JPH08159Y2 - Cutting blade cleaning mechanism of cutting equipment - Google Patents

Cutting blade cleaning mechanism of cutting equipment

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Publication number
JPH08159Y2
JPH08159Y2 JP1991093995U JP9399591U JPH08159Y2 JP H08159 Y2 JPH08159 Y2 JP H08159Y2 JP 1991093995 U JP1991093995 U JP 1991093995U JP 9399591 U JP9399591 U JP 9399591U JP H08159 Y2 JPH08159 Y2 JP H08159Y2
Authority
JP
Japan
Prior art keywords
cutting blade
cutting
cleaning mechanism
blade
foreign matter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1991093995U
Other languages
Japanese (ja)
Other versions
JPH0541698U (en
Inventor
隆 土田
Original Assignee
ユーエイチティー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ユーエイチティー株式会社 filed Critical ユーエイチティー株式会社
Priority to JP1991093995U priority Critical patent/JPH08159Y2/en
Publication of JPH0541698U publication Critical patent/JPH0541698U/en
Application granted granted Critical
Publication of JPH08159Y2 publication Critical patent/JPH08159Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Nonmetal Cutting Devices (AREA)

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】本考案は、切断加工装置の切断刃
清浄機構に関する。さらに詳しくは、平刃形の切断刃を
加工材料上で昇降移動させる切断加工装置に具備され切
断刃に付着した加工材料キリコ等の異物を除去する切断
加工装置の切断刃清浄機構において、異物の除去性能に
係る改良に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting blade cleaning mechanism for a cutting machine. More specifically, in the cutting blade cleaning mechanism of the cutting processing device that is provided in the cutting processing device that moves the flat blade-shaped cutting blade up and down on the processing material and removes the foreign material such as the cutting material Chirico attached to the cutting blade, The present invention relates to improvement relating to removal performance.

【0002】[0002]

【従来の技術】従来、切断加工装置の切断刃清浄機構と
しては、例えば、昇降移動する切断刃の昇降移動の途中
位置に切断刃の両側に僅かに当触するような払拭部を固
定的に設置してなるものが知られている。
2. Description of the Related Art Conventionally, as a cutting blade cleaning mechanism of a cutting apparatus, for example, a wiping portion that slightly touches both sides of the cutting blade is fixedly provided at an intermediate position of the ascending / descending movement of the vertically moving cutting blade. It is known to be installed.

【0003】この従来の切断加工装置の切断刃清浄機構
は、昇降移動する切断刃が払拭部と擦違う際に、切断刃
に付着している異物を払拭部で掻落し又は掻上げるよう
にして除去するものである。
The conventional cutting blade cleaning mechanism of this conventional cutting apparatus is designed to scrape or scrape foreign matter adhering to the cutting blade when the cutting blade moving up and down rubs against the wiping portion. To remove.

【0004】このような従来の切断加工装置の切断刃清
浄機構では、切断刃と払拭部とが擦違う構成が採られて
いることから、切断刃,払拭部の当触圧力を高めて異物
の除去性能を高くしようとすると、切断刃の昇降移動に
対する抵抗が強くなり昇降性能が阻害されるため、切断
刃,払拭部の当触圧力を余り高くすることができず異物
の除去性能が低いという問題点を有している。
In the conventional cutting blade cleaning mechanism of such a conventional cutting apparatus, since the cutting blade and the wiping portion are rubbed against each other, the contact pressure between the cutting blade and the wiping portion is increased to remove foreign matter. If you try to improve the removal performance, the resistance to the up-and-down movement of the cutting blade becomes strong and the up-and-down performance is hindered. Therefore, the contact pressure of the cutting blade and the wiping part cannot be increased too much, and the removal performance of foreign matter is low I have a problem.

【0005】[0005]

【考案が解決しようとする課題】本考案は上記従来事情
に鑑みてなされたもので、その目的とする処は平刃形の
切断刃を加工材料上で昇降移動させて加工材料を切断す
る切断加工装置において、切断刃が昇降移動時に抵抗を
受けることなく付着したキリコ等の異物の除去が確実
で、しかもその異物で切断が妨害を受けることがない切
断刃清浄機構を提供することにある。
The present invention It is an object of the present invention the above-described conventional circumstances
It was made in consideration of the
Cut the processing material by moving the cutting blade up and down on the processing material.
In the cutting processing equipment,
Reliable removal of foreign substances such as chips without receiving
And the foreign matter does not interfere with the cutting.
It is to provide a blade cleaning mechanism.

