coil C to be transferred correspond to the holes H, H of the mounting board P.

After that, by lowering the sandwiching plates 10 and 12 in the direction of arrow D, preferably part of the lead portions C2 and C2 are inserted into the holes H of the mounting substrate P, respectively.

However, in this state, the lower ends of the sandwiching plates 10 and 12 are separated from the mounting board P by a predetermined distance L as shown in FIG.
It's getting away.

As described above, it is necessary to set the predetermined interval L without placing the lower ends of the sandwiching plates 10 and 12 on the upper surface of the mounting substrate P exactly, as shown in FIGS. 1 and 2. Dressing plate 1
This is because the cut-out portion 100 of 0 does not hit the winding portion C1 of the adjacent air-core coil C.

Next, as shown in step 4 of FIG. 8, the pressing block 11 is lowered in the direction of arrow D to push down the winding portion C1 in the direction of arrow C. As a result, the lead portion C2 can be completely pushed into the hole H of the mounting board P. When the lead parts C2, C2 are pushed into the hole H, the corners of the lead parts C2, C2 of the winding part C1 are sandwiched by the sandwiching plate 1.
Since it is guided along the inner surfaces of the corner portions 10d and 12d of 0 and 12, the lead portions C2 and C2 can be accurately passed through the hole H.

Next, moving to step 5 in FIG. 9, the holding plate 11 is held in the direction of the arrow D while the sandwiching plates 10 and 1 are held.
The holding force of the air core coil C of 2 is released. This holding force is released by, for example, holding plates 10 and 12 while holding air core coil C in the direction of mounting substrate P with holding block 11.
In the state in which the clamping force is eliminated, for example, in the case of a chuck using a compressor, the air pressure is reduced so that the holding plates 10 and 12 are not positively opened, as shown in FIG. This is performed by slightly separating the sandwiching plates 10 and 12 from the air-core coil C. Then, the sandwiching plates 10 and 12 are raised in the direction of the arrow D1, and then the pressing block 11 is detached from the air-core coil C.

By doing so, the air-core coil C can be obtained as shown in FIGS. 1 and 2 by only requiring a very small buffer area of the sandwiching plates 10 and 12 (also referred to as a chuck buffer area or dead space). As shown in the figure, it is possible to successively and densely mount the mounting board P in a continuous or adjacent state. After this, air core coil C is finally passed through solder or the like.
By electrically connecting the lead portions C2 and C2 to the wiring portion of the mounting board P, the mounting work of the mounting board P of the air-core coil C is completed.

By repeating the above-described operation, the air-core coils can be sequentially mounted one by one in the holes H of the mounting substrate P. By the way, as described above, the lead portions C2, C2 of the air-core coil C are guided by the inner surfaces of the corner portions 10d, 12d of the sandwiching plates 10, 12 of FIG. Since the portions C2 and C2 are inserted into the holes H of the mounting substrate P, the lead portions C2 and C2 are held when the air core coil C is held.
There is no deformation and the like, and the insertion of the lead portion C2 into the hole H is easy and reliable. In the above-described embodiments of the present invention, the plurality of holding members sandwich and hold the side portions of the electronic component. Then, when the plurality of holding members insert a part of the electronic component into the holes of the substrate at a position away from the substrate for mounting the electronic component, the holding members are at a position separated from the substrate by a distance L. Moreover, since the cutout portion is provided, it is possible to prevent the holding member from hitting another electronic component mounted on the substrate. Thereby, an electronic component can be newly mounted in the immediate vicinity of the already mounted electronic component, and high-density mounting of electronic components can be performed.

Next, the sandwiching plates 10 and 12 constituting the above-mentioned chuck and the pressing block 11 as the pressing means.
An example of a chucking device including the above will be described with reference to FIGS. 10 and 11.

10 and 11 show an example of a chuck device, FIG. 10 is a side view with a partial cross section of the chuck device, and FIG. 11 is a front view of the chuck device.

On the upper rear side of the apparatus main body 20 shown in FIG.
A cylinder 21 for moving the sandwiching plates 10 and 12 up and down is attached, and a cylinder 22 for opening and closing the sandwiching plates 10 and 12 is attached to the upper part of the front side of the apparatus body 20. On the lower side of the device body 20, the metal bush 2
An up-and-down moving block 23 is attached via 4 to be vertically movable.

The vertical movement block 23 is pushed up by the return spring 25. As shown in FIG. 11, two slide guide shafts 2 are provided on the front side of the vertical movement block of FIG.
6, 26 are attached in a state of protruding left and right.
A pair of left and right moving blocks 27, 27 are attached to both ends of the guide slide shafts 26, 26 so as to be movable left and right.

Since the left and right moving blocks 27, 27 are biased inward by the spring member, the left and right moving blocks 27, 27 are
27 is an adjusting screw 28, the inner end of the 28 is a vertical movement block 23.
It is adapted to move to the center side of the apparatus main body 20 to a position where it hits.

