JPH08162377A - Chip part filling device - Google Patents

Abstract

PURPOSE: To realize a chip filling device which is capable of improving holding holes provided to a holding plate in chip part mounting rate. CONSTITUTION: A holding plate 20 provided with holding holes which hold chip parts and a guide plate 10 provided with guide holes for guiding chip parts to the holding holes are placed on the base plate 40 of a filling device. A stay guide 30 is arranged on the surface of the guide plate 10. When the guide plate 10 and the holding plate 20 are tilted, the stay guide 30 is moved by a motor 32 and a poke screw 31 from a start point A to an end point B on the surface of the guide plate 10 at a constant speed restraining chip parts 9 from shifting or coming off.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer device used for inserting a chip component such as a chip capacitor or a chip resistor into a holding hole of a holding plate, and particularly to a holding hole for holding a large number of chip components. The present invention relates to a transfer device for chip parts, which has an improved filling rate.

[0002]

2. Description of the Related Art Conventionally, a holding plate for elastically holding a large number of chip parts has been used in order to simultaneously apply an electrode material to the ends of a large number of chip parts. FIG. 3 is a cross-sectional perspective view showing the general structure of such a holding plate. The holding plate 20 is made of an elastic body such as rubber surrounded by a frame body, and a large number of holding holes 21 for elastically supporting the outer surface of the chip component are formed therein.
Usually, when filling the chip components into the holding holes 21 of the holding plate 20, the guide plate 10 is also used. The guide plate 10 is mounted on the surface of the holding plate 20 using positioning pins or the like. A large number of guide holes 11 corresponding to the holding holes 21 of the holding plate 20 are formed in the guide plate 10. The guide hole 11 has a tapered recess so as to guide the chip component to the holding hole 21 of the holding plate 20. As shown in FIG. 4, the chip component 9 guided by the guide hole 11 is attached to the guide plate 10.
And is slightly inserted into the insertion opening of the holding hole 21 of the holding plate 20.

After that, the chip component 9 is press-fitted into the holding hole 21 by the press pin 25 so that the end of the chip component 9 is exposed from the main surface of the holding plate 20.
To fill. When the chip component 9 is filled in the holding plate 20, the guide plate 10 is removed, and the electrode material is applied to the end portion of the chip component 9 protruding from the main surface of the holding plate 20.

Conventionally, in order to efficiently fill a large amount of chip components in the holding plate 20, a chip component transfer device has been used. FIG. 5 is a structural diagram showing a schematic structure of a transfer device for chip parts according to a conventional example, and such a transfer device is disclosed in, for example, Japanese Unexamined Patent Publication No. 5-226201. The transfer device 1 is roughly composed of a stage 2 and
The transfer case 3 is provided with a stage 2 and a swing mechanism section for swinging the transfer case 3 and a leg section 4.

For example, referring to FIG. 6A, the stage 2
Has a placing surface on which the holding plate 20 and the guide plate 10 are placed, and the holding plate 20 is placed on the placing surface.
Opening 2a exposing the lower surface of the mounted
Are formed. Further, one end of the stage 2 has a swing shaft 8
Is engaged with the swing shaft 8 during the operation described later.
It is configured to be swingable around.

Further, the transfer case 3 is formed in a hollow box shape and has an input port 3b for inputting a large number of chip parts 9,
It has a component storage portion 3c for storing the chip component 9 and an opening 3d for receiving the holding plate 20 and the guide plate 10. Further, the lower surface of the component storage section side is engaged with the swing shaft 8 and is rotatable around the swing shaft 8. Further, a lock lever 3a is formed at the tip of the transfer case 3. The lock lever 3a will be described later.

The swing mechanism portion includes a motor 5 capable of rotating in the forward and reverse directions, and a chain 6 for transmitting the rotation of the motor 5.
And a gear 7 that engages with the chain 6, and a swing shaft 8 that serves as a rotation shaft of the gear 7. The swing mechanism section rotates the swing shaft 8 in the forward and reverse directions according to the forward or reverse rotation of the motor 5. Then, the stage 2 and the transfer case 3 perform an oscillating motion according to the rotating operation of the oscillating shaft 8.