【0006】[0006]

【課題を解決するための手段】前述の課題を解決するた
めに講じた技術的手段は、請求項1は平刃形の切断刃を
加工材料上で昇降移動させる切断加工装置に具備され切
断刃に付着した異物を除去する切断加工装置の切断刃清
浄機構であって、切断刃の上昇停止位置において切断刃
の長手方向に沿って水平状に架設され同切断刃の刃長よ
りも長い移動路と、その移動路に走行可能に設けられ且
つ弾性材で形成した払拭部を切断刃に両側から当触させ
ながら走行させる走行体とを備えたことを要旨とする。
また、請求項2は請求項1記載の走行体が払拭部で掻取
られた異物を受ける異物受けをその払拭部の直下に有す
ることを要旨とする。
The technical means taken to solve the above-mentioned problems are as follows: Claim 1 is a cutting blade provided in a cutting device for moving a flat blade-shaped cutting blade up and down on a work material. A cutting blade cleaning mechanism for a cutting device that removes foreign matter adhering to the cutting blade.
Is installed horizontally along the longitudinal direction of the
The longest moving path, and provided so that it can run on that moving path.
The wiper made of elastic material against the cutting blade from both sides.
The gist of the present invention is to provide a traveling body that allows the vehicle to travel while traveling .
Further, in claim 2, the traveling body according to claim 1 is scraped by a wiping part.
There is a foreign material receiver directly below the wiping part.
The point is that

【0007】[0007]

【作用】(請求項1)切断刃の上昇停止位置で移動路に
沿って走行体を走行させて切断刃を両側から挟んだ払拭
部を切断刃の長手方向へ移動させ、それにより弾性材で
形成したその払拭部を高圧力で刃長全長に当触させて付
着異物を効率的に掻取る。また、切断刃の昇降移動の際
に走行体を切断刃から退避させることで、切断刃の昇降
移動の抵抗になるのを避けることができる。 (請求項2)請求項1によって掻取られた付着異物を加
工材料上に落下させない。
(Claim 1) The traveling body is caused to travel along the moving path at the rising and stopping position of the cutting blade to move the wiping portion sandwiching the cutting blade from both sides in the longitudinal direction of the cutting blade, whereby the elastic material is used. The formed wiping portion is brought into contact with the entire length of the blade under high pressure to efficiently scrape the adhering foreign matter. Further, by retreating the traveling body from the cutting blade when the cutting blade moves up and down, it is possible to avoid the resistance of the cutting blade moving up and down. (Claim 2) The adhered foreign matter scraped off according to claim 1 is not dropped onto the work material.

【0008】[0008]

【実施例】以下、本考案に係る切断加工装置の切断刃清
浄機構の実施例を図面に基づいて説明する。
Embodiments of the cutting blade cleaning mechanism of the cutting apparatus according to the present invention will be described below with reference to the drawings.

【0009】この実施例では、セラミックグリーンシー
ト等の比較的薄性の加工材料Pを複数方向へ連続的に切
断加工するに好適な切断加工装置Mに具備されたものを
示してある。
In this embodiment, a cutting machine M suitable for continuously cutting a relatively thin working material P such as a ceramic green sheet in a plurality of directions is shown.