At the lower end of the vertically moving block 23, the sandwich plate 1
0 and 12 are attached respectively, and cam protrusions 29 and 29 are attached to the front side of the left and right moving blocks 27 and 27.

At the tip of the cylinder rod 22a of the cylinder 22 for opening and closing the sandwich plate, a cam plate 30 for moving the left and right moving blocks 27, 27 left and right by being engaged with and disengaged from the cam protrusions 29, 29 is attached. Has been. The tip end side of the cylinder rod of the cylinder 21 for raising and lowering the sandwiching plate can be engaged and disengaged in relation to the vertical movement block 23.

As shown in FIG. 10, the upper part of the pressing block 11 arranged on the upper side between the sandwiching plates 10 and 12 is inserted into the hole 20a at the lower end of the apparatus main body 20.
In this case, the pressing block 11 is positioned in a state of being pressed to a predetermined lower position by the absorbing spring 31.

Such a chuck device can be used for front and rear, left and right,
The robot can be attached to the lower end of a vertically movable robot (not shown).

Next, the operation of this chuck device will be described.
Above the pallet R as shown in FIG. 5, the cylinder rod 22a of the opening / closing cylinder 22 descends to lower the cam plate 30, so that the cam plate 30 and the cam projections 29, 29 are engaged with each other. As a result, as shown in FIG. 11, the pair of left and right moving blocks 27, 27 move outwards from each other,
Open the pair of sandwich plates 10, 12. This sandwich plate 10, 12
The open state of is shown in FIG.

Next, the cylinder rod of the cylinder 21 for vertically moving the sandwiching plate descends and pushes down the vertically moving block 23 in FIG. 10 against the repulsive force of the return spring 25, so that the slide guide shafts 26, 26. Through the left and right block 2
7, 27 also descend, and the sandwiching plates 10, 12 move in the direction of arrow D. In this case, the cam protrusions 29, 29 are attached to the cam plate 3
In order to move the straight line portion of 0, the pair of sandwich plates 10, 10
Keeps it open.

Next, the cylinder rod 22a of the opening / closing cylinder 22 is raised to move the cam plate 30 and the cam projections 29, 29.
Is disengaged. As a result, the sandwiching plates 10 and 12 are closed, and the sandwiching plates 10 and 12 position and hold the air-core coil C on the pallet R as shown in FIGS. 5 and 6. In this state, the chuck device moves to a predetermined upper position of the mounting board P in the direction of arrow D1 in FIG. 6, and then moves down to the mounting board P side shown in FIG. 7 in the direction of arrow D, and the lead portion C2 of the air-core coil C is moved. The mounting board P is inserted into the hole H as shown in FIG.

Next, the cylinder rod of the vertical cylinder 21 is raised, and the vertical movement block 23 is raised by the force of the return spring 25, whereby the slide guide shafts 26, 26.
And the sandwich plates 10, 10 via the left and right moving blocks 27, 27.
Also rises. In this case, the holding block 11 holds the upper part of the winding portion C1 of the air-core coil C in order to lower the entire chuck device in time with the raising operation of the sandwiching plates 10, 10. The sandwich plates 10 and 12 are separated from the air-core coil C.

The mounting apparatus of the present invention is an apparatus for mounting an air-core coil-shaped component on, for example, a PCB substrate, and the component insertion chuck is a two-part box type such as the sandwiching plates 10 and 12, and is inserted. Without positively opening the rear chuck, for example, by lowering the air pressure of the cylinder, the clamping force of the clamping plates 10 and 12 is eliminated, and the rear chuck is detached. Further, the shape is devised so that the component posture can be reliably maintained and the chuck buffer area can be secured. Minimization of (dead space) and close mounting in the axial direction of the air core coil are possible.

The sandwiching plates 10 and 12 are rigid flat plates each having a substantially L-shaped cross section.
The d and 12d portions are opposed to each other. It is sandwiched so that the surface of the air-core coil fits in the right-angled space generated by this.
The air-core coil can be inserted into the substrate by transferring this onto the substrate and pushing it out. By providing a cutout groove having substantially the same shape as the air-core coil winding surface in the end face direction of the rigid plate, it is possible to avoid buffering with the existing air-core coil already mounted on the substrate.

In the embodiment of the present invention, a chuck having a shape in which two substantially L-shaped plate-like claws are arranged in point symmetry is used. By closing and clamping the chuck so that the legs of the air-core coil component come inside the corners of the L-shaped chuck, the most important lead portion (leg) variation during mounting is eliminated, and the mounting board The lead portion can be reliably inserted into the hole. The direction of movement of the jaws for opening and closing the chuck is not limited to a right angle with respect to the axis of the air-core coil, but may be an oblique direction.

