JPH08167318A - Heat radiating structure of heating component - Google Patents

Abstract

PURPOSE: To facilitate close contact work so as to improve heat radiating effect by bringing a heating component into close contact by means of the elasticity of a pressing piece. CONSTITUTION: Since a heating component 2 is fixed in a case main body 1 and is brought into close contact with an elastic pressing piece 3, the heating component 2 is sandwiched between a pair of side boards 4 facing each other of the main body 1 via the pressing piece 3. Since the component 2 is brought into close contact with the pressing piece 3 by the elasticity of the pressing piece 3, sandwiching the component 2 with a fitting spring or fastening the component 2 with a fitting screw is not required so that no number of part items increases. Since the component 2 is brought into close contact by pushing to fix in the main body 1, close contact work is facilitated and heat radiating effect is improved even if the elasticity of the pressing piece 3 is strong. Since the component 2 is sandwiched between the pair of side boards 4 facing each other of the main body 1 via the pressing piece 3, the heat radiating area of the component 2 becomes large so that the heat radiating effect is further improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiation structure for heat generating components of electronic components.

[0002]

2. Description of the Related Art A first conventional example is shown in FIGS. That is, the heat dissipation structure of the heat generating component is such that the metal case body 50, the printed circuit board 53 on which the electronic component 52 including the heat generating component 51 such as a transistor is mounted, and the heat generating component 51 are closely attached to the side plate of the case body 50. And a spring 54. 55 is a lid for closing the opening of the case body, 56
Is a terminal.

A second conventional example is shown in FIGS. That is, the heat dissipating structure of this heat-generating component has the mounting spring 5
Instead of 4, the heat generating component 51 and one piece of the L-shaped heat dissipation plate 57 are attached to the printed circuit board 53 with the attachment screws 58, and are attached to the side plate of the case body 50 with the attachment screws 59. The other common parts are given the same reference numerals.

[0004]

However, in the first conventional example, the heat generating component 51 is attached to the case body 50 by the mounting spring 54.
However, if the mounting spring 54 is made strong, it becomes difficult to attach the heat generating component 51. There are drawbacks.

The second conventional example has the disadvantages that the mounting screw 59 is mounted only on one side plate of the case body 50, so that the heat radiation area is small and the mounting work is troublesome.
Further, in the first conventional example and the second conventional example, the mounting spring 5 is used.
4 and the mounting screw 59 are required, and there is a drawback that the number of parts increases. Therefore, an object of the present invention is to provide a heat-dissipating structure for a heat-generating component, in which the number of components does not increase, the heat-dissipating effect is good, and the work of closely adhering the heat-generating component is easy.

[0006]

According to a first aspect of the present invention, there is provided a heat dissipating structure for a heat-generating component, comprising a metal case body having an elastic pressing piece on its side plate, and heat generated by being fixed in the case body and being in close contact with the elastic pressing piece. And parts. A heat dissipation structure for a heat-generating component according to claim 2, wherein a metal case body having an elastic pressing piece on a side plate and a pair of side pressing plates housed in the case body and facing each other of the elastic pressing piece. And a heat-generating component sandwiched therebetween.

[0007]

According to the heat dissipating structure for a heat-generating component of claim 1, since the heat-generating component is brought into close contact with the elastic pressing member by the elasticity of the elastic pressing member, the heat-generating component is sandwiched between the mounting springs as in the prior art.
The number of parts does not increase because it is not tightened with the mounting screws, and the heat generating parts can be fixed to the case body just by pushing them into close contact with the elastic pressing piece. The work is facilitated and the heat dissipation effect can be improved.