【0010】この実施例が具備された切断加工装置M
は、基枠Maに固定されたパルスモータMbと、基枠M
aに支持されパルスモータMbによって水平回転移動さ
れる水平回転移動部Mcと、水平回転移動部Mcに固定
されたパルスモータMdと、水平回転移動部Mcに支持
されパルスモータMdによって水平直線移動される水平
直線移動部Meと、水平直線移動部Meに固定されたサ
ーボモータMfと、水平直線移動部Meに支持されサー
ボモータMfによって昇降移動される昇降移動部Mg
と、昇降移動部Mgの下端に取付けられた切断刃Mhと
を備え、切断刃Mhを任意の方向へ一定ピッチで昇降移
動させて加工材料Pを切断加工することができるように
なっている。なお、切断刃Mhの近くには、切断刃Mh
下での加工材料Pの位置を検出して図示しないコントロ
ーラとの連係でパルスモータMb,Md,サーボモータ
Mfを自動的に駆動,補正制御する検出機構Miが設け
られている。
Cutting apparatus M provided with this embodiment
Is the pulse motor Mb fixed to the base frame Ma and the base frame M
The horizontal rotation moving part Mc supported by a and horizontally rotated by the pulse motor Mb, the pulse motor Md fixed to the horizontal rotation moving part Mc, and the horizontal linear movement by the pulse motor Md supported by the horizontal rotation moving part Mc. A horizontal linear moving part Me, a servo motor Mf fixed to the horizontal linear moving part Me, and an elevating moving part Mg supported by the horizontal linear moving part Me and moved up and down by the servo motor Mf.
And a cutting blade Mh attached to the lower end of the elevating and moving unit Mg, and the cutting material Mh can be moved up and down in any direction at a constant pitch to cut the processing material P. In addition, near the cutting blade Mh, the cutting blade Mh
A detection mechanism Mi is provided for detecting the position of the processing material P below and automatically driving and correcting the pulse motors Mb and Md and the servo motor Mf in cooperation with a controller (not shown).

【0011】さらに、この切断加工装置Mは、搬送フィ
ルムMkを捲回した搬送フィルム繰出しローラM1と搬
送フィルムMkを巻取る搬送フィルム巻取りローラMm
とを切断刃Mhの下方に間隔を介して配置し、搬送フィ
ルムMkに加工材料Pを載せて連続的に切断刃Mh直下
に移動供給するようになっている。
Further, the cutting and processing apparatus M includes a transport film feeding roller M1 on which the transport film Mk is wound and a transport film winding roller Mm for winding the transport film Mk.
Are arranged below the cutting blade Mh with a space therebetween, and the processing material P is placed on the transport film Mk so as to be continuously moved and supplied immediately below the cutting blade Mh.

【0012】さらに、この切断加工装置Mは、搬送フィ
ルム繰出しローラM1,搬送フィルム巻取りローラMm
の間の搬送フィルムMkの下面に沿って配設された固定
台Mjの中央部の切断刃Mhの直下にまな板Mnを設置
し、まな板Mnを昇降部Moで昇降可能にし、まな板M
nの昇降で加工材料Pを一定の加工工作面に設定するこ
とができるようになっている。
Further, the cutting apparatus M includes a conveying film feeding roller M1 and a conveying film winding roller Mm.
The cutting board Mn is installed just below the cutting blade Mh at the center of the fixed base Mj arranged along the lower surface of the transport film Mk between the cutting board Mk, and the cutting board Mn can be moved up and down by the lifting unit Mo.
The working material P can be set on a constant working surface by raising and lowering n.

【0013】このような切断加工装置Mにおいて、前記
切断刃MhはカッタホルダMpに取付けられ、カッタホ
ルダMpはボックス形のツールボックスMrに取付けら
れ、ツールボックスMrは昇降移動部Mgの下端に取付
けられている。なお、ツールボックスMrには、カッタ
ホルダMpに沿ってスライドし切断刃Mhを出没させる
ストリッパMsが切断刃Mhを露出させる方向へ弾圧付
勢するスプリングMtを有して設けられ、昇降移動部M
gには、ストリッパMsに対してスプリングMtの逆方
向へ押圧力を付与するエア圧,オイル圧に応動型のシリ
ンダロッドMuが設けられている。このため、シリンダ
ロッドMuの押圧力を制御することにより、加工材料P
に対するストリッパPの押圧力を調整することができる
と共に、昇降移動の任意の位置で切断刃Mhを出没させ
ることもできる。
In such a cutting apparatus M, the cutting blade Mh is attached to the cutter holder Mp, the cutter holder Mp is attached to the box-shaped tool box Mr, and the tool box Mr is attached to the lower end of the ascending / descending movement unit Mg. There is. The tool box Mr is provided with a stripper Ms that slides along the cutter holder Mp to move the cutting blade Mh in and out, and includes a spring Mt that elastically biases the cutting blade Mh in a direction to expose the cutting blade Mh.
The g is provided with a cylinder rod Mu that is responsive to air pressure and oil pressure that applies a pressing force to the stripper Ms in the direction opposite to the spring Mt. Therefore, by controlling the pressing force of the cylinder rod Mu, the processing material P
The pressing force of the stripper P with respect to can be adjusted, and the cutting blade Mh can be projected and retracted at an arbitrary position for vertical movement.