After the component is inserted, the clamping force of the chuck is lost while the component is pressed to the substrate side by a pressing block called pusher which is a structure different from the chuck (for example, in the case of a chuck using compressed air, Only the air pressure is dropped, and the positive opening operation is not performed), so that only the chuck is detached from the air core coil, and then the pusher is detached. As a result, the air-core coil can be mounted on the substrate in the extremely small chuck buffer area (dead space).

The insertion height of the air-core coil component is set so that it is inserted into the hole H only at the tip of the foot, and the foot (lead portion) of the remaining air-core coil component is inserted only by the holding block. ing. When the next air core coil component is to be inserted into the air core coil that has already been mounted in close contact with it in the axial direction, the portion of the sandwiching plate (claw) that cushions the air core coil that has already been mounted should be deleted. Thus, the air-core coil can be closely mounted in the axial direction.

The present invention is not limited to the above embodiment. In the above-described embodiment, the case where the air-core coil is mounted on the substrate has been described. However, the present invention is not limited to this, and can be applied to the case where various electronic components other than the air-core coil are mounted.

[0066]

As described above, according to the present invention, electronic components such as air core coils can be mounted on a substrate with high density.

[Brief description of drawings]

FIG. 1 is a front view showing a preferred embodiment of a mounting apparatus and an air core coil which is an electronic component of the present invention.

FIG. 2 is a perspective view showing the mounting apparatus and the air-core coil shown in FIG.

3 is a plan view having a cross section showing a sandwiching plate and an air core coil of the mounting apparatus of FIG. 1. FIG.

FIG. 4 is a plan view having a cross section showing a state in which the sandwich plate of FIG. 3 holds an air-core coil.

5 is a view showing a sandwiching plate, an air-core coil, and a pressing block corresponding to FIG.

FIG. 6 is a view showing a state where the air-core coil shown in FIG. 5 is held by a sandwiching plate and lifted.

FIG. 7 is a diagram showing a state where a lead portion of an air-core coil is partially inserted into a hole of a mounting board.

FIG. 8 is a diagram showing a state where the lead portion of the air-core coil is completely inserted into the hole of the substrate by the pressing block.

FIG. 9 is a view showing a state in which the sandwiching plate is separated from the air-core coil in a state where the sandwiching plate is pressed by a pressing block.

FIG. 10 is a side view having a cross section showing an example of a chuck device as a mounting device including the sandwiching plate and the pressing block of the present invention.

11 is a front view of the chuck device of FIG.

FIG. 12 is a diagram showing a sandwiching plate, an air-core coil, and a pressing block in the chuck device shown in FIGS. 10 and 11.

FIG. 13 is a view showing an air core coil held by a sandwich plate.

FIG. 14 is a view showing the air-core coil and the sandwiching plate in a state corresponding to FIG.

FIG. 15 is a plan view showing an air-core coil and a sandwiching plate corresponding to FIG.

FIG. 16 is a diagram showing how a conventional chuck device attaches an air-core coil as an electronic component to a mounting substrate.

FIG. 17 is a view showing an occupied space when the air-core coil is attached to the mounting board by the conventional chuck device of FIG. 16.

FIG. 18 is a diagram showing a deformed state of the air-core coil when the air-core coil is attached to the mounting substrate by the conventional chuck device of FIG. 16.

FIG. 19 is a diagram showing types and shapes of air-core coils as an example of electronic components.

[Explanation of symbols]

 10, 12 sandwiching plate (holding member) 11 pressing block (pusher, pressurizing means) 100 notch C air core coil (electronic component) C2, C2 air core coil lead (foot) H mounting board hole L Distance between sandwich plate and mounting board P Mounting board

Claims (5)

[Claims] 1. A plurality of holding members for holding a side portion of an electronic component between them, wherein a part of the electronic component is inserted into a hole of the substrate at a position separated from a substrate for mounting the electronic component. At this time, the holding member having a cutout portion for avoiding hitting an electronic component mounted on another substrate adjacent to the electronic component, and the electronic held by the plurality of holding members A mounting device for an electronic component, further comprising: a pressing unit for inserting the component into the hole of the substrate. 2. The holding member is provided with the cutout portion in one of the plurality of holding members, and the plurality of holding members have a substantially L-shaped cross section. Mounting device for the electronic component described. 3. The electronic component is a coil.
An electronic component mounting apparatus as described in. 4. A holding member sandwiches and holds a side portion of an electronic component, and at a position where the holding member is separated from a substrate for mounting the electronic component, a part of the electronic component is placed in a hole of the substrate. Inserting, the cutout portion of the holding member, avoiding hitting another electronic component adjacent to the electronic component, by pressing means, the electronic component held by the plurality of holding members, Furthermore, the method for mounting an electronic component is characterized in that the electronic component is inserted into the hole of the substrate. 5. The electronic component held by the plurality of holding members is further inserted into the hole of the substrate by the pressurizing means in a state where the pressure giving the holding force of the holding member is released. Item 4. A method for mounting an electronic component according to Item 4.