Now, the transfer operation of the chip component using the transfer device 1 will be described with reference to FIG. First, FIG.
As shown in (a), after the holding plate 20 and the guide plate 10 are assembled, they are placed on the stage 2 at a predetermined position. Further, a large number of chip components 9 are charged from the component charging port 3b of the transfer case 3 and stored in the component storing section 3c.

Next, as shown in FIG. 6B, the transfer case 3 is put on the surface of the stage 2, and the transfer case 3 is locked to the stage 2 by the lock lever 3a. As a result, the holding plate 20 and the guide plate 10 are received in the opening 3d of the transfer case 3, and the large number of chip components 9 placed in the component storage 3c can be moved onto the surface of the guide plate 10. The stage 2 and the transfer case 3 are integrally swung around the swing shaft 8 by the swing motion of the swing mechanism section described above. As a result, a large number of chip components 9 reciprocate on the surface of the guide plate 10 and are individually introduced into the guide holes 11 of the guide plate 10. At the same time, during this swinging movement, a slight vibration due to a vibrator (not shown) or vertical vibration of the entire stage 2 is further added, and the chip component 9 receives the vibration and enters the guide hole 11 of the guide plate 10. It is easy to be introduced. Further, a suction (vacuum suction) device (not shown) is connected to the opening 2a of the stage 2 to add the operation of sucking the chip component 9 into the holding hole 21 of the holding plate 20.

Further, as shown in FIG. 6 (c), the lock lever 3a of the transfer case 3 is released, and the holding plate 20 is released.
Also, the transfer case 3 is vertically opened while the guide plate 10 is incorporated in the transfer case 3. As a result, the chip component 9 remaining on the guide plate 10 is returned to the component storage section 3c side again. Further, the chip component 9 introduced into the guide hole 11 of the guide plate 10 maintains the held state.

After that, the guide plate 10 and the holding plate 20 are taken out from the transfer case 3 and, as already described with reference to FIG.
The chip component 9 introduced in 1 is pushed into the holding hole 21 of the holding plate 20. Through the above steps, the transfer work of the chip parts to the holding plate 20 is completed.

[0012]

In the conventional transfer device described above, the stage 2 is tilted, that is, the surface of the guide plate 10 is tilted, and the chip component 9 is slid on the surface of the guide hole 11 so as to slide. It is configured to guide the chip component 9 therein. At this time, when the inclination of the surface of the guide plate 10 is gentle, the slip of the chip component 9 is small, the chip component 9 does not spread over the entire surface of the guide plate 10, and when the inclination becomes steep, the guide plate 10
Since the speed of the chip component 9 that slides down toward the tip side of the inclined surface becomes faster, the probability of being guided to the guide hole 11 becomes lower. In particular, such a situation becomes remarkable when the number of chip parts 9 is smaller than the number of guide holes 11 of the guide plate 10.

As described above, in the conventional transfer device, the surface of the guide plate 10 is inclined, and the guide hole 11 is filled with the chip component by the natural sliding movement of the chip component. There is a problem that the filling rate of the chip component into the guide hole 11 becomes low due to the increase in the sliding speed.

It is an object of the present invention to provide a chip component transfer device capable of improving the filling rate of the guide holes of the guide plate of the chip component.

[0015]

A chip component transfer apparatus according to the present invention includes a holding plate having a plurality of holding holes for penetrating and holding the chip component, and a chip plate disposed in the holding plate. And a guide plate having a guide hole for guiding. Then, while tilting the holding plate and the guide plate and moving a large number of chip components supplied to one end side on the guide plate surface to the other end side along the inclination direction on the guide plate surface, individual chip components Through the guide hole of the guide plate and into the holding hole of the holding plate. For this reason, the base on which the holding plate on which the guide plate is placed is placed, and the base on which the base is inclined so that a large number of chip components supplied to one end side of the guide plate can drop toward the other end side The surface of the guide plate is arranged on the surface of the guide plate from the one end side to the other end side of the guide plate while suppressing the movement of the chip component when the guide plate is arranged on the surface of the guide plate according to the inclination of the base. A staying guide that moves at a predetermined speed along with a guide driving unit that moves the staying guide at a predetermined speed.