【0014】このような切断加工装置Mに対して、切断
刃清浄機構Cは、前記水平直線移動部Meに固定され前
記昇降移動部Mgに沿って垂設された取付け部1に取付
けられた移動路2と、移動路2を走行する走行体3とで
構成されている。
In contrast to the cutting apparatus M, the cutting blade cleaning mechanism C is mounted on the mounting portion 1 which is fixed to the horizontal linear moving portion Me and vertically installed along the elevating and moving portion Mg. It is composed of a road 2 and a traveling body 3 that travels on the moving road 2.

【0015】移動路2は、切断刃Mhの上昇死点の位置
に切断刃Mhの刃長方向に沿って配設されたガイドシャ
フト21と、ガイドシャフト21の下方にガイドシャフ
ト21と平行に配設された走行シャフト22とからな
る。なお、これ等のガイドシャフト21,走行シャフト
22は、切断刃Mhの刃長よりも長く形成されている。
The moving path 2 is arranged at the position of the ascending dead center of the cutting blade Mh along the lengthwise direction of the cutting blade Mh, and below the guide shaft 21 in parallel with the guide shaft 21. The traveling shaft 22 is provided. The guide shaft 21 and the traveling shaft 22 are longer than the cutting blade Mh.

【0016】走行体3は、ガイドシャフト21に嵌合し
てスライドするガイド筒31と、ガイド筒31に吊持さ
れ走行シャフト22に嵌合して走行するロッドレスシリ
ンダ32と、ロッドレスシリンダ32に支持されて切断
刃Mhを両側から挟付けるニトリルゴム等の弾性材から
なる払拭部33と、払拭部33の下方に支持された皿形
の異物受け34とからなる。
The traveling body 3 includes a guide cylinder 31 which fits on the guide shaft 21 and slides, a rodless cylinder 32 which is hung on the guide cylinder 31 and fits on the traveling shaft 22 to travel, and a rodless cylinder 32. The wiper 33 is made of an elastic material such as nitrile rubber and is supported by the wiper 33 to sandwich the cutting blade Mh from both sides, and a dish-shaped foreign matter receiver 34 supported below the wiper 33.

【0017】このような実施例によると、切断刃清浄機
構Cを機能させるには、切断刃Mhが上昇死点に到達し
た際に、シリンダロッドMuの押圧力を制御しストリッ
パPをスライドさせて切断刃Mhを露出させ、移動路2
に走行体3を走行させることになる。走行体3が走行す
ると、切断刃Mhを両側から挟んだ払拭部33が切断刃
Mhの刃長方向へ移動し、弾性材で形成され切断刃Mh
に高圧力で当触する払拭部33で切断刃Mhに付着した
異物Dを効率的に掻取ることができる。そして、このよ
うに掻取られた異物Dは、払拭部33の下方の異物受け
34内に収納され加工材料P上には落下しないようにな
っている。また、切断刃Mhの昇降移動の際には、切断
刃Mhの刃長よりも長く形成されている移動路2を利用
して、走行体3を切断刃Mhから退避させることがで
き、切断刃清浄機構Cが切断刃Mhの昇降移動の抵抗と
なることを避けることができる。
According to such an embodiment, in order for the cutting blade cleaning mechanism C to function, when the cutting blade Mh reaches the ascending dead center, the pressing force of the cylinder rod Mu is controlled and the stripper P is slid. Exposing the cutting blade Mh and moving path 2
The traveling body 3 is caused to travel. When the traveling body 3 travels, the wiping unit 33 sandwiching the cutting blade Mh from both sides moves in the blade length direction of the cutting blade Mh, and is formed of an elastic material.
The foreign matter D adhering to the cutting blade Mh can be efficiently scraped off by the wiping unit 33 that is in contact with the high pressure. The foreign matter D thus scraped off is stored in the foreign matter receiver 34 below the wiping unit 33 and is prevented from falling onto the processing material P. When the cutting blade Mh is moved up and down, the traveling body 3 can be retracted from the cutting blade Mh by using the moving path 2 formed longer than the blade length of the cutting blade Mh. It can be avoided that the cleaning mechanism C acts as a resistance to the vertical movement of the cutting blade Mh.