According to the heat dissipation structure of the heat-generating component of claim 2,
Since the heat-generating component is sandwiched between the pair of side plates facing each other of the case body via the elastic pressing piece, the heat-dissipating component has a large heat-dissipating area, so that the heat-dissipating effect is further improved.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A discharge lamp lighting device to which an embodiment of the present invention is applied will be described with reference to FIGS. That is, the heat dissipation structure of the heat generating component has the case body 1 and the heat generating component 2. The case body 1 is made of metal and has elastically deformable elastic pressing pieces 3 on its side plates. Case body 1 of the embodiment
Consists of a bottom plate 5 and both side plates 4 rising from both sides of the bottom plate 5, and is an elongated box-like shape having an opening formed between the both side plates 4, and mounting holes 6 are formed at both ends of the bottom plate 5. The elastic pressing piece 3 is formed in a convex curve so as to project in the opposing direction as shown in FIG. Are provided at two locations in the longitudinal direction of the. A printed circuit board 7 is housed in the case body 1. This printed circuit board 7
Has an electronic component 14 that constitutes a lighting circuit, and has an input terminal 8 and an output terminal 9 at both ends. Input terminal 8
As shown in FIG. 3, an AC power source 10 is connected to the output terminal 9 and a discharge lamp 11 is connected to the output terminal 9 so that the discharge lamp 11 can be turned on.

The heat-generating component 2 is fixed in the case body 1 and comes into close contact with the elastic pressing piece 3, and is sandwiched between the pair of side plates 4 of the case body 1 facing each other via the elastic pressing piece 3. . In the embodiment, the transformer 2a and the transistor 2b of the electronic component 14 are used as the heat generating component 2, and these are elastic pressing pieces 3.
It is pinched by. In this case, notches 12 are formed on both side edges of the printed circuit board 7 facing the elastic pressing piece 3 so that the elastic pressing piece 3 is easily elastically deformed. The transistor 2b is a heat sink 16 having a substantially Z-shaped plane.
Both side pieces 16a which are attached to the printed circuit board 7 by the mounting screws 15 via the
Are sandwiched between the elastic pressing pieces 3. 13 is the case body 1
Is a lid that covers the upper surface of the.

According to this embodiment, since the heat-generating component 2 comes into close contact with the elastic pressing member 3 due to the elasticity of the elastic pressing member 3, it is possible to sandwich the heat-generating component with the mounting spring or tighten the mounting screw as in the prior art. Since there is no, the number of parts does not increase,
Further, since the heat generating component 2 is pressed into the case body 1 and fixed to the elastic pressing piece 3, the elastic pressing piece 3 is closely attached.
Even if the elasticity is strong, the adhesion work can be facilitated and the heat dissipation effect can be improved.

Since the heat-generating component 2 is sandwiched between the pair of side plates 4 of the case body 1 which face each other with the elastic pressing piece 3 interposed therebetween, the heat-dissipating area of the heat-generating component 2 is increased, so that the heat-dissipating effect is further enhanced. Will be good. A second embodiment of the present invention is shown in FIGS. That is, in the heat dissipation structure of this heat-generating component, the pair of transistors 2b is used as the heat-generating component 2, and this is attached to the surface of one piece 17b of the radiator 17 bent in an L shape, and this one piece 17b is attached together with the transistor 2b by the mounting screw 15. The other piece 17a is attached to the printed circuit board 7 and faces the side plate 4 of the case body 1. The elastic pressing piece 3 is formed by cutting and raising, and the elastic pressing piece 3 is in elastic contact with the other piece 17a. Others are the same as those in the first embodiment, and therefore, common parts are denoted by the same reference numerals and description thereof is omitted. This embodiment also has substantially the same operational effect as the first embodiment.

A third embodiment of the present invention is shown in FIG.
That is, in the heat dissipation structure of this heat-generating component, the transistor 2b, which is the heat-generating component 2, is attached to the printed board 7 via the heat sink 18 by the mounting screw 15. The heat dissipation plate 18 is formed by bending both side pieces 19, and the both side pieces 19 are sandwiched by the elastic pressing piece 3 of the case body 1. The elastic pressing piece 3 is formed to have a width that avoids the printed circuit board 7, and does not have the cutout 12 as in the first embodiment. Others are the same as those in the first embodiment, and therefore, common parts are denoted by the same reference numerals and description thereof is omitted. Further, this embodiment also has the same operation and effect as the first embodiment.