[0016]

In the transfer device according to the present invention, the staying guide moves in the direction of inclination at a predetermined speed while preventing many chip components from sliding down on the surface of the inclined guide plate. Therefore, the moving speed of the chip component is regulated by the moving speed of the retention guide. Therefore, if the moving speed of the retention guide is set to be slower than the conventional free sliding speed of the chip component, the time for passing over the guide hole of the guide plate becomes longer, and the probability that the chip component is guided into the guide hole is increased. improves. This improves the filling rate of the chip parts.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be clarified by describing embodiments with reference to the drawings.

FIG. 1 is a structural perspective view showing the structure of the main part of a chip component transfer apparatus according to an embodiment of the present invention. The main part shown in the figure can be used by incorporating it into the conventional transfer device shown in FIG. 5, for example, at a position where an assembly of the conventional holding plate 20 and the guide plate 10 is placed.

Referring to FIG. 1, the main part of the chip component transfer device according to the present embodiment is configured such that a holding plate 20 and a guide plate 10 are combined on a surface of a base plate 40 and are detachably held. The holding plate 20 and the guide plate 10 have basically the same structure as the conventional example shown in FIG. That is, a large number of guide holes 11 are formed on the surface of the guide plate 10. Further, the holding plate 20 made of an elastic member such as rubber is provided with a large number of holding holes 21 at positions corresponding to the guide holes 11.

Further, on the surface of the base plate 40, a motor 32, a ball screw 31 connected to the rotation shaft of the motor 32, shaft support plates 33a and 33b for supporting the rotation of the ball screw 31, and a ball screw 31 are provided. A retention guide 30 is formed for engagement.

The staying guide 30 is composed of an engaging portion 30a that engages with the ball screw 31, and a rectangular staying plate 30b extending on the surface of the guide plate. The retention plate 30b contacts the surface of the guide plate 10,
Or with a gap that does not allow chip parts to pass,
It is held so as to move on the surface of the guide plate 10. Then, the stay guide 30 reciprocates between the one shaft support plate 33b and the other shaft support plate 33a in accordance with the normal rotation and the reverse rotation of the ball screw 31. The moving speed of the stay guide 30 is defined by the rotating speed of the ball screw 31, that is, the rotating speed of the motor 32.

The base plate 40 shown in FIG. 1 is constructed, for example, by a structure equivalent to the swing mechanism of a conventional transfer device so that the swing motion is possible. For convenience of the following description, the position indicated by reference symbol A of the guide plate 10 in FIG. 1 is the starting position of the transfer operation of the chip component, and the position indicated by reference symbol B is the end position. The operation of the main part of the transfer apparatus shown in FIG. 1 will be described below with reference to FIG.

First, as shown in FIG. 2A, when the base plate 40 begins to tilt clockwise from the horizontal position about the swing shaft 8, a large number of chip parts 9 are placed at the starting point A on the guide plate 10. Supplied. Further, the motor 32 is driven, and the rotation of the ball screw 31 causes the retention guide 30 to start moving toward the end point B side along the inclined surface of the guide plate 10. The tip guide 9 is prevented from slipping toward the end point B side by the retention guide 30, so that the tip parts 9 are sequentially introduced into the guide holes 11 of the guide plate 10 on the start point A side of the retention guide 30 and gradually move as the retention guide 30 moves. Move to the end point B side. At this time, a minute vibration may be applied to the chip component 9 on the surface of the guide plate 10 by a device such as a vibrator.

Next, as shown in FIG. 2B, when the stay guide 30 moves to the end point B side of the guide plate 10,
The chip component 9 is introduced into most of the guide holes 11 of the guide plate 10. Then, the remaining chip component 9 remains on the end point B side while being retained by the retention guide 30.