【0018】なお、前述の切断刃清浄機構Cの動作は走
行体3の直線移動動作であり切断刃Mhが上昇死点に到
達した際に迅速に行うことができるため、切断刃清浄機
構Cの動作に対応して切断刃Mh(昇降移動部Mg)の
昇降移動を駆動するサーボモータMfを一々停止する必
要はない。又、この切断刃清浄機構Cは、切断刃Mhが
上昇した際に必ず動作させなければならないものではな
く、切断刃Mhの数回の上昇に対して1回動作するよう
に設定したり、切断刃Mhの異物Dの付着状態を切断刃
Mhの切味の低下による昇降移動の所要時間の変化から
検出して自動的に動作するように設定したりすることも
でき、さらに走行体3を片道走行,往復走行させる選択
も可能である。
The above-mentioned operation of the cutting blade cleaning mechanism C is a linear movement operation of the traveling body 3 and can be quickly performed when the cutting blade Mh reaches the ascending dead center. It is not necessary to stop the servo motor Mf that drives the vertical movement of the cutting blade Mh (the vertical movement unit Mg) in response to the operation. Further, the cutting blade cleaning mechanism C is not necessarily required to operate when the cutting blade Mh moves upward, and is set to operate once for several times the cutting blade Mh moves up, or the cutting blade Mh is cut. It is also possible to detect the adhesion state of the foreign matter D on the blade Mh from the change in the time required for the up-and-down movement due to the deterioration of the sharpness of the cutting blade Mh and set it to automatically operate. You can also choose to drive or reciprocate.

【0019】以上、図示した実施例の外に、走行体3を
スクリューネジ,モータ等により走行駆動する実施例と
することも可能である。
In addition to the illustrated embodiment, the running body 3 may be driven by a screw, a motor or the like.

【0020】[0020]

【考案の効果】以上のように本考案に係る切断加工装置
の切断刃清浄機構は、切断刃の上昇停止位置で弾性材で
形成され切断刃に高圧力で当触する払拭部を刃長全長以
上まで長手方向に沿って走行移動させてキリコ等の異物
を効率的に掻取ると共に掻取り後には切断刃の昇降移動
範囲からその払拭部が外れる切断刃清浄機構であるか
ら、切断刃の切断時の昇降性能を阻害することなく切断
刃の刃長全長に亘って付着したキリコ等の異物を確実に
除去することができる。しかも、払拭部を有する走行体
がその払拭部の直下に異物受けを有し、その異物受けが
払拭部と一緒に走行するようになっているから、除去さ
れた異物で加工材料上に落下して切断抵抗になって切断
精度に害を及ぼすことなく、高精度をもって切断するこ
とができる。
As described above, the cutting blade cleaning mechanism of the cutting processing apparatus according to the present invention has the blade length and the entire length of the wiping portion which is made of the elastic material at the rising and stopping position of the cutting blade and is in contact with the cutting blade with high pressure. It is a cutting blade cleaning mechanism that moves along the longitudinal direction so as to efficiently scrape foreign substances such as chips and removes the wiping part from the vertical movement range of the cutting blade after scraping. It is possible to reliably remove foreign matter such as chips attached over the entire length of the cutting blade without impeding the vertical movement performance. Moreover, since the traveling body having the wiping portion has the foreign matter receiver directly below the wiping portion, and the foreign matter receiver travels together with the wiping portion, the removed foreign matter falls on the work material. As a result, the cutting resistance becomes high and the cutting accuracy is not adversely affected, and the cutting can be performed with high accuracy.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案に係る切断加工装置の切断刃清浄機構の
実施例が具備された切断加工装置の全体を示す正面断面
図である。
FIG. 1 is a front cross-sectional view showing the entire cutting processing apparatus provided with an embodiment of a cutting blade cleaning mechanism of the cutting processing apparatus according to the present invention.

【図2】図1の中央縦断断面図である。FIG. 2 is a central longitudinal sectional view of FIG.