A fourth embodiment of the present invention is shown in FIGS. 15 and 16. That is, in the heat dissipation structure of this heat generating component, the transistor 2b which is the heat generating component 2 is attached to the printed circuit board 7 by the mounting screw 15, and one elastic pressing piece 3 formed by cutting and bending on one side plate 4 of the case body 1. The transistor 2b is sandwiched by pressing the side surface of the transistor 2b against the side plate 4 on the opposite side of the case body 1. Others are the same as those in the first embodiment, and therefore, common parts are denoted by the same reference numerals and description thereof is omitted. This embodiment is also the first
The effect is almost the same as that of the embodiment.

In the present invention, the heat generating component 2 is sandwiched by the elastic pressing piece 3 so that the case body 1 can be held.
The printed circuit board 7 of the heat-generating component 2 is fixed to the
The fixing to the printed circuit board 7 may be omitted, or the heat generating component 2 may be provided separately from the printed circuit board 7.

[0016]

According to the heat dissipating structure of the heat generating component of the first aspect, since the heat generating component is brought into close contact with the elastic pressing member by the elasticity of the elastic pressing member, the heat generating component is pinched by the mounting spring or the mounting screw is mounted as in the prior art. Since the number of parts does not increase because it is not tightened with, and since it adheres to the elastic pressing piece just by fixing the heat generating part in the case body, the adhesion work can be performed even if the elastic pressing piece has a strong elasticity. There is an effect that it becomes easy and the heat dissipation effect can be improved.

According to the heat dissipation structure of the heat-generating component of claim 2,
Since the heat-generating component is sandwiched between the pair of side plates facing each other of the case body via the elastic pressing piece, the heat-dissipating component has a large heat-dissipating area, so that the heat-dissipating effect is further improved.

[Brief description of drawings]

1A and 1B show a lighting device to which a first embodiment of the present invention is applied, where FIG. 1A is a plan view of an open state, FIG. 1B is a front view of a closed state, and FIG. It is a top view of a state.

2A is a right side view thereof, and FIG. 2B is a left side view thereof.

FIG. 3 is a connection diagram showing an external circuit of the lighting device.

FIG. 4 is a partially enlarged view of FIG.

FIG. 5 is a partially exploded perspective view showing a state in which the heat generating component is removed.

FIG. 6 is a partial perspective view of a state in which heat generating components are stored.

FIG. 7 is a partially enlarged view of FIG.

FIG. 8 is a plan view of the heat generating component.

9A and 9B show a second embodiment, in which FIG. 9A is a plan view in an open lid state, FIG. 9B is a front view in a closed lid state, and FIG. 9C is a plan view thereof.

FIG. 10 is a right side view thereof.

FIG. 11 is a partially enlarged perspective view showing a heat generating component.

FIG. 12 is a partially exploded perspective view showing the heat generating component and the elastic pressing piece.

FIG. 13 is a partial perspective view of a heat generating component in a stored state.

14A and 14B show a third embodiment, wherein FIG. 14A is a perspective view of a heat-generating component, and FIG. 14B is a partial perspective view of the heat generating component housed in a case body.

FIG. 15 is a partially exploded perspective view of the fourth embodiment.

FIG. 16 is a partial perspective view of a state in which the heat generating component is stored.

17A and 17B show a first conventional example, in which FIG. 17A is a plan view in an open lid state, FIG. 17B is a front view in a closed lid state, and FIG.

FIG. 18 is a right side view thereof.

FIG. 19 is a partial side view of the heat generating component in a mounted state.

20A and 20B show a second conventional example, in which FIG. 20A is a plan view in an open state, FIG. 20B is a front view in a closed state, and FIG.

FIG. 21 is a right side view thereof.

FIG. 22 is a partial perspective view of a heat generating component in an attached state.

[Explanation of reference numerals] 1 case body 2 heat generating component 3 elastic pressing piece 4 both side plates

Claims (2)

[Claims] 1. A heat-dissipating structure for a heat-generating component, comprising: a metal case body having an elastic pressing piece on a side plate; and a heat-generating component fixed in the case body and in close contact with the elastic pressing piece. 2. A metal case body having elastic pressing pieces on side plates, and heat generated by being housed in the case body and sandwiched between a pair of side plates facing each other of the case body via the elastic pressing pieces. A heat dissipation structure for heat generating parts including parts.