Further, as shown in FIG. 2 (c), when the base plate 40 starts to rotate counterclockwise about the swing shaft 8, the chip component 9 remaining on the surface of the guide plate 10 is located on the starting point A side. Begins to slide toward. in this case,
The staying guide 30 does not move and stops on the end point B side.
By this counterclockwise rotation, the chip component 9 sliding down from the end point B side of the guide plate 10 to the starting point A side is introduced into the guide hole 11 not filled with the chip component 9 or slides down to the starting point A side as it is.

Then, as shown in FIG. 2D, the chip component 9 not introduced into any of the guide holes 11 of the guide plate 10 is returned to the chip component storage portion (not shown).

As described above, when the chip guide is transferred using the staying guide 30, the filling rate of the chip parts into the holding holes 21 of the holding plate 20 is 98%, which is about 90% conventionally. Improved. Further, even when the transfer work was performed using less than the total number of the guide holes 11 of the guide plate 10, all the chip components could be introduced into the guide holes 11 of the guide plate 10.

In the examples shown in FIGS. 2A to 2D, the case where the base plate 40 is oscillated once is described. However, the base plate 40 is oscillated a plurality of times depending on the filling state of the chip components. An action may be performed. In this case, the stay guide 3
0 is the returning process of the chip component 9 (FIGS. 2C and 2D)
In the above, the operation may be gradually or all at once returned from the end point B side to the start point A side.

Further, the retention plate 30 of the retention guide 30
As described above, the shape of b is not limited to the rectangular plate shape, and may be any other shape as long as it can move on the surface of the guide plate 10 while suppressing the drop of the chip component 9. It may be.

Further, the moving speed of the staying guide 30 may be appropriately set so that the filling state of the chip component 9 is verified and the optimum filling state is obtained. In addition, by changing the rotation of the motor 32 and the ball screw 31 using a variable device,
The moving speed of the retention guide may be arbitrarily changed.

[0031]

As described above, the tip component transfer apparatus according to the present invention is provided with the retention guide, and guides the tip component at a predetermined speed while suppressing the movement of the tip component that is about to fall on the inclined guide plate surface. Since it is configured to pass over the guide hole of the plate 10, the filling rate of the chip component into the guide plate guide hole or the holding hole of the holding plate is improved, and the transfer work can be made efficient. It was

[Brief description of drawings]

FIG. 1 is a structural perspective view showing a configuration of a main part of a transfer device for chip parts according to an embodiment of the present invention.

FIG. 2 is a transfer operation (a) of a main part of the transfer apparatus shown in FIG.
6A to 6D are operation explanatory diagrams showing FIG.

FIG. 3 is a holding plate 20 used conventionally and in the present invention.
3 is a structural schematic diagram schematically showing a combined structure of the guide plate 10 and the guide plate 10. FIG.

FIG. 4 is a cross-sectional view illustrating an operation of pushing the chip component 9 into the holding plate 20.

FIG. 5 is a schematic structural diagram of a conventional transfer device for chip parts.

6 is a transfer operation (a) to (c) of the transfer device shown in FIG.
FIG.

[Explanation of symbols]

 10 ... Guide plate 11 ... Guide hole 20 ... Holding plate 21 ... Holding hole 30 ... Retaining guide 31 ... Ball screw 32 ... Motor 33a, 33b ... Shaft support plate 40 ... Base plate

Claims (1)

[Claims] 1. A holding plate having a plurality of holding holes for penetrating and holding a chip component, and a guide plate provided on the holding plate and having a guide hole for guiding the chip component to the holding hole. While tilting the holding plate and the guide plate, while moving a large number of chip components supplied to one end side on the guide plate surface to the other end side along the tilt direction of the guide plate surface. A chip component transfer device for introducing each of the chip components into the holding hole of the holding plate through the guide hole of the guide plate, wherein a base on which the holding plate on which the guide plate is placed is placed, The plurality of chip parts supplied to the one end side of the guide plate may drop toward the other end side. A base inclining means for inclining the base, the guide plate being disposed on the surface of the guide plate and suppressing the movement of the chip component when the guide plate is inclined according to the inclination of the base. And a guide drive unit for moving the retention guide at a predetermined speed along the surface of the guide plate from the one end side to the other end side of the guide plate. A transfer device for chip parts.