【図3】図1の要部の拡大断面図である。FIG. 3 is an enlarged cross-sectional view of a main part of FIG.

【図4】図3の縦断面図である。FIG. 4 is a vertical sectional view of FIG.

【図5】図3の動作状態を示す断面図である。5 is a cross-sectional view showing an operating state of FIG.

【図6】図5の縦断面図である。FIG. 6 is a vertical sectional view of FIG.

【符号の説明】[Explanation of symbols]

2 移動路 33 払拭部 3 走行体 Mh 切断刃 C 切断刃清浄機構 D 異物 M 切断加工装置 P 加工材料 2 moving path 33 wiping part 3 traveling body Mh cutting blade C cutting blade cleaning mechanism D foreign material M cutting processing device P processing material

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】平刃形の切断刃を加工材料上で昇降移動さ
せる切断加工装置に具備され切断刃に付着した異物を除
去する切断加工装置の切断刃清浄機構であって、切断刃
上昇停止位置において切断刃の長手方向に沿って水平
状に架設され同切断刃の刃長よりも長い移動路と、その
移動路に走行可能に設けられ且つ弾性材で形成した払拭
部を切断刃に両側から当触させながら走行させる走行体
とを備えたことを特徴とする切断加工装置の切断刃清浄
機構。
1. A cutting blade cleaning mechanism of the cutting device for removing foreign matter adhered to by the cutting blade provided in the cutting device vertically moving the cutting blade flat blade-shaped on the workpiece, increase the cutting blade Horizontal along the longitudinal direction of the cutting blade at the stop position
A long travel path is bridged to Jo than the blade length of the cutting blade, the
Wiping provided on the moving path so that it can travel and made of elastic material
A cutting blade cleaning mechanism for a cutting device, comprising: a traveling body that travels while being in contact with the cutting blade from both sides .
【請求項2】上記走行体が払拭部で掻取られた異物を受
ける異物受けをその払拭部の直下に有することを特徴と
する請求項1記載の切断加工装置の切断刃清浄機構。
2. The traveling body receives foreign matter scraped by a wiping portion.
It has a foreign matter receiver that is placed directly below the wiping part.
The cutting blade cleaning mechanism of the cutting apparatus according to claim 1.
JP1991093995U 1991-11-15 1991-11-15 Cutting blade cleaning mechanism of cutting equipment Expired - Lifetime JPH08159Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1991093995U JPH08159Y2 (en) 1991-11-15 1991-11-15 Cutting blade cleaning mechanism of cutting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991093995U JPH08159Y2 (en) 1991-11-15 1991-11-15 Cutting blade cleaning mechanism of cutting equipment

Publications (2)

Publication Number Publication Date
JPH0541698U JPH0541698U (en) 1993-06-08
JPH08159Y2 true JPH08159Y2 (en) 1996-01-10

Family

ID=14097987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991093995U Expired - Lifetime JPH08159Y2 (en) 1991-11-15 1991-11-15 Cutting blade cleaning mechanism of cutting equipment

Country Status (1)

Country Link
JP (1) JPH08159Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10695094B2 (en) 2009-08-27 2020-06-30 The Foundry, Llc Method and apparatus for altering biomechanics of articular joints
US10898237B2 (en) 2012-08-24 2021-01-26 The Foundry, Llc Method and apparatus for altering biomechanics of the spine
US11241256B2 (en) 2015-10-15 2022-02-08 The Foundry, Llc Method and apparatus for altering biomechanics of the shoulder

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6240746A (en) * 1985-08-16 1987-02-21 Nec Corp Semiconductor device
JPS63288697A (en) * 1987-05-19 1988-11-25 株式会社 堀鐵工所 Cloth tape cutter

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10695094B2 (en) 2009-08-27 2020-06-30 The Foundry, Llc Method and apparatus for altering biomechanics of articular joints
US10898237B2 (en) 2012-08-24 2021-01-26 The Foundry, Llc Method and apparatus for altering biomechanics of the spine
US11241256B2 (en) 2015-10-15 2022-02-08 The Foundry, Llc Method and apparatus for altering biomechanics of the shoulder

Also Published As

Publication number Publication date
JPH0541698U (en) 1993-06-